JPH03164242A - Preparation of laminated sheet - Google Patents

Preparation of laminated sheet

Info

Publication number
JPH03164242A
JPH03164242A JP30568989A JP30568989A JPH03164242A JP H03164242 A JPH03164242 A JP H03164242A JP 30568989 A JP30568989 A JP 30568989A JP 30568989 A JP30568989 A JP 30568989A JP H03164242 A JPH03164242 A JP H03164242A
Authority
JP
Japan
Prior art keywords
base material
resin
resistance
laminated sheet
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30568989A
Other languages
Japanese (ja)
Inventor
Hideki Ishihara
秀樹 石原
Mitsuo Yokota
横田 光雄
Yoshihiro Nakamura
吉宏 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP30568989A priority Critical patent/JPH03164242A/en
Publication of JPH03164242A publication Critical patent/JPH03164242A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

Abstract

PURPOSE:To prepare a laminated sheet with excellent moisture resistance, resistance to silver migration and resistance to electrolytic corrosion by using a base material and a resin in such a way that concn. of metallic ions and chlorine ion included in the laminated sheet after curing are at specified values or smaller. CONSTITUTION:In a method for preparation of a laminated sheet wherein a base material is impregnated with a thermosetting resin and is cured, the base material and the resin are used in such a way that concn. of metallic ions and chlorine ion included in the cured laminated sheet are respectively 2,000ppm or smaller and 300ppm or smaller. When the concn. of the metallic ions exceeds 2,000ppm and the concn. of the chlorine ion exceeds 300ppm, both resistance to electrolytic corrosion and resistance to silver migration are deteriorated. As the base material, a kraft paper, a linter paper, etc., are used. When flame retardancy is required, a brominated epoxy resin, a brominated biphenyl ether and phosphates are incorporated. To manufacture the laminated sheet, required number of sheets of prepregs obtd. by impregnating the base material with a specified amt. of a varnish of a thermosetting resin dissolved in a solvent such as toluene, methanol and acetone and drying it are laminated and if necessary, a copper foil is laminated and the laminated body is heated and pressed.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は,耐湿性、耐恨マイグレーション性及び耐電食
性に優れた積N板の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for producing a laminated N plate having excellent moisture resistance, anti-migration properties, and electrolytic corrosion resistance.

〔従来の技術〕[Conventional technology]

近年,[子機器にほの多機能性及び高信頼性が要求され
るようになり.紙を基材とする積層板にも,銀ペースト
によるスルーホールめっきが行われるようになってきて
いる. 従来.紙を基材とする積層板を製造するに際して.耐湿
性を向上させるために,樹脂を含浸するに先立って水溶
性フェノール樹脂や水溶性メラミン樹脂等で基材を処理
している。
In recent years, more functionality and high reliability have been required for child devices. Through-hole plating with silver paste has also begun to be applied to paper-based laminates. Conventional. When manufacturing paper-based laminates. In order to improve moisture resistance, the base material is treated with water-soluble phenol resin, water-soluble melamine resin, etc. prior to impregnation with resin.

しかしながら.配線の高密度化に{゛卜い1電食や銀の
マイグレーションによる事故が多発するようになった. 本発明者等はその原因について追究し,回路に印加され
る電圧により.積層板中のイオンが移動することにより
電食や銀のマイグレーンゴンを生ずること,即ち5電食
や銀のマイグレーションに積層板中の金属イオン及び塩
素イオンが関係することをを突き止め,本発明に至った
however. As wiring density increases, accidents due to electrolytic corrosion and silver migration have become more frequent. The inventors investigated the cause of this problem and found that it was caused by the voltage applied to the circuit. It was discovered that electrolytic corrosion and silver migration occur due to the movement of ions in the laminate, that is, metal ions and chloride ions in the laminate are related to electrolytic corrosion and silver migration, and the present invention has been made. reached.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

本発明は耐電食性に優れ,恨マイグレーションを生しに
くい積層板の製造方法を提供することを目的とするもの
である。
An object of the present invention is to provide a method for manufacturing a laminate that has excellent electrolytic corrosion resistance and is less likely to cause migration.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は.基材に熱硬化性樹脂を含浸硬化させる禎WI
板の製造方法において,硬化後の積層板の含有するイオ
ン濃度が,金属イオン2000ppm以下,塩素イオン
濃度300ppm以下となるように基材及び樹脂を使用
することを特徴とする積層板の製造方法である。
The present invention is. TeiWI, which impregnates and cures thermosetting resin into the base material
A method for manufacturing a laminate, characterized in that the base material and resin are used so that the ion concentration contained in the laminate after curing is 2000 ppm or less for metal ions and 300 ppm or less for chlorine ions. be.

熱硬化性樹脂については蒸留.洗浄等で塩素イオンと金
属イオンを低減させた原料を用い,またその製造工程に
おいてもこれらのイオンが混入しないようにし,紙法材
も.同様にイオンを低減させたものを使用する。
Distillation for thermosetting resins. We use raw materials with reduced chlorine ions and metal ions through washing, etc., and we also ensure that these ions do not get mixed in during the manufacturing process. Similarly, use one with reduced ions.

金属イオン濃度が2000ppmまた塩素イオン濃度が
300ppmを超えると耐電食性,耐銀マンダレーショ
ン性共に劣化する。
If the metal ion concentration exceeds 2000 ppm or the chlorine ion concentration exceeds 300 ppm, both the electrolytic corrosion resistance and the silver manduration resistance deteriorate.

熱硬化性樹脂はフェノール樹脂,エボキシ樹脂,不飽和
ポリエステル樹脂等であるが.これらを乾性柚,ポリエ
ステル.ポリエーテル,エボキシ化プタジエン等で変性
する場合もある。
Thermosetting resins include phenolic resin, epoxy resin, and unsaturated polyester resin. These are dried yuzu and polyester. It may also be modified with polyether, eboxidized putadiene, etc.

基材としては,クラフト紙,リンター紙などを用いる。Kraft paper, linter paper, etc. are used as the base material.

祇基材を水溶性フェノール樹脂.メラξン樹脂等で処理
すると更に良好な結果をうることかできる。
The base material is water-soluble phenolic resin. Even better results can be obtained by treatment with melanin resin or the like.

難燃性を必要とする場合には.ブロム化エポキシ+X−
1 脂,ブロム化ビフエニルエーテル,りAJエステル
類を添加すればよい。
When flame retardancy is required. Brominated epoxy +X-
1 Fats, brominated biphenyl ethers, and AJ esters may be added.

本発明により積層板を製造するには,トルエン,メタノ
ール.アセトン等の溶剤に溶解した熱硬化性樹脂ワニス
を基材に所定量含浸乾燥して得られたブリブレグを必要
枚数積層更に必要により同箔を積層して加熱加圧する。
To produce a laminate according to the present invention, toluene and methanol are used. A required number of blibregs obtained by impregnating and drying a base material with a predetermined amount of thermosetting resin varnish dissolved in a solvent such as acetone are laminated, and if necessary, the same foil is laminated and heated and pressed.

(実施例〕 実施例1 予め水溶性フェノール樹脂を樹脂付着114〜20%と
なるように処理した金属イオン及び塩素イオン含有量の
少ないクラフト紙に,茂留.洗浄を繰り返して.金属イ
オン及び塩素イオンを低滅した桐柚変性率30%のレゾ
ール樹脂を含侵乾燥してブリプレグ(樹脂付着量48〜
60%)とした。このプリプレグ8枚と接着材付S’A
 f&とを組合せ.加熱加圧して銅張り積層板を得た。
(Example) Example 1 A kraft paper with low metal ion and chlorine ion content that has been treated with a water-soluble phenol resin in advance to have a resin adhesion of 114 to 20% is coated with Shigetome. Repeated washing is performed to remove metal ions and chlorine. Bripreg (resin adhesion amount 48~
60%). These 8 sheets of prepreg and S'A with adhesive
Combine f&. A copper-clad laminate was obtained by heating and pressing.

得られた積層板は鉄イオン200ppm,ナトリウムイ
オン400ppm,カルシウムイオン800ρρmカリ
ウムイオン5oppm,塩素イオン180ppmであっ
た。
The obtained laminate contained 200 ppm of iron ions, 400 ppm of sodium ions, 800 ppm of calcium ions, 5 oppm of potassium ions, and 180 ppm of chlorine ions.

実施例2 予め水溶性フェノール樹脂を樹脂付着量14〜20%と
なるように処理したクラフト紙に,蒸留洗浄を繰り返し
て,金属イオン及び塩素イオンを低減した洞油変性率3
0%,鉄イオン100ppm,ナトリウムイオン80p
pm,カルシウムイオン150ppm,塩素イオン50
ppmのレゾール樹脂を含浸乾燥してプリプレグ(樹脂
付着量48〜60%)とした.このプリプレグ8枚と接
着材付銅箔とを組合せ.加熱加圧して銅張り積層手反を
得た。
Example 2 Kraft paper that had been previously treated with a water-soluble phenol resin to a resin adhesion amount of 14 to 20% was repeatedly washed by distillation to reduce metal ions and chloride ions, resulting in an oil modification rate of 3.
0%, iron ion 100ppm, sodium ion 80p
pm, calcium ion 150ppm, chloride ion 50
A prepreg (resin adhesion amount: 48-60%) was obtained by impregnating and drying ppm of resol resin. Combine these 8 sheets of prepreg and copper foil with adhesive. A copper-clad laminated fabric was obtained by heating and pressing.

比較例 予め水溶性フェノール樹脂を樹脂付着ft14〜20%
となるように処理したクラフト紙に,市販の桐油変性率
30%のレゾール樹脂を含浸乾燥してプリプレグ(樹脂
付着量48〜60%)とした。
Comparative example: Water-soluble phenol resin was attached to the resin in advance by 14 to 20%.
A prepreg (resin adhesion amount: 48 to 60%) was obtained by impregnating and drying a commercially available resol resin with a tung oil modification rate of 30% into kraft paper treated to give the following properties.

このブリブレグ8枚と接着材付銅箔とを組合せ,加熱加
圧して銅張り積層板を得た。得られた積層板は鉄イオン
400ppm.ナトリウムイオン700ppm,  カ
ルシウムイオン1200ppmカリウムイオン100p
pm,塩素イオン320ppmであった。
Eight of these brev legs and copper foil with adhesive were combined and heated and pressed to obtain a copper-clad laminate. The obtained laminate contained 400 ppm of iron ions. Sodium ion 700ppm, calcium ion 1200ppm potassium ion 100p
pm, and chlorine ions were 320 ppm.

以上得られた積層板の特性を表1に示す。Table 1 shows the properties of the laminate obtained above.

試験方法 耐銀マイグレーション性 穴間ビノチ2.Omm,  ランド径1.5Φ.穴径0
,7Φ.90穴連続2回路の銀マイグレーシゴンテスト
パターンにおける印加電圧50V,W度90%RH.温
度40゜C2000時間処理後の回路間絶縁抵抗 吸湿率 プレンシャークッカ121゜C,2.1気圧8時間処理
後の吸温率 〔発明の効果〕
Test method Silver migration resistance Anama binochi 2. Omm, land diameter 1.5Φ. Hole diameter 0
, 7Φ. Applied voltage 50V, W degree 90%RH. Insulation resistance between circuits after 2000 hours of treatment at 40°C Moisture absorption rate Heat absorption rate after 8 hours of treatment at 121°C and 2.1 atm in prensher cooker [Effects of the invention]

Claims (1)

【特許請求の範囲】[Claims] 1、基材に熱硬化性樹脂を含浸硬化させる積層板の製造
方法において、硬化後の積層板の含有するイオン濃度が
、金属イオン2000ppm以下、塩素イオン濃度30
0ppm以下となるように基材及び樹脂を使用すること
を特徴とする積層板の製造方法。
1. In a method for manufacturing a laminate in which a thermosetting resin is impregnated into a base material and cured, the ion concentration of the laminate after curing is 2000 ppm or less for metal ions, and 30 ppm for chlorine ions.
A method for manufacturing a laminate, characterized in that a base material and a resin are used so that the concentration is 0 ppm or less.
JP30568989A 1989-11-24 1989-11-24 Preparation of laminated sheet Pending JPH03164242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30568989A JPH03164242A (en) 1989-11-24 1989-11-24 Preparation of laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30568989A JPH03164242A (en) 1989-11-24 1989-11-24 Preparation of laminated sheet

Publications (1)

Publication Number Publication Date
JPH03164242A true JPH03164242A (en) 1991-07-16

Family

ID=17948176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30568989A Pending JPH03164242A (en) 1989-11-24 1989-11-24 Preparation of laminated sheet

Country Status (1)

Country Link
JP (1) JPH03164242A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009109003A1 (en) * 2008-03-03 2009-09-11 Depco-Trh Pty Ltd Heat reflective laminate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009109003A1 (en) * 2008-03-03 2009-09-11 Depco-Trh Pty Ltd Heat reflective laminate

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