JPH03193466A - Manufacture of thermal head - Google Patents
Manufacture of thermal headInfo
- Publication number
- JPH03193466A JPH03193466A JP33685189A JP33685189A JPH03193466A JP H03193466 A JPH03193466 A JP H03193466A JP 33685189 A JP33685189 A JP 33685189A JP 33685189 A JP33685189 A JP 33685189A JP H03193466 A JPH03193466 A JP H03193466A
- Authority
- JP
- Japan
- Prior art keywords
- common electrode
- layer
- lead electrode
- thermal head
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000010410 layer Substances 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011888 foil Substances 0.000 claims abstract description 6
- 229920006015 heat resistant resin Polymers 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 239000011241 protective layer Substances 0.000 claims abstract description 3
- 238000005338 heat storage Methods 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 abstract description 9
- 239000004642 Polyimide Substances 0.000 abstract description 8
- 238000005530 etching Methods 0.000 abstract description 4
- 239000002243 precursor Substances 0.000 abstract description 4
- 238000011282 treatment Methods 0.000 abstract description 3
- 238000001035 drying Methods 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract description 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 2
- 239000007921 spray Substances 0.000 abstract description 2
- 239000010409 thin film Substances 0.000 abstract description 2
- 238000005406 washing Methods 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229940005574 sodium gluconate Drugs 0.000 description 1
- 235000012207 sodium gluconate Nutrition 0.000 description 1
- 239000000176 sodium gluconate Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
この発明は、ファクシミリやプリンタ等の感熱記録装置
に用いられるサーマルヘッドに関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to a thermal head used in a thermal recording device such as a facsimile or a printer.
（ロ）従来の技術
近年、サーマルヘッドはファクシミリ、ワードプロセッ
サ用プリンタ等の各種の記録装置に多用されるようにな
っている。これらの機器は小型・軽量化と低価格化が要
請されており、小型で安価なサーマルヘッドが望まれて
いる。(B) Prior Art In recent years, thermal heads have come into widespread use in various recording devices such as facsimiles and word processor printers. These devices are required to be smaller, lighter, and less expensive, and a smaller, cheaper thermal head is desired.
従来のサーマルヘッドは、純度９０％以上のアルミナセ
ラミック基板に印刷、焼成されて成るグレードガラス層
の蓄熱層を用いて形成される。A conventional thermal head is formed using a heat storage layer of a grade glass layer that is printed and fired on an alumina ceramic substrate with a purity of 90% or more.
第３図は従来のサーマルヘッドの要部断面図、第４図は
従来のサーマルヘッドの製造工程を示すフローチャート
である。つまり、従来のサーマルヘッドにおいては、ま
ず、セラミック基板１１上にグレードガラス蓄熱層１７
を形成し、次に蒸着法又はスパッタ法により発熱抵抗膜
１４を形成した後、蒸着法又はスパッタ法により電極膜
を成膜し、さらにフォトリソグラフィ法によりパターン
化して共通電極１３を形成する。次に、再び蒸着法又は
スパッタ法により電極膜を成膜してフォトリソグラフィ
法によりそれをパターン化し、リ一ド電ｔｆｆｉ１２を
形成して発熱抵抗部を形成し、次に保護＠１５を成膜す
る。このように形成されたサーマルヘッド基板を所定サ
イズに分割し、駆動用ＩＣチップをフェイスダウンボン
ディングにより実装し、樹脂によってモールド処理した
のち、組立を行う。FIG. 3 is a sectional view of a main part of a conventional thermal head, and FIG. 4 is a flowchart showing the manufacturing process of a conventional thermal head. That is, in the conventional thermal head, first, the grade glass heat storage layer 17 is placed on the ceramic substrate 11.
Next, a heat generating resistive film 14 is formed by a vapor deposition method or a sputtering method, an electrode film is formed by a vapor deposition method or a sputtering method, and a common electrode 13 is formed by patterning by a photolithography method. Next, an electrode film is again formed by vapor deposition or sputtering, and it is patterned by photolithography to form a lead electrode tffi12 to form a heat generating resistor, and then a protection @15 is formed. do. The thermal head substrate thus formed is divided into predetermined sizes, a driving IC chip is mounted by face-down bonding, molded with resin, and then assembled.
（ハ）発明が解決しようとする課題
しかしながら、従来のサーマルヘッドは、上記のように
製作工程が複雑で、原料アルミナ粉末の精製、研磨、印
刷、焼成等の高温処理を含んだ多くの工程を必要とする
ために、生産コストが高くなるという問題点がある。ま
た、基板としてアルミナセラミックスを使用しているた
めに、高温焼成炉の大きさから基板サイズが限定され、
その大型化が阻害されるという問題点がある。(c) Problems to be Solved by the Invention However, as mentioned above, conventional thermal heads have a complicated manufacturing process, and require many steps including high-temperature treatments such as refining raw material alumina powder, polishing, printing, and firing. There is a problem in that the production cost is high because of the necessity. Additionally, since alumina ceramics are used as the substrate, the size of the substrate is limited due to the size of the high-temperature firing furnace.
There is a problem in that the enlargement is hindered.
これらの問題を解決するために、最近では、ポリイミド
フレキンプル基板又はホウロウ基板等をグレーズセラミ
ック基板の代わりに用いたサーマルヘッドが検討されて
いるが、コネクター、コンデンサー、サーミスタ等を接
続するプリント回路部分を別途に取り付ける必要がある
上に、上記プリント回路基板との接続に要する回路基板
、ゴム押え、押え金具、ビス等の敗多くの部品を必要と
する上に、組立に多くの工数を必要とするため、単にサ
ーマルヘッド部分を形成する基板を他の材料に置き換え
るだけでは解決できないという問題点があった。In order to solve these problems, thermal heads that use polyimide flexible boards or enamel boards instead of glazed ceramic boards have recently been considered, but the printed circuit parts that connect connectors, capacitors, thermistors, etc. In addition, it requires a large number of parts such as the circuit board, rubber presser, presser metal fittings, and screws required for connection with the printed circuit board, and requires a large number of man-hours for assembly. Therefore, there has been a problem that cannot be solved simply by replacing the substrate forming the thermal head portion with another material.
この発明はこのような事情を考慮してなされたもので、
グレーズドアルミナ基板に代わる回路基板として耐熱性
両面銅張積層板を使用することにより、基板の大型化が
可能であり、共通電極とリード電極を同時にバターニン
グすることにより電極形成工程の簡素化が可能であり、
基板に発熱抵抗体部とドライバーＩＣの搭載部分の回路
基板とを一体化することにより組立工程の簡素化をはか
ることができる安価なサーマルヘッドを提供するもので
ある。This invention was made in consideration of these circumstances,
By using a heat-resistant double-sided copper-clad laminate as a circuit board instead of a glazed alumina board, it is possible to increase the size of the board, and by patterning the common electrode and lead electrode at the same time, the electrode formation process can be simplified. and
The present invention provides an inexpensive thermal head that can simplify the assembly process by integrating a heating resistor section and a circuit board of a driver IC mounting section onto a substrate.
（ニ）課題を解決するための手段
この発明は、基板上に発熱抵抗層と、発熱抵抗層に通電
するためのリード電極および共通電極を設けたサーマル
ヘッドの製造方法において、耐熱ｔａｔｌ１１［の表面
に予め銅およびアルミニウム箔を積層した基板を使用し
て、まず、アルミニウム層を剥離し、銅箔をパターン化
してリード電極および共通電極を同時に形成し、リード
電極および共通電極間に樹脂からなる蓄熱層を形成し、
蓄熱層の上にリード電極から共通電極にわたる発熱抵抗
層を形成し、さらに、リード電極と共通電極と発熱抵抗
層を覆う保護層を形成することを特徴とするサーマルヘ
ッドの製造方法である。(D) Means for Solving the Problems The present invention provides a method for manufacturing a thermal head in which a heating resistor layer is provided on a substrate, and a lead electrode and a common electrode for supplying current to the heating resistor layer. Using a board on which copper and aluminum foil have been laminated in advance, the aluminum layer is first peeled off, the copper foil is patterned to simultaneously form a lead electrode and a common electrode, and a heat storage layer made of resin is formed between the lead electrode and the common electrode. form a layer,
This method of manufacturing a thermal head is characterized by forming a heat generating resistive layer extending from a lead electrode to a common electrode on a heat storage layer, and further forming a protective layer covering the lead electrode, the common electrode, and the heat generating resistive layer.
電極である銅箔の厚さはパターン精度に対する依存性が
あり、サーマルヘッド用電極パターン精度±３μｍ〜±
５μｍを達成するためには、銅箔厚さは３〜１８μ−が
望ましいが、厚さが厚くなるに従い精度が低下するデメ
リットがある。しかし、共通電極の抵抗値は低下するメ
リットがある。従って、銅箔厚さは、５〜！２μｍがパ
ターン精度の点でも共通電極の導体抵抗値５００ｉ＋Ω
以下を達成できる点から望ましい値である。The thickness of the copper foil that is the electrode depends on the pattern accuracy, and the electrode pattern accuracy for thermal heads is ±3 μm to ±
In order to achieve 5 μm, the thickness of the copper foil is preferably 3 to 18 μm, but there is a disadvantage that the accuracy decreases as the thickness increases. However, there is an advantage that the resistance value of the common electrode is reduced. Therefore, the copper foil thickness is 5~! Even though 2μm is good for pattern accuracy, the conductor resistance of the common electrode is 500i+Ω.
This is a desirable value because it can achieve the following:
（ホ）作用
耐熱樹脂基板を基板として使用することにより、リード
電極パターンと共通電極パターンとを同時に同一プロセ
スで形成できると共に基板サイズの大型化が図れること
により、市場から要請されている小型・軽量で且つ安価
なサーマルヘッドを提供できる。即ち、綴り基板サイズ
の大型化及び電極形成プロセスの簡素化、電極形成プロ
セスに要する設備金額の軽減を図ることができる。(E) Function By using a heat-resistant resin substrate as a substrate, lead electrode patterns and common electrode patterns can be formed simultaneously in the same process, and the substrate size can be increased, making it possible to meet the demands of the market for compactness and light weight. It is possible to provide an inexpensive thermal head. That is, it is possible to increase the size of the printed circuit board, simplify the electrode formation process, and reduce the cost of equipment required for the electrode formation process.
（へ）実施例
以下、図面に示す実施例に基づいてこの発明を説明する
。(f) Examples The present invention will be described below based on examples shown in the drawings.
第１図は、この発明の実施例を示すサーマルヘッドの蓄
熱層近傍の断面図、第２図はこのサーマルヘッドの製造
工程を示すフローチャートである。FIG. 1 is a sectional view of the vicinity of the heat storage layer of a thermal head showing an embodiment of the present invention, and FIG. 2 is a flowchart showing the manufacturing process of this thermal head.
まず、ガラス布に高耐熱樹脂、硬化剤、促進剤および溶
剤を含浸させた後、乾燥させて裁断する。First, a glass cloth is impregnated with a high heat-resistant resin, a hardening agent, an accelerator, and a solvent, then dried and cut.
そして、アルミニウムと銅とを貼り合わせた二層箔が密
着しやすいように基板の表面処理を施した後、加熱、加
圧し、ガラス布を芯材とした両面にその二層箔を貼付け
、アルミニウム・銅張積層板を作製する（以下、この基
板をＵＴＣ基板劃１側ｒａＴｈｉｎ Ｃｕｐｅｒと記す
）。After applying surface treatment to the substrate so that the two-layer foil made of aluminum and copper adheres easily, the two-layer foil is attached to both sides using glass cloth as a core material by heating and pressurizing. - Fabricate a copper-clad laminate (hereinafter, this board will be referred to as UTC board side 1 side raThin Cuper).
次に、このＵＴＣ基板のアルミニウム箔をカセイーダと
グルコン酸ソーダを含んだエツチング液で除去すること
により、銅箔厚さが３〜１２μｍの銅張積層板が得られ
る。これを所定の寸法に切断して平面状の耐熱樹脂基板
■を形成し、それを洗浄して熱処理した後、銅箔の整面
処理を行う。Next, by removing the aluminum foil of this UTC board with an etching solution containing Kaceida and sodium gluconate, a copper-clad laminate having a copper foil thickness of 3 to 12 μm is obtained. This is cut into predetermined dimensions to form a planar heat-resistant resin substrate (2), which is cleaned and heat-treated, and then the copper foil is subjected to surface-leveling treatment.
次に、液状のポジ型ホトレジストを用いてリード電極部
及び共通電極部を同時にバターニングする。Next, the lead electrode portion and the common electrode portion are simultaneously patterned using a liquid positive photoresist.
次に、塩化第二鉄又は塩化第二銅溶液によるスプレィエ
ツチングによりリード電極２ａおよび共通電極３ａを形
成した後、無電解ＮｉＰメツキを施して約１．０μｍの
厚さのＮｉ層２ｂ、３ｂを形成し、次いで無電解Ａｕメ
ツキを施して０．１〜０．５μｍの厚さのＡｕ層２ｃ、
３ｃを形成する。この時、サーマルヘッドの共通電極と
リード電極及びドライバーＩＣ部にフヱイスダウンボン
ディングができる電極構造を一度に作る。Next, after forming lead electrodes 2a and common electrodes 3a by spray etching with ferric chloride or cupric chloride solution, electroless NiP plating is applied to form Ni layers 2b and 3b with a thickness of about 1.0 μm. formed and then subjected to electroless Au plating to form an Au layer 2c with a thickness of 0.1 to 0.5 μm,
Form 3c. At this time, an electrode structure that allows face-down bonding to the common electrode, lead electrode, and driver IC part of the thermal head is created at once.
次に、この基板上にポリイミド前駆体を、ロールコータ
−やスピンオンコーター又はスクリーン印刷機を用いて
所定の厚さに塗布し、乾燥した後、このポリイミド前駆
体の層を所定のパターンエツチングした後、硬化を行い
ポリイミド層６．７を形成する。つまり、ポリイミド樹
脂による蓄熱層７及びフェイスダウンボンディング用ハ
ンダダム６をパターン形成する。Next, a polyimide precursor is applied onto this substrate to a predetermined thickness using a roll coater, a spin-on coater, or a screen printer, and after drying, the polyimide precursor layer is etched in a predetermined pattern. , curing is performed to form a polyimide layer 6.7. That is, the heat storage layer 7 made of polyimide resin and the solder dam 6 for face-down bonding are patterned.
更に、スパッタリング法により、Ｔａ−５ｌ−０、Ｔ
ａ ｔＮ 、 Ｎ ｉ Ｃｒ等のいずれかから成る薄
膜発熱抵抗層を全面に形成した後、ホトリソグラフィ法
によりパターン化して発熱抵抗層パターン４を形成し、
その後、Ｔ ａ ｔｏ ｓ、 Ｓ ｉ Ｏｔ、サイアロ
ン、ＳｉＣ，５ｉＯＮのいずれかから成る保護膜５をス
パッタ法又はプラズマＣＶＤ法により形成し、フェイス
ダウンボンディング用サーマルヘッド基板ができ上がる
。Furthermore, by sputtering method, Ta-5l-0, T
After forming a thin film heating resistance layer made of either a tN, NiCr, etc. on the entire surface, patterning is performed by photolithography to form a heating resistance layer pattern 4,
Thereafter, a protective film 5 made of any one of Tatos, SiOt, Sialon, SiC, and 5iON is formed by sputtering or plasma CVD to complete a face-down bonding thermal head substrate.
更に、基板上にドライバーＩＣをフェイスダウンボンデ
ィング法により搭載し、半田リフロー樹脂モールド、部
品組み立ておよびテストを行なうことにより、サーマル
ヘッドが完成する。Furthermore, the driver IC is mounted on the board by face-down bonding, and the thermal head is completed by performing solder reflow resin molding, parts assembly, and testing.
このように、ＵＴＣ基板を用いたサーマルヘッドは、銅
箔が１２μｌ以下で、従来の銅張積層板より薄いために
、共通電極及びリード電極のパターニング精度が従来の
プリント基板の構造でありながら±ＩＯμ園以下にでき
る利点があり、。８ドツト／ａｘのサーマルヘッド用電
極を歩留良く形成することができる。又、基板サイズも
１２００ｍｇＸ １２００ｘｍ程度の大きさでも容易に
提供できることから、グレーズドアルミナ基板に比較し
て、基板サイズの制限を受けにくく、従って、−基板当
りのヘッドの取り数が上がるうえに、単位面積当りの基
板単価が安く、電極形成工程で高価な蒸着機やスパッタ
装置を必要としないという特徴を有しており、低コスト
化が可能であり、産業界が検索中のサーマルヘッドの要
望に合致する。In this way, the thermal head using the UTC board uses less than 12 μl of copper foil, which is thinner than a conventional copper-clad laminate, so the patterning accuracy of the common electrode and lead electrode is within ± There are advantages that can be made below IOμ garden. A thermal head electrode of 8 dots/ax can be formed with a high yield. In addition, since it can be easily provided with a substrate size of about 1200 mg x 1200 x m, it is less subject to restrictions on substrate size compared to glazed alumina substrates. The substrate unit price per area is low, and the electrode forming process does not require expensive evaporation equipment or sputtering equipment, making it possible to reduce costs and meeting the needs of thermal heads that are currently being searched by industry. Match.
（ト）発明の効果
この発明によれば、共通電極およびリード電極のパター
ン形成を同時に行うことにより、工程の削減が可能とな
り、コストの低減化が可能なサーマルヘッドが提供でき
る。(g) Effects of the Invention According to the present invention, by simultaneously forming patterns for the common electrode and lead electrode, it is possible to reduce the number of steps and provide a thermal head that can reduce costs.
第１図はこの発明の一実施例を示すサーマルヘッドの要
部構成説明図、第２図は第１図のサーマルヘッドの製造
工程を示すフローチャート、第３図は従来のサーマルヘ
ッドの第１図対応図、第４図は従来のサーマルヘッドの
第２図対応図である。
ｌ・・・・・・耐熱性絶縁基板、
２ａ・・・・・・リード電極、２ｂ、３ｂ・旧・・Ｎｉ
層、３ａ・・・・・・共通電極、２ｃ、３ｃ・旧・・Ａ
ｕ層、４・・・・・・発熱抵抗層パターン、５・旧・・
保護膜、６．７・・・・・・ポリイミド層。
り°Ｎ
１
図
第
図FIG. 1 is an explanatory diagram of the main part configuration of a thermal head showing an embodiment of the present invention, FIG. 2 is a flowchart showing the manufacturing process of the thermal head shown in FIG. 1, and FIG. 3 is a first diagram of a conventional thermal head. FIG. 4 is a diagram corresponding to FIG. 2 of a conventional thermal head. l...Heat-resistant insulating substrate, 2a...Lead electrode, 2b, 3b-old...Ni
Layer, 3a...Common electrode, 2c, 3c/old...A
U layer, 4...Heating resistance layer pattern, 5. Old...
Protective film, 6.7... Polyimide layer. ri°N 1 Figure Figure
Claims (1)
のリード電極および共通電極を設けたサーマルヘッドの
製造方法において、 耐熱樹脂板の表面に予め銅およびアルミニウム箔を積層
した基板を使用して、まず、アルミニウム層を剥離し、
銅箔をパターン化してリード電極および共通電極を同時
に形成し、リード電極および共通電極間に樹脂からなる
蓄熱層を形成し、蓄熱層の上にリード電極から共通電極
にわたる発熱抵抗層を形成し、さらに、リード電極と共
通電極と発熱抵抗層を覆う保護層を形成することを特徴
とするサーマルヘッドの製造方法。[Claims] 1. A method for manufacturing a thermal head in which a heating resistance layer is provided on a substrate, and a lead electrode and a common electrode for supplying electricity to the heating resistance layer, wherein copper and aluminum foils are preliminarily coated on the surface of a heat-resistant resin plate. Using a laminated board, first peel off the aluminum layer,
patterning copper foil to simultaneously form a lead electrode and a common electrode, forming a heat storage layer made of resin between the lead electrode and the common electrode, forming a heat generating resistor layer extending from the lead electrode to the common electrode on the heat storage layer; The method of manufacturing a thermal head further comprises forming a protective layer covering the lead electrode, the common electrode, and the heat generating resistor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33685189A JPH085202B2 (en) | 1989-12-25 | 1989-12-25 | Method of manufacturing thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33685189A JPH085202B2 (en) | 1989-12-25 | 1989-12-25 | Method of manufacturing thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03193466A true JPH03193466A (en) | 1991-08-23 |
| JPH085202B2 JPH085202B2 (en) | 1996-01-24 |
Family
ID=18303246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33685189A Expired - Fee Related JPH085202B2 (en) | 1989-12-25 | 1989-12-25 | Method of manufacturing thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085202B2 (en) |
-
1989
- 1989-12-25 JP JP33685189A patent/JPH085202B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH085202B2 (en) | 1996-01-24 |
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|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |