JPH03221552A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPH03221552A JPH03221552A JP1498390A JP1498390A JPH03221552A JP H03221552 A JPH03221552 A JP H03221552A JP 1498390 A JP1498390 A JP 1498390A JP 1498390 A JP1498390 A JP 1498390A JP H03221552 A JPH03221552 A JP H03221552A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- acid
- resin
- abs resin
- polyamide elastomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 13
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims abstract description 22
- 239000004952 Polyamide Substances 0.000 claims abstract description 17
- 229920002647 polyamide Polymers 0.000 claims abstract description 17
- 229920001971 elastomer Polymers 0.000 claims abstract description 16
- 239000000806 elastomer Substances 0.000 claims abstract description 16
- 239000003792 electrolyte Substances 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 239000005486 organic electrolyte Substances 0.000 claims abstract description 6
- 229920000642 polymer Polymers 0.000 claims description 11
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 9
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 abstract description 2
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 3
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 abstract 3
- KQHXBDOEECKORE-UHFFFAOYSA-L beryllium sulfate Chemical compound [Be+2].[O-]S([O-])(=O)=O KQHXBDOEECKORE-UHFFFAOYSA-L 0.000 abstract 2
- 229920000058 polyacrylate Polymers 0.000 abstract 2
- 230000002045 lasting effect Effects 0.000 abstract 1
- -1 ω-aminoenanthate Chemical compound 0.000 description 17
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 239000004677 Nylon Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 150000003951 lactams Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 150000004714 phosphonium salts Chemical class 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- QXYJCZRRLLQGCR-UHFFFAOYSA-N dioxomolybdenum Chemical compound O=[Mo]=O QXYJCZRRLLQGCR-UHFFFAOYSA-N 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- IIPYXGDZVMZOAP-UHFFFAOYSA-N lithium nitrate Chemical compound [Li+].[O-][N+]([O-])=O IIPYXGDZVMZOAP-UHFFFAOYSA-N 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 239000012763 reinforcing filler Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- LDMOEFOXLIZJOW-UHFFFAOYSA-N 1-dodecanesulfonic acid Chemical compound CCCCCCCCCCCCS(O)(=O)=O LDMOEFOXLIZJOW-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- JINGUCXQUOKWKH-UHFFFAOYSA-N 2-aminodecanoic acid Chemical compound CCCCCCCCC(N)C(O)=O JINGUCXQUOKWKH-UHFFFAOYSA-N 0.000 description 1
- TVONJMOVBKMLOM-UHFFFAOYSA-N 2-methylidenebutanenitrile Chemical compound CCC(=C)C#N TVONJMOVBKMLOM-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- UQXNEWQGGVUVQA-UHFFFAOYSA-N 8-aminooctanoic acid Chemical compound NCCCCCCCC(O)=O UQXNEWQGGVUVQA-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical group NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 1
- 229910017610 Cu(NO3) Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229920009204 Methacrylate-butadiene-styrene Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910019328 PrCl3 Inorganic materials 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- APUPEJJSWDHEBO-UHFFFAOYSA-P ammonium molybdate Chemical compound [NH4+].[NH4+].[O-][Mo]([O-])(=O)=O APUPEJJSWDHEBO-UHFFFAOYSA-P 0.000 description 1
- 239000011609 ammonium molybdate Substances 0.000 description 1
- 235000018660 ammonium molybdate Nutrition 0.000 description 1
- 229940010552 ammonium molybdate Drugs 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- QEZIKGQWAWNWIR-UHFFFAOYSA-N antimony(3+) antimony(5+) oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[Sb+3].[Sb+5] QEZIKGQWAWNWIR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 159000000007 calcium salts Chemical class 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- LHLUQDDQLCJCFU-UHFFFAOYSA-L disodium;1-sulfocyclohexa-3,5-diene-1,3-dicarboxylate Chemical compound [Na+].[Na+].OS(=O)(=O)C1(C([O-])=O)CC(C([O-])=O)=CC=C1 LHLUQDDQLCJCFU-UHFFFAOYSA-L 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- CRBREIOFEDVXGE-UHFFFAOYSA-N dodecoxybenzene Chemical compound CCCCCCCCCCCCOC1=CC=CC=C1 CRBREIOFEDVXGE-UHFFFAOYSA-N 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- SQQMAOCOWKFBNP-UHFFFAOYSA-L manganese(II) sulfate Chemical compound [Mn+2].[O-]S([O-])(=O)=O SQQMAOCOWKFBNP-UHFFFAOYSA-L 0.000 description 1
- 229910000357 manganese(II) sulfate Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229920012128 methyl methacrylate acrylonitrile butadiene styrene Polymers 0.000 description 1
- QLPMKRZYJPNIRP-UHFFFAOYSA-M methyl(trioctyl)azanium;bromide Chemical compound [Br-].CCCCCCCC[N+](C)(CCCCCCCC)CCCCCCCC QLPMKRZYJPNIRP-UHFFFAOYSA-M 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000005078 molybdenum compound Substances 0.000 description 1
- 150000002752 molybdenum compounds Chemical class 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- XCOHAFVJQZPUKF-UHFFFAOYSA-M octyltrimethylammonium bromide Chemical compound [Br-].CCCCCCCC[N+](C)(C)C XCOHAFVJQZPUKF-UHFFFAOYSA-M 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- VAUKWMSXUKODHR-UHFFFAOYSA-M pentyl(triphenyl)phosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCCC)C1=CC=CC=C1 VAUKWMSXUKODHR-UHFFFAOYSA-M 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910001392 phosphorus oxide Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical group 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- ZNNZYHKDIALBAK-UHFFFAOYSA-M potassium thiocyanate Chemical compound [K+].[S-]C#N ZNNZYHKDIALBAK-UHFFFAOYSA-M 0.000 description 1
- LHBNLZDGIPPZLL-UHFFFAOYSA-K praseodymium(iii) chloride Chemical compound Cl[Pr](Cl)Cl LHBNLZDGIPPZLL-UHFFFAOYSA-K 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- AQZSPJRLCJSOED-UHFFFAOYSA-M trimethyl(octyl)azanium;chloride Chemical compound [Cl-].CCCCCCCC[N+](C)(C)C AQZSPJRLCJSOED-UHFFFAOYSA-M 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 239000011686 zinc sulphate Substances 0.000 description 1
- 235000009529 zinc sulphate Nutrition 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、帯電防止性に優れた樹脂組成物、さらに詳し
くは、ＡＢＳ系樹脂とポリアミドエラストマーと（メタ
）アクリル酸エステル重合体を基本樹脂成分として含有
し、持続的な帯電防止性を有するとともに、機械的特性
に優れる樹脂組成物に関するものである。Detailed Description of the Invention [Field of Industrial Application] The present invention provides a resin composition with excellent antistatic properties, more specifically, a resin composition comprising an ABS resin, a polyamide elastomer, and a (meth)acrylic acid ester polymer as a basic resin. The present invention relates to a resin composition that contains the present invention as a component, has sustained antistatic properties, and has excellent mechanical properties.
〔従来の技術及び発明が解決しようとする課題〕従来、
ＡＢＳ系樹脂は安価であり、機械的強度、剛性などの機
械的特性や成形性に優れていることから、多くの分野に
おいて幅広く用いられている。[Problems to be solved by conventional techniques and inventions] Conventionally,
ABS resins are inexpensive and have excellent mechanical properties such as mechanical strength and rigidity, and moldability, so they are widely used in many fields.
しかしながら、このものは、例えば、ビデ才力セント、
ＩＣカード、複写機、テレビなどの電子・電気機器部品
の材料として用いる場合、静電気帯電による障害が発生
したり、あるいは家電製品やＯＡ機器のハウジング材料
として用いる場合、静電気の発生、帯電によりゴミが付
着して汚れが生じるなど好ましくない事態を招来する欠
点を有している。このため、ＡＢＳ系樹脂本来の望まし
い特性に加えて、帯電防止性を有する成形材料の開発が
要望されていた。However, this one, for example,
When used as a material for parts of electronic and electrical equipment such as IC cards, copiers, and televisions, failures may occur due to static electricity charging, and when used as housing materials for home appliances and OA equipment, static electricity is generated and dust is generated due to charging. It has the drawback of causing undesirable situations such as adhesion and staining. For this reason, there has been a demand for the development of a molding material that has antistatic properties in addition to the desirable characteristics inherent to ABS resins.
ところで、このＡＢＳ系樹脂の耐衝撃性や制電性を改良
するため、ＡＢＳ系樹脂にポリアミドエラストマーを配
合することが試みられている（特開閉５９−１９３９５
９号公報、同６０−２３４３５号公報、同６３−９５２
５１号公報、同６３−９７６５３号公報など）。By the way, in order to improve the impact resistance and antistatic properties of this ABS resin, attempts have been made to blend polyamide elastomer into the ABS resin (Japanese Patent Application Laid-Open No. 59-19395).
Publication No. 9, Publication No. 60-23435, Publication No. 63-952
No. 51, No. 63-97653, etc.).
しかしながら、この場合、ポリアミドエラストマーとし
て、ハードセグメントのポリアミドとソフトセグメント
のポリエーテルとを、エステル結合で連結したポリエー
テルエステルアミドやアミド結合で連結したポリエーテ
ルアミド、あるいはソフトセグメントがポリエステルで
あるポリエステルアミドなどが用いられているが、これ
らのポリアミドエラストマーはＡＢＳ系樹脂との相容性
が悪いという欠点がある。However, in this case, the polyamide elastomer may be polyether ester amide in which a hard segment polyamide and a soft segment polyether are linked by an ester bond, a polyether amide in which the soft segment is a polyester, or a polyester amide in which the soft segment is a polyester. However, these polyamide elastomers have the disadvantage of poor compatibility with ABS resins.
また、ポリアミドエラストマーとの相容性を向上させる
ために、カルボキシル基を含有するビニル系単量体を共
重合させたビニル系共重合体を用い、耐衝撃性を改良す
ることが試みられている（特開昭５９−１９３９５９号
公報）、この場合、該ポリアミドエラストマーを４０重
量％以上使用しているので、剛性の低下は避けられない
という問題がある。Additionally, in order to improve compatibility with polyamide elastomers, attempts have been made to improve impact resistance by using vinyl copolymers made by copolymerizing vinyl monomers containing carboxyl groups. (Japanese Unexamined Patent Publication No. 59-193959) In this case, since the polyamide elastomer is used in an amount of 40% by weight or more, there is a problem that a decrease in rigidity is unavoidable.
本発明者は、永久帯電防止性を有し、かつ耐衝撃性に代
表される機械的特性および層状剥離のない帯電防止性樹
脂を提供することを目的として鋭意検討した結果、ＡＢ
Ｓ系樹脂にポリアミドエラストマーと（メタ）アクリル
酸エステル重合体を特定の割合で混合することにより、
上記目的が効率的に達成されることを見出し、本発明に
到達した。さらに有機電解質や無機電解質を添加するこ
とにより、著しい帯電防止効果を示、すことを見出し、
この知見に基づいて本発明を完成するに至った。The inventor of the present invention has conducted extensive studies with the aim of providing an antistatic resin that has permanent antistatic properties and is free from mechanical properties such as impact resistance and delamination.
By mixing S-based resin with polyamide elastomer and (meth)acrylic acid ester polymer in a specific ratio,
The inventors have discovered that the above object can be efficiently achieved and have arrived at the present invention. Furthermore, we discovered that adding an organic electrolyte or an inorganic electrolyte exhibits a significant antistatic effect.
Based on this knowledge, we have completed the present invention.
すなわち、本発明は、（Ａ）ＡＢＳ系樹脂２５〜９６重
量％と（Ｂ）ポリエーテルエステルアミド３〜３０重量
％と（Ｃ）（メタ）アクリル酸エステル系重合体１〜４
５重量％を配合させて成る樹脂組成物、及び上記樹脂組
成物１００重量部に、（Ｄ）有機電解質又は無機電解質
の中から選ばれた少なくとも１種の電解質０．０１〜１
０重量部を含有させた樹脂組成物である。That is, the present invention comprises (A) 25 to 96% by weight of ABS resin, (B) 3 to 30% by weight of polyether ester amide, and (C) 1 to 4% of (meth)acrylic acid ester polymer.
5% by weight of a resin composition, and 100 parts by weight of the above resin composition, (D) 0.01 to 1% of at least one electrolyte selected from organic electrolytes or inorganic electrolytes.
This is a resin composition containing 0 parts by weight.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明組成物に用いる（Ａ）成分としてのＡＢＳ系樹脂
としては、スチレン−ブタジェン−アクリロニトリル共
重合体（ＡＢＳ樹脂）、ＡＢＳとポリカーボネート樹脂
とのポリブレンド物、ＡＢＳ樹脂と塩化ビニル樹脂との
ポリブレンド物などが挙げられる。これらのスチレンも
しくはニトリルの一部が、α−メチルスチレン、Ｐ−メ
チルスチレン、メタクリロニトリル、エタクリロニトリ
ル、Ｎ−フェニルマレイミド、Ｎ−メチルマレイミド、
アクリルアミドなとで置換したものであってもよい。Ａ
ＢＳ系樹脂の含有量としては、２５〜９６重量％の範囲
にあることが必要であって、好ましくは５０〜９５重量
％である。含有量が２５重量％未満では、衝撃強度、機
械的強度が充分でなく、また、９６重量％を超えると帯
電防止効果がなくなる。Examples of the ABS resin as component (A) used in the composition of the present invention include styrene-butadiene-acrylonitrile copolymer (ABS resin), a polyblend of ABS and polycarbonate resin, and a polyester of ABS resin and vinyl chloride resin. Examples include blends. Some of these styrenes or nitriles include α-methylstyrene, P-methylstyrene, methacrylonitrile, ethacrylonitrile, N-phenylmaleimide, N-methylmaleimide,
It may be substituted with acrylamide or the like. A
The content of the BS resin needs to be in the range of 25 to 96% by weight, preferably 50 to 95% by weight. When the content is less than 25% by weight, impact strength and mechanical strength are insufficient, and when it exceeds 96% by weight, the antistatic effect is lost.
本発明に用いる（Ｂ）ポリアミドエラストマーとしては
、ハードセグメントとしての炭素数が６以上のアミノカ
ルボン酸又はラクタムもしくはｍ＋ｎ≧１２のナイロン
ｍｎ塩（ａ）及びソフトセグメントとしては、ポリオー
ル、具体的にはポリ （アルキレンオキシド）グリコー
ル（ｂ）から構成され、かつ（ａ）６分の全共重合体中
に占める比率が９５〜１０、好ましくは９０〜２０、さ
らに好ましくは８０〜３０重量％である。ここでいう炭
素数が６以上のアミノカルボン酸又はラクタムもしくは
ｍ＋ｎ≧Ｉ２のナイロンｍｎ塩（ａ）としては、ω−ア
ミノカプロン酸、ω−ア旦ノエナント酸、ω−アミノカ
プリル酸、ω−アミノペルゴン酸、ωアミノカプリン酸
、１１−アミノウンデカン酸、１２−アミノドデカン酸
等のアミノカルボン酸あるいはカプロラクタム、ラウロ
ラクタム等のラクタムやナイロン６．６，６．１０．６
．１２．１１．６．１１．１０．１１．１２．１２．６
．１２．１０．１２．１２などのナイロン塩が挙げられ
る。ポリ（アルキレンオキシド）グリコール（ｂ）とし
ては、ポリエチレングリコール、ポリ（工、２および１
．３プロピレンオキシド）グリコール、ポリ（テトラメ
チレンオキシド）グリコール、ポリ（ヘキサメチレンオ
キシド）グリコル、エチレンオキシドとプロピレンオキ
シドのブロツク又はランダム共重合体、エチレンオキシ
ドとテトラヒドロフランのブロツク又はランダム共重合
体などが挙げられる。このものの平均分子量は５００〜
３，０００である。As the polyamide elastomer (B) used in the present invention, the hard segment is an aminocarboxylic acid or lactam having 6 or more carbon atoms, or the nylon mn salt (a) with m+n≧12, and the soft segment is a polyol, specifically, It is composed of poly(alkylene oxide) glycol (b), and the proportion of (a) 6 in the total copolymer is 95 to 10, preferably 90 to 20, more preferably 80 to 30% by weight. The aminocarboxylic acids or lactams having 6 or more carbon atoms or the nylon mn salts (a) with m+n≧I2 include ω-aminocaproic acid, ω-aminoenanthate, ω-aminocaprylic acid, ω-aminopergonic acid. , ω aminocarboxylic acids such as aminocapric acid, 11-aminoundecanoic acid, and 12-aminododecanoic acid, lactams such as caprolactam and laurolactam, and nylon 6.6, 6.10.6
．． 12.11.6.11.10.11.12.12.6
．． Examples include nylon salts such as 12.10.12.12. Poly(alkylene oxide) glycol (b) includes polyethylene glycol, poly(alkylene oxide), 2 and 1.
．． Examples include 3-propylene oxide) glycol, poly(tetramethylene oxide) glycol, poly(hexamethylene oxide) glycol, block or random copolymers of ethylene oxide and propylene oxide, and block or random copolymers of ethylene oxide and tetrahydrofuran. The average molecular weight of this product is 500~
3,000.
本発明では、ポリ（アルキレンオキシド）グリコールの
両末端をアミノ化又はカルボキシル化しても良い。In the present invention, both ends of the poly(alkylene oxide) glycol may be aminated or carboxylated.
（ａ）成分と（ｂ）成分の結合は、（ｂ）成分の末端基
に応じてエステル結合又はアミド結合が考えられる。結
合に応じてジカルボン酸やジアミンなどの第３成分を用
いることができる。The bond between component (a) and component (b) may be an ester bond or an amide bond depending on the terminal group of component (b). A third component such as dicarboxylic acid or diamine can be used depending on the bond.
具体的な合成法としては、例えば特公昭５６−４５４１
９号公報、特開昭５５−１３３４２４号公報などに開示
されている。As a specific synthesis method, for example, Japanese Patent Publication No. 56-4541
This method is disclosed in Japanese Patent Application Laid-Open No. 55-133424, etc.
ジカルボン酸としては、炭素数４〜２ｏのものが考えら
れ、テレフタル酸、イソフタル酸、フタル酸、ナフタレ
ン−２，６−ジカルボン酸、ナフタレン−２，７−ジカ
ルボン酸、ジフェニル−４，４ジカルボン酸、ジフェノ
キシエタンジカルボン酸、３−スルホイソフタル酸ナト
リウムのような芳香族ジカルボン酸、１．４−シクロヘ
キサンジカルボン酸、１．２−シクロヘキサンジカルボ
ン酸、ジシクロへキシル−４，４ジカルボン酸のごとき
脂環族ジカルボン酸およびこはく酸、シュウ酸、アジピ
ン酸、セバシン酸、ドデカンジ酸のごとき脂肪族ジカル
ボン酸を挙げることができる。Dicarboxylic acids include those having 4 to 2 carbon atoms, such as terephthalic acid, isophthalic acid, phthalic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid, diphenyl-4,4-dicarboxylic acid. , diphenoxyethanedicarboxylic acid, aromatic dicarboxylic acids such as sodium 3-sulfoisophthalate, alicyclic acids such as 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, and dicyclohexyl-4,4dicarboxylic acid. Mention may be made of the group dicarboxylic acids and aliphatic dicarboxylic acids such as succinic acid, oxalic acid, adipic acid, sebacic acid, dodecanedioic acid.
ジアミンとしては、芳香族、脂環族、脂肪族ジアミンが
用いられる。具体的には、脂肪族ジアミンとしては、ヘ
キサメチルシアミンが考えられる。As the diamine, aromatic, alicyclic, and aliphatic diamines are used. Specifically, hexamethylcyamine is considered as the aliphatic diamine.
ポリアミドエラストマーの含有量としては、３〜３０重
量％の範囲にあることが必要であって、３重量％未満で
は十分な帯電防止効果が得られなく、３０重量％を超え
ると剛性が不足するようになる。The content of polyamide elastomer needs to be in the range of 3 to 30% by weight; if it is less than 3% by weight, sufficient antistatic effect cannot be obtained, and if it exceeds 30% by weight, rigidity may be insufficient. become.
本発明に用いる（Ｃ）（メタ）アクリル酸エステル系重
合体としては、例えばポリメタクリル酸メチ／Ｌ／ （
Ｍ Ｍ Ａ 樹脂） 、’：ｆム強化ポリメタクリル酸
メチル、メタクリル酸メチル−ブタジェン−スチレン共
重合体（ＭＢＳ樹脂）、メタクリル酸メチルアクリロニ
トリル−ブタジェン−スチレン共重合体（ＭＡＢＳ樹脂
）及びメタクリル酸メチル６０重量％以上と他の共重合
体ビニルモノマー４０重量％以下とを共重合させて威る
重合体などが挙げられ、これらは１種用いてもよいし、
２種以上を組み合わせて用いてもよい。また、前記共重
合性ビニルモノマーとしては、例えばメタクリル酸エチ
ル、メタクリル酸ブチル、メタクリル酸シクロヘキシル
、メタクリル酸２−エチルヘキシル、アクリル酸メチル
、アクリル酸エチル、アクリル酸ブチル、アクリル酸２
−エチルヘキシル、スチレン、α−メチルスチレン、ア
クリロニトリル、アクリル酸、メタクリル酸、フマル酸
、マレイン酸、イタコン酸などが挙げられる。The (C)(meth)acrylic acid ester polymer used in the present invention is, for example, polymethacrylic acid methacrylate/L/(
M M A resin) ,':fm reinforced polymethyl methacrylate, methyl methacrylate-butadiene-styrene copolymer (MBS resin), methylacrylonitrile methacrylate-butadiene-styrene copolymer (MABS resin), and methyl methacrylate Examples include polymers made by copolymerizing 60% by weight or more and 40% by weight or less of other copolymer vinyl monomers, and these may be used alone, or
You may use two or more types in combination. Examples of the copolymerizable vinyl monomer include ethyl methacrylate, butyl methacrylate, cyclohexyl methacrylate, 2-ethylhexyl methacrylate, methyl acrylate, ethyl acrylate, butyl acrylate, and 2-ethylhexyl methacrylate.
- Ethylhexyl, styrene, α-methylstyrene, acrylonitrile, acrylic acid, methacrylic acid, fumaric acid, maleic acid, itaconic acid and the like.
（メタ）アクリル酸エステル系重合体の含有量としては
、ｌ〜４５重量％の範囲にあることが必要であって、好
ましくは、５〜３０重量％である。The content of the (meth)acrylic acid ester polymer needs to be in the range of 1 to 45% by weight, preferably 5 to 30% by weight.
１重量％未満では、剥離が見られ、４５重目方を超える
と、アイゾツト衝撃強度が不足するようになる。If it is less than 1% by weight, peeling is observed, and if it exceeds 45 weight %, the Izot impact strength becomes insufficient.
本発明組成物においては、（Ｄ）ドデシルベンゼンスル
ホン酸ナトリウムのような電解質を併用すると帯電防止
効果で、顕著な相乗効果を示すことが分かった。In the composition of the present invention, it has been found that when an electrolyte such as (D) sodium dodecylbenzenesulfonate is used in combination, a remarkable synergistic effect is exhibited in terms of antistatic effect.
このような効果を示す有機電解質としては、酸性基を有
する有機化合物若しくはその金属塩又は有機アンモニウ
ム塩若しくは有機ホスホニウム塩などが挙げられる。こ
の酸性基を有する有機化合物若しくはその金属塩として
は、例えばドデシルベンゼンスルホン酸、Ｐ−）ルエン
スルホン酸、ドデシルフェニルエーテルジスルホン酸、
ナフタリンスルホン酸、ナフタリンスルホン酸とホルマ
リンの縮合物、ポリスチレンスルホン酸などの芳香族ス
ルホン酸、ラウリルスルホン酸などのアルキルスルホン
酸、ステアリン酸、ラウリン酸、ポリアクリル酸などの
有機カルボン酸、亜リン酸ジフェニル、リン酸ジフェニ
ルなどの有機リン酸やそれらのアルカリ金属塩、アルカ
リ土類金属塩が挙げられる。Examples of organic electrolytes that exhibit such effects include organic compounds having acidic groups, metal salts thereof, organic ammonium salts, and organic phosphonium salts. Examples of the organic compound having an acidic group or its metal salt include dodecylbenzenesulfonic acid, P-)luenesulfonic acid, dodecyl phenyl ether disulfonic acid,
Naphthalene sulfonic acid, a condensate of naphthalene sulfonic acid and formalin, aromatic sulfonic acids such as polystyrene sulfonic acid, alkyl sulfonic acids such as lauryl sulfonic acid, organic carboxylic acids such as stearic acid, lauric acid, polyacrylic acid, phosphorous acid Examples include organic phosphoric acids such as diphenyl and diphenyl phosphate, and their alkali metal salts and alkaline earth metal salts.
遊離酸の形でも効果を発現するが、好ましくはアルカリ
金属又はアルカリ土類金属の塩の形で用いた方がよく、
例えばナトリウム、リチウム、カリウム、マグネシウム
、カルシウムの塩などが好ましい。Although it is effective even in the form of a free acid, it is preferable to use it in the form of an alkali metal or alkaline earth metal salt.
For example, sodium, lithium, potassium, magnesium, and calcium salts are preferred.
有機アンモニウム塩としては、例えばトリメチルオクチ
ルアンモニウムプロミド、トリメチルオクチルアンモニ
ウムクロリド、セチルトリメチルアンモニウムプロミド
、セチルトリメチルアンモニウムクロリド、トリオクチ
ルメチルアンモニウムプロミドなどの四級アンモニウム
塩が挙げられ、有機ホスホニウム塩としては、例えばア
ミルトリフェニルホスホニウムプロミド、テトラブチル
ホスホニウムプロミドなどの四級ホスホニウム塩が挙げ
られる。Examples of organic ammonium salts include quaternary ammonium salts such as trimethyloctylammonium bromide, trimethyloctylammonium chloride, cetyltrimethylammonium bromide, cetyltrimethylammonium chloride, and trioctylmethylammonium bromide; examples of organic phosphonium salts include Examples include quaternary phosphonium salts such as amyltriphenylphosphonium bromide and tetrabutylphosphonium bromide.
また、無機電解質としては、例えばＡｇＮ０．、Ｂｅ５
Ｏａ 、ＣａＣｌ２２ 、Ｃａ（ＮＯｓ）ｚ、ＣｄＣｆ
ｚ 、Ｃｄ（ＮＯ＋＋）ｚ、ＣａＣｌ２ Ｚ 、Ｃｒ
Ｃｌ２３、ＣｓＣ１，ＣｕＣ１ｚ 、Ｃｕ（ＮＯ３）ｚ
、ＣｕＳＯ４、ＦｅＣｆ ２ 、ＫＢｒ 、 Ｋ）＋２
ＰＯ４、ＫＳＣＮ、 ＫＮＯ３、Ｌｉ（／！、 ＬｉＯ
Ｈ，、ＬｉＮＯ３、ＭｇＣｊ２□、Ｍｇ（ＮＯ３）ｚ、
門ｇｓＯａＭｎＣｆ ｚ 、ＭｎＳＯ４、ＮＨ４Ｃｊ２
、ＮＨ，ＮＯ３、（ＮＨｎ）ｚｓＯａ、ＮａＢｒ、Ｎａ
２ＣＯ，、ＮａＬＰＯ４、ＮａＮ０：＋ 、Ｎ１５Ｏ
ａ 、Ｐｂ（ＮＯｚ）ｚ、ＰｒＣｌ３、ＲｂＣｆ、
ＲｂＮ０：＋ 、 Ｚｎ（Ｎｏ：＋）ｚ、ＺｎＳＯ４
などが挙げられる。Further, as the inorganic electrolyte, for example, AgN0. , Be5
Oa, CaCl22, Ca(NOs)z, CdCf
z, Cd(NO++)z, CaCl2Z, Cr
Cl23, CsC1, CuC1z, Cu(NO3)z
, CuSO4, FeCf 2 , KBr, K)+2
PO4, KSCN, KNO3, Li(/!, LiO
H,, LiNO3, MgCj2□, Mg(NO3)z,
Gate gsOaMnCf z , MnSO4, NH4Cj2
, NH, NO3, (NHn)zsOa, NaBr, Na
2CO,, NaLPO4, NaN0:+, N15O
a, Pb(NOz)z, PrCl3, RbCf,
RbN0:+, Zn(No:+)z, ZnSO4
Examples include.
これらの電解質の添加量は（Ａ）成分、（Ｂ）成分及び
（Ｃ）成分の合計１００重量部に対し、０．０１〜１０
重量部、好ましくは０．１〜５重量部の範囲で選ばれる
。この量が０．０１重量部未満では添加物の効果が十分
に発揮されないし、１０重量部を超えると衝撃強度の低
下、金型の腐食、モールドデポジットの発現、外観の低
下などの原因となり好ましくない。The amount of these electrolytes added is 0.01 to 10 parts by weight per 100 parts by weight of component (A), component (B), and component (C).
It is selected in parts by weight, preferably in the range of 0.1 to 5 parts by weight. If this amount is less than 0.01 parts by weight, the effect of the additive will not be fully exhibited, and if it exceeds 10 parts by weight, it will cause a decrease in impact strength, corrosion of the mold, appearance of mold deposits, deterioration of appearance, etc. do not have.
また、これらの電解質の中で、金型腐食性や外観の点か
ら有機電解質の方が無機電解質より好ましい。Further, among these electrolytes, organic electrolytes are more preferable than inorganic electrolytes in terms of mold corrosion resistance and appearance.
本発明組成物には、本発明の目的をそこなわない範囲で
、所望に応じ各種添加成分、例えば顔料、染料、補強性
充填剤、熱安定剤、酸化防止剤、核剤、滑剤、可塑剤、
紫外線吸収剤、離型剤、難燃剤、他の重合体などを、層
線過程や成形過程などの任意の過程において含有させる
ことができる。The composition of the present invention may contain various additive components as desired, such as pigments, dyes, reinforcing fillers, heat stabilizers, antioxidants, nucleating agents, lubricants, and plasticizers, to the extent that the objects of the present invention are not impaired. ,
Ultraviolet absorbers, mold release agents, flame retardants, other polymers, etc. can be included in any process such as the layering process or the molding process.
補強性充填剤としては、例えばガラス繊維、炭素繊維、
チタン酸カリウムなどの繊維状補強剤やマイカ、タルク
、クレー、ケイ酸カルシウム、炭酸カルシウム、ガラス
箔、ガラスピーズ、他のポリマーなとの粒状又は薄片状
充填剤を挙げることができるが、これらの中で、特にガ
ラス繊維及びマイカが好ましい。Examples of reinforcing fillers include glass fiber, carbon fiber,
Mention may be made of fibrous reinforcing agents such as potassium titanate and granular or flaky fillers such as mica, talc, clay, calcium silicate, calcium carbonate, glass foil, glass beads, and other polymers. Among these, glass fiber and mica are particularly preferred.
難燃剤としては、通常ＡＢＳ系樹脂６ご用いられる有機
ハロゲン系、有機リン系、金属水酸化物系などが使用で
きる。As the flame retardant, organic halogen type, organic phosphorus type, metal hydroxide type, etc. which are usually used in ABS resin 6 can be used.
ＡＢＳ系樹脂に対する前記有機ハロゲン系、有機リン系
及び金属水酸化物難燃剤の添加量は、通常、ＡＢＳ系樹
脂１００重量部当り４〜３５重量部、好ましくは１０〜
２５重量部の範囲で選ばれる。The amount of the organic halogen, organic phosphorus, and metal hydroxide flame retardants added to the ABS resin is usually 4 to 35 parts by weight, preferably 10 to 35 parts by weight per 100 parts by weight of the ABS resin.
The amount is selected within the range of 25 parts by weight.
このような難燃剤の効果をさらに増大させる作用を有す
る難燃助剤を使用することができる。このＨＨ助剤とし
ては、例えば二酸化モリブデン、モリブデン酸アンモニ
ウムなどのモリブデン化合物、三酸化アンチモンなどの
アンチモン化合物などを挙げることができ、特に好まし
いのは、二酸化アンチモンである。難燃助剤の使用量は
、通常スチレン系樹脂１００重量部当り２〜１０重量部
の範囲で選ばれる。Flame retardant aids can be used that have the effect of further increasing the effectiveness of such flame retardants. Examples of the HH aid include molybdenum compounds such as molybdenum dioxide and ammonium molybdate, and antimony compounds such as antimony trioxide, with antimony dioxide being particularly preferred. The amount of the flame retardant aid used is usually selected within the range of 2 to 10 parts by weight per 100 parts by weight of the styrene resin.
本発明組成物は、前記（Ａ）成分、（Ｂ）成分、（Ｃ）
成分及び必要に応じて用いられる各種添加成分から戒る
混合物、または、（Ａ）成分、（Ｂ）成分、（Ｃ）成分
、Ｄｇ分及び必要に応じて用いられる各種添加成分から
なる混合物を公知の方法、例えばバンバＩＪ−ミキサー
ミキシングロール、−軸若しくは二軸の押出機などを
使用して混練する方法により調製することができる。こ
の際の混練温度は１８０〜２８０°Ｃの範囲で行うのが
好ましい。The composition of the present invention comprises the above-mentioned (A) component, (B) component, and (C)
Known mixtures consisting of components and various additive components used as necessary, or mixtures consisting of component (A), component (B), component (C), Dg and various additive components used as necessary For example, it can be prepared by a method of kneading using a Bamba IJ-mixer mixing roll, a single-screw or twin-screw extruder, or the like. The kneading temperature at this time is preferably in the range of 180 to 280°C.
なお、電解質の融点が高いものについては、あらかじめ
電解質を水、アルコール、ジメチルホルムアミドなどの
溶媒に溶解したのち、この溶液を押出機のベントロに滴
下させた方が、該電解質の分散が均一に行われ、帯電防
止効果、機械的物性、外観などの良好な組成物が得られ
るので有利である。If the electrolyte has a high melting point, it is better to dissolve the electrolyte in a solvent such as water, alcohol, or dimethylformamide in advance, and then drop this solution into the vent hole of the extruder for more uniform dispersion of the electrolyte. This is advantageous because a composition with good antistatic effect, mechanical properties, appearance, etc. can be obtained.
このようにして得られたＡＢＳ系樹脂組威物は、一般に
熱可塑性樹脂の成形に用いられている公知の方法、例え
ば射出成形、押出成形、ブロー成形、真空成形などの方
法によって成形することができる。The ABS resin composition thus obtained can be molded by known methods generally used for molding thermoplastic resins, such as injection molding, extrusion molding, blow molding, and vacuum forming. can.
本発明の樹脂組成物は、ＡＢＳ系樹脂とポリアミドエラ
ストマーと（メタ）アクリル酸エステル系重合体を基本
樹脂成分とするものであって、恒久的な帯電防止性を有
するとともに、機械的特性に優れるなどの特徴を有し、
例えばビデオカセット、ビデオディスク、クリーナー、
テレビ、複写機をはじめとする、エレクトロニクス、家
電製品、ＯＡ機器などの各種部品に、静電気帯電を防止
しうる成形材料として広く用いられる。The resin composition of the present invention has ABS resin, polyamide elastomer, and (meth)acrylic acid ester polymer as basic resin components, and has permanent antistatic properties and excellent mechanical properties. It has characteristics such as
For example, video cassettes, video discs, cleaners,
It is widely used as a molding material that can prevent static electricity in various parts of electronics, home appliances, office automation equipment, etc., including televisions and copying machines.
次に、実施例により本発明をさらに詳細に説明するが、
本発明はこれらの例によってなんら限定されるものでは
ない。Next, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited in any way by these examples.
なお、組成物の各物性は次に示す方法に従って求めた。In addition, each physical property of the composition was determined according to the following method.
（１）引張降伏強度
ＡＳＴＭ Ｄ６３８に準じて１７８インチ厚みのダン
ベル片を用い、２３°Ｃ２５０％ＲＨで測定した。(1) Tensile Yield Strength Measured at 23° C. and 250% RH using a dumbbell piece with a thickness of 178 inches according to ASTM D638.
（２）曲げ弾性率
ＡＳＴＭ Ｄ７９０に準じて１／４インチ厚みの試験
片を用い、２３°Ｃ１５０％ＲＨで測定した。(2) Flexural Modulus Measured at 23° C. and 150% RH using a 1/4 inch thick test piece according to ASTM D790.
（３）アイゾツト衝撃強度
ＡＳＴＭ Ｄ２５６に準じて１７４インチ厚みのノツ
チ付試験片を用いて、２３°Ｃ１５０％ＲＨで測定した
。(3) Izot impact strength Measured at 23° C. and 150% RH using a notched test piece with a thickness of 174 inches according to ASTM D256.
（４）表面抵抗率
１／８インチ厚の平板を用い、東亜電波工業株式会社製
、極超絶縁計５Ｍ−１０Ｅ型により、下記の条件で測定
した。(4) Surface resistivity The surface resistivity was measured using a 1/8 inch thick flat plate using a Kyokucho Megohmmeter Model 5M-10E manufactured by Toa Denpa Kogyo Co., Ltd. under the following conditions.
（イ）成形後、２３°Ｃ１５０％Ｒ）ｌの条件にて２４
時間状態調節した後測定した。(a) After molding, 24°C under the conditions of 150%R)
Measurements were taken after time conditioning.
（＋７）成形後、１０分間流水中に浸漬し、表面の水分
を取り除き、２３°Ｃ１５０％ＲＨの条件にて２４時間
状態調節した後、測定した。(+7) After molding, it was immersed in running water for 10 minutes to remove surface moisture, and the condition was adjusted for 24 hours at 23° C. and 150% RH, and then measured.
（５）成形品剥離性
成形品の層状剥離防止性は成形品を折り曲げ、および引
張試験した試験片の破断面の観察により行ない、◎：極
めて良好、○：良好、×：成形品が層状剥離を起こす、
を判定基準とした。(5) Peelability of molded products The ability to prevent delamination of molded products was determined by bending the molded product and observing the fracture surface of a tensile test specimen. cause,
was used as the criterion.
物性測定用試験片は、実施例及び比較例で得られたペレ
ットを射出成形機にて、１７８インチ厚の平板（縦９０
ｍｍ、横５０ ｍｍ ）と、１７８インチ及び１／４イ
ンチ厚のテストピースを成形し用いた。The test pieces for measuring physical properties were made by molding the pellets obtained in the Examples and Comparative Examples into flat plates with a thickness of 178 inches (vertical: 90 mm) using an injection molding machine.
Test pieces of 178 inches and 1/4 inch thickness were molded and used.
実施例１〜６
ＡＢＳ樹脂、ＡＳ樹脂、ポリアミドエラストマ、及び電
解質を第１表に示す割合でｌ混合し、スクリュー径３０
順の二軸押出機（ナカタニ機械■製、ＡＳ ３０型）を
用い、シリンダー温度２４０’Ｃ。Examples 1 to 6 ABS resin, AS resin, polyamide elastomer, and electrolyte were mixed in the proportions shown in Table 1, and the screw diameter was 30.
Using a double-screw extruder (manufactured by Nakatani Kikai, Model AS 30), the cylinder temperature was 240'C.
スクリュー回転数７５ ｒｐｍで溶融製練し、１０ｋｇ
／ｈｒの押出速度で押出を行い、３本のストランドとし
た後、水で約３０°Ｃまで冷却した。Melted and milled at a screw rotation speed of 75 rpm, 10 kg
After extrusion was performed at an extrusion speed of /hr to form three strands, the strands were cooled to about 30°C with water.
次いで、冷却したストランドを造粒して、樹脂組成物の
ペレットを得た。Next, the cooled strands were granulated to obtain pellets of the resin composition.
このペレットを８０°Ｃで約３時間ギヤオープン中で斃
燥したのち、シリンダー温度２４０°Ｃ１金型温度４５
°Ｃの条件で射出成形を行い、物性測定用及び表面抵抗
率測定用試験片を作成した。After drying the pellets at 80°C for about 3 hours in an open gear, the cylinder temperature was 240°C, the mold temperature was 45°C.
Injection molding was performed under the conditions of °C to prepare test pieces for measuring physical properties and measuring surface resistivity.
いずれも優れた光沢を示した。得られた試験片の諸性質
を先に述べた方法に従って測定評価した。All exhibited excellent gloss. Various properties of the obtained test piece were measured and evaluated according to the method described above.
その結果を第１表に示す。The results are shown in Table 1.
比較例１〜３
ＡＢＳ樹脂、ＡＳ樹脂、ポリアミドエラストマ及び電Ｍ
質を第１表に示す割合で混合し、実施例１〜５と同様に
して試験片を作威し、各種評価を行なった。その結果を
第１表に示す。Comparative Examples 1 to 3 ABS resin, AS resin, polyamide elastomer and electric M
The materials were mixed in the proportions shown in Table 1, test pieces were prepared in the same manner as in Examples 1 to 5, and various evaluations were performed. The results are shown in Table 1.
（以下余白） 手 続 補 正 書（自発） 平成２年２月９日(Margin below) hand Continued Supplementary Positive calligraphy (spontaneous) February 9, 1990
Claims (1)
アミドエラストマー３〜３重量％と（Ｃ）（メタ）アク
リル酸エステル系重合体１〜４５重量％からなることを
特徴とする樹脂組成物。 ２、（Ａ）ＡＢＳ系樹脂２５〜９６重量％と（Ｂ）ポリ
アミドエラストマー ３〜３重量％と（Ｃ）（メタ）ア
クリル酸エステル系重合体１〜４５重量％からなる組成
物１００重量部に、（Ｄ）有機電解質又は無機電解質の
中から選ばれた少なくとも１種の電解質０．０１〜１０
重量部を含有させたことを特徴とする樹脂組成物。[Claims] 1. Consisting of (A) 25 to 96% by weight of ABS resin, (B) 3 to 3% by weight of polyamide elastomer, and (C) 1 to 45% by weight of (meth)acrylic acid ester polymer. A resin composition characterized by: 2. 100 parts by weight of a composition consisting of (A) 25 to 96% by weight of ABS resin, (B) 3 to 3% by weight of polyamide elastomer, and (C) 1 to 45% by weight of (meth)acrylic acid ester polymer. , (D) at least one electrolyte selected from organic electrolytes or inorganic electrolytes 0.01 to 10
A resin composition characterized in that it contains parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1498390A JPH03221552A (en) | 1990-01-26 | 1990-01-26 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1498390A JPH03221552A (en) | 1990-01-26 | 1990-01-26 | Resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03221552A true JPH03221552A (en) | 1991-09-30 |
Family
ID=11876198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1498390A Pending JPH03221552A (en) | 1990-01-26 | 1990-01-26 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03221552A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004256777A (en) * | 2003-02-28 | 2004-09-16 | Toyo Ink Mfg Co Ltd | Antistatic resin composition and its molded article |
| JP2006273877A (en) * | 2005-03-25 | 2006-10-12 | Techno Polymer Co Ltd | Thermoplastic resin composition and molded article |
| JP2010163630A (en) * | 2010-05-06 | 2010-07-29 | Asahi Kasei Chemicals Corp | Cover, case or housing |
-
1990
- 1990-01-26 JP JP1498390A patent/JPH03221552A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004256777A (en) * | 2003-02-28 | 2004-09-16 | Toyo Ink Mfg Co Ltd | Antistatic resin composition and its molded article |
| JP2006273877A (en) * | 2005-03-25 | 2006-10-12 | Techno Polymer Co Ltd | Thermoplastic resin composition and molded article |
| JP2010163630A (en) * | 2010-05-06 | 2010-07-29 | Asahi Kasei Chemicals Corp | Cover, case or housing |
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