JPH03211288A - Electroless gold plating solution - Google Patents
Electroless gold plating solutionInfo
- Publication number
- JPH03211288A JPH03211288A JP616290A JP616290A JPH03211288A JP H03211288 A JPH03211288 A JP H03211288A JP 616290 A JP616290 A JP 616290A JP 616290 A JP616290 A JP 616290A JP H03211288 A JPH03211288 A JP H03211288A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- electroless gold
- gold plating
- soln
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 60
- 239000010931 gold Substances 0.000 title claims abstract description 38
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 22
- 229910052737 gold Inorganic materials 0.000 title claims description 22
- 239000012535 impurity Substances 0.000 claims abstract description 27
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 25
- 150000001450 anions Chemical class 0.000 claims abstract description 22
- 150000003839 salts Chemical class 0.000 claims abstract description 19
- 150000002500 ions Chemical class 0.000 claims abstract description 14
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 8
- 239000008139 complexing agent Substances 0.000 claims abstract description 5
- 238000000354 decomposition reaction Methods 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 239000002253 acid Substances 0.000 abstract description 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 abstract description 2
- -1 Ni<2+> Chemical class 0.000 abstract description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 abstract description 2
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 abstract description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 abstract description 2
- 229910018162 SeO2 Inorganic materials 0.000 abstract 1
- 229910018143 SeO3 Inorganic materials 0.000 abstract 1
- JPJALAQPGMAKDF-UHFFFAOYSA-N selenium dioxide Chemical compound O=[Se]=O JPJALAQPGMAKDF-UHFFFAOYSA-N 0.000 abstract 1
- 239000000654 additive Substances 0.000 description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052708 sodium Inorganic materials 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000012279 sodium borohydride Substances 0.000 description 2
- 229910000033 sodium borohydride Inorganic materials 0.000 description 2
- 159000000000 sodium salts Chemical class 0.000 description 2
- 235000010265 sodium sulphite Nutrition 0.000 description 2
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 2
- 235000019345 sodium thiosulphate Nutrition 0.000 description 2
- XDVOLDOITVSJGL-UHFFFAOYSA-N 3,7-dihydroxy-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound O1B(O)OB2OB(O)OB1O2 XDVOLDOITVSJGL-UHFFFAOYSA-N 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- VQTSAVIGVPAOQB-UHFFFAOYSA-N [B].[B].[B].[B].[Na] Chemical compound [B].[B].[B].[B].[Na] VQTSAVIGVPAOQB-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000006179 pH buffering agent Substances 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 229910001380 potassium hypophosphite Inorganic materials 0.000 description 1
- CRGPNLUFHHUKCM-UHFFFAOYSA-M potassium phosphinate Chemical compound [K+].[O-]P=O CRGPNLUFHHUKCM-UHFFFAOYSA-M 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 description 1
Abstract
Description
【発明の詳細な説明】
Ｃ産業上の利用分野］
本発明は、Ｎｉ” 、Ｃｕ”＋等の不純物金属イオンの
混入に対しても安定な無電解金めつき液に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Use] The present invention relates to an electroless gold plating solution that is stable even against the contamination of impurity metal ions such as Ni'' and Cu''+.
［従来の技術］
従来の無電解金めっき液としては、例えば、特公昭５６
−２０３５３号公報に記載されている次のような組成の
液が知られている。[Prior art] As a conventional electroless gold plating solution, for example,
A liquid having the following composition described in Japanese Patent No. 20353 is known.
ＫＡｕＣｌ４３．Ｏｔ／露
ＣＨ，ＯＣＲ，Ｃｌ２Ｎ（ＣＩ、）、ＢＨ，２，０（／
ｌＮａＯＨｐ）Ｉを１２．５にする必要量［発明が解決
しようとする課題］
上記従来技術による無電解金めっき液は、Ｎ ｉ” 、
Ｃｕ”＋等の不純物金属イオンに対する考慮がなされ
ていない、このため、これらの不純物金属イオンがめつ
き液に混入すると、液中の還元剤により還元剤され、生
成したＮｉ、Ｃｕ等の金属微粒子とめっき液中のＡｕイ
オンとが反応して、Ａｕが液中に析出し、それが核とな
ってめっき液が短時間に分解するという問題点が有った
。KAuCl43. Ot/dew CH, OCR, Cl2N (CI, ), BH, 2,0 (/
Necessary amount to make lNaOHp)I 12.5 [Problem to be solved by the invention] The electroless gold plating solution according to the above-mentioned prior art has Ni'',
No consideration has been given to impurity metal ions such as Cu"+. Therefore, when these impurity metal ions are mixed into the plating solution, they are reduced by the reducing agent in the solution, and are mixed with the generated metal fine particles such as Ni and Cu. There was a problem in that Au ions in the plating solution reacted with each other, causing Au to precipitate in the solution, which became nuclei and caused the plating solution to decompose in a short period of time.
本発明の目的は、Ｎ ｘ ” ” ｇ Ｃｕ ” ”等
の不純物金属イオンの混入によっても、長時間にわたり
、めっき液の分解が生じない、安定性に優れた無電解金
めっき液を提供することにある。An object of the present invention is to provide an electroless gold plating solution with excellent stability that does not cause decomposition of the plating solution over a long period of time even when impurity metal ions such as N x ``g Cu '' are mixed in. It is in.
〔課題を解決するための手段］ 本発明は、Ａｕイオン、Ａｕイオンの錯化剤。[Means to solve the problem] The present invention relates to Au ions and complexing agents for Au ions.
および、還元剤を含む無電解金めつき液にＮｉＩ＋Ｃｕ
”＋等の不純物全翼イオンとＳ溶性塩を生成する陰イオ
ンを添加することにより、Ｎｉ”Ｃｕ”“等の不純物金
属イオンの難溶性塩を形成し、前述のように、めっき液
中の還元剤によりこれらの不純物金属イオンが還元され
、めっき液分解の核となることを防止しようとするもの
である。Then, NiI+Cu was added to the electroless gold plating solution containing a reducing agent.
By adding impurity full-winged ions such as "+" and anions that produce S-soluble salts, sparingly soluble salts of impurity metal ions such as Ni, "Cu", etc. are formed, and as described above, This is intended to prevent these impurity metal ions from being reduced by the reducing agent and becoming the core of decomposition of the plating solution.
不純物金属イオンと難溶性塩を生成する陰イオンとして
は、Ｎｉ” 、Ｃｕ”＋等に対する溶解度積が６以上の
陰イオンが使用される。すなわち、Ｎｉ”に対シテは、
Ｐ ０４”−＊ Ｐ ｘ Ｏ７’−ＣａＯ２”−、Ｃｏ
ａ”−であり、Ｆｅ”＋に対しては、ｃ、ｏ、”−、ｃ
ｏａ”−であり、Ｆｅａ＋に対しては、ＰＯ２２ 、５
ｅａＪ”−であり、Ｃｕ”＋に対しては、ｐｏ、”−、
ｐ、ｏ、’−、ｃ、ｏ、’−、ｃｏ、”−８ｅ Ｏ２２
−である、これらの陰イオンはナトリウム塩、カリウム
塩または酸として用いられる。なお、これらは単独で用
いてもよいし、二種類以上混合して用いてもよい、これ
らの陰イオンの濃度は第１図に示すように、Ｎｉ”、Ｃ
ｕ”＋等の不純物金属イオンに対してモル比で百倍から
五千倍の範囲が適している。溶解度積の大きい陰イオン
はど少量の添加で大きな効果が得られる十倍未満では難
溶性塩の形成が十分行なわれず不純物金属イオンの除去
効果が小さい、また五千倍より大きくしても難溶性塩形
成の効果が向上しない。As the anion that generates the impurity metal ion and the poorly soluble salt, an anion having a solubility product of 6 or more with respect to Ni", Cu"+, etc. is used. In other words, the difference between Ni'' and Shite is
P 04”-* P x O7’-CaO2”-, Co
a"-, and for Fe"+, c, o, "-, c
oa”−, and for Fea+, PO22,5
eaJ"-, and for Cu"+, po,"-,
p, o, '-, c, o, '-, co, "-8e O22
-, these anions are used as sodium salts, potassium salts or acids. In addition, these anions may be used alone or in a mixture of two or more.As shown in FIG. 1, the concentration of these anions is as follows:
A range of 100 to 5,000 times the molar ratio of impurity metal ions such as u"+ is suitable. Anions with a large solubility product can produce a large effect with the addition of a small amount. If it is less than 10 times, it becomes a poorly soluble salt. is not sufficiently formed, and the effect of removing impurity metal ions is small.Also, even if it is made larger than 5,000 times, the effect of forming hardly soluble salts does not improve.
無電解金めっき液中のＡｕイオンは塩化金酸。The Au ions in the electroless gold plating solution are chloroauric acid.
亜硫酸金、または、それらのナトリウム塩、カリウム塩
、アンモニウム塩より供給されるａ Ａ ｕイオンの錯
化剤はチオ硫酸、亜硫酸、または、それらのナトリウム
塩、カリウム塩、アンモニウム塩より供給される。還元
剤としては１次亜リン酸ナトリウム、次亜リン酸カリウ
ム、水素化ホウ素ナトリウム、水素化ホウ素カリウム、
チオ尿素、ジメチルアミンボラン、ホルムアルデヒド等
が適している。また、めっき液のｐＨ緩衝剤として四ホ
ウ酸、ホウ酸のナトリウム塩、カリウム塩を添加するこ
とは、めっき液ｐＨの安定性向上に効果が大きい。The complexing agent for a A u ions supplied by gold sulfite or its sodium, potassium, or ammonium salts is supplied by thiosulfate, sulfite, or their sodium, potassium, or ammonium salts. As reducing agents, primary sodium hypophosphite, potassium hypophosphite, sodium borohydride, potassium borohydride,
Thiourea, dimethylamine borane, formaldehyde, etc. are suitable. Furthermore, addition of tetraboric acid, sodium salt or potassium salt of boric acid as a pH buffering agent for the plating solution is highly effective in improving the stability of the pH of the plating solution.
［作用］ 前述のｐｏ４”−、ｐ、ｏ、’−等の陰イオンは。[Effect] The aforementioned anions such as po4''-, p, o, '-, etc.
めっき液に混入したＮｉ” 、Ｃｕ”＋等の不純物金属
イオンと難溶性塩を形成し、これらの不純物金属イオン
を沈殿させる。沈殿はめっき液を口過することによりめ
っき液中より除去される。これにより不純物金属イオン
がめつき液中で還元剤により還元され、Ｎｉ、Ｃｕ等の
金属微粒子を生成することが防止されるので、これらの
Ｎｉ、Ｃｕ等の金属微粒子がめつき液中のＡｕイオンと
反応して、Ａｕが液中に析出する現象、すなわち、めっ
き液の分解が生じなくなる。A sparingly soluble salt is formed with impurity metal ions such as Ni'' and Cu''+ mixed in the plating solution, and these impurity metal ions are precipitated. The precipitate is removed from the plating solution by passing it through the mouth. This prevents the impurity metal ions from being reduced by the reducing agent in the plating solution and producing metal fine particles such as Ni and Cu, so that these metal fine particles such as Ni and Cu are combined with the Au ions in the plating liquid. A phenomenon in which Au reacts and precipitates in the solution, that is, decomposition of the plating solution does not occur.
［実施例］ 以下、本発明の詳細な説明する。[Example] The present invention will be explained in detail below.
〈実施例１〜４〉
塩化金酸ナトリウム２ｇ／Ｑ、チオ硫酸ナトリウム１５
ｇ ／ Ｑ、亜硫酸ナトリウム４０ ｇ ／ Ｑ、水
素化ホウ素ナトリウム０．５ｇ７ｍ、西ホウ酸ナトリウ
ムから成る無電解金めっき液に、不純物金属イオンであ
るＮｉ”と難溶性塩を形成する陰イオンとして第１表に
示す化合物を加えた。この無電解金めっき液に加えたＮ
ｉａ＋は２０ｐｐ−である。<Examples 1 to 4> Sodium chloraurate 2g/Q, sodium thiosulfate 15
g/Q, sodium sulfite 40 g/Q, sodium borohydride 0.5 g 7 m, and sodium west borate. The compounds shown in Table 1 were added.The N added to this electroless gold plating solution
ia+ is 20pp-.
（以下余白）
第１表
第１表に示すように、めっき液を８０℃に加熱放置した
とき、めっき液が分縮するまでの時間（分解時間）は、
難溶性塩を形成する陰イオンを添加した場合は、いずれ
も、無添加の場合にくらべて大幅に改善された。また、
めっき速度、めっき外観とも無添加の場合と同等の良好
な結果が得られた。(Margin below) Table 1 As shown in Table 1, when the plating solution is heated and left at 80°C, the time it takes for the plating solution to undergo decomposition (decomposition time) is:
In all cases where anions that form poorly soluble salts were added, there was a significant improvement compared to the case where no anions were added. Also,
Good results were obtained in terms of plating speed and plating appearance, which were equivalent to those obtained without additives.
〈実施例５，６〉
実施例１と同じ組成の無電解金めっき液に不純物金属イ
オンであるＦｅ２＋と難溶性塩を形成する陰イオンとし
て第２表に示す化合物を添加した。Examples 5 and 6 Compounds shown in Table 2 were added to an electroless gold plating solution having the same composition as in Example 1 as anions that form poorly soluble salts with Fe2+, which is an impurity metal ion.
このめっき液に加えたＦｅ”＋は５ ｐｐｍである。Fe''+ added to this plating solution was 5 ppm.
第２表
第２表に示すように、めっき液を８０℃に加熱放置した
ときの分解時間は、いずれも、無添加の場合にくらべて
大幅に改善された。また、めっき速度、めっき外観とも
無添加の場合と同等の良好な結果が得られた。As shown in Table 2, the decomposition time when the plating solution was heated to 80° C. was significantly improved compared to the case without additives. In addition, good results were obtained in terms of plating speed and plating appearance, which were equivalent to those obtained without additives.
〈実施例７，８〉
実施例１と同じ組成の無電解金めっき液に不純物金属イ
オンであるＦｅ３＋と難溶性塩を形成する陰イオンとし
て第３表に示す化合物を添加した。Examples 7 and 8 Compounds shown in Table 3 were added to an electroless gold plating solution having the same composition as in Example 1 as anions that form poorly soluble salts with Fe3+, which is an impurity metal ion.
このめっき液に加えたＦｅ３＋は１０ｐｐｍである。Fe3+ added to this plating solution was 10 ppm.
第３表
第３表に示すように、めっき液を８０℃に加熱放置した
ときの分解時間はいずれも無添加の場合にくらべて大幅
に改善された。また、めっき速度、めっき外観とも無添
加の場合と同等の良好な結果が得られた。As shown in Table 3, the decomposition time when the plating solution was heated to 80° C. was significantly improved compared to the case without additives. In addition, good results were obtained in terms of plating speed and plating appearance, which were equivalent to those obtained without additives.
〈実施ｖ４９〜１４〉
塩化金酸ナトリウム５ｇ／Ｑ、チオ硫酸ナトリウム２５
ｇ ／ Ｑ、亜硫酸ナトリウム５０ ｇ ／ Ｑ、チ
オ尿素３ｇ／Ｑ、四ホウ激ナトリウム３０ｇ／ａから成
る無電解金めっき液に、不純物金属イオンであるＣｕ”
＋と難溶性塩を形成する陰イオンとして第４表に示す化
合物を加えた、このめっき液に加えたＣｕ”＋は３０Ｐ
；）１１である。<Implementation v49-14> Sodium chloraurate 5g/Q, sodium thiosulfate 25
Cu” which is an impurity metal ion is added to an electroless gold plating solution consisting of 50 g/Q, sodium sulfite 50 g/Q, thiourea 3 g/Q, and 30 g/a sodium tetraboron.
The Cu"+ added to this plating solution contains the compounds shown in Table 4 as anions that form poorly soluble salts with 30P.
;) It is 11.
（以下余白）
第４表
第４表に示すように、めっき液を８０℃に加熱放置した
ときの分解時間はいずれも無重加の場合にくらべて大幅
に改善された。また、めっき速度、めっき外観とも無添
加の場合と同等の良好な結果が得られた。(The following is a blank space) Table 4 As shown in Table 4, the decomposition time when the plating solution was heated and left at 80° C. was significantly improved compared to when no weight was applied. In addition, good results were obtained in terms of plating speed and plating appearance, which were equivalent to those obtained without additives.
［発明の効果］
本発明によれば、不純物金属イオンと難溶性塩を形成す
る陰イオンを無電解金めっき液に添加することにより、
Ｎｉ” 、Ｃｕ２＋等の不純物金属イオンの混入による
めっき液の分解が防止され。[Effects of the Invention] According to the present invention, by adding anions that form a poorly soluble salt with impurity metal ions to an electroless gold plating solution,
Decomposition of the plating solution due to the contamination of impurity metal ions such as Ni'' and Cu2+ is prevented.
めっき液の安定性を著しく向上させることができた。こ
れにより、高価な金めつき液の利用効率が向上し、製品
のコストを低下させることができた。The stability of the plating solution was significantly improved. This improved the efficiency of using expensive gold plating solution and lowered product costs.
第１図は本発明の不純物金属イオンに対する難溶性塩を
形成する陰イオンの添加量とめっき液の分解時間との５
１係を示す特性図である。Figure 1 shows the relationship between the amount of anion added and the decomposition time of the plating solution that forms a poorly soluble salt for impurity metal ions of the present invention.
It is a characteristic diagram showing the 1st section.
Claims (5)
を含む無電解金めっき液において、不純物金属イオンと
難溶性塩を生成する陰イオンを含有することを特徴とす
る無電解金めっき液。1. An electroless gold plating solution containing Au ions, a complexing agent for the Au ions, and a reducing agent, characterized in that the solution contains anions that generate impurity metal ions and hardly soluble salts.
を生成する陰イオンがＰＯ＿４＾２＾−、Ｐ＿２Ｏ＿７
＾４＾−、Ｃ＿２Ｏ＿４＾２＾−、またはＣＯ＿３＾２
＾−であることを特徴とする請求項１に記載の無電解金
めっき液。2. The impurity metal ion is Ni^2^+, and the anions that generate poorly soluble salts are PO_4^2^-, P_2O_7
^4^-, C_2O_4^2^-, or CO_3^2
The electroless gold plating solution according to claim 1, wherein the electroless gold plating solution is ^-.
を生成する陰イオンがＣＯ＿２＾２＾−またはＣ＿２Ｏ
＿４＾２＾−であることを特徴とする請求項１に記載の
無電解金めっき液。3. The impurity metal ion is Fe^2^+, and the anion that generates the poorly soluble salt is CO_2^2^- or C_2O.
The electroless gold plating solution according to claim 1, wherein the electroless gold plating solution is _4^2^-.
を生成する陰イオンがＰＯ＿４＾２＾−またはＳｅＯ＿
２＾２＾−であることを特徴とする請求項１に記載の無
電解金めっき液。4. The impurity metal ion is Fe^2^+, and the anion that generates the poorly soluble salt is PO_4^2^- or SeO_
2. The electroless gold plating solution according to claim 1, wherein the electroless gold plating solution is 2^2^-.
を生成する陰イオンがＰＯ＿４＾３＾−、Ｐ＿２Ｏ＿７
＾７＾−、ＣＯ＿２＾２＾−、Ｃ＿２Ｏ＿４＾２＾−、
ＳｅＯ＿２＾２＾−であることを特徴とする請求項１に
記載の無電解金めっき液。5. The impurity metal ion is Cu^2^+, and the anions that generate poorly soluble salts are PO_4^3^-, P_2O_7
^7^-, CO_2^2^-, C_2O_4^2^-,
The electroless gold plating solution according to claim 1, wherein the electroless gold plating solution is SeO_2^2^-.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP616290A JPH03211288A (en) | 1990-01-17 | 1990-01-17 | Electroless gold plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP616290A JPH03211288A (en) | 1990-01-17 | 1990-01-17 | Electroless gold plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03211288A true JPH03211288A (en) | 1991-09-17 |
Family
ID=11630834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP616290A Pending JPH03211288A (en) | 1990-01-17 | 1990-01-17 | Electroless gold plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03211288A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06243652A (en) * | 1993-02-16 | 1994-09-02 | Nec Corp | Cleaning device for information recording medium |
| CN104617290A (en) * | 2013-11-04 | 2015-05-13 | 中国科学院大连化学物理研究所 | Homogenous precipitation method for preparing Fe2O3 nanobelt and Fe2O3 nanobelt-carbon composite material |
-
1990
- 1990-01-17 JP JP616290A patent/JPH03211288A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06243652A (en) * | 1993-02-16 | 1994-09-02 | Nec Corp | Cleaning device for information recording medium |
| CN104617290A (en) * | 2013-11-04 | 2015-05-13 | 中国科学院大连化学物理研究所 | Homogenous precipitation method for preparing Fe2O3 nanobelt and Fe2O3 nanobelt-carbon composite material |
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