JPH03222420A - Wafer processing device - Google Patents
Wafer processing deviceInfo
- Publication number
- JPH03222420A JPH03222420A JP1978590A JP1978590A JPH03222420A JP H03222420 A JPH03222420 A JP H03222420A JP 1978590 A JP1978590 A JP 1978590A JP 1978590 A JP1978590 A JP 1978590A JP H03222420 A JPH03222420 A JP H03222420A
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- processing liquid
- wafers
- tank
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims abstract description 34
- 235000012431 wafers Nutrition 0.000 claims abstract description 31
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 239000000428 dust Substances 0.000 abstract description 8
- 238000011109 contamination Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 4
- 241000218691 Cupressaceae Species 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はウェーハ処理装置に関し、特に半導体ウェーハ
の洗浄装置あるいはエツチング装置を含むウェーハ処理
装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer processing apparatus, and more particularly to a wafer processing apparatus including a semiconductor wafer cleaning apparatus or an etching apparatus.
従来、この種のウェーハ処理装置は、側面に開口部を有
したキャリアに複数のウェーハを収納し、キャリアを処
理液が入った槽に浸漬し、ウェーハの処理を行っていた
。この時、処理液は、順次槽の底部から供給され、槽上
面よりオーバーフローし、循環する構造となっていた。Conventionally, in this type of wafer processing apparatus, a plurality of wafers are stored in a carrier having an opening on the side, and the wafers are processed by immersing the carrier in a tank containing a processing liquid. At this time, the processing liquid was sequentially supplied from the bottom of the tank, overflowed from the top of the tank, and circulated.
上述した従来のウェーハ処理装置は、槽内の処理液の流
れ方によっては、キャリア側面の開口部より処理液がキ
ャリア内に入り込み、塵埃をつ工−ハ表面に付着し、ウ
ェーハ汚染を起こすという問題点があった。In the conventional wafer processing equipment described above, depending on the flow of the processing liquid in the tank, the processing liquid may enter the carrier through the opening on the side of the carrier, attracting dust and adhering to the surface of the wafer, causing wafer contamination. There was a problem.
また、槽上面から処理液をオーバーフローさせているが
、槽内の淀み部に塵埃数を増加させ、ウェーハ汚染を起
こすという問題点があった。Furthermore, although the processing solution is allowed to overflow from the top of the tank, there is a problem in that it increases the number of dust particles in the stagnation area within the tank, causing wafer contamination.
本発明の目的は、ウェーハ汚染を起すことのないウェー
ハ処理装置を提供することにある。An object of the present invention is to provide a wafer processing apparatus that does not cause wafer contamination.
本発明は、ウェーハを収納するキャリアと、該キャリア
を支持するキャリア受台を有する檜と、核種に処理液が
循環するように接続された供給配管と、該供給配管の中
間に配置された前記処理液を循環させるポンプと、前記
処理液を浄化するフィルターとを備えたウェーハ処理装
置において、前記処理液の導入部の面積が導出部の面積
よりも大きく、かつ°、側面に液もれのない漏斗状のキ
ャリヤを備えている。The present invention provides a carrier that stores a wafer, a cypress having a carrier pedestal that supports the carrier, a supply pipe connected to the nuclide so that a processing liquid circulates, and a In a wafer processing apparatus equipped with a pump that circulates a processing solution and a filter that purifies the processing solution, the area of the introduction section for the processing solution is larger than the area of the outlet section, and the side surface is free from leakage. Features no funnel-shaped carrier.
次に本発明の実施例について図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第１図は、本発明の第１の実施例の概略構成図である。FIG. 1 is a schematic diagram of a first embodiment of the present invention.
第１の実施例は、第１図に示すように、側面に開口部が
ないキャリア２に複数のウェーハ１が収納され、面積の
大きい処理液の導入部を下にして、槽６内のキャリア受
台１２上に設置されている。In the first embodiment, as shown in FIG. 1, a plurality of wafers 1 are stored in a carrier 2 that has no openings on its side, and the carrier 1 is placed in a tank 6 with its large-area processing liquid inlet facing down. It is installed on a pedestal 12.
また、ウェーハ１は支持棒３によりキャリア２からの落
下を防止するように支持されている。Further, the wafer 1 is supported by a support rod 3 to prevent it from falling from the carrier 2.
ウェーハ１を処理する場合には、まず、処理液１１を槽
６内に必要量供給する。When processing the wafer 1, first, a necessary amount of processing liquid 11 is supplied into the tank 6.
次に、配管９に接続されたバルブ７を開き、ポンプ５に
よりフィルター４を通し、キャリア２下部により処理液
１１を循環する。この時、キャリア２内では矢印で示す
ように、処理液１１は、キャリア２内に淀むことなく、
キャリア２上部に流れ、また、槽内に戻る。そして、キ
ャリア２下部面は槽２内の処理液１１の面より高くなっ
ているので、ウェーハ１１は、塵埃で汚れた処理液１１
に直接触れることがないようになっている。Next, the valve 7 connected to the pipe 9 is opened, and the processing liquid 11 is circulated through the filter 4 by the pump 5 and by the lower part of the carrier 2. At this time, the processing liquid 11 does not stagnate within the carrier 2, as shown by the arrow.
It flows to the top of the carrier 2 and returns to the tank. Since the lower surface of the carrier 2 is higher than the surface of the processing liquid 11 in the tank 2, the wafer 11 is exposed to the processing liquid 11 contaminated with dust.
It is designed so that there is no direct contact with it.
次に、数回循環させた処理液１１をバルブ８を開き、外
部に排出し、処理液を交換して同じ作業を繰返す。Next, the processing liquid 11 that has been circulated several times is discharged to the outside by opening the valve 8, and the processing liquid is replaced and the same operation is repeated.
第２図は本発明の第２の実施例の概略構成図である。FIG. 2 is a schematic diagram of a second embodiment of the present invention.
第２の実施例は、第２図に示すように、キャリア２の設
置された下部のキャリア受台１２内部に複数のヒータ１
０を設け、供給される処理液１１を加熱する構造となっ
ている。したがって、処理液１１が活性化され、スムー
ズなウェーハ処理が可能となる。In the second embodiment, as shown in FIG.
0 is provided to heat the supplied processing liquid 11. Therefore, the processing liquid 11 is activated and smooth wafer processing becomes possible.
以上説明したように、本発明は、側面に開口部がないキ
ャリアを使用し、キャリアを面積の大きい処理液の導入
部を下に槽内の液面より高い位置にセットし、ポンプと
フィルターを有した供給配管にて、液を下方よりキャリ
ア内に供給することにより、ウェーハには常に塵埃の処
理液が供給され、処理中に発生した塵埃も処理液ととも
にキャリア上部より排出されるため、ウェーハ表面の塵
埃の汚染が低減されるという効果がある。As explained above, the present invention uses a carrier with no openings on the side, sets the carrier at a position higher than the liquid level in the tank with the large-area introduction part of the processing liquid facing down, and connects the pump and filter. By supplying the liquid into the carrier from below through a supply pipe with a This has the effect of reducing surface dust contamination.
第１図は本発明の第１の実施例の概略構成図、第２図は
本発明の第２の実施例の概略構成図である。
１・・・ウェーハ、２・・・キャリア、３・・・支持棒
、４・・・フィルター ５・・・ポンプ、６・・・槽、
７．８・・・バルブ、９・・・配管、１０・・・ヒータ
、１１・・・処理液。FIG. 1 is a schematic diagram of a first embodiment of the present invention, and FIG. 2 is a schematic diagram of a second embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Wafer, 2... Carrier, 3... Support rod, 4... Filter 5... Pump, 6... Tank,
7.8... Valve, 9... Piping, 10... Heater, 11... Processing liquid.
Claims (1)
するキャリア受台を有する槽と、該槽に処理液が循環す
るように接続された供給配管と、該供給配管の中間に配
置された前記処理液を循環させるポンプと、前記処理液
を浄化するフィルターとを備えたウェーハ処理装置にお
いて、前記処理液の導入部の面積が導出部の面積よりも
大きく、かつ、側面に液もれのない漏斗状のキャリヤを
備えたことを特徴とするウェーハ処理装置。 ２、請求項１記載のウェーハ処理装置において、前記キ
ャリアの下面が前記処理液の液面よりも高くなっている
ことを特徴とするウェーハ処理装置。 ３、請求項１記載のウェーハ処理装置おいて、前記キャ
リア受台内部にヒータを設け、前記処理液供給時に該処
理液を加熱することを特徴とするウェーハ処理装置。[Claims] 1. A carrier for storing wafers, a tank having a carrier pedestal for supporting the carrier, a supply pipe connected to the tank so that a processing liquid circulates, and an intermediate part of the supply pipe In the wafer processing apparatus, the area of the introduction part for the processing liquid is larger than the area of the outlet part, and the area of the introduction part of the processing liquid is larger than the area of the outlet part. A wafer processing device characterized by being equipped with a funnel-shaped carrier that does not leak liquid. 2. The wafer processing apparatus according to claim 1, wherein the lower surface of the carrier is higher than the liquid level of the processing liquid. 3. The wafer processing apparatus according to claim 1, wherein a heater is provided inside the carrier pedestal to heat the processing liquid when the processing liquid is supplied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978590A JPH03222420A (en) | 1990-01-29 | 1990-01-29 | Wafer processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978590A JPH03222420A (en) | 1990-01-29 | 1990-01-29 | Wafer processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03222420A true JPH03222420A (en) | 1991-10-01 |
Family
ID=12008988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978590A Pending JPH03222420A (en) | 1990-01-29 | 1990-01-29 | Wafer processing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03222420A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5485861A (en) * | 1993-10-19 | 1996-01-23 | Dan Science Co., Ltd. | Cleaning tank |
| US5845663A (en) * | 1996-03-13 | 1998-12-08 | Lg Semicon Co., Ltd. | Wafer wet processing device |
-
1990
- 1990-01-29 JP JP1978590A patent/JPH03222420A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5485861A (en) * | 1993-10-19 | 1996-01-23 | Dan Science Co., Ltd. | Cleaning tank |
| US5845663A (en) * | 1996-03-13 | 1998-12-08 | Lg Semicon Co., Ltd. | Wafer wet processing device |
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