JPH03220229A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPH03220229A JPH03220229A JP30887790A JP30887790A JPH03220229A JP H03220229 A JPH03220229 A JP H03220229A JP 30887790 A JP30887790 A JP 30887790A JP 30887790 A JP30887790 A JP 30887790A JP H03220229 A JPH03220229 A JP H03220229A
- Authority
- JP
- Japan
- Prior art keywords
- formulas
- tables
- resin
- formula
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 25
- 239000004593 Epoxy Substances 0.000 claims abstract description 30
- 150000001875 compounds Chemical class 0.000 claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- 239000000203 mixture Substances 0.000 claims abstract description 21
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims abstract description 18
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims abstract description 13
- 150000002989 phenols Chemical class 0.000 claims abstract description 9
- 235000010290 biphenyl Nutrition 0.000 claims abstract description 8
- 239000004305 biphenyl Substances 0.000 claims abstract description 8
- 229920003986 novolac Polymers 0.000 claims abstract description 8
- 239000011256 inorganic filler Substances 0.000 claims abstract description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 7
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 3
- 238000005538 encapsulation Methods 0.000 claims description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims 10
- 230000035939 shock Effects 0.000 abstract description 12
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000005350 fused silica glass Substances 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 2
- LMBFAGIMSUYTBN-MPZNNTNKSA-N teixobactin Chemical compound C([C@H](C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CO)C(=O)N[C@H](CCC(N)=O)C(=O)N[C@H]([C@@H](C)CC)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CO)C(=O)N[C@H]1C(N[C@@H](C)C(=O)N[C@@H](C[C@@H]2NC(=N)NC2)C(=O)N[C@H](C(=O)O[C@H]1C)[C@@H](C)CC)=O)NC)C1=CC=CC=C1 LMBFAGIMSUYTBN-MPZNNTNKSA-N 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 description 15
- 230000007423 decrease Effects 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 11
- 238000005476 soldering Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 229920001568 phenolic resin Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229940126062 Compound A Drugs 0.000 description 2
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- MPDDTAJMJCESGV-CTUHWIOQSA-M (3r,5r)-7-[2-(4-fluorophenyl)-5-[methyl-[(1r)-1-phenylethyl]carbamoyl]-4-propan-2-ylpyrazol-3-yl]-3,5-dihydroxyheptanoate Chemical group C1([C@@H](C)N(C)C(=O)C2=NN(C(CC[C@@H](O)C[C@@H](O)CC([O-])=O)=C2C(C)C)C=2C=CC(F)=CC=2)=CC=CC=C1 MPDDTAJMJCESGV-CTUHWIOQSA-M 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- JZUFKLXOESDKRF-UHFFFAOYSA-N Chlorothiazide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC2=C1NCNS2(=O)=O JZUFKLXOESDKRF-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 102000011759 adducin Human genes 0.000 description 1
- 108010076723 adducin Proteins 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- -1 siloxane chains Chemical group 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は高集精度ＩＣ封止用樹脂組成物に適する超低応
力、高強度、低粘度のエポキシ樹脂組成物に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an epoxy resin composition with ultra-low stress, high strength, and low viscosity that is suitable for a resin composition for high-accuracy IC sealing.
エポキシ樹脂は耐熱性、電気特性、機械強度や接着性に
優れた樹脂であり、塗料、接着剤、電子部品封止用樹脂
、積層板用樹脂やその信子方面にわたって広く用いられ
ている樹脂である。Epoxy resin is a resin with excellent heat resistance, electrical properties, mechanical strength, and adhesive properties, and is widely used in paints, adhesives, electronic component sealing resins, laminate resins, and their components. .
例えばＩＣ，ＬＳＩ、トランジスター、ダイオードなと
の半導体素子や電子回路等の樹脂封止には特性、コスト
の両面からエポキシ樹脂組成物か一般に用いられている
。For example, epoxy resin compositions are generally used for resin encapsulation of semiconductor elements and electronic circuits such as ICs, LSIs, transistors, and diodes, from the viewpoint of both properties and cost.
しかし近年ＩＣサイズの増大、パッケージサイズの小型
化・薄・自他により、■温度サイクルによるパッケージ
クラックの増大、■表面実装時の半田熱衝撃によるパッ
ケージクラックの増大か生しやすくなり、これらを改善
する効果的な手法が強く求められている。However, in recent years, with the increase in IC size and the miniaturization, thinness, and other factors of package sizes, it has become easier to cause (increase in package cracks due to temperature cycling) and (increase in package cracks due to solder thermal shock during surface mounting), so these issues need to be improved. There is a strong need for effective methods to do so.
これらを改善するため、（Ｄ低弾性率化、■低熱膨張係
数化、■高衝撃強度化、■低吸水率化が検討されている
。In order to improve these, (D) lowering the elastic modulus, (2) lowering the coefficient of thermal expansion, (2) increasing impact strength, and (2) lowering water absorption are being considered.
（Ｄ低弾性率化については、シリコーン変性エポキシ樹
脂化合物を利用する方法（特開昭６１−７３７２５号公
報、特開昭６２−１７４２２２号公報）か効果かあると
言われているか、単に低弾性化するたけては強度も低下
するため半田耐熱性か低下し、良好な半導体封止用樹脂
組成物は得られなかった。(D Regarding lowering the elastic modulus, it is said that there is a method using a silicone-modified epoxy resin compound (JP-A-61-73725, JP-A-62-174222). As the resin composition deteriorates, the strength also decreases, and the soldering heat resistance also decreases, making it impossible to obtain a good resin composition for semiconductor encapsulation.
■低熱膨張係数化については、樹脂組成物中のノリ力充
填材量を増加させることが効果的といわれるか、充填材
量増加にともなう樹脂組成物の粘度の上昇が問題となり
、成形性の著しい低下をクリアする必要かあった。■Increasing the amount of adhesive filler in the resin composition is said to be effective for lowering the coefficient of thermal expansion, or the problem is that the viscosity of the resin composition increases as the amount of filler increases, resulting in significant moldability. It was necessary to clear the decline.
■高衝撃強度化については、ビフェニル型エポキシ樹脂
や３官能エポキシ樹脂の使用（特開昭６１−１６８６２
０号公報）が効果あるといわれているが、いずれも成形
性、特にウスバリ特性や金型汚れ性の低下がみられる。■For high impact strength, use of biphenyl-type epoxy resin or trifunctional epoxy resin (Japanese Patent Application Laid-Open No. 61-16862
No. 0) is said to be effective, but all of them show deterioration in moldability, especially in mold properties and mold staining properties.
■低吸水率化については、シリコーン変性樹脂の使用や
充填材量の増加が効果あるといわれているが、いずれも
上記に示す欠点があり、実用化にまでは至っていない。(2) It is said that using silicone-modified resin and increasing the amount of filler are effective in reducing water absorption, but both have the drawbacks mentioned above and have not been put into practical use.
本ＩＩＳ明の目的とするところは成形性、流動性、電気
特性および他の諸特性を劣化させることなく耐熱衝撃性
、半田耐熱性に非常に優れた樹脂組成物を提供すること
にある。The purpose of this IIS is to provide a resin composition that has excellent thermal shock resistance and soldering heat resistance without deteriorating moldability, fluidity, electrical properties, and other various properties.
本発明者らはこれらの問題を解決するために鋭意研究を
進め、つぎの組成をもつ組成物を見出した。衝撃強度向
上、低粘度化に効果を有する下記式（１）で示されるナ
フタレン型エポキシ化合物と、式（ＩＩ）で示される、
ビフェニル型エポキシ化合物
またはこれらの化合物とエポキシ樹脂との混合物と、低
弾性率化、低吸水率化に効果を有するシリコーン変性フ
ェノール樹脂硬化剤（下記式（Ｉ［）、（ＩＶ）で示さ
れるノリコーン化合物とフェノール樹脂との反応物）
を組み合わせ、さらに全樹脂組成物中の無機充填材の含
有量を７０〜９０重量％とじ、硬化促進剤を必須成分と
することにより、低弾性、低熱膨張係数、高強度、低吸
水率の極めてバランスのとれた優れた半導体封止用樹脂
組成物かえられることを見出して本願発明を完成するに
至ったものである。The present inventors conducted extensive research to solve these problems and discovered a composition having the following composition. A naphthalene type epoxy compound represented by the following formula (1) which is effective in improving impact strength and reducing viscosity, and a naphthalene type epoxy compound represented by formula (II),
A biphenyl-type epoxy compound or a mixture of these compounds and an epoxy resin, and a silicone-modified phenolic resin curing agent that is effective in lowering the elastic modulus and water absorption (Noricone represented by the following formulas (I[) and (IV))] By combining a compound (a reaction product of a compound and a phenolic resin), limiting the content of inorganic filler in the total resin composition to 70 to 90% by weight, and making a curing accelerator an essential component, low elasticity and a low coefficient of thermal expansion are achieved. The present invention was completed by discovering that it is possible to create an excellent resin composition for semiconductor encapsulation that has an extremely well-balanced combination of high strength and low water absorption.
本発明において用いられる式〔Ｉ〕で示される構造のナ
フタレン型エポキシ樹脂や、式（ＩＩ）で示されるビフ
ェニル型エポキシ樹脂は成形温度（１６５〜１８５°Ｃ
）において数センチボイズという低粘度を存するために
樹脂組成物の粘度を著しく低下させることか可能のため
、樹脂組成物中の充填材含有量を通常量より大幅にアッ
プさせることか出来る。The naphthalene type epoxy resin having the structure represented by the formula [I] used in the present invention and the biphenyl type epoxy resin having the structure represented by the formula (II) have a molding temperature (165 to 185°C).
) has a low viscosity of several centimeter voids, which makes it possible to significantly reduce the viscosity of the resin composition, making it possible to significantly increase the filler content in the resin composition compared to the usual amount.
そしてこれらの平面構造を有するエポキン化合物は分子
同志のバッキングか良好のために樹脂組成物の衝撃強度
を向上させ、耐熱衝撃性、半田耐湿性、半田後の耐湿性
等に優れるという特徴を有している。These Epoquin compounds with a planar structure have good backing between molecules, which improves the impact strength of the resin composition, and has characteristics such as excellent thermal shock resistance, soldering moisture resistance, and post-soldering moisture resistance. ing.
しかしながら、これらの樹脂を３０重量％以上含むエポ
キシ樹脂は、他の樹脂との反応性、相溶性が悪く、しか
も粘度が低いために成形性、特にウスバリ特性、金型汚
れ性か低下するという問題を有していた。However, epoxy resins containing 30% by weight or more of these resins have poor reactivity and compatibility with other resins, and low viscosity, resulting in a problem of poor moldability, especially thinness properties, and mold stain resistance. It had
しかし、この問題は後述するシリコーン変性フェノール
樹脂との組み合わせてクリアすることか可能である。However, this problem can be overcome by combining it with a silicone-modified phenol resin, which will be described later.
式〔Ｉ〕で示されるナフタレン型エポキシ化合物とＣＩ
Ｉ）で示されるビフェニル型エポキシ化合物は、他のエ
ポキシ樹脂と混合して用いても良いか、総量か総エボキ
ソ樹脂量中の３０重量％以北とすることか必要である。Naphthalene type epoxy compound represented by formula [I] and CI
The biphenyl type epoxy compound represented by I) may be used in combination with other epoxy resins, or it must be used in an amount of 30% by weight or more based on the total amount of epoxy resin.
３０重量％未満の場合は低粘度、低吸水、高衝撃強度の
いずれも得られず、半田耐熱性や流動性の悪い樹脂組成
物となる。When the amount is less than 30% by weight, neither low viscosity, low water absorption, nor high impact strength can be obtained, resulting in a resin composition with poor soldering heat resistance and fluidity.
式〔Ｉ〕で示されるナフタレン型エポキシ樹脂と、式（
ＩＩＩで示されるビフェニル型エポキシ樹脂とは重量比
で１０／９０〜９０／ １０の割合内で併用する。A naphthalene type epoxy resin represented by the formula [I] and a naphthalene type epoxy resin represented by the formula (
It is used together with the biphenyl type epoxy resin represented by III in a weight ratio of 10/90 to 90/10.
ナフタレン型エポキシ化合物は反応性が高く、しかも強
度向上に効果有るため半田耐熱性は良くなるが、耐熱衝
撃性は十分でない。また液状のために取扱いか困難であ
・る。Naphthalene-type epoxy compounds have high reactivity and are effective in improving strength, so they improve soldering heat resistance, but do not have sufficient thermal shock resistance. Also, because it is liquid, it is difficult to handle.
一方、ビフェニル型エポキシ化合物は半田耐熱性と耐熱
衝撃性にすぐれ、結晶性のために取扱いに不便さはない
か、多少反応性か低い傾向にある。On the other hand, biphenyl-type epoxy compounds have excellent soldering heat resistance and thermal shock resistance, and because of their crystallinity, they tend to be inconvenient to handle or have somewhat low reactivity.
両者を併用して使用することにより、お互いの欠点をお
ぎなう樹脂組成物を得ることができる。By using both in combination, a resin composition that overcomes the drawbacks of each can be obtained.
本発明で（Ｂ）成分として用いるシリコーン変性フェノ
ール樹脂の原料としてのフェノール樹脂はフェノールノ
ボラック樹脂、クレゾールノホラソタ樹脂及びこれらの
変性樹脂等か挙げられ、これらは１＃＠又は２種以上混
合して用いることも出来る。Phenolic resins as raw materials for the silicone-modified phenolic resin used as component (B) in the present invention include phenol novolac resins, cresol nohorasota resins, and modified resins thereof, and these may be used in 1#@ or in combination of two or more. It can also be used as
これらのフェノール樹脂の中でも、水酸基当量か８０〜
＋５０、軟化点か６０〜１２０℃でありＮａ’、ＣＩ−
等のイオン性不純物を出来る限り除いたものか好ましい
。Among these phenolic resins, the hydroxyl equivalent is 80~
+50, softening point is 60~120℃, Na', CI-
It is preferable to remove ionic impurities such as as much as possible.
また、本発明のシリコーン変性フェノール樹脂の一方の
原料として用いられるオルガノポリシロキサンは、上述
のフェノール樹脂と反応し得る官能基を有するもので、
官能基としては、たとえばカルボキシル基、シクロヘキ
シル型エポキシ基、グリシジル型エポキシ基、活性水素
等が挙げられる。Furthermore, the organopolysiloxane used as one of the raw materials for the silicone-modified phenolic resin of the present invention has a functional group that can react with the above-mentioned phenolic resin,
Examples of the functional group include a carboxyl group, a cyclohexyl epoxy group, a glycidyl epoxy group, and active hydrogen.
分子構造は下記式（ＩＩＩ）、（ＩＶ）で示される才。The molecular structure is shown by the following formulas (III) and (IV).
ルガノポリシロキサンてあり
Ｒ・低級アルキレン
Ｎ （／＋ｍ＋ｎ＋２）か１０未満の時は、低弾性率性
、高強度性が低下し、しかもフェノールノボラック樹脂
と、の反応性基（式（ＩＩＩ）、（ＩＶ）のＡ基〉が１
分子中に１つも存在しないオルガノポリシロキサンが副
生成物として存在する可能性が大きくなるためにシリコ
ーン変性フェノール樹脂硬化剤の合成が困難となり、メ
リットか少ない。When the ratio of luganopolysiloxane R and lower alkylene N (/+m+n+2) is less than 10, low elastic modulus and high strength decrease, and moreover, reactive groups (formula (III), ( IV) A group〉 is 1
Since there is a greater possibility that organopolysiloxane, which does not exist at all in the molecule, exists as a by-product, it becomes difficult to synthesize a silicone-modified phenolic resin curing agent, and there are few benefits.
また、Ｎか２００より大きい場合、フェノールノボラッ
ク樹脂との混和性が低下し、十分に合成反応か進まない
ために、樹脂からシリコーンオイルがブリードし、成形
性を大きく損なう。Furthermore, if N is greater than 200, the miscibility with the phenol novolak resin decreases and the synthesis reaction does not proceed sufficiently, causing silicone oil to bleed from the resin, greatly impairing moldability.
さらに、式（Ｉｔ）、（Ｉ）のすルガノポリノロキサン
において、ｍ ／ Ｎはθ〜０．１か望ましく、０．１
を越えるとシロキサン鎖の熱運動か抑制され、ノロキサ
ン成分のＴｇか高温側にシフトするためにより高温域か
らてないと低応力効果か生じず、樹脂組成物の耐熱衝撃
性か低下する。Furthermore, in the sulfanopolynoroxanes of formulas (It) and (I), m/N is preferably θ ~ 0.1, preferably 0.1
If the temperature exceeds this temperature, the thermal movement of the siloxane chains will be suppressed, and the Tg of the noroxane component will shift to the high temperature side, so that a low stress effect will not be produced unless the temperature is within a higher temperature range, and the thermal shock resistance of the resin composition will deteriorate.
また、０．１を越えるとオルガノポリシロキサン合成の
コストが高くなってしまう。Moreover, if it exceeds 0.1, the cost of organopolysiloxane synthesis will increase.
ｍ／ＮはＯ，１以下ならばとのような値であっても良い
か、０．０５程度が望ましい。m/N may be a value such as O.1 or less, or is preferably about 0.05.
シロキサンのＴｇの高温へのシフトもなく、しかも側鎖
官能基の存在のためフェノールノボラック樹脂との相溶
性が向上し、ノリコーン変性フェノール樹脂の合成が容
易となるためである。This is because there is no shift in the Tg of siloxane to high temperatures, and the presence of side chain functional groups improves compatibility with phenol novolak resins, making it easier to synthesize noricone-modified phenol resins.
そして５≦Ｎ／ｎ≦５０であることが望ましい。It is desirable that 5≦N/n≦50.
Ｎ／ｎが５０より大きければオルガノポリシロキサンと
フェノール樹脂との反応性か悪いため、未反応のすルガ
ノポリシロキサンのブリードがあり、成形性が低下する
。５より小さければ、合成反応時にゲル化を起こし、満
足出来るノリコーン変性フェノール樹脂か得られない。If N/n is greater than 50, the reactivity between the organopolysiloxane and the phenol resin is poor, and unreacted sulganopolysiloxane bleeds out, resulting in poor moldability. If it is smaller than 5, gelation will occur during the synthesis reaction, making it impossible to obtain a satisfactory noricone-modified phenol resin.
ノリコーン変性フェノール樹脂中のノリコーン成分の含
有ｌは原料フェノール樹脂１００重量部に対して１０〜
５０重量部となる範囲のものか好適に用いられる。The content of the noricorn component in the noricorne modified phenolic resin is 10 to 100 parts by weight per 100 parts by weight of the raw material phenolic resin.
A range of 50 parts by weight is preferably used.
シリコーン成分が１０重量部未満の場合は耐熱衝撃性が
不十分てあり、５０重量部を越えれば反応率が低下し、
未反応のすルガノポリシロキサンかブリードし成形性か
低下する。If the silicone component is less than 10 parts by weight, the thermal shock resistance is insufficient, and if it exceeds 50 parts by weight, the reaction rate will decrease.
Unreacted surganopolysiloxane bleeds, reducing moldability.
尚、本発明においてシリコーン変性フェノール樹脂硬化
剤は単独もしくは従来からあるフェノール系樹脂硬化剤
と混合して用いても良いか、これらの混合系においては
ランダム共重合シリコーン変性フェノール樹脂は硬化剤
系の内３０重量％以上用いることか好ましく、３０重量
％未満となると耐熱衝撃性が低下する。In the present invention, the silicone-modified phenolic resin curing agent may be used alone or in combination with a conventional phenolic resin curing agent. In these mixed systems, the random copolymerized silicone-modified phenolic resin may be used as a curing agent. It is preferable to use 30% by weight or more, and if it is less than 30% by weight, thermal shock resistance will decrease.
総エポキシ成分と総フェノール成分は当量比でエポキシ
基／フェノール性水酸基か７０／１００〜Ｉ ＯＯ／７
０の範囲か好適である。当量比か７０／１００未満もし
くは＋ ００／７０より大きいとＴｇの低下、熱時硬度
の低下、耐湿性の低下等か生し、半導体封止用樹脂組成
物として不適となってしまう。The equivalent ratio of the total epoxy component and the total phenol component is epoxy group/phenolic hydroxyl group or 70/100 to IOO/7.
A range of 0 is preferred. If the equivalent ratio is less than 70/100 or greater than +00/70, there will be a decrease in Tg, a decrease in hardness when heated, a decrease in moisture resistance, etc., making it unsuitable as a resin composition for semiconductor encapsulation.
なお、通常のエボキン樹脂−フエノール樹脂系組成物に
上記ナフタレン型エポキシ化合物およびビフェニル型エ
ポキシ化合物を配合すればウスバリ特性が低下するが、
本発明のようにエポキシ樹脂−シリコーン変性フェノー
ル樹脂系組成物にナフタレン型エポキシ化合物およびビ
フェニル型エポキシ化合物を配合すれば、低分子のエポ
キシ化合物はシリコーン変性による高重合度成分とも反
応するため、ブリードしに（（なり、ウスバリ特性は低
下しない。 本発明で用いられる（Ｃ）成分としての無
機充填材としては結晶性シリカ、溶融シリカ、アルミナ
、炭酸カルシウム、タルク、マイカ、ガラス繊維等が挙
げられ、これらは１種又は２種以上混合して使用される
。これらの中で特に結晶性シリカまたは溶融シリカが好
適に用いられる。Note that if the naphthalene-type epoxy compound and biphenyl-type epoxy compound are blended into a normal Evokin resin-phenol resin composition, the usability properties will decrease;
If a naphthalene-type epoxy compound and a biphenyl-type epoxy compound are blended into an epoxy resin-silicone-modified phenol resin composition as in the present invention, the low-molecular-weight epoxy compound also reacts with the high degree of polymerization component resulting from silicone modification, so it will not bleed. The inorganic filler as component (C) used in the present invention includes crystalline silica, fused silica, alumina, calcium carbonate, talc, mica, glass fiber, etc. These may be used alone or in combination of two or more. Among these, crystalline silica or fused silica is particularly preferably used.
いずれの場合も、無機充填材の量は総樹脂組成物中の７
０〜９０重ｆｉＬｏ４を占めることか必要である。７０
重量０６未満の場合は、熱膨張係数が増大し、低応力効
果か十分てないために耐熱衝撃性が低下し、また吸水率
か上昇することにより半田耐熱性か低下し、さらに低粘
度になりすぎるためウスバリが発生し成形性が低下する
。In either case, the amount of inorganic filler is 7% in the total resin composition.
It is necessary to occupy 0 to 90 times fiLo4. 70
If the weight is less than 06, the coefficient of thermal expansion will increase, the low stress effect will not be sufficient, so the thermal shock resistance will decrease, and the water absorption will increase, so the soldering heat resistance will decrease, and the viscosity will further decrease. If it is too thick, burrs will occur and moldability will deteriorate.
９０重量０６より大きい場合は高粘度になりすぎ成形で
きなくなる。If the weight exceeds 90 and 06, the viscosity becomes too high and molding becomes impossible.
また、本発明に使用される硬化促進剤はエポキシ基とフ
ェノール性水酸基との反応を促進するものであれば良く
、一般に封止用材料に使用されているものを広く使用す
ることができ、例えばＢＤＭＡ等の第３級アミン類、イ
ミダゾール類、ｌ、８−ジアザビシクロ〔５，４，０〕
ウンデセン−７、トリフェニルホスフィン等の有機リン
化合物等が単独もしくは２種以上混合して用いられる。Further, the curing accelerator used in the present invention may be one that promotes the reaction between the epoxy group and the phenolic hydroxyl group, and a wide variety of those commonly used in sealing materials can be used, such as Tertiary amines such as BDMA, imidazoles, l,8-diazabicyclo[5,4,0]
Organic phosphorus compounds such as undecene-7 and triphenylphosphine can be used alone or in combination of two or more.
その他必要に応じてワックス類等の離型剤、ヘキサブロ
ムベンゼン、デカブロムビフェニルエーテル、三酸化ア
ンチモン等の難燃剤、カーボンプラック、ベンガラ等の
着色網、ンランカソブリング剤その地熱可塑性樹脂等を
適宜添加配合することかてきる。In addition, as necessary, mold release agents such as waxes, flame retardants such as hexabromobenzene, decabromo biphenyl ether, and antimony trioxide, colored nets such as carbon plaque and red iron oxide, phosphorescent bonding agents, geothermal plastic resins, etc. It can be added and blended as appropriate.
本発明の半導体封止用エポキシ樹脂組成物を製造するに
は一般的な方法としては、所定の配合比の原料をミキサ
ー等によって十分に混合した後、更にロールやニーダ−
等により溶融混線処理し、次いて冷却固化させて適当な
大きさに粉砕することにより容易に製造することが出来
る。The general method for producing the epoxy resin composition for semiconductor encapsulation of the present invention is to thoroughly mix raw materials in a predetermined blending ratio using a mixer, etc., and then further mix them using a roll or kneader.
It can be easily produced by carrying out a melt cross-fertilization process, followed by cooling and solidifying, and pulverizing into an appropriate size.
フェノールノボラック樹脂（軟化点１０５℃、ＯＨ当量
１０５）とオルガノポリシロキサンとを溶媒中で触媒存
在下で反応させ、第−表に示すンリコーン変性フェノー
ル樹脂（イ〜チ）を得た。A phenol novolac resin (softening point: 105 DEG C., OH equivalent: 105) and an organopolysiloxane were reacted in a solvent in the presence of a catalyst to obtain oleicone-modified phenol resins (1 to 1) shown in Table 1.
実施例１
ナフタレン型エポキシ化合物 ５０重量部ビフェ
ニル型エポキシ化合物Ａ ５０１量部臭素化ビスフ
ェノールＡ型エポキシ樹脂（エポキシ当量３７０、軟化
点６５℃、臭素含有率３７％）
ｌＯ重量部シリコーン変性フフェノールノボラック
樹脂イ）７０重量部
破砕状溶融ンリカ ８００重量部三酸化
アンチモン １０重量部シランカップ
リング剤 ２重量部トリフェニルホスフ
・イン ２重量部カーボンブラック
３重量部カルナバワックス
３重量部を常温で十分に混合し、更に９５〜１
００℃で２軸ロールにより混練し、冷却後粉砕して成形
材料とし、これをタブレット化して半導体封止用エポキ
シ樹脂組成物を得た。Example 1 Naphthalene type epoxy compound 50 parts by weight Biphenyl type epoxy compound A 501 parts by weight Brominated bisphenol A type epoxy resin (epoxy equivalent 370, softening point 65°C, bromine content 37%)
10 parts by weight Silicone-modified phenol novolac resin a) 70 parts by weight Crushed molten liquor 800 parts by weight Antimony trioxide 10 parts by weight Silane coupling agent 2 parts by weight Triphenylphosphine 2 parts by weight Carbon black
3 parts by weight carnauba wax
Thoroughly mix 3 parts by weight at room temperature, and then add 95 to 1
The mixture was kneaded using twin-screw rolls at 00°C, cooled, and then ground to obtain a molding material, which was then made into tablets to obtain an epoxy resin composition for semiconductor encapsulation.
この材料をトランスファー成形機（成形条件：金型温度
１７５℃、硬化時間２分）を用いて成形し、得られた成
形品を１７５℃、８時間で後硬化し評価した。結果を第
２表に示す。This material was molded using a transfer molding machine (molding conditions: mold temperature 175°C, curing time 2 minutes), and the resulting molded product was post-cured at 175°C for 8 hours and evaluated. The results are shown in Table 2.
実施例２〜４
実施例１と同様にして第１表に示す組成物の半導体封止
用エポキシ樹脂組成物を得た。Examples 2 to 4 Epoxy resin compositions for semiconductor encapsulation having the compositions shown in Table 1 were obtained in the same manner as in Example 1.
この半導体封止用エポキシ樹脂組成物の評価結果を第２
表に示す。The evaluation results of this epoxy resin composition for semiconductor encapsulation were evaluated in the second
Shown in the table.
比較例１〜１１
実施例１と同様にして第１表に示す組成物の半導体封止
用エボキン樹脂組成物を得た。Comparative Examples 1 to 11 Evoquin resin compositions for semiconductor encapsulation having the compositions shown in Table 1 were obtained in the same manner as in Example 1.
この半導体封止用エポキシ樹脂組成物の評価結果を第２
表に示す。The evaluation results of this epoxy resin composition for semiconductor encapsulation were evaluated in the second
Shown in the table.
※ｌ 下記式（Ｖ〕て示されるオルがノポリシロキサン
※３ 下記式〔■〕で示されるオルガノポリシロキサン
※４ 下記式〔■〕で示されるオルガノポリシロ※２
下記式（ＶＩ）で示されるオルガノポリシロ※５ 下記
式（ＩＸ）で示されるオルガノポリシロキサン
キサン
※６
下記式
（）
で示されるオルガノポリノロ
※９
下記式
％式％）
て示されるビフェニル型工
牛サン
ポキシ化合物Ａ
（エポキシ当量１
８５）
※１０
下記式Ｂ
（ＸＩＶ）
て示されるビフェニル型
※７
下記式〔Ｘ！〕
で示されるオルガノボリノ
エホキシ化合物
（エポキシ当量１
５５）
ロキサン
※１１
下記式
に示すエポキシ樹脂
西。*l Nopolysiloxane represented by the following formula (V) *3 Organopolysiloxane represented by the following formula [■] *4 Organopolysiloxane represented by the following formula [■] *2
Organopolysiloxane represented by the following formula (VI) *5 Organopolysiloxane xane represented by the following formula (IX) *6 Organopolysiloxane represented by the following formula () *9 Biphenyl type represented by the following formula (% formula %) Engineered sampoxy compound A (epoxy equivalent: 1 85) *10 Biphenyl type shown by the following formula B (XIV) *7 The following formula [X! ] Organoborino epoxy compound represented by (epoxy equivalent: 155) Roxane*11 An epoxy resin represented by the following formula.
※８
下記式
（［）
で示すナフタレン型エポキ
シ化合物（エポキシ当量１
５１）
※１２
下記式
（）
に示すフェノール樹脂
評価方法
スパイラルフロー
ＥＭＭＩ−１−６６に準したスパイラルフロー測定用金
型を用い、試料を２０ｇ、成形温度１７５℃、成形圧カ
フ、 ＯＭ Ｐ ａ、成形時間２分て成型した時の成形
品の長さ。*8 Naphthalene-type epoxy compound represented by the following formula ([) (epoxy equivalent: 151) *12 Using a spiral flow measurement mold according to the phenol resin evaluation method spiral flow EMMI-1-66 shown in the following formula (), The length of the molded product when 20 g of sample was molded at a molding temperature of 175°C, a molding pressure cuff of OM Pa, and a molding time of 2 minutes.
ウスバリ長さ 得られた１６ｐＤＩＰ成形品のベントバリの長さ。Usbari length The length of the bent burr of the obtained 16p DIP molded product.
曲げ強度、弾性率
テンシロン曲げ強さ測定機、スパン１００ｍｍ、負荷速
度１０１１１Ｉ／ｍｉｎ 、室温における測定値。Bending strength, elastic modulus Tensilon bending strength measuring machine, span 100 mm, loading rate 10111 I/min, measured values at room temperature.
熱膨張係数
熱膨張係数測定機、サンプルサイズ１５×３×４閣、２
５℃時の熱膨張係数。Thermal expansion coefficient Thermal expansion coefficient measuring machine, sample size 15 x 3 x 4, 2
Thermal expansion coefficient at 5℃.
Ｔｇ（ガラス転移温度）
熱膨張係数測定機、サンプルサイズ１５×３４ｍ
耐熱衝撃試験
成形品（チップサイズ３６閣２ パッケージ厚２．（ｌ
ｏａ）２０個の温度サイクルのテスト（＋１５０〜−１
９６℃）にかけ、＋０００サイクルのテストを行いクラ
ックの発生した個数を示す。Tg (glass transition temperature) Thermal expansion coefficient measuring machine, sample size 15 x 34 m, thermal shock resistance test molded product (chip size 36 cm, package thickness 2. (l)
oa) Test of 20 temperature cycles (+150 to -1
96°C) and subjected to a test of +000 cycles, and the number of cracks generated is shown.
半田耐熱性試験
成形品（チップサイズ３６閣２ パッケージ厚２．０ｍ
＋）２０個について８５°Ｃ１８５％ＲＨの水蒸気下で
７２時間処理後、２４０″ＣのＩＲリフロー処理を行い
、クラックの発生した個数を示す。Solder heat resistance test molded product (chip size 36mm 2, package thickness 2.0m)
+) 20 pieces were treated under steam at 85°C and 185% RH for 72 hours, and then subjected to IR reflow treatment at 240″C, and the number of pieces with cracks is shown.
本発明のナフタレン型エポキシ化合物及びビフェニル型
エポキシ化合物、シリコーン変性フェノール樹脂硬化刑
、無機充填剤および硬化促進剤を必須成分とする半導体
封止用樹脂組成物は耐熱衝撃性に極めて優れ、低粘度で
あり、このため金線変形性および充填性に優れ、さらに
成形加工性（樹脂パリ）や半田耐熱性にも優れ、極めて
バランスのとれた樹脂組成物であるため高集積度ＩＣ封
止用樹脂組成物として非常に信頼性の高いものである。The semiconductor encapsulation resin composition of the present invention, which contains a naphthalene-type epoxy compound, a biphenyl-type epoxy compound, a silicone-modified phenol resin curing agent, an inorganic filler, and a curing accelerator as essential components, has extremely excellent thermal shock resistance, low viscosity, and As a result, it has excellent gold wire deformability and filling properties, as well as excellent molding processability (resin breakage) and soldering heat resistance, and is an extremely well-balanced resin composition, making it an excellent resin composition for encapsulating highly integrated ICs. It is extremely reliable as a product.
Claims (1)
エポキシ化合物と下記式〔II〕で示されるビフェニル型
エポキシ化合物を重量比で１０／９０〜９０／１０の割
合で混合した混合物を総エポキシ量に対し３０〜１００
重量％含有するエポキシ樹脂。 ▲数式、化学式、表等があります▼〔 I 〕 ▲数式、化学式、表等があります▼〔II〕 （Ｒ：Ｈ又はＣＨ＿３） （Ｂ）下記式〔III〕および下記式〔IV〕の内の少なく
とも１種以上のシリコーン化合物とフェノールノボラッ
ク樹脂とを反応させて得られるシリコーン変性フェノー
ルノボラック樹脂硬化剤を総硬化剤量に対して３０〜１
００重量％含有する硬化剤。 ▲数式、化学式、表等があります▼〔III〕 ▲数式、化学式、表等があります▼〔IV〕 Ｒ＿１：▲数式、化学式、表等があります▼、−Ｃ＿２
Ｈ＿４−▲数式、化学式、表等があります▼、Ｃ＿２Ｈ
＿５Ｒ＿２：▲数式、化学式、表等があります▼、−Ｃ
＿２Ｈ＿４−▲数式、化学式、表等があります▼、Ｃ＿
２Ｈ＿５、ＣＨ＿３Ａ：−Ｒ−ＣＯＯＨ、−Ｒ−▲数式
、化学式、表等があります▼、−Ｒ−▲数式、化学式、
表等があります▼、ＨＲ：低級アルキレン ここで１０≦Ｎ：ｌ＋ｍ＋ｎ＋２≦２００ ０≦ｍ／Ｎ≦０．１、５≦Ｎ／ｎ≦５０ （Ｃ）総樹脂組成物量に対し７０〜９０重量％を占める
無機充填材。 （Ｄ）硬化促進剤 を必須成分とする半導体封止用の樹脂組成物。(1) (A) A mixture of a naphthalene type epoxy compound represented by the following formula [I] and a biphenyl type epoxy compound represented by the following formula [II] in a weight ratio of 10/90 to 90/10. 30-100 for total epoxy amount
Epoxy resin containing % by weight. ▲There are mathematical formulas, chemical formulas, tables, etc.▼[I] ▲There are mathematical formulas, chemical formulas, tables, etc.▼[II] (R:H or CH_3) (B) Among the following formulas [III] and the following formulas [IV] A silicone-modified phenol novolac resin curing agent obtained by reacting at least one silicone compound with a phenol novolac resin is added at a ratio of 30 to 1% based on the total amount of curing agent.
Hardening agent containing 00% by weight. ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ [III] ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ [IV] R_1: ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, -C_2
H_4-▲There are mathematical formulas, chemical formulas, tables, etc.▼, C_2H
＿５R＿２：▲There are mathematical formulas, chemical formulas, tables, etc.▼, -C
＿２H＿４－▲There are mathematical formulas, chemical formulas, tables, etc.▼、C＿
2H_5, CH_3A: -R-COOH, -R-▲Mathematical formulas, chemical formulas, tables, etc.▼, -R-▲Mathematical formulas, chemical formulas,
There are tables, etc. ▼, HR: Lower alkylene where 10≦N: l+m+n+2≦200 0≦m/N≦0.1, 5≦N/n≦50 (C) 70 to 90% by weight based on the total amount of resin composition inorganic fillers. (D) A resin composition for semiconductor encapsulation containing a curing accelerator as an essential component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30887790A JP2823682B2 (en) | 1989-11-22 | 1990-11-16 | Resin composition |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1-301975 | 1989-11-22 | ||
| JP30197589 | 1989-11-22 | ||
| JP30887790A JP2823682B2 (en) | 1989-11-22 | 1990-11-16 | Resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03220229A true JPH03220229A (en) | 1991-09-27 |
| JP2823682B2 JP2823682B2 (en) | 1998-11-11 |
Family
ID=26562949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30887790A Expired - Fee Related JP2823682B2 (en) | 1989-11-22 | 1990-11-16 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2823682B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0496929A (en) * | 1990-08-14 | 1992-03-30 | Shin Etsu Chem Co Ltd | Epoxy resin composition and semiconductor device |
| JPH05129475A (en) * | 1991-11-05 | 1993-05-25 | Shin Etsu Chem Co Ltd | Sealing material for tab type semiconductor device, and tab type semiconductor device |
| JPH05320317A (en) * | 1992-05-21 | 1993-12-03 | Fujitsu Ltd | Epoxy resin composition |
| JPH06287273A (en) * | 1993-03-31 | 1994-10-11 | Toray Ind Inc | Epoxy resin composition for sealing semiconductor |
| JP2003026769A (en) * | 2001-05-09 | 2003-01-29 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing and electronic part device |
-
1990
- 1990-11-16 JP JP30887790A patent/JP2823682B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0496929A (en) * | 1990-08-14 | 1992-03-30 | Shin Etsu Chem Co Ltd | Epoxy resin composition and semiconductor device |
| JPH05129475A (en) * | 1991-11-05 | 1993-05-25 | Shin Etsu Chem Co Ltd | Sealing material for tab type semiconductor device, and tab type semiconductor device |
| JPH05320317A (en) * | 1992-05-21 | 1993-12-03 | Fujitsu Ltd | Epoxy resin composition |
| JPH06287273A (en) * | 1993-03-31 | 1994-10-11 | Toray Ind Inc | Epoxy resin composition for sealing semiconductor |
| JP2003026769A (en) * | 2001-05-09 | 2003-01-29 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing and electronic part device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2823682B2 (en) | 1998-11-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |