JPH03155191A - Multilayer interconnection board - Google Patents
Multilayer interconnection boardInfo
- Publication number
- JPH03155191A JPH03155191A JP29540789A JP29540789A JPH03155191A JP H03155191 A JPH03155191 A JP H03155191A JP 29540789 A JP29540789 A JP 29540789A JP 29540789 A JP29540789 A JP 29540789A JP H03155191 A JPH03155191 A JP H03155191A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- nonwoven fabric
- layer material
- layer
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 29
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 239000011521 glass Substances 0.000 claims abstract description 21
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 16
- 238000009835 boiling Methods 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 229920000742 Cotton Polymers 0.000 abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000945 filler Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract description 3
- 239000012209 synthetic fiber Substances 0.000 abstract description 3
- 229920002994 synthetic fiber Polymers 0.000 abstract description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010425 asbestos Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract description 2
- 239000011888 foil Substances 0.000 abstract description 2
- 239000012784 inorganic fiber Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 229910052895 riebeckite Inorganic materials 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- 239000000454 talc Substances 0.000 abstract description 2
- 229910052623 talc Inorganic materials 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000011701 zinc Substances 0.000 abstract description 2
- 239000000057 synthetic resin Substances 0.000 abstract 1
- 229920003002 synthetic resin Polymers 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 6
- 239000004744 fabric Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- -1 polybutylene terephthalate Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、電気機器、コンピューター通信機器
等に用いられる多層配線基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a multilayer wiring board used in electronic equipment, electrical equipment, computer communication equipment, etc.
従来の多層配線基板に用いられてｂる基材はガラス布で
あるため、スルホール加工時等のドリル加工におＡて、
ドリル直進性が悪く、これに起因して煮沸耐熱性も悪く
なると論う問題があうた。Since the base material used for conventional multilayer wiring boards is glass cloth, it is difficult to use during drilling such as through-hole processing.
There was a problem that the straightness of the drill was poor and the boiling heat resistance was also poor due to this.
従来の技術で述べたように、多層配線基板の基材にガラ
ス布のみを用いるとドリル直進性、煮沸耐熱性が悪くな
る問題がある。本発明は従来の技術における上述の問題
点に鑑みてなされたもので、その目的とするところはド
リル直進性、煮沸耐熱性に優れた多層配線基板を提供す
ることにある。As described in the related art section, if only glass cloth is used as the base material of the multilayer wiring board, there is a problem that the straightness of the drill and the boiling heat resistance deteriorate. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a multilayer wiring board that is excellent in straight-line drilling performance and boiling heat resistance.
本発明はガラス不織布を含む所要枚数の内層材の上面及
び又は下面に、ガラス不織布を含む樹脂層を介して外層
材を配役−像化したことｔ−特徴とする多層配線基板の
ため、ガラス不織布はガラス布よりドリルに対し柔らか
いため、ドリル直進性、煮沸耐熱性を向上させることが
できたもので、以下本発明の詳細な説明する。The present invention is a multilayer wiring board characterized in that an outer layer material is cast and imaged on the upper surface and/or lower surface of a required number of inner layer materials containing a glass nonwoven fabric via a resin layer containing a glass nonwoven fabric. Since it is softer to the drill than glass cloth, it was able to improve the straightness of the drill and the boiling heat resistance.The present invention will be described in detail below.
本発明に用する内層材としてはフェノール樹脂クレゾー
ル樹脂、エボキＶ樹脂、不飽和ポリエステル樹脂、ポリ
イミド樹脂、ポリブタジェン樹脂、ポリフェニレンサル
ファイド樹脂、ポリブチレンテレフタレート樹脂、ポリ
エチレンテレフタレートａ脂、弗化樹脂等の樹脂と、ガ
ラス、アスベスト等の無機繊維やポリエステル、ポリア
クリル、ポリアミド、ポリビニルアルコール等の有機合
成繊維や木綿等の天然＃ｌＩｌ維、紙基材とからなる片
面又は両面金属張積層板に電気回路を形成したものであ
るが、基材の所要枚数には必らずガラス不織布を用いる
ことが必要で、ガラス不織布とはガラスベーパーをも包
含するものである。基材にガラス不織布を用いた場合は
好ましくは基材に含浸させる樹脂にアルミナ、シリカ、
タルク、炭酸カルシウム、水酸化アルミニウム、クレー
ガラス粉、ガラス繊維チップ、合成繊維チ・ｌプ、パ
ルプ、綿粉等の有機或は無機充填剤を添加しておくこと
が望ましい。この際樹脂と充填剤との比出は樹脂１００
重重部（以下単に部と記す）に対し充填剤５０〜２００
部が好まし層。即ち５０部未満では吸湿後耐熱性が向上
せず、２００部をこえると層間接着性が低下するためで
ある。樹脂層として内層材ｌζ用いたような樹脂の塗布
層、樹脂シート層或は樹脂と基材とからなる樹脂含浸基
材層であり単独或は併用して用いることができるが、必
らず樹脂含浸ガラス不織布基材を用いることが必要で、
かくすることｌこよりドリル直進性、煮沸耐熱性全署る
しく向上することができる。外層材としては銅、アルミ
ニウム、鉄、ニッケル、亜鉛等の単独、合金、複合から
なる金属箔や片面金属張積層板音用することができる。Inner layer materials used in the present invention include resins such as phenolic resin cresol resin, Evoki V resin, unsaturated polyester resin, polyimide resin, polybutadiene resin, polyphenylene sulfide resin, polybutylene terephthalate resin, polyethylene terephthalate a resin, and fluorinated resin. Electric circuits are formed on single-sided or double-sided metal-clad laminates made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyacrylic, polyamide, and polyvinyl alcohol, natural fibers such as cotton, and paper base materials. However, it is necessary to use a glass nonwoven fabric for the required number of substrates, and the glass nonwoven fabric also includes glass vapor. When a glass nonwoven fabric is used as the base material, it is preferable that the resin impregnated into the base material contains alumina, silica,
It is desirable to add organic or inorganic fillers such as talc, calcium carbonate, aluminum hydroxide, clay glass powder, glass fiber chips, synthetic fiber chips, pulp, and cotton powder. At this time, the ratio of resin and filler is resin 100.
Filler 50 to 200 per heavy part (hereinafter simply referred to as part)
Part is the preferred layer. That is, if the amount is less than 50 parts, the heat resistance after moisture absorption will not improve, and if it exceeds 200 parts, the interlayer adhesion will decrease. The resin layer is a resin coating layer like the inner layer material lζ, a resin sheet layer, or a resin-impregnated base material layer consisting of a resin and a base material, and can be used alone or in combination, but it is not always necessary to use a resin. It is necessary to use an impregnated glass nonwoven substrate,
In this way, the straightness of the drill and the boiling heat resistance can all be significantly improved. The outer layer material may be a metal foil made of copper, aluminum, iron, nickel, zinc, etc. alone, an alloy, or a composite, or a single-sided metal-clad laminate.
一体化手段としては多段プレス法、真空多段プレス法、
マルチロール法、ダブルベルト法、ドラム法、無圧連続
加熱法等で積層−像化するものである。The integration methods include multi-stage press method, vacuum multi-stage press method,
Lamination and imaging are carried out by a multi-roll method, a double belt method, a drum method, a pressureless continuous heating method, etc.
以下本発明全実施例にもとづいて説明する。The following is a description based on all the embodiments of the present invention.
実施例
硬化剤含有エポキシ樹脂ｉｏｏ部に対し、水酸化アルミ
ニウム１００ 部を加えた樹脂フェスをガラス不織布（
日本バイリーン株式会社製、品番Ｅｐｍ。Example A resin face prepared by adding 100 parts of aluminum hydroxide to 100 parts of hardener-containing epoxy resin was coated with a glass nonwoven fabric (
Manufactured by Nippon Vilene Co., Ltd., product number Epm.
単重６０ｇ／♂）に樹脂量が５０重童憾（以下単に壬と
記す）になるように含浸、乾燥して樹脂含浸不織布基材
を得た。別ｌこ硬化剤含有エボ牛シ樹脂フェスをガラス
布（日東紡績株式会社製、品番１１６Ｅ ）に樹脂量が
４５係になるように含浸、乾燥して樹脂含浸基材を得た
。次に上記樹脂含浸不織布基材１枚の上下面に、上記樹
脂含浸基材を夫々１枚づつ介して厚み０．０３５ ｔｘ
の銅箔を配設した積層体を成形圧力３０Ｋｇ／ｄ、 １
６５℃で１２０分間積層成形して得た両面鋼張積層板の
両面に電気回路を形成して内層材とした。次に該内層材
の上下面に上記樹脂含浸不織布基材を夫々１枚づつ介し
て厚みＱ、０３５ｆｌの銅箔を配設した積層体を成形圧
力ｓｏｂ□、１６５℃で１２０分間積層成形して４層回
路配線基板を得た。A resin-impregnated nonwoven fabric base material was obtained by impregnating a resin (unit weight 60 g/male) with a resin amount of 50 g/m (hereinafter simply referred to as 壬) and drying. A glass cloth (manufactured by Nitto Boseki Co., Ltd., product number 116E) was impregnated with a glass cloth (manufactured by Nitto Boseki Co., Ltd., product number 116E) so that the amount of resin was 45%, and dried to obtain a resin-impregnated base material. Next, one resin-impregnated base material was placed on the upper and lower surfaces of one resin-impregnated nonwoven fabric base material to a thickness of 0.035 tx.
A laminate with copper foil placed on it was molded at a pressure of 30 kg/d, 1
Electric circuits were formed on both sides of a double-sided steel-clad laminate obtained by lamination molding at 65° C. for 120 minutes to obtain an inner layer material. Next, a laminate in which copper foil with a thickness of Q and 035 fl was disposed on the upper and lower surfaces of the inner layer material through one resin-impregnated nonwoven fabric base material was layer-molded at a molding pressure of sob□ at 165°C for 120 minutes. A four-layer circuit wiring board was obtained.
比較例
実施例と同じ樹脂含浸基材６枚を重ねた上下面に、厚み
Ｑ、０３５ ｆｌの銅箔を配設した積層体を成形圧力３
０ Ｋｑ／ｄ、１６５℃で１２０分間積層成形して得た
両面鋼張積層板の両面に電気回路を形成して得た内層材
を用いた以外は実施例と同様に処理して４層回路配線基
板を得た。Comparative Example A laminate in which copper foil with a thickness of Q and 035 fl was arranged on the upper and lower surfaces of six resin-impregnated base materials, which were the same as those in the example, was formed under a molding pressure of 3.
A four-layer circuit was prepared in the same manner as in the example except that an inner layer material obtained by forming electric circuits on both sides of a double-sided steel-clad laminate obtained by lamination molding at 0 Kq/d and 165°C for 120 minutes was used. A wiring board was obtained.
実施例及び比較例の４層回路配線基板の性能は第１表の
ようである。Table 1 shows the performance of the four-layer circuit wiring boards of Examples and Comparative Examples.
注
４層回路配線基板を２枚重ね、直径０．３５ ｍのドリ
ルで５ｏｏｏ ｒ、 ｐ、 ｍ 、 １２Ｖ／ｒｅｖで
５０ 大全開穴し、１枚重表（ドリル入口）と２枚目裏
（ドリル出口）の比較でみる。Note: Stack two 4-layer circuit wiring boards, drill 50 holes completely using a 0.35 m diameter drill at 500 r, p, m, 12 V/rev, and make one double layer on the front (drill entrance) and the second layer on the back ( Let's take a look at the comparison (drill exit).
壷２ 水で２時間、３時間、４時間煮沸し、煮沸後２６
０℃で溶融ハンダに２０秒間浸漬し、ふくれのなＡもの
を○、ふくれの発生するものを×とした。Jar 2 Boil in water for 2 hours, 3 hours, 4 hours, 26 hours after boiling
The samples were immersed in molten solder for 20 seconds at 0°C, and samples A with no blisters were graded ○, and samples with blisters were graded x.
壷１
〔発明の効果〕
本発明は上述した如く構成されて層る。特許請求の範囲
に記載した多層配線基板は、ドリル直進性、煮沸耐熱性
が向上−する効果がある。Jar 1 [Effects of the Invention] The present invention is constructed and layered as described above. The multilayer wiring board described in the claims has the effect of improving straight-line drilling performance and boiling heat resistance.
Claims (1)
又は下面に、ガラス不織布を含む樹脂層を介して外層材
を配設一体化したことを特徴とする多層配線基板。(1) A multilayer wiring board characterized in that an outer layer material is integrated with the upper and/or lower surfaces of a required number of inner layer materials containing a glass nonwoven fabric via a resin layer containing a glass nonwoven fabric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29540789A JPH03155191A (en) | 1989-11-14 | 1989-11-14 | Multilayer interconnection board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29540789A JPH03155191A (en) | 1989-11-14 | 1989-11-14 | Multilayer interconnection board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03155191A true JPH03155191A (en) | 1991-07-03 |
Family
ID=17820208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29540789A Pending JPH03155191A (en) | 1989-11-14 | 1989-11-14 | Multilayer interconnection board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03155191A (en) |
-
1989
- 1989-11-14 JP JP29540789A patent/JPH03155191A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH03155191A (en) | Multilayer interconnection board | |
| JP2612129B2 (en) | Laminated board | |
| JPH03155190A (en) | Multilayer interconnection board | |
| JPH03155193A (en) | Multilayer interconnection board | |
| JPH03155194A (en) | Multilayer interconnection board | |
| JPH03155195A (en) | Multilayer interconnection board | |
| JPH03155192A (en) | Multilayer interconnection board | |
| JP2557325B2 (en) | Multilayer copper clad laminate | |
| JPH06260765A (en) | Multilayer wiring board and manufacture thereof | |
| JPH03155188A (en) | Manufacture of multilayer interconnection board | |
| JPH0315536A (en) | Preparation of printed wiring board | |
| JPH0315529A (en) | Preparation of printed wiring board | |
| JPH03155695A (en) | Multilayer interconnection board | |
| JPS61117883A (en) | Multilayer printed wiring board | |
| JPH0315528A (en) | Preparation of printed wiring board | |
| JPH0315532A (en) | Preparation of printed wiring board | |
| JPH03155189A (en) | Manufacture of multilayer interconnection board | |
| JPH06260764A (en) | Multilayer wiring board and manufacture thereof | |
| JPH0240234B2 (en) | ||
| JPH02303191A (en) | Manufacture of printed wiring board | |
| JPH0425094A (en) | Multilayer interconnection substrate | |
| JPH0425096A (en) | Multilayer interconnection substrate | |
| JPH06232556A (en) | Multilayer printed wiring board | |
| JPH02277289A (en) | Manufacture of printed wiring board | |
| JPH0315538A (en) | Preparation of printed wiring board |