JPH0317623U - - Google Patents
Info
- Publication number
- JPH0317623U JPH0317623U JP1989076274U JP7627489U JPH0317623U JP H0317623 U JPH0317623 U JP H0317623U JP 1989076274 U JP1989076274 U JP 1989076274U JP 7627489 U JP7627489 U JP 7627489U JP H0317623 U JPH0317623 U JP H0317623U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- external lead
- bump electrode
- bump
- out electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
Landscapes
- Wire Bonding (AREA)
Description
第１図、第３図、第４図及び第５図は本考案の
実施例を示す図、第２図は従来のバンプ電極を示
す図である。
１４…開口部、１５…インナーリード、１６…
バンプエリヤ、１７，３７…バンプ電極、１８…
接続部。
1, 3, 4, and 5 are views showing embodiments of the present invention, and FIG. 2 is a view showing a conventional bump electrode. 14...Opening, 15...Inner lead, 16...
Bump area, 17, 37... bump electrode, 18...
Connection part.
Claims (1)
形成されたバンプ電極において、 このバンプ電極と外部導出電極とが接続される
領域を前記外部導出電極の一部分とした事を特徴
とするバンプ電極。[Claims for Utility Model Registration] In a bump electrode formed on an external lead-out electrode provided on the surface of a semiconductor element, a region where the bump electrode and the external lead-out electrode are connected is a part of the external lead-out electrode. A bump electrode featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989076274U JPH0317623U (en) | 1989-06-30 | 1989-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989076274U JPH0317623U (en) | 1989-06-30 | 1989-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317623U true JPH0317623U (en) | 1991-02-21 |
Family
ID=31617590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989076274U Pending JPH0317623U (en) | 1989-06-30 | 1989-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317623U (en) |
-
1989
- 1989-06-30 JP JP1989076274U patent/JPH0317623U/ja active Pending