JPH03148127A - Wet treating device for semiconductor - Google Patents
Wet treating device for semiconductorInfo
- Publication number
- JPH03148127A JPH03148127A JP28626389A JP28626389A JPH03148127A JP H03148127 A JPH03148127 A JP H03148127A JP 28626389 A JP28626389 A JP 28626389A JP 28626389 A JP28626389 A JP 28626389A JP H03148127 A JPH03148127 A JP H03148127A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holder
- processing
- dust
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 11
- 235000012431 wafers Nutrition 0.000 claims abstract description 41
- 238000012545 processing Methods 0.000 claims abstract description 35
- 239000000428 dust Substances 0.000 abstract description 14
- 239000004809 Teflon Substances 0.000 abstract description 3
- 229920006362 Teflon® Polymers 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000000126 substance Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000012993 chemical processing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Weting (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体湿式処理装置に関し、特に半導体装置の
製造等に使用されるウェハーの工・ソチング及び洗浄等
の湿式処理装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor wet processing apparatus, and more particularly to a wet processing apparatus for processing, soching, and cleaning wafers used in the manufacture of semiconductor devices.
従来、この種の半導体湿式処理装置は、第３図＜ａ）、
（ｂ）の側面断面図及び正面断面図に示すように、処理
すべきウェハー３を点接触型の搬送用キャリアｌに乗せ
て処理槽２の処理液４中に投入する構造であったため、
薬液処理を必要としないウェハー３の裏面側も薬液に接
触するようになっていた。Conventionally, this type of semiconductor wet processing equipment is shown in Fig. 3<a).
As shown in the side sectional view and front sectional view of (b), the structure was such that the wafer 3 to be processed was placed on a point-contact type transport carrier l and put into the processing liquid 4 of the processing tank 2.
The back side of the wafer 3, which does not require chemical treatment, also came into contact with the chemical.
上述した従来の半導体湿式処理装置は、ウェハーを点接
触型の搬送用キャリアに乗せて処理薬液中に投入するた
め、ウェハーの裏面及び搬送用キャリアの全表面といっ
た薬液処理に関係のないかなり広い面積が処理槽中に持
ち込まれて薬液にさらされることになり、その結果、前
工程の搬送等でウェハー裏面に付着した塵埃が、薬液中
に拡散してウェハー表面に再付着したり、あるいは点接
触型の搬送用キャリアからも薬液中に塵埃を持ち込むと
いうように、薬液を汚染する可能性が極めて高いという
欠点を有する装置であった。In the conventional semiconductor wet processing equipment described above, the wafer is placed on a point-contact transport carrier and placed in the processing chemical, so a fairly large area unrelated to chemical processing, such as the back side of the wafer and the entire surface of the transport carrier, is used. The wafer is brought into the processing tank and exposed to the chemical solution, and as a result, dust that has adhered to the backside of the wafer during transportation in the previous process can diffuse into the chemical solution and re-adhere to the wafer surface, or may cause point contact. This device had the disadvantage that there was an extremely high possibility of contaminating the chemical solution, as dust was brought into the chemical solution from the carrier for transporting the mold.
又、近年、集積回路の微細化が進むにつれて、薬液処理
中にウェハー表面に再付着する塵埃が悪影響を及ぼし、
半導体製造の大きな障害となっている。In addition, in recent years, as integrated circuits have become smaller, dust that re-adheres to the wafer surface during chemical processing has an adverse effect.
This has become a major obstacle in semiconductor manufacturing.
上述した従来の半導体湿式処理装置に対し、本発明はウ
ェハー裏面を処理液から完全に隔離することにより、ウ
ェハー裏面から薬液中への塵埃の拡散をなくし、ウェハ
ー裏面への塵埃の再付着を防止する、又、点接触型のキ
ャリアを使用しないため、ウェハー以外からの塵埃の持
ち込みを防止するという相違点を有する。In contrast to the conventional semiconductor wet processing equipment described above, the present invention completely isolates the backside of the wafer from the processing solution, thereby eliminating the diffusion of dust from the backside of the wafer into the chemical solution and preventing dust from re-adhering to the backside of the wafer. Moreover, since a point contact type carrier is not used, there is a difference in that dust from other than the wafer is prevented from being introduced.
本発明の半導体湿式処理装置は、ウェハー裏面側を処理
液から隔離した状態で密着固定するホルダーと、このホ
ルダーを取り付けホルダーごと処理液に浸漬させて湿式
処理を行なう搬送用アームとを有している。The semiconductor wet processing apparatus of the present invention includes a holder that tightly fixes the back side of the wafer while separating it from the processing solution, and a transfer arm that attaches this holder and immerses the holder together in the processing solution to perform wet processing. There is.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）は本発明の実施例１の側面断面図
及び正面断面図である。FIGS. 1(a) and 1(b) are a side sectional view and a front sectional view of Embodiment 1 of the present invention.
ウェハー吸着搬送アーｌ、５及び吸着用のホルダー７は
テフロン樹脂製であり、ウェハー３を吸着するホルダー
７は両面に真空吸着用の数個の孔を有する円盤状をなし
、このボルダ−７が複数個、平行にウェハー吸着搬送ア
ーム５に収り付けられている。The wafer suction transport arm 1, 5 and suction holder 7 are made of Teflon resin, and the holder 7 for suctioning the wafer 3 has a disc shape with several holes for vacuum suction on both sides. A plurality of wafer suction and transfer arms 5 are housed in parallel.
上述のウェハー吸着搬送アーノ＼５のホルダー７に、処
理するウェハー３をホルダー両端を除き表面が互いに向
い合わせになるように真空吸着し、処理液４の入った処
理槽２へウェハー吸着搬送アーム５ごと投入し、湿式処
理を行なう。The wafer 3 to be processed is vacuum-adsorbed onto the holder 7 of the above-mentioned wafer suction transport arm 5 with the surfaces facing each other except for both ends of the holder, and the wafer suction transport arm 5 is transferred to the processing tank 2 containing the processing liquid 4. Pour in all the raw materials and perform wet processing.
第４図は、本実施例と同等の条件で実験を行ない、湿式
処理後乾燥を行なったウェハーの塵埃付着数を従来処理
と比較した実験データによるグラフを示す。塵埃付着数
は従来処理の数分の−に減少している。FIG. 4 shows a graph based on experimental data comparing the number of dust deposits on wafers subjected to wet processing and drying, compared with conventional processing, in an experiment conducted under the same conditions as in this example. The number of adhering dust particles has been reduced to a fraction of that of conventional processing.
第２図（ａ＞、（ｂ）は、本発明の実施例２の側面断面
図及び正面図である。この搬送アーム６は、実施例１と
同様テフロン樹脂製の複数の円盤状のホルダー７を有す
る。ただし、真空吸着手段は備えていない。このホルダ
ー７の両面には、Ｏリング８が溝にはめ込まれている。FIGS. 2(a) and 2(b) are a side sectional view and a front view of a second embodiment of the present invention.This transfer arm 6 includes a plurality of disc-shaped holders 7 made of Teflon resin as in the first embodiment. However, it does not include vacuum suction means.O-rings 8 are fitted into grooves on both sides of this holder 7.
そして、ウェハーを固定する外周箇所に、ホルダー７を
貫通してステンレス製のコイルばねで結合されたばね付
きクランプ９が設けられている。A spring-loaded clamp 9 that passes through the holder 7 and is coupled with a stainless steel coil spring is provided on the outer periphery of the wafer for fixing the wafer.
この搬送アーム６上のＯリング８ヘウェハ−３を乗せ、
ばね付きクランプ９でウェハーを固定することにより薬
液処理を行なう。この実施例では真空吸着を使用しない
ため、真空ポンプが不用となる。又、真空部分への液回
り込みを防ぐことができるという利点がある。Place the wafer 3 on the O-ring 8 on the transfer arm 6,
Chemical liquid processing is performed by fixing the wafer with a spring-loaded clamp 9. Since this embodiment does not use vacuum suction, a vacuum pump is not required. Another advantage is that liquid can be prevented from flowing into the vacuum area.
以上説明したように本発明は、ウェハー裏面を処理液か
ら完全に隔離することにより、ウェハー裏面の塵埃が処
理液中に拡散す４ことを防止し、ウェハー裏面への塵埃
の再付着を全くなくすることができるという効果がある
。As explained above, the present invention completely isolates the backside of the wafer from the processing solution, thereby preventing dust on the backside of the wafer from diffusing into the processing solution, and completely eliminating re-adhesion of dust to the backside of the wafer. The effect is that it can be done.
又、従来の点接触型キャリアを使用せず、且つウェハー
表面以外で薬液と接触する部分の面積を”２きるだけ小
さくしであるため、ウェハー以外からの塵埃の持ち込み
も非常に小さくすることができるという効果がある。In addition, because the conventional point-contact type carrier is not used and the area of the part other than the wafer surface that comes into contact with the chemical solution is minimized, the amount of dust brought in from other than the wafer can be minimized. There is an effect that it can be done.
第１図（ａ）、（ｂ）は本発明の実施例１の側面断面図
及び正面断面図、第２図（ａ）、（＋３＞は本発明の実
施例２の側面断面図及び正面図、第３図（ａ）、（ｂ）
は従来の処理装置の側面断面図及び正面断面図、第４図
は本発明の効果を示す実験データのグラフである。
１・・・搬送用キャリア、２・・・処理槽、３・・・ウ
ェハ、４・・・処理液、５・・・ウェハー吸着搬送アー
ム、６・・・搬送アーム、７・・・ホルダー、８・・・
Ｏリング、９・・・ばね付きクランプ。1(a) and (b) are side sectional views and front sectional views of Embodiment 1 of the present invention, and FIG. 2(a) and (+3> are side sectional views and front sectional views of Embodiment 2 of the present invention. , Figure 3(a),(b)
4 is a side sectional view and a front sectional view of a conventional processing device, and FIG. 4 is a graph of experimental data showing the effects of the present invention. DESCRIPTION OF SYMBOLS 1... Carrier for transportation, 2... Processing tank, 3... Wafer, 4... Processing liquid, 5... Wafer adsorption transfer arm, 6... Transfer arm, 7... Holder, 8...
O-ring, 9...clamp with spring.
Claims (1)
う半導体湿式処理装置において、ウェハー裏面側を処理
液から隔離した状態で密着固定するホルダーと、このホ
ルダーを取り付けホルダーごと処理液に浸漬させて湿式
処理を行なう搬送用アームとを備えたことを特徴とする
半導体湿式処理装置。In semiconductor wet processing equipment, which performs wet processing by immersing semiconductor wafers in a processing solution, there is a holder that tightly fixes the back side of the wafer isolated from the processing solution. A semiconductor wet processing device characterized by comprising a transport arm for carrying out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28626389A JPH03148127A (en) | 1989-11-02 | 1989-11-02 | Wet treating device for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28626389A JPH03148127A (en) | 1989-11-02 | 1989-11-02 | Wet treating device for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03148127A true JPH03148127A (en) | 1991-06-24 |
Family
ID=17702100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28626389A Pending JPH03148127A (en) | 1989-11-02 | 1989-11-02 | Wet treating device for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03148127A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009224472A (en) * | 2008-03-14 | 2009-10-01 | Denso Corp | Etching device for semiconductor wafer |
| JP2011512687A (en) * | 2008-02-19 | 2011-04-21 | エルジー エレクトロニクス インコーポレイティド | Asymmetric wafer etching method, solar cell including asymmetric etching wafer, and solar cell manufacturing method |
-
1989
- 1989-11-02 JP JP28626389A patent/JPH03148127A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011512687A (en) * | 2008-02-19 | 2011-04-21 | エルジー エレクトロニクス インコーポレイティド | Asymmetric wafer etching method, solar cell including asymmetric etching wafer, and solar cell manufacturing method |
| JP2009224472A (en) * | 2008-03-14 | 2009-10-01 | Denso Corp | Etching device for semiconductor wafer |
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