JP2000169605A - Prepreg sheet for laminated board and its production - Google Patents
Prepreg sheet for laminated board and its productionInfo
- Publication number
- JP2000169605A JP2000169605A JP10376631A JP37663198A JP2000169605A JP 2000169605 A JP2000169605 A JP 2000169605A JP 10376631 A JP10376631 A JP 10376631A JP 37663198 A JP37663198 A JP 37663198A JP 2000169605 A JP2000169605 A JP 2000169605A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- prepreg sheet
- component
- varnish
- resin varnish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は積層板の積層成形用途
或は接着用途のプリプレグシートに関し、更に詳しくは
加熱加圧して積層成形する際に、樹脂フローが少なく、
且つボイドの発生の少ないプリプレグシートおよびその
製造法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prepreg sheet for use in laminating or laminating laminates, and more particularly, to reduce the resin flow when laminating by heating and pressing.
The present invention also relates to a prepreg sheet with less generation of voids and a method for producing the same.
【０００２】[0002]
【従来技術およびその問題点】積層板は、プリプレグシ
ートを適数枚重ね、これを加熱加圧して一体に形成する
ことにより得ることができる。またプリント配線板等に
用いられる銅箔張りの積層板は、プリプレグシート適数
枚とその片面または両面に銅箔を重ね合せ、この重ね合
わせ構成体を加熱加圧して一体に形成することにより、
片面または両面銅箔張りの積層板を得ることができる。
更にまた、多層プリント配線板の中間製品である内層回
路入りの積層板は、片面または両面銅箔張りの積層板の
銅箔に所望の回路パターンをケミカルエッチング等の手
段により形成してなる回路板の片面または両面に、接着
用とのプリプレグシートを重ね合わせ、その上に銅箔ま
たは別の回路板若しくは銅箔張り積層板を更に重ね合わ
せて、この重ね合わせ構成体を加熱加圧して一体に成形
することにより、得ることができる。この多層プリント
配線板用の内層回路入り積層板に、屡々電子部品搭載用
の凹部を形成することがあるが、この電子部品搭載用の
凹部を形成する内層回路入り積層板にあっては、回路板
に重ね合わせるプリプレグシートや別の回路板若しくは
銅箔張り積層板に予め電子部品搭載用の凹部を形成する
ための貫通穴加工を施したものを用いて、加熱加圧によ
る積層成形と同時に電子部品搭載用の凹部も成形するこ
とが行われている。積層板の加熱加圧による積層成形す
る際に、電子部品搭載用の凹部を同時に形成する場合に
おいて特に、プリプレグシートの樹脂フローが少ないと
電子部品搭載用の凹部を形成する内層回路入り積層板積
層板の内部及び／或は表面にボイドが発生し易くなり、
またボイドの発生を抑制するために樹脂フローを多くす
ると電子部品搭載用の凹部内に流れ出て電子部品搭載用
の凹部を所望の形、状態に形成できなくなり、ボイドの
発生が少なく且つ電子部品搭載用の凹部等への樹脂の流
れ出しの少ない樹脂フローの適正の範囲は極めて狭い、
と云う問題がある。発明者等は、係る問題点を解決する
ために、プリプレグシートのＢ−ステージ化の反応度合
いの変化に対するプリプレグシートを加熱し溶融軟化さ
せた際の溶融粘度の変化幅を少なくすることについて鋭
意検討している際に、本発明を成した。2. Description of the Related Art A laminated plate can be obtained by laminating a suitable number of prepreg sheets, and heating and pressurizing the prepreg sheets to integrally form the prepreg sheets. Also, a copper foil-clad laminate used for printed wiring boards, etc., is formed by laminating a suitable number of prepreg sheets and copper foil on one or both sides thereof, and heating and pressing this laminated structure to form an integral body,
A single-sided or double-sided copper foil-clad laminate can be obtained.
Furthermore, a laminated board containing an inner layer circuit, which is an intermediate product of a multilayer printed wiring board, is a circuit board formed by forming a desired circuit pattern on a copper foil of a single-sided or double-sided copper foil-laminated laminate by means of chemical etching or the like. One or both sides of the prepreg sheet for bonding is laminated, copper foil or another circuit board or copper foil-clad laminate is further laminated thereon, and the laminated structure is heated and pressed to form an integrated body It can be obtained by molding. A concave portion for mounting an electronic component is often formed on the laminate containing an inner layer circuit for the multilayer printed wiring board. Using a prepreg sheet or another circuit board or a copper foil-clad laminate, which has been previously subjected to through-hole processing to form recesses for mounting electronic components, using a prepreg sheet, Molding of a recess for mounting a component is also performed. When forming a concave portion for mounting electronic components at the same time as forming a laminate by applying heat and pressure to the laminate, especially when forming a concave portion for mounting electronic components when the resin flow of the prepreg sheet is small, the laminated plate with an inner layer circuit is formed. Voids are easily generated inside and / or on the surface of the plate,
Also, if the resin flow is increased in order to suppress the generation of voids, the resin flows out into the recesses for mounting electronic components and the recesses for mounting electronic components cannot be formed in a desired shape and state. The appropriate range of resin flow with less resin flow to the recess for
There is a problem. In order to solve such a problem, the inventors have intensively studied to reduce the change width of the melt viscosity when the prepreg sheet is heated and melt-softened in response to the change in the degree of reaction of the prepreg sheet in the B-stage. In doing so, the present invention was accomplished.
【０００３】[0003]
【問題点を解決するための手段】この第一発明の積層板
用プリプレグシートは、上記問題点を解決するために、
基材に樹脂ワニスを含浸し、これを加熱乾燥した積層板
用のプリプレグシートであって、樹脂ワニスがエポキシ
樹脂、硬化剤および硬化促進剤からなる樹脂成分と無機
充填剤成分と溶剤成分とを必須成分とし、溶剤成分５０
重量％のときを基準にして１７０℃での硬化時間が３６
０秒以上である樹脂ワニスであり、且つ加熱乾燥の後に
おける１７０℃での樹脂流れが５％以下であることを特
徴とするものである。また、第二発明の積層板用プリプ
レグシートの製造法は、基材にエポキシ樹脂、硬化剤お
よび硬化促進剤からなる樹脂成分と無機充填剤成分と溶
剤成分とを必須成分とし、溶剤成分５０重量％のときを
基準にして１７０℃での硬化時間が３６０秒以上である
樹脂ワニスを含浸し、これを乾燥後における１７０℃で
の樹脂流れが５％以下となるまで加熱乾燥することを特
徴とするものである。Means for Solving the Problems The prepreg sheet for a laminate according to the first invention is intended to solve the above problems.
A prepreg sheet for a laminate, in which a base material is impregnated with a resin varnish and heated and dried, wherein the resin varnish comprises an epoxy resin, a resin component including a curing agent and a curing accelerator, an inorganic filler component, and a solvent component. Essential component, solvent component 50
Curing time at 170 ° C. based on weight% is 36
It is a resin varnish of 0 seconds or more, and the resin flow at 170 ° C. after heating and drying is 5% or less. The method for producing a prepreg sheet for a laminate according to the second invention comprises, as essential components, a resin component comprising an epoxy resin, a curing agent and a curing accelerator, an inorganic filler component and a solvent component, and a solvent component of 50 wt. %, And impregnated with a resin varnish having a curing time at 170 ° C. of 360 seconds or more at 170 ° C., and drying by heating until the resin flow at 170 ° C. after drying becomes 5% or less. Is what you do.
【０００４】この発明に用いる樹脂ワニスは、基材に含
浸するエポキシ樹脂、硬化剤および硬化促進剤からなる
樹脂成分と無機充填剤成分と溶剤成分とを必須成分と
し、溶剤成分５０重量％のときを基準にして１７０℃で
の硬化時間が３６０秒以上であることが必要であり、且
つ加熱乾燥の後における１７０℃での樹脂流れが５％以
下であることも必要である。樹脂ワニスの固形分濃度と
しては、限定するものではないが、４０〜６０重量％が
含浸性・作業性の点において好ましい。[0004] The resin varnish used in the present invention comprises, as essential components, a resin component comprising an epoxy resin, a curing agent and a curing accelerator, an inorganic filler component and a solvent component which are impregnated into a base material. The curing time at 170 ° C. must be 360 seconds or more based on the above, and the resin flow at 170 ° C. after heating and drying must be 5% or less. The solid content of the resin varnish is not limited, but is preferably 40 to 60% by weight in terms of impregnation and workability.
【０００５】樹脂ワニスの硬化時間は、溶剤成分５０重
量％（これは固形成分濃度５０重量％に相当する。）の
樹脂ワニスから、０．５ｍｌを採取し、これを１７０℃
に調整した熱盤上に置き、へらでかきまぜ、糸状の樹脂
が切れるまで接円運動を繰り返し、切れた時点までの時
間を測定することにより求める。プリプレグシートの樹
脂流れは、ＪＩＳ−Ｃ６５２１の５．５項に準拠して測
定することにより求める。[0005] The curing time of the resin varnish was such that 0.5 ml was sampled from a resin varnish having a solvent component of 50% by weight (corresponding to a solid component concentration of 50% by weight).
It is determined by placing the sample on a hot plate, stirring with a spatula, repeating tangential movement until the thread-like resin is cut, and measuring the time until the cut. The resin flow of the prepreg sheet is determined by measuring in accordance with 5.5 of JIS-C6521.
【０００６】樹脂ワニスの固形分濃度としては、限定す
るものではないが、４０〜６０重量％が含浸性・作業性
の点において好ましい。基材に樹脂ワニスを含浸し、こ
れを加熱乾燥する条件は、限定するものではないが、温
度として約１２０〜２２０℃の範囲で、時間として約１
〜３０分の範囲であり、樹脂流れ５％以下の点から定め
る。The solid content of the resin varnish is not limited, but is preferably 40 to 60% by weight in terms of impregnation and workability. The conditions for impregnating the base material with the resin varnish and heating and drying the resin varnish are not limited, but the temperature is in the range of about 120 to 220 ° C. and the time is about 1 hour.
It is in the range of ３０30 minutes and is determined from the point of 5% or less of resin flow.
【０００７】プリプレグシートは、基材に含浸する樹脂
ワニスの硬化時間が長いほど、プリプレグ樹脂の加熱し
溶融軟化した際における樹脂流れに対する溶融粘度の変
化幅が少なくなり、実用的には３６０〜６００秒で、６
００秒以上では樹脂の流れ出しがより少なくなり、硬化
時間がより長くなってボイドの除去の点はより改善でき
るが、硬化反応により長い時間を要し、生産効率が下が
ると云う別の問題が発生する。樹脂ワニスの硬化時間が
長いほど（３６０秒以上）、換言すれば、樹脂ワニスの
硬化速度がゆるやかであるほど、プリプレグ樹脂の溶融
粘度が高くなって一定化するのは、硬化反応の初期にお
いて３次元化の反応よりも２次元化（直線状化）の反応
が優先的に生じて、長鎖状高分子状態になる割合が高い
ためであろうと思われる。In the prepreg sheet, the longer the curing time of the resin varnish impregnated in the base material, the smaller the range of change in the melt viscosity with respect to the resin flow when the prepreg resin is heated and melt-softened. In seconds, 6
If the time is longer than 00 seconds, the resin flows less, the curing time is longer, and the point of void removal can be improved. However, another problem occurs that the curing reaction requires a longer time and the production efficiency is reduced. I do. The longer the curing time of the resin varnish (360 seconds or more), in other words, the slower the curing speed of the resin varnish, the higher the melt viscosity of the prepreg resin and the more constant it is at the beginning of the curing reaction. This is probably because the two-dimensional (linear) reaction occurs preferentially over the three-dimensional reaction, and the ratio of the long-chain polymer state is high.
【０００８】この発明に用いる基材としては、限定する
ものではないが、ガラス繊維、セルローズ繊維、合成繊
維等を使用した布、不織布、紙等を例示できる。Examples of the substrate used in the present invention include, but are not limited to, cloth, nonwoven fabric, paper and the like using glass fiber, cellulose fiber, synthetic fiber and the like.
【０００９】この発明に用いるエポキシ樹脂としては、
固形のものを用いる。限定するものではないが、ビスフ
ェノールＡ型エポキシ樹脂、ノボラック型エポキシ樹
脂、三官能型エポキシ樹脂、四官能型エポキシ樹脂、ビ
フェル型エポキシ樹脂、ジシクロペンタジエン型エポキ
シ樹脂、などやこれら変性エポキシ樹脂、更にはこれら
の臭素化、リン化樹脂などを例示でき、これらの一種も
しくは数種を併用して用いることができる。The epoxy resin used in the present invention includes:
Use a solid one. Although not limited, bisphenol A type epoxy resin, novolak type epoxy resin, trifunctional type epoxy resin, tetrafunctional type epoxy resin, bifel type epoxy resin, dicyclopentadiene type epoxy resin, etc. and modified epoxy resins thereof, Can be exemplified by these brominated and phosphinated resins, and one or more of these can be used in combination.
【００１０】この発明に用いる硬化剤としては、固形タ
イプのものを用いる。限定するものではないが、アミン
類、酸無水物、ポリアミド樹脂、フェノール樹脂類、イ
ミダゾール類、弗化ホウ素錯塩類などを例示できる。As the curing agent used in the present invention, a solid type curing agent is used. Examples include, but are not limited to, amines, acid anhydrides, polyamide resins, phenolic resins, imidazoles, and boron fluoride complex salts.
【００１１】この発明に用いる硬化促進剤としては、限
定するものではないが、イミダゾール類、三級アミン
類、ホスフィン類などを例示できる。The curing accelerator used in the present invention includes, but is not limited to, imidazoles, tertiary amines, phosphines and the like.
【００１２】この発明に用いる無機充填剤は、プリプレ
グ樹脂の溶融軟化の際の粘性流動にチクソトロピー性を
付与できるものが好ましく、粒径が０．８μｍ乃至１．
２μｍの範囲の平板状のタルクが好適であり、１５〜４
０部配合すると、樹脂ワニス中での均一分散の保持性、
基材への含浸性に優れると共に、プリプレグ樹脂を溶融
軟化させた際にチクソトロピー性が発現する。The inorganic filler used in the present invention is preferably capable of imparting thixotropic properties to the viscous flow of the prepreg resin during melt softening, and has a particle size of 0.8 μm to 1.
Flat talc in the range of 2 μm is preferred,
When 0 parts are blended, the retention of uniform dispersion in the resin varnish,
In addition to being excellent in impregnating properties to the base material, thixotropic properties are exhibited when the prepreg resin is melt-softened.
【００１３】この発明に用いる溶剤としては、限定する
ものではないが、アセトン、ＭＥＫなどのケトン類、ア
ルコール類、セロソルブ類、ＤＭＦ、芳香族炭化水素
類、などを例示でき、基材への含浸性、沸点、毒性など
を考慮して決定する。Examples of the solvent used in the present invention include, but are not limited to, ketones such as acetone and MEK, alcohols, cellosolves, DMF, and aromatic hydrocarbons. Determined in consideration of properties, boiling point, toxicity, etc.
【００１４】以下、本発明を実施例、比較例を用いて説
明する。Hereinafter, the present invention will be described with reference to Examples and Comparative Examples.
【実施例】先ず、次の（ａ１）〜（ｅ２）の組成物から
なり、硬化促進剤（ｃ）の配合量により１７０℃でのワ
ニスの硬化時間を３８０秒に調節し、溶剤（ｅ２）の配
合量により溶剤成分５０重量％（これは固形成分５０重
量％に相当する。）に調節してエポキシ樹脂ワニスＡを
調合した。 （ａ１）エポキシ樹脂：東都化成製ＹＤＢ−５３０ ………… ９０部。 （ａ２）エポキシ樹脂：東都化成製ＹＤＣＮ−７０４ ……… １０部。 （ｂ ）硬化剤：ジシアンジアミド ……………………………… ３部。 （ｃ ）硬化促進剤：イミダゾール２Ｅ４ＭＺ（ワニスの硬化時間が３８０秒と なる量） …………………………………… 約０．０３部。 （ｄ ）充填剤：タルク（平均粒形１．０μｍ） …………… ２０部。 （ｅ１）溶剤：メチルセロソルブ ……………………………… ３０部。 （ｅ２）溶剤：ＭＥＫ（ワニスの固形分５０重量％となる量） … 適量。 次に、エポキシ樹脂ワニスＡを日東紡製ＷＥ−０５Ｅの
厚み０．０５ｍｍのガラスクロス基材に含浸・予備乾燥
して樹脂含有量６５重量％のプリプレグシートとし、こ
のプリプレグシートを乾燥温度１５０℃において、乾燥
時間を調節することにより樹脂流れが０．１％、１．２
％、３％、４％、５％のプリプレグシートとを得た。次
いで、別途準備した両面銅箔（厚み３５μｍ）張りガラ
スクロス基材エポキシ樹脂積層板（厚み０．５ｍｍ）の
銅箔に、電子部品の収納用凹部の約２５ｍｍ角の大きさ
の底面を含めた所望の回路パターンをケミカルエッチン
グにより形成した回路板の上に、プリプレグシートに電
子部品収納用の約２５ｍｍ角の大きさの貫通孔を加工し
たものを位置合せしながら重ね合わせ、更にその上に別
途準備した片面銅箔（厚み１８μｍ）張りガラスクロス
基材エポキシ樹脂積層板（厚み０．３ｍｍ）に電子部品
収納用の約２５ｍｍ角の大きさの貫通孔を加工したもの
を位置合せしながら重ね合わせた組合せ構成体とするこ
とにより、樹脂流れが０．１％、１．０％、２．０％、
３．０％、４．０％、５．０％のプリプレグシートを用
いた６種類の組合せ構成体を得た。これら６種類の組合
せ構成体を上下より加熱加圧する金型にセットし、金型
の上下にそれぞれクラフトクッション紙１０枚づつを介
して圧力４０ｋｇｆ／ｃｍ２・温度１５０℃で３０分
間、その後１７０℃に昇温し６０分間の条件で加熱加圧
して、樹脂流れが０．１％、１．０％、２．０％、３．
０％、４．０％、５．０％のプリプレグシートに対応す
る６種類の厚み０．８ｍｍの電子部品収納用凹部を有す
内層回路入り両面銅箔張り積層板を得た。これら６種類
の電子部品収納用凹部を有す内層回路入り両面銅箔張り
積層板の凹部におけるボイドの発生および樹脂しみだし
量を調べ、その結果を表１に示した。First, the curing time of a varnish at 170 ° C. was adjusted to 380 seconds by the amount of the curing accelerator (c), comprising the following compositions (a 1 ) to (e 2 ). The epoxy resin varnish A was prepared by adjusting the solvent component to 50% by weight (this corresponds to a solid component of 50% by weight) depending on the amount of e 2 ). (A 1) an epoxy resin: Toto Kasei YDB-530 ............ 90 parts. (A 2) epoxy resin: Toto Kasei YDCN-704 ......... 10 parts. (B) Curing agent: dicyandiamide ……………………………… 3 parts. (C) Curing accelerator: imidazole 2E4MZ (an amount that gives a varnish curing time of 380 seconds) Approx. 0.03 parts. (D) Filler: talc (average particle size: 1.0 μm) 20 parts. (E 1) Solvent: methyl cellosolve .................................... 30 parts. (E 2 ) Solvent: MEK (amount of varnish having a solid content of 50% by weight) ... appropriate amount. Next, the epoxy resin varnish A was impregnated and pre-dried into a 0.05 mm-thick glass cloth base material of WE-05E manufactured by Nitto Bosshi to prepare a prepreg sheet having a resin content of 65% by weight, and the prepreg sheet was dried at 150 ° C. In the above, the resin flow was adjusted to 0.1%, 1.2% by adjusting the drying time.
%, 3%, 4%, and 5% of prepreg sheets. Then, a separately prepared copper foil of a double-sided copper foil (thickness: 35 μm) -clad glass cloth base epoxy resin laminate (thickness: 0.5 mm) was provided with a bottom having a size of about 25 mm square of a recess for storing electronic components. On a circuit board on which a desired circuit pattern is formed by chemical etching, a prepreg sheet with a through-hole of about 25 mm square for storing electronic components is superimposed while aligning, and further over it The prepared single-sided copper foil (thickness: 18 μm) -clad glass cloth base epoxy resin laminate (thickness: 0.3 mm) with a through-hole of approximately 25 mm square for storing electronic components processed and superimposed while aligning With the combined structure, the resin flow is 0.1%, 1.0%, 2.0%,
Six types of combined components using 3.0%, 4.0%, and 5.0% prepreg sheets were obtained. These six types of combined components are set in a mold that heats and presses from above and below, and a pressure of 40 kgf / cm 2 , a temperature of 150 ° C. for 30 minutes, and a temperature of 170 ° C., respectively, above and below the mold via ten pieces of kraft cushion paper. And heated and pressurized under the condition of 60 minutes to reduce the resin flow to 0.1%, 1.0%, 2.0% and 3.
Six types of double-sided copper foil-clad laminates having an inner layer circuit and having recesses for housing electronic components with a thickness of 0.8 mm corresponding to 0%, 4.0%, and 5.0% prepreg sheets were obtained. The occurrence of voids and the amount of resin exudation in the recesses of the double-sided copper foil-clad laminate containing the inner layer circuit having these six types of recesses for housing electronic components were examined. The results are shown in Table 1.
【００１５】[0015]
【比較例】実施例のうち、充填剤として平均粒径１．６
μｍのタルクを用い、エポキシ樹脂ワニスのワニス硬化
時間を硬化促進剤（ｃ）の量を調節することにより２０
０秒とした以外は、実施例と同様に行って、６種類の電
子部品収納用の凹部を有す内層回路入り両面銅箔張り積
層板を得て、ボイドの発生および樹脂しみだし量を調
べ、その結果を表２に示した。[Comparative Example] In Examples, an average particle size of 1.6 was used as a filler.
The varnish curing time of the epoxy resin varnish can be adjusted by adjusting the amount of the curing accelerator (c) by using talc of μm.
Except for 0 second, the same procedure as in Example was carried out to obtain a double-sided copper foil-clad laminate containing an inner circuit having six kinds of recesses for accommodating electronic components, and the generation of voids and the amount of resin exudation were examined. The results are shown in Table 2.
【００１６】[0016]
【表１】 [Table 1]
【００１７】[0017]
【表２】 [Table 2]
【００１８】[0018]
【発明の効果】この発明は、加熱加圧により積層成形す
る際に、ボイドの発生が少なく且つ樹脂のしみだしの少
ないプリプレグシートおよびその製造法を提供できる。According to the present invention, it is possible to provide a prepreg sheet in which the generation of voids is small and the resin is less exuded when laminating and molding by heating and pressing, and a method for producing the same.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F072 AA02 AA04 AA05 AA07 AB02 AB03 AB09 AB28 AB29 AB31 AD23 AE01 AE02 AE23 AF06 AF28 AF30 AG03 AH02 AH21 AJ04 AL12 AL13 4J002 CC03X CD00W CD02W CD03W CD05W CD06W CL00X DH007 DJ048 DK006 EF006 EN006 EN007 EU116 EU117 EW017 FD018 FD14X FD146 FD157 GF00 GQ00 ──────────────────────────────────────────────────続 き Continuing on the front page F term (reference) 4F072 AA02 AA04 AA05 AA07 AB02 AB03 AB09 AB28 AB29 AB31 AD23 AE01 AE02 AE23 AF06 AF28 AF30 AG03 AH02 AH21 AJ04 AL12 AL13 4J002 CC03X CD00W CD02W CD03W CD05W CD06007 006 006 006 EU116 EU117 EW017 FD018 FD14X FD146 FD157 GF00 GQ00
Claims (3)
乾燥した積層板用のプリプレグシートであって、前記樹
脂ワニスがエポキシ樹脂、硬化剤および硬化促進剤から
なる樹脂成分と無機充填剤成分と溶剤成分とを必須成分
とし、溶剤成分５０重量％のときを基準にして１７０℃
での硬化時間が３６０秒以上である樹脂ワニスであり、
且つ前記加熱乾燥の後における１７０℃での樹脂流れが
５％以下であることを特徴とする積層板用プリプレグシ
ート。1. A prepreg sheet for a laminate in which a base material is impregnated with a resin varnish and heated and dried, wherein the resin varnish is a resin component comprising an epoxy resin, a curing agent and a curing accelerator, and an inorganic filler. Component and a solvent component as essential components, and 170 ° C. based on 50% by weight of the solvent component.
A resin varnish having a curing time of at least 360 seconds,
A prepreg sheet for a laminate, wherein the resin flow at 170 ° C. after the heating and drying is 5% or less.
１．２μｍのタルクであることを特徴とする請求項１記
載の積層板用プリプレグシート。2. The prepreg sheet for a laminated board according to claim 1, wherein the inorganic filler is talc having an average particle size of 0.8 μm to 1.2 μm.
促進剤からなる樹脂成分と無機充填剤成分と溶剤成分と
を必須成分とし、溶剤成分５０重量％のときを基準にし
て１７０℃での硬化時間が３６０秒以上である樹脂ワニ
スを含浸し、これを乾燥後における１７０℃での樹脂流
れが５％以下となるまで加熱乾燥することを特徴とする
積層板用プリプレグシートの製造法。3. A base material comprising a resin component comprising an epoxy resin, a curing agent and a curing accelerator, an inorganic filler component and a solvent component as essential components, and at 170 ° C. based on 50% by weight of the solvent component. A method for producing a prepreg sheet for a laminate, comprising impregnating a resin varnish having a curing time of 360 seconds or longer, and heating and drying the resin varnish until the resin flow at 170 ° C. after drying becomes 5% or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10376631A JP2000169605A (en) | 1998-12-04 | 1998-12-04 | Prepreg sheet for laminated board and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10376631A JP2000169605A (en) | 1998-12-04 | 1998-12-04 | Prepreg sheet for laminated board and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000169605A true JP2000169605A (en) | 2000-06-20 |
Family
ID=18507475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10376631A Pending JP2000169605A (en) | 1998-12-04 | 1998-12-04 | Prepreg sheet for laminated board and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000169605A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002088626A (en) * | 2000-09-20 | 2002-03-27 | Shin Kobe Electric Mach Co Ltd | Glass fiber nonwoven fabric for laminated sheet and composite laminated sheet |
| JP2003347695A (en) * | 2002-05-28 | 2003-12-05 | Matsushita Electric Works Ltd | Method of manufacturing printed wiring board |
| WO2006121090A1 (en) * | 2005-05-12 | 2006-11-16 | Risho Kogyo Co., Ltd. | White prepreg, white laminated plate, and metal foil clad white laminated plate |
| JP2012214602A (en) * | 2011-03-31 | 2012-11-08 | Nippon Zeon Co Ltd | Method of producing metal-clad laminate |
| CN105462168A (en) * | 2014-09-26 | 2016-04-06 | 松下知识产权经营株式会社 | Prepreg, metal-clad laminate, and printed wiring board |
| WO2019142735A1 (en) * | 2018-01-16 | 2019-07-25 | 三菱ケミカル株式会社 | Prepreg and fiber-reinforced composite material |
-
1998
- 1998-12-04 JP JP10376631A patent/JP2000169605A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002088626A (en) * | 2000-09-20 | 2002-03-27 | Shin Kobe Electric Mach Co Ltd | Glass fiber nonwoven fabric for laminated sheet and composite laminated sheet |
| JP2003347695A (en) * | 2002-05-28 | 2003-12-05 | Matsushita Electric Works Ltd | Method of manufacturing printed wiring board |
| WO2006121090A1 (en) * | 2005-05-12 | 2006-11-16 | Risho Kogyo Co., Ltd. | White prepreg, white laminated plate, and metal foil clad white laminated plate |
| KR100940232B1 (en) | 2005-05-12 | 2010-02-04 | 리쇼 고교 가부시키가이샤 | White prepreg, white laminated plate, and metal foil clad white laminated plate |
| TWI403545B (en) * | 2005-05-12 | 2013-08-01 | Risho Kogyo Kk | White prepreg, white laminates, and metal foil-cladded white laminates |
| JP2012214602A (en) * | 2011-03-31 | 2012-11-08 | Nippon Zeon Co Ltd | Method of producing metal-clad laminate |
| CN105462168A (en) * | 2014-09-26 | 2016-04-06 | 松下知识产权经营株式会社 | Prepreg, metal-clad laminate, and printed wiring board |
| JP2016069389A (en) * | 2014-09-26 | 2016-05-09 | パナソニックＩｐマネジメント株式会社 | Prepreg, metal-clad laminate and printed wiring board |
| WO2019142735A1 (en) * | 2018-01-16 | 2019-07-25 | 三菱ケミカル株式会社 | Prepreg and fiber-reinforced composite material |
| JPWO2019142735A1 (en) * | 2018-01-16 | 2020-01-23 | 三菱ケミカル株式会社 | Prepreg and fiber reinforced composite materials |
| JP2020196896A (en) * | 2018-01-16 | 2020-12-10 | 三菱ケミカル株式会社 | Prepreg and fiber-reinforced composite material |
| US11339261B2 (en) | 2018-01-16 | 2022-05-24 | Mitsubishi Chemical Corporation | Prepreg and fiber-reinforced composite material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5260400B2 (en) | Multilayer board for producing multilayer printed wiring boards | |
| JP2000169605A (en) | Prepreg sheet for laminated board and its production | |
| JP4016782B2 (en) | Epoxy resin composition for printed wiring board, prepreg, metal-clad laminate, multilayer printed wiring board | |
| JP3412572B2 (en) | Epoxy resin composition, prepreg, metal foil with resin, adhesive sheet, laminated board and multilayer board | |
| JP2002145994A (en) | Prepreg for printed circuit board and laminate | |
| KR101174698B1 (en) | Prepreg for printed wiring board and copper-clad laminated board | |
| JPS61179221A (en) | Epoxy glass/copper laminate | |
| JP2002348754A (en) | Glass cloth, prepreg, laminated sheet, and printed wiring board | |
| JP2001030279A (en) | Manufacture of laminated sheet | |
| JP3288819B2 (en) | Copper clad laminate | |
| JP3596819B2 (en) | Printed circuit laminate | |
| JP2007091812A (en) | Epoxy resin composition, prepreg and metal foil-clad laminate | |
| JP3243027B2 (en) | Copper clad laminate | |
| JPH08151507A (en) | Epoxy resin composition for laminate | |
| JPH07176843A (en) | Laminated board for printed circuit | |
| JPS62169828A (en) | Production of substrate for printed circuit | |
| JP3409245B2 (en) | Epoxy resin composition for copper clad laminate, copper clad laminate, multilayer laminate | |
| JP2004165268A (en) | Laminate and printed circuit board | |
| JPH08103984A (en) | Copper-clad laminated plate | |
| JP2006316131A (en) | Method for producing glass substrate prepreg and glass substrate prepreg produced by the same production method | |
| JPH05286074A (en) | Copper-clad laminate | |
| JP2001269931A (en) | Production method of prepreg, prepreg and multilayer board | |
| JP2005171075A (en) | Resin composition for printed wiring board, and resin varnish using the resin composition, prepreg and laminated board | |
| JPH05318651A (en) | Copper-plated laminated sheet | |
| JPH10182946A (en) | Epoxy resin composition for printed wiring board and prepreg using the same |