JPH03164240A - Laminated body - Google Patents
Laminated bodyInfo
- Publication number
- JPH03164240A JPH03164240A JP30565089A JP30565089A JPH03164240A JP H03164240 A JPH03164240 A JP H03164240A JP 30565089 A JP30565089 A JP 30565089A JP 30565089 A JP30565089 A JP 30565089A JP H03164240 A JPH03164240 A JP H03164240A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- film
- laminate
- metal foil
- amine residue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 239000011888 foil Substances 0.000 claims abstract description 24
- 150000001412 amines Chemical group 0.000 claims abstract description 23
- 229920001721 polyimide Polymers 0.000 claims abstract description 14
- 239000004962 Polyamide-imide Substances 0.000 claims abstract description 13
- 229920002312 polyamide-imide Polymers 0.000 claims abstract description 13
- 239000009719 polyimide resin Substances 0.000 claims abstract description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000001257 hydrogen Substances 0.000 claims abstract description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 3
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 150000003949 imides Chemical class 0.000 abstract description 3
- 125000000217 alkyl group Chemical group 0.000 abstract description 2
- 150000001408 amides Chemical group 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 25
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000002904 solvent Substances 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 239000002253 acid Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- GLRKPWHKRHFMGC-UHFFFAOYSA-N 1,3-dioxo-2-benzofuran-4-carbonyl chloride Chemical compound ClC(=O)C1=CC=CC2=C1C(=O)OC2=O GLRKPWHKRHFMGC-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical compound C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- OONPLQJHBJXVBP-UHFFFAOYSA-N 3-(2-phenylethenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=CC=2C=CC=CC=2)=C1C(O)=O OONPLQJHBJXVBP-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 235000003823 Petasites japonicus Nutrition 0.000 description 1
- 240000003296 Petasites japonicus Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006114 decarboxylation reaction Methods 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 etc. can be used Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、たとえばフレキシブル配線ＪＪ＆等に用い
ることのできる、ポリイミド樹脂またはポリアミドイミ
ド樹脂を主成分とするフ．ｆルムの片面または両面に金
属済を積層させた積雇体に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a film whose main component is polyimide resin or polyamideimide resin, which can be used, for example, in flexible wiring JJ&. This relates to a laminated body in which a metal layer is laminated on one or both sides of a lumen.
［従来の艮術コ
フレキシブル配線基板は、可撓性をｈ゛する印刷同路板
であって、近年、電子１ｉ″＋１路の薄１じ化および軽
量化の要請に応えて多用されてきている。[Conventional design co-flexible wiring boards are printed circuit boards with high flexibility, and have been widely used in recent years in response to demands for thinner and lighter electronic 1i''+1 circuits. There is.
従来より工業的に専ら採用されているフレキシブル配線
基板の製遣方法は、たとえばデュポン社製カブトンのよ
うなポリイミドフィルムの両面または片面に金属箔とし
ての銅箔を接着剤層を介して、加熱、加圧下に貼り合わ
せポリイミドフィルム銅張板とする方法である。しかし
ながら、この方法では、銅箔とフィルムとの貼り合わせ
に使用する接着剤の耐熱性、電気的特性および機械的特
性に制約を受けるため、耐熱性フィルムが本来有する耐
熱性、電気的特性および機械的特性を発揮することがで
きない。そこで、このような問題を解消する方法として
、サブトラクティブ法や、セミアディティブ法またはフ
ルアディティブ法と呼ばれる方法が検討されている。The manufacturing method for flexible wiring boards, which has been exclusively used industrially, is to apply copper foil as a metal foil to one or both sides of a polyimide film such as DuPont's Kabuton through an adhesive layer, heat it, This is a method of laminating polyimide films under pressure to form a copper-clad board. However, this method is limited by the heat resistance, electrical properties, and mechanical properties of the adhesive used to bond the copper foil and film. cannot demonstrate its characteristics. Therefore, methods called a subtractive method, a semi-additive method, or a fully additive method are being considered as a method for solving such problems.
サブトラクティブ法は、たとえばポリイミド前駆体であ
るポリアミド溶液のような耐熱性樹脂溶液を、銅箔の上
に流延・塗６ｉ Ｌ、その後これを乾燥・硬化して銅箔
積層板としている。これらはそのままあるいは貼り合わ
せてからエッチング加工され、フレキシブル配線凰板と
して使用される。In the subtractive method, a heat-resistant resin solution such as a polyamide solution, which is a polyimide precursor, is cast and coated onto a copper foil, and then dried and cured to form a copper foil laminate. These are used as they are or after being bonded together and then etched and used as a flexible wiring board.
セミアディティブ法またはフルアディティブ法と呼ばれ
る方法は、耐熱性樹脂フィルムの片面あるいは両面に、
蒸着、スパッタリング、イオンプレーティング法などの
ような物理的な方法で、あるいは湿式めっきなどのよう
な化学的な方法で、直接銅の回路を形成する方法である
。A method called a semi-additive method or a fully additive method uses a heat-resistant resin film on one or both sides.
This is a method of directly forming copper circuits using physical methods such as evaporation, sputtering, ion plating, etc., or chemical methods such as wet plating.
［発明が解決しようとする課題］
しかしながら、これらの従来の方法では、金属箔との接
着性が悪く、フレキシブル配線旦板がフラットな平面を
形戊せず、カールして一方面側に湾曲してしまうという
問題があった。さらに、セミアディティブ法やフルアデ
ィティブ法では、コストが高くなるという問題もあった
。[Problems to be Solved by the Invention] However, with these conventional methods, the adhesion to the metal foil is poor, and the flexible wiring board does not form a flat plane, but curls and curves to one side. There was a problem with this. Furthermore, the semi-additive method and the fully additive method have the problem of high costs.
この発明の目的は、全属箔とフィルムとの間の接着性が
優れており、かつカールしにくい、フィルムと金属箔と
の積層体を提（ｊ％することにある。An object of the present invention is to provide a laminate of a film and a metal foil that has excellent adhesion between the entire metal foil and the film and is less likely to curl.
［課題を解決するための手段］
この発明の積層体は、イミド粘合またはアミド結合を形
威した下記のｔＭ ａ式（１）のアミン残基戊分が全ア
ミン残基の６０モル％以上含まれるポリイミド樹脂また
はポリアミドイミド樹脂を主成分とするフィルムと、こ
のフィルムの少なくとも一方の面の上に積層される金属
箔とを備えている。[Means for Solving the Problems] The laminate of the present invention has an amine residue fraction of the following tM a formula (1) forming imide viscosity or amide bonding of 60 mol% or more of the total amine residues. It includes a film whose main component is polyimide resin or polyamideimide resin, and a metal foil laminated on at least one surface of this film.
（以下余白）
（ここで、Ｒ，，Ｒ，，は、水素、または炭素数１〜４
のアルキル基であり、Ｒ１とＲ２は同じでもよい。）
マタ、この発明の積層体におけるフィルムには、低分子
量エボキシ樹脂が含まれていてもよく、その割合として
は、ポリイミド樹脂またはポリアミドイミド樹脂／低分
子量エポキシ樹脂の重量比で８ ０／２ ０〜９９／１
が好ましい。(Left below) (Here, R,,R,, is hydrogen or has 1 to 4 carbon atoms.
is an alkyl group, and R1 and R2 may be the same. ) The film in the laminate of the present invention may contain a low molecular weight epoxy resin, and the weight ratio of polyimide resin or polyamideimide resin/low molecular weight epoxy resin is 80/20. ~99/1
is preferred.
上記の構造式（Ｉ）のアミン残基成分を含めるために使
用する原料としては、たとえばトリジン、トリジンジイ
ソシアネートなどがある。このような原料を６０モル％
以上になるように配合し重合させることによって、構造
式（Ｉ）のアミン残基成分が全アミン残基の６０モル％
以上含まれるポリイミド樹脂またはポリアミドイミド樹
脂とすることができる。Examples of raw materials used to include the amine residue component of structural formula (I) above include tolidine and tolidine diisocyanate. 60 mol% of such raw materials
By blending and polymerizing in the above manner, the amine residue component of structural formula (I) is 60 mol% of the total amine residues.
The polyimide resin or polyamideimide resin contained above can be used.
この発明において、構造式（１）のアミンＫＰＭ成分が
含まれる量は、全アミン残基に対し６０モル％以上であ
るが、好ましくは７０モル％以上である。６０モル％未
満では、金属漬層仮およびそのエッチング加工品のカー
ルが大きくなり、フレキシブルプリント配線基板として
、加工性および機能性の向で峰ましいものではなくなる
。In this invention, the amount of the amine KPM component of structural formula (1) contained is 60 mol% or more, preferably 70 mol% or more, based on the total amine residues. If it is less than 60 mol%, curling of the temporary metallized layer and its etched product will become large, and the flexible printed wiring board will not be excellent in terms of workability and functionality.
この発明において、ポリイミド樹脂またはポリアミドイ
ミド樹脂を構成する他のアミン残基およびカルボン酸残
基は特に阻定されるものではない。In this invention, other amine residues and carboxylic acid residues constituting the polyimide resin or polyamideimide resin are not particularly restricted.
用いることできる原料の例として、以下に、アミン、イ
ソシアネート、カルボン酸、酸無水物および酸塩化物の
形で列半する。Examples of raw materials that can be used are listed below in the form of amines, isocyanates, carboxylic acids, acid anhydrides and acid chlorides.
アミン成分としては、ｐ−フ二二レンジアミン、ｍ−フ
二二レンジアミン、４．４’ −ジアミノジフエニルエ
ーテル、４．４’ −ジアミノジフエニルメタン、４．
４’ −ジアミノジフエニルスルホン、４、４′−ジア
ミノベンゾフェノン、２，２ビス（４−アミノフエニル
）プロパン、２，４−トリレンジイソシアネート、２．
６−トリレンジイソシアネート、４．４’ −ジフエニ
ルメタンジイソシアネート、キシリレンジイソシアネー
ト、イソホロンジイソシアネート、およびヘキサメチレ
ンジイソシアネートなどがある。As the amine component, p-phenyl diamine, m-phenyl diamine, 4.4'-diaminodiphenyl ether, 4.4'-diaminodiphenylmethane, 4.
4'-diaminodiphenyl sulfone, 4,4'-diaminobenzophenone, 2,2bis(4-aminophenyl)propane, 2,4-tolylene diisocyanate,2.
Examples include 6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate, isophorone diisocyanate, and hexamethylene diisocyanate.
カルボン酸成分としては、テレフタル酸、イソフタル酸
、４．４’ −ビフエニルジカルボン酸、トリメリット
酸、無水トリメット酸、ビロメリット酸、ピロメリット
酸無水物、３．３’ ，４．４一ベンゾフェノンテトラ
カルボン酸、３．３’４，４′−ベンゾフェノンテトラ
カルボン酸二無水物、３．３’ ．４．４’ −ジフ
エニルスルホンテトラカルボン酸二無水物、３−クロロ
ホルミル無水フタル酸、テレフタル酸二塩化物、イソフ
タル酸二塩化物、アジビン酸、セバシン酸、マレイン酸
、フマール酸、ダイマー酸、スチルベンジカルボン酸な
どがある。Carboxylic acid components include terephthalic acid, isophthalic acid, 4.4'-biphenyldicarboxylic acid, trimellitic acid, trimetic anhydride, biromellitic acid, pyromellitic anhydride, and 3.3',4.4-benzophenone. Tetracarboxylic acid, 3.3'4,4'-benzophenonetetracarboxylic dianhydride, 3.3'. 4.4'-diphenylsulfonetetracarboxylic dianhydride, 3-chloroformyl phthalic anhydride, terephthalic acid dichloride, isophthalic acid dichloride, adivic acid, sebacic acid, maleic acid, fumaric acid, dimer acid, Examples include stilbene dicarboxylic acid.
これらの原料からこの発明に用いられるポリイミドまた
はポリアミドイミド樹脂を製造する方法としては従来公
知の方法を使用することができるが、アミン威分として
イソシアネートを用いる脱炭酸縮合法が好ましい。Conventionally known methods can be used to produce the polyimide or polyamideimide resin used in the present invention from these raw materials, but a decarboxylation condensation method using isocyanate as the amine component is preferred.
重合溶媒としては、ニトロベンゼン、スルホラン、ジメ
チルホルムアミド、ジメチルアセトアミド、Ｎ−メチル
−２−ビロリドンなどを用いることができる。As the polymerization solvent, nitrobenzene, sulfolane, dimethylformamide, dimethylacetamide, N-methyl-2-pyrrolidone, etc. can be used.
この発明において樹脂を溶解するための溶媒としては、
ジメチルホルムアミド、ジメチルアセトアミド、Ｎ−メ
チル−２−ピロリドン、エチルセロソルブ、ジエチレン
グリコールジメチルエーテルなどがある。希釈剤として
は、アセトン、トルエン、午シレン、ソルベツソ、ｍ−
クレゾール、ジオキサン、テトラヒドロフランなどを１
丁ｆｒ．ｌこ用いることができる。In this invention, the solvent for dissolving the resin is
Examples include dimethylformamide, dimethylacetamide, N-methyl-2-pyrrolidone, ethyl cellosolve, and diethylene glycol dimethyl ether. As a diluent, acetone, toluene, silane, sorbetso, m-
Cresol, dioxane, tetrahydrofuran, etc.
Ding fr. l can be used.
また、この発明においては、重合１１．１７に用いた溶
液をそのまま用い塗／１ｉすることができる。また塗工
性および乾燥性の面から考゛應して、同じ溶媒あるいは
他の溶媒を用いて希釈し塗王液を調製することもできる
。In addition, in this invention, the solution used in Polymerization 11.17 can be used as it is for coating/1i. In addition, in consideration of coating properties and drying properties, a coating liquid may be prepared by diluting with the same solvent or another solvent.
この発明において用いる金属箔の厚みは特に限定される
ものではないが、たとえば５μｍ〜１００μｍの厚みの
金属箔を用いることができる。また、金属箔としては、
銅箔、アルミニウム箔、スチール箔およびニッケル箔な
どを使用することができ、これらを複合した複合金属箔
や皿鉛やクロムなどの他の金属で処理した金属箔を用い
ることもできる。Although the thickness of the metal foil used in this invention is not particularly limited, for example, a metal foil with a thickness of 5 μm to 100 μm can be used. In addition, as a metal foil,
Copper foil, aluminum foil, steel foil, nickel foil, etc. can be used, and composite metal foils made of these or metal foils treated with other metals such as flat lead or chromium can also be used.
この発明において金属箔とフィルムを積層する方法とし
ては、上述のように金屈箔の上に樹脂の有機溶剤による
溶液を塗工する方法がある。この塗工方法は特に限定さ
れるものではなく、従来からよく知られている方法を適
用させることができ、たとえばロールコータ、ナイフコ
ー夕、ドクターブレードコータなどにより塗工すること
ができる。In the present invention, as a method for laminating the metal foil and the film, there is a method of applying a solution of a resin in an organic solvent onto the metal foil as described above. This coating method is not particularly limited, and conventionally well-known methods can be applied, such as a roll coater, knife coater, doctor blade coater, etc.
乾燥後の塗膜の厚みは５ ｌＺ ｍ〜１５０μｍが好ま
しく、さらに好ましくは１０μｍ〜６０μｍである。ま
た、塗工および乾燥を複数回繰返し重ね塗りしてもよい
。The thickness of the coating film after drying is preferably 5 lZ m to 150 μm, more preferably 10 μm to 60 μm. Further, the coating and drying may be repeated multiple times.
この発明において金属箔とフィルムを積層させる他の方
法として、たとえば、別のシート上に樹脂の有機溶媒溶
戒を塗上し、これを適度に乾燥させた後、金属箔上に転
写する方法がある。Another method for laminating metal foil and film in the present invention is, for example, to coat another sheet with an organic solvent resin, dry it appropriately, and then transfer it onto the metal foil. be.
塗工した溶媒含有樹脂層から溶媒を除表するには、通常
５０℃〜２５０℃、奸ましくは５０℃〜２００℃に加熱
する。また、溶媒を完全に除去せずに、樹脂層を外側に
なるように積層体を巻取り、巻取った状態で加熱して溶
剤を除上ずることも可能である。この場合、溶剤除大の
雰囲気としては、良空または窒素などの不活性ガス中で
あることが好ましい。In order to remove the solvent from the coated solvent-containing resin layer, it is heated usually to 50°C to 250°C, preferably 50°C to 200°C. It is also possible to remove the solvent by winding up the laminate with the resin layer on the outside and heating it in the wound state, without completely removing the solvent. In this case, the atmosphere for removing the solvent is preferably clear air or an inert gas such as nitrogen.
この発明において、フィルムの両面に金属箔を積層する
方法としては、金属箔上にフィルムの樹脂溶液を塗王し
、この上にさらに金属箔をラミネートする方法がある。In this invention, as a method for laminating metal foil on both sides of the film, there is a method in which a resin solution of the film is coated on the metal foil, and then a metal foil is further laminated thereon.
このようなラミネーションは、塗工後、溶媒を完全に除
去する前に行なうことが好ましい。通営、５０〜２００
℃、好ましくは８０〜１５０℃で数分乾燥した後にラミ
ネートを行なう。ラミネートの方法としては、従来より
知られている方法を適用させることかでき、たとえばロ
ールラミネーション、プレスラミネーションなどの方法
を利用することができる。また、積層体を巻取った状態
で加熱することによりラミネートしてもよい。Such lamination is preferably performed after coating and before completely removing the solvent. Tsuei, 50-200
Lamination is carried out after drying for several minutes at a temperature of preferably 80 to 150°C. As the lamination method, conventionally known methods can be applied, such as roll lamination and press lamination. Alternatively, the laminate may be laminated by heating the laminate in a wound state.
また、積層体中に残存する溶剤は、ラミネートした後に
１００〜３００℃、奸ましくは１００〜２００℃の温度
でキュアすることにより樹脂中に気泡が発生することな
く完全にＬ２ｉすることができる。In addition, the solvent remaining in the laminate can be completely L2i without generating bubbles in the resin by curing at a temperature of 100 to 300 °C, preferably 100 to 200 °C after lamination. .
また、この発明においては、積層体のフィルムの諸特性
、たとえば接着性、耐熱性、機械特性、電気特性、およ
び滑り性などを改良する目的で、他の樹脂や有機化合物
、および無機化合物を混合させたり、あるいは反応させ
て併用してもよい。In addition, in this invention, other resins, organic compounds, and inorganic compounds are mixed in order to improve various properties of the film of the laminate, such as adhesion, heat resistance, mechanical properties, electrical properties, and slipperiness. It may be used in combination by reacting or reacting.
たとえば、エボキシ化合物、シリコン化合物、フッ素化
合物のような樹脂や有機化合物、酸化硅素、酸化チタン
、および炭酸カルシウムなどの無機化合物をこの発明の
目的を阻害しない範囲で併用することができる。この場
合、これらの含有量は樹脂因形分に対し１重量％〜３０
重量％が好ましい。For example, resins such as epoxy compounds, silicon compounds, and fluorine compounds, organic compounds, and inorganic compounds such as silicon oxide, titanium oxide, and calcium carbonate can be used in combination within the range that does not impede the object of the present invention. In this case, the content of these is 1% by weight to 30% by weight based on the resin content.
Weight percent is preferred.
［発明の作用効果］
この発明の積層体では、上記の構逍式（１）のアミン残
基成分を全アミン残基の６０モル％以上含むポリイミド
樹脂またはポリアミドイミド樹脂を、金属箔と積鳩する
フィルムの主成分とすることによって、従来問題となっ
ている積層体のカールを代減させ、積層体におけるフィ
ルムと金属箔との接着性を向上させている。[Operations and Effects of the Invention] In the laminate of the present invention, a polyimide resin or a polyamide-imide resin containing the amine residue component of the above structural formula (1) in an amount of 60 mol% or more of the total amine residues is combined with metal foil and a stacking board. By using it as the main component of the film, the curling of the laminate, which has been a problem in the past, is reduced, and the adhesion between the film and the metal foil in the laminate is improved.
この発明の積層体は、このようにカールが低減され、優
れた接着性を有するので、フレキシブル配線話板などの
分野において幅広く有効に利用され得るものである。Since the laminate of the present invention has reduced curl and excellent adhesive properties, it can be widely and effectively used in fields such as flexible wiring boards.
［丈施例］
丈施例１
無水トリメリット酸０． １モル（１９．２ｇ）、２
．４−トリレンジイソシアネー｝ （２．４−ＴＤＩ）
０．０２モル（３．５ｇ）、およびトリジンジイソシア
ネート（ＴＯＤＩ）０．０８モル（２ １． ２ ｇ
）をＮ−メチル−２−ピロリドン（ＮＭＰ）１５０ｇ中
に加え撹律しながら、１６０℃までＩＨ９間で昇温し、
さらに１ ６ ０ ’Ｃて５ｎｌ間反応させた。得られ
たポリマーのＮＭＰ中での対数粘度は１．８１であった
。[Length example] Length example 1 Trimellitic anhydride 0. 1 mole (19.2g), 2
．． 4-Tolylene diisocyanate} (2.4-TDI)
0.02 mol (3.5 g), and 0.08 mol (2 1.2 g) tolidine diisocyanate (TODI)
) was added to 150 g of N-methyl-2-pyrrolidone (NMP) and heated to 160°C at IH9 while stirring,
Further, the reaction was carried out for 5 nl at 160'C. The obtained polymer had a logarithmic viscosity in NMP of 1.81.
２．４−ＴＤ１０．０２モルに対しＴＯＤＩを０．０８
モル加えているので、得られたボリマー中の構造式（１
）のアミン残話成分はほぼ８０モル％である。2.4-TODI 0.08 for 10.02 mol TD
Since the structural formula (1) in the obtained polymer is
The amine residual component of ) is approximately 80 mol %.
乾燥後の厚みが３０ｌｌｍとなるようにこのポリアミド
イミド溶岐を電解銅箔上に流延塗布し、１００℃で５分
間指触乾燥し、次いで直径２０ｃｍの鉄管に樹脂面が外
側になるように巻付けて、２００℃で３時間キュアした
。This polyamide-imide fuki was cast onto electrolytic copper foil so that the thickness after drying was 30 llm, dried to the touch at 100°C for 5 minutes, and then cast onto an iron pipe with a diameter of 20 cm so that the resin side was on the outside. It was wrapped and cured at 200°C for 3 hours.
得られたフレキシブル印刷回路用配線基板のカールは、
樹脂層を内側とする曲率半径１５．２ｃｍであり、実用
上何ら差支えない程度であった。The curl of the obtained flexible printed circuit wiring board is
The radius of curvature with the resin layer on the inside was 15.2 cm, which was enough to cause no practical problems.
比較例１
実施例１で用いたた２，４−ＴＤＩおよびＴＯＤＩの代
わりに、４．４’ −ジフエニルメタンジイソシアネー
トを用いて、その他は尖施例１と同様にしてポリアミド
イミド樹脂溶液を作製し、フレキシブル印刷同路用基板
を作製した。このフレキシブル印刷川路用基板のカール
は、樹脂層を内側として曲十半径０．５ｃｍであり、著
しくカールしていた。Comparative Example 1 A polyamide-imide resin solution was prepared in the same manner as in Example 1 except that 4,4'-diphenylmethane diisocyanate was used instead of 2,4-TDI and TODI used in Example 1. Then, a flexible printed circuit board was fabricated. The curl of this flexible printed circuit board had a radius of 0.5 cm with the resin layer inside, and was extremely curled.
実施例２
ジフエニルテトラカルボン酸無水物０．１モルとｏ−ト
リジン０．１モルを、ＮＭＰ１８０ｇ中に添加し、芳香
族ポリアミック酸溶液を調製した。Example 2 0.1 mol of diphenyltetracarboxylic anhydride and 0.1 mol of o-tolidine were added to 180 g of NMP to prepare an aromatic polyamic acid solution.
この溶液の対数粘度は１．７５であった。The logarithmic viscosity of this solution was 1.75.
乾燥後の厚みが３０μｍとなるように、この樹脂溶液を
電解銅箔上に流延塗布し、１００℃で５分間指触乾燥し
、次いで直径２０ｃｍの鉄管に樹脂曲が外側になるよう
に嬰付けて、２５０℃で１１１ｊ間、３５０℃で１０分
間キュアした。This resin solution was cast onto electrolytic copper foil so that the thickness after drying was 30 μm, dried to the touch at 100°C for 5 minutes, and then poured onto a 20 cm diameter iron pipe with the resin curve facing outward. and cured at 250°C for 111j and at 350°C for 10 minutes.
得られたフレキシブル印刷同路用配線基阪は、カールが
全く発生していなかった。The resulting flexible printed circuit board had no curling at all.
実施例３
実施例１で調製したのと同様の樹脂病液をＩＪＩ！ＩＩ
製し、乾燥後の厚みが１５μｍとなるように、３５μｒ
Ｔｌの電解銅箔上に流延塗／＋ｉし、１００℃で５分間
指触乾燥した。このようにして？１Ｉられた２枚の銅張
阪を、樹脂面同士が密着するように重ね合わせてて、直
径２ ０ ｃ ｍの鉄管に巻付け、２００℃で２時間キ
ュアした。ｒＩられた積層仮は、樹脂面が完全に接着し
ており、エッチング後気泡等の発生は全く見られなかっ
た。Example 3 A resinous solution similar to that prepared in Example 1 was prepared using IJI! II
35 μr so that the thickness after drying is 15 μm.
It was cast/+i on an electrolytic copper foil of Tl and dried to the touch at 100°C for 5 minutes. In this way? The two sheets of copper-clad slats were placed one on top of the other so that the resin surfaces were in close contact with each other, and then wrapped around a 20 cm diameter iron pipe and cured at 200°C for 2 hours. The resin surfaces of the laminated material subjected to rI were completely adhered, and no bubbles were observed after etching.
実施例４
丈施例２において調製したのと同様の樹脂溶液を調製し
、丈施例３と同様にして銅張ｆｒ１層板を作製した。得
られた積層体は、樹脂而が完全に接着しており、エッチ
ング後気泡等の発生は全く認められなかった。Example 4 A resin solution similar to that prepared in Length Example 2 was prepared, and a copper-clad fr1-layer board was produced in the same manner as Length Example 3. In the obtained laminate, the resin was completely adhered, and no bubbles were observed after etching.
比較例２
無水トリメリット酸０． １モル、ＴＯＤ Ｉ ０．
０５モル、および２．４−ＴＤＩ０．０５モルを、ＮＭ
Ｐ１５０ｇ中に加え、撹律しながら１６０℃まで１０！
ｊ間で昇温し、さらに８時間程度反応させた。ポリマー
の対数粘度は１．５０であった。２，４−ＴＤＩ０．０
５モルに対しＴＯＤＩを０．０５モル添加しているので
、上記の構造式（１）のアミン残基成分が全アミン残基
のほぼ５０モル％てある樹脂が得られた。Comparative Example 2 Trimellitic anhydride 0. 1 mol, TOD I 0.
05 mol, and 0.05 mol of 2.4-TDI in NM
Add to 150g of P and heat to 160℃ for 10 minutes while stirring.
The temperature was raised between 1 and 2 hours, and the reaction was further continued for about 8 hours. The logarithmic viscosity of the polymer was 1.50. 2,4-TDI0.0
Since 0.05 mol of TODI was added per 5 mol, a resin in which the amine residue component of the above structural formula (1) accounted for approximately 50 mol % of the total amine residues was obtained.
乾燥後の厚みが３０μ］ｎとなるように、この溶戚を３
５ １ｔ…の電解銅箔上に流延塗１’１ｉＬ、１００
℃で５分間指触乾燥し、次いで直径２ ０ ｃ ｒｎの
鉄管に樹脂面を外側に向けて巻付け、２００℃で３時間
キュアした。This melting layer was poured into 3 layers so that the thickness after drying was 30μ]
5 Cast coating 1'1iL on 1t... of electrolytic copper foil, 100
It was dried to the touch at 200° C. for 5 minutes, then wrapped around a 20 cm diameter iron tube with the resin side facing outward, and cured at 200° C. for 3 hours.
得られたフレキシブル銅張板は、樹脂面を内側にして曲
率′ト径６ ． ５ ｃ ｍ ｆＷ度カールしており
、丈施例ｌに比べカールの度合が大きかった。The obtained flexible copper clad board had a curvature and a diameter of 6.5 mm with the resin surface facing inside. It was curled by a degree of 5 cm fW, and the degree of curl was greater than that of Length Example 1.
Claims (2)
造式（ I ）のアミン残基成分が全アミン残基の６０モ
ル％以上含まれるポリイミド樹脂またはポリアミドイミ
ド樹脂を主成分とするフィルムと、 前記フィルムの少なくとも一方の面の上に積層される金
属箔とを備える、積層体。 ▲数式、化学式、表等があります▼（ I ） （ここで、Ｒ＿１、Ｒ＿２は、水素、または炭素数１〜
４のアルキル基であり、Ｒ＿１とＲ＿２は同じでもよい
。）(1) A film whose main component is a polyimide resin or polyamide-imide resin containing 60 mol% or more of the total amine residues of an amine residue component of the following structural formula (I) forming an imide bond or an amide bond; A laminate comprising a metal foil laminated on at least one surface of the film. ▲There are mathematical formulas, chemical formulas, tables, etc.▼(I) (Here, R_1 and R_2 are hydrogen or carbon atoms with 1 to 1 carbon atoms.
4, and R_1 and R_2 may be the same. )
イミド樹脂またはポリアミドイミド樹脂／低分子量エポ
キシ樹脂の重量比で８０／２０〜９９／１含む、請求項
１に記載の積層体。(2) The laminate according to claim 1, wherein the film contains a low molecular weight epoxy resin in a weight ratio of polyimide resin or polyamideimide resin/low molecular weight epoxy resin of 80/20 to 99/1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30565089A JP2853218B2 (en) | 1989-11-24 | 1989-11-24 | Laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30565089A JP2853218B2 (en) | 1989-11-24 | 1989-11-24 | Laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03164240A true JPH03164240A (en) | 1991-07-16 |
| JP2853218B2 JP2853218B2 (en) | 1999-02-03 |
Family
ID=17947688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30565089A Expired - Lifetime JP2853218B2 (en) | 1989-11-24 | 1989-11-24 | Laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2853218B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0543409A2 (en) * | 1991-11-22 | 1993-05-26 | Sumitomo Electric Industries, Ltd | Insulated wire |
| EP0977209A4 (en) * | 1998-02-13 | 2003-04-02 | Furukawa Electric Co Ltd | Insulated wire |
| US6998455B1 (en) | 1999-10-21 | 2006-02-14 | Nippon Steel Chemical Co., Ltd. | Laminate and process for producing the same |
| US7070864B2 (en) | 2001-04-19 | 2006-07-04 | Nippon Steel Chemical Co., Ltd. | Laminate for electronic materials |
| US7468197B2 (en) | 2000-08-04 | 2008-12-23 | Toyo Boseki Kabushiki Kaisha | Flexible metal-clad laminate and method for producing the same |
-
1989
- 1989-11-24 JP JP30565089A patent/JP2853218B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0543409A2 (en) * | 1991-11-22 | 1993-05-26 | Sumitomo Electric Industries, Ltd | Insulated wire |
| US5356708A (en) * | 1991-11-22 | 1994-10-18 | Sumitomo Electric Industries, Ltd. | Insulated wire |
| EP0977209A4 (en) * | 1998-02-13 | 2003-04-02 | Furukawa Electric Co Ltd | Insulated wire |
| US6998455B1 (en) | 1999-10-21 | 2006-02-14 | Nippon Steel Chemical Co., Ltd. | Laminate and process for producing the same |
| US7468197B2 (en) | 2000-08-04 | 2008-12-23 | Toyo Boseki Kabushiki Kaisha | Flexible metal-clad laminate and method for producing the same |
| US7070864B2 (en) | 2001-04-19 | 2006-07-04 | Nippon Steel Chemical Co., Ltd. | Laminate for electronic materials |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2853218B2 (en) | 1999-02-03 |
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