JPH0313944B2 - - Google Patents
Info
- Publication number
- JPH0313944B2 JPH0313944B2 JP1097476A JP9747689A JPH0313944B2 JP H0313944 B2 JPH0313944 B2 JP H0313944B2 JP 1097476 A JP1097476 A JP 1097476A JP 9747689 A JP9747689 A JP 9747689A JP H0313944 B2 JPH0313944 B2 JP H0313944B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- printed circuit
- solder bumps
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 238000005476 soldering Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 230000006866 deterioration Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75253—Means for applying energy, e.g. heating means adapted for localised heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75261—Laser
- H01L2224/75263—Laser in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
- H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ICチツプのはんだ付け方法に関し、
詳しくは、フレキシブルプリント回路基板上にフ
リツプチツプ方式でレーザ光によりはんだ付けを
行うICチツプのはんだ付け方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for soldering IC chips.
Specifically, the present invention relates to a method of soldering IC chips on a flexible printed circuit board using a flip-chip method using laser light.
従来、ICチツプをフリツプチツプ方式で基板
上に実装する場合、温度調整機能を有し、吸着可
能なコレツトによりICチツプを吸着保持させる
ようになし、一方温度調整が可能な試料台上に被
実装物である基板を位置決め装置により位置決め
して載置した上、コレツトおよび試料台を適切な
温度に保つて、ICチツプと基板との相対位置決
めが行われる。
Conventionally, when an IC chip is mounted on a board using the flip-chip method, the IC chip is held by suction using a collect that has a temperature adjustment function and can be suctioned. The IC chip and the substrate are positioned relative to each other by positioning and mounting the substrate using a positioning device, and then maintaining the collet and sample stage at appropriate temperatures.
そして、このようにコレツトと試料台との間で
位置決めがなされた上で、コレツトおよび試料台
を介して熱が供給され、はんだ付けが行われる
か、あるいはリフロー炉またはレーザ等の熱源に
よつて熱が供給され、はんだ付けが行われてき
た。なお、従来は基板の材料としてセラミツクや
ガラス等が使用される場合が多かつたが、近年で
は基板に熱劣化し易いフレキシブルプリント回路
基板が一般に使用されるようになつてきており、
上述したような従来のはんだ付け方法では色々な
問題点が多い。 After the collet and the sample stage are positioned in this way, heat is supplied through the collet and the sample stage to perform soldering, or a heat source such as a reflow oven or laser is used. Heat has been supplied and soldering has been performed. In the past, ceramics, glass, etc. were often used as substrate materials, but in recent years, flexible printed circuit boards, which are susceptible to thermal deterioration, have become commonly used as substrates.
Conventional soldering methods such as those described above have many problems.
第２図は従来の方法によりフレキシブルプリン
ト回路基板上にICチツプをはんだ付けする例を
示す。本例の場合温度調整機能を有する試料台１
がはんだ溶融点温度程度に設定され、その上に被
実装物であるフレキシブルプリント回路基板２が
載置される。次に温度調整機能を具え、ICチツ
プ３を吸着するための吸着孔４を有するコレツト
５が適度な温度に設定され、ICチツプ３を吸着
した状態でフレキシブルプリント回路基板２上に
位置決めされた後、適当な荷重で加圧され、コレ
ツト５と試料台１とからの熱供給によつて、IC
チツプ３上のはんだバンプ６とフレキシブルプリ
ント回路基板２上の電極パターン７との間にはん
だ付けが行われる。 FIG. 2 shows an example of soldering an IC chip onto a flexible printed circuit board using the conventional method. In this example, sample stage 1 with temperature adjustment function
is set to about the solder melting point temperature, and the flexible printed circuit board 2, which is the object to be mounted, is placed thereon. Next, the collet 5, which is equipped with a temperature adjustment function and has a suction hole 4 for suctioning the IC chip 3, is set to an appropriate temperature, and is positioned on the flexible printed circuit board 2 with the IC chip 3 suctioned. , is pressurized with an appropriate load, and the IC is
Soldering is performed between the solder bumps 6 on the chip 3 and the electrode patterns 7 on the flexible printed circuit board 2.
更にまた、第３Ａ図〜第３Ｃ図は他の従来例に
よるはんだ付け方法を示す。この場合はICチツ
プ３の位置決めが第３Ａ図に示すようにしてコレ
ツト５によるはんだの仮付によつて行われた後、
第３Ｂ図に示すようにしてリフロー炉等で全体加
熱方式の熱供給が行われるか、あるいは、第３Ｃ
図に示すようにしてレーザ光８を照射することに
よつて熱供給がなされ、本付けのはんだ付けが行
われてきた。 Furthermore, FIGS. 3A to 3C show another conventional soldering method. In this case, after positioning the IC chip 3 as shown in FIG. 3A by temporarily applying solder using the collect 5,
As shown in Figure 3B, heat is supplied using a reflow oven or the like, or as shown in Figure 3C.
Heat has been supplied by irradiating laser light 8 as shown in the figure, and actual soldering has been performed.
しかしながら、上述したように、ICチツプを
フリツプチツプ方式にてフレキシブルプリント回
路基板にはんだ付けするのに、例えば第２図に示
すような方法では、フレキシブルプリント回路基
板２を載置する試料台１の温度を、はんだ溶融点
付近まであげる必要があり、フレキシブルプリン
ト回路基板２全体が加熱され、熱容量の低いフレ
キシブルプリント回路基板２に熱変形や熱劣化が
生じる問題があり、かつ、無駄な箇所に熱供給が
なされてしまう。
However, as mentioned above, in order to solder an IC chip to a flexible printed circuit board using the flip-chip method, for example, the method shown in FIG. It is necessary to raise the temperature to near the melting point of the solder, which causes the entire flexible printed circuit board 2 to be heated, causing thermal deformation and thermal deterioration of the flexible printed circuit board 2, which has a low heat capacity. will be done.
また、第３Ｂ図に示す方法の場合も、第２図の
場合と同様に全体加熱でありフレキシブルプリン
ト回路基板２の熱変形および熱劣化を生じる問題
がある上、２工程にわたつて、はんだ付けを行う
必要があり、無駄な熱供給と共に効率的にも問題
がある。 Furthermore, in the case of the method shown in FIG. 3B, as in the case of FIG. It is necessary to do this, which causes problems in terms of efficiency as well as wasteful heat supply.
更にまた、第３Ｃ図に示す方法の場合は、レー
ザ光８による局部加熱のためフレキシブルプリン
ト回路基板２の熱変形や熱劣化は生じないが、レ
ーザ照射によるはんだ付け時にICチツプ３が固
定保持されていないために、ICチツプ３とフレ
キシブルプリント回路基板２との間に位置ずれが
生じる問題がある。 Furthermore, in the case of the method shown in FIG. 3C, thermal deformation or thermal deterioration of the flexible printed circuit board 2 does not occur due to local heating by the laser beam 8, but the IC chip 3 is held fixed during soldering by laser irradiation. Since the IC chip 3 and the flexible printed circuit board 2 are not connected to each other, there is a problem that misalignment occurs between the IC chip 3 and the flexible printed circuit board 2.
本発明の目的は、上述したような従来の課題に
着目し、その解決を図るべく、効率がよく、しか
もフレキシブルプリント回路基板に熱変形や熱劣
化を生じさせることがなく、さらにはICチツプ
とフレキシブルプリント回路基板との間に位置ず
れが生じることのないICチツプのはんだ付け方
法を提供することにある。 The purpose of the present invention is to focus on the above-mentioned conventional problems, and to solve the problems, it is an object of the present invention to provide a flexible printed circuit board that is efficient, does not cause thermal deformation or thermal deterioration, and furthermore, is compatible with IC chips. An object of the present invention is to provide a method for soldering an IC chip without causing misalignment with a flexible printed circuit board.
かかる目的を達成するために本発明は、プリン
ト回路基板上の電極にICチツプのはんだバンプ
をはんだ付けするにあたり、プリント回路基板を
試料台上に載置し、レーザ光を周囲部から反射さ
せるようにしたコレツトによりICチツプの中心
部を吸着し、ICチツプのはんだバンプをプリン
ト回路基板上の電極に対応させるように位置決め
して圧接した後、レーザ光をコレツトの周囲部に
照射して、その反射光をコレツトに吸着させた
ICチツプをはんだバンプの裏面部に入射させ、
はんだバンプを溶融させてはんだ付けを行うこと
を特徴とするものである。
In order to achieve such an object, the present invention is designed to place the printed circuit board on a sample stage and reflect laser light from the surrounding area when soldering the solder bumps of an IC chip to the electrodes on the printed circuit board. The center of the IC chip is attracted by the collected collector, the solder bumps of the IC chip are positioned so as to correspond to the electrodes on the printed circuit board, and the solder bumps are pressed. After that, laser light is irradiated onto the periphery of the collector to attach the solder bumps to the electrodes on the printed circuit board. The reflected light was absorbed into the collection.
Insert the IC chip into the back side of the solder bump,
This method is characterized by performing soldering by melting the solder bumps.
本発明によれば、コレツトによつて吸着され、
かつ、プリント回路基板上に位置決めされたIC
チツプが、コレツトの反射面に向かつて入射され
たレーザ光の反射光によつて局部加熱されること
によりICチツプのはんだバンプを介してこれと
加圧接触しているプリント回路基板上の電極パタ
ーンが加熱され、回路基板の他の部分に熱影響を
与えることなく、またICチツプとフレキシブル
プリント回路基板との間に位置ずれを生じること
なく、ICチツプのはんだバンプとプリント回路
基板の電極パターンとの間にはんだ付けを行うこ
とができる。
According to the present invention, it is adsorbed by the collect,
and an IC positioned on a printed circuit board
An electrode pattern on a printed circuit board in which the chip is locally heated by the reflected light of the laser beam incident on the reflective surface of the collector, and is brought into pressure contact with the IC chip through the solder bumps. The solder bumps on the IC chip and the electrode pattern on the printed circuit board are heated, and the solder bumps on the IC chip are connected to the electrode patterns on the printed circuit board without thermally affecting other parts of the circuit board or causing any misalignment between the IC chip and the flexible printed circuit board. Soldering can be done in between.
以下に、図面に基いて本発明の実施例を詳細か
つ具体的に説明する。
Embodiments of the present invention will be described in detail and specifically below based on the drawings.
第１図は本発明によるICチツプのはんだ付け
方法の一実施例を示す。ここで、１５は本発明に
適用されるコレツトであり、コレツト１５はその
先端部周辺に反射面１６が形成されていて、この
反射面１６に集光レンズ１７を介して所定の入射
角θでレーザ光８を投光させることにより反射面
１６でレーザ光を反射させ、ICチツプ３に吸収
させてこれを加熱することができる。 FIG. 1 shows an embodiment of the IC chip soldering method according to the present invention. Here, reference numeral 15 is a collet applied to the present invention, and the collet 15 has a reflective surface 16 formed around its tip, and the collet 15 has a reflective surface 16 through a condensing lens 17 at a predetermined angle of incidence θ. By projecting the laser beam 8, the laser beam can be reflected by the reflecting surface 16, absorbed by the IC chip 3, and heated.
そこで、本実施例においては、まずコレツト１
５によつてICチツプ３を正しく吸着した上で、
試料台１上に載置されたフレキシブルプリント回
路基板２上の所定の位置にICチツプ３を導いて
位置決めし、上方から適度の荷重を加えて加圧す
る。そして、この状態で反射面１６に向けてレー
ザ光８を照射すると、その反射されたレーザ光に
よりICチツプ３のはんだバンプの裏面部が加熱
されることにより、集中的にはんだバンプ６を介
してフレキシブルプリント回路基板２上の電極パ
ターン７が共に加熱され、はんだバンプ６を溶融
させてその間にはんだ付けを行うことができる。 Therefore, in this embodiment, first, collect 1 is
After correctly adsorbing IC chip 3 using step 5,
The IC chip 3 is guided and positioned at a predetermined position on the flexible printed circuit board 2 placed on the sample stage 1, and an appropriate load is applied from above to pressurize it. When the laser beam 8 is irradiated toward the reflective surface 16 in this state, the back side of the solder bumps of the IC chip 3 is heated by the reflected laser beam, thereby intensively passing through the solder bumps 6. The electrode patterns 7 on the flexible printed circuit board 2 are heated together, melting the solder bumps 6 and allowing soldering to occur therebetween.
なお、以上に述べた実施例では好適例としてフ
レキシブルプリント回路基板上にICチツプをは
んだ付けする場合について述べたが、本発明の適
用はこれに限られるものではなく、セラミツクや
ガラス基板上にICチツプのはんだバンプをはん
だ付けする場合にも適用できることは勿論であ
る。 In the embodiments described above, the case where an IC chip is soldered onto a flexible printed circuit board is described as a preferred example, but the application of the present invention is not limited to this, and the case where an IC chip is soldered onto a ceramic or glass substrate is described. Of course, the present invention can also be applied to the soldering of solder bumps on chips.
以上説明してきたように、本発明によれば、試
料台上に載置したプリント回路基板上に、レーザ
光を周囲部から反射させることが可能なコレツト
にICチツプの中心部を吸着させた状態で位置決
めし、ICチツプのはんだバンプをプリント回路
基板上の電極に対応させるようになしてこの状態
ではICチツプをプリント回路基板に圧接させ、
コレツトの周囲部から反射させたレーザ光をIC
チツプのはんだバンプの裏面部に入射させてはん
だバンプを溶融させるようにしたので、プリント
回路基板に不必要な熱供給がなされることがな
く、従つて、フレキシブルプリント回路基板に
ICチツプをはんだ付けするのに好適で、その熱
変形や熱劣化などを発生させるような問題がな
い。さらに、ICチツプとフレキシブルプリント
回路基板との間の位置ずれの発生も防止可能とな
る。
As explained above, according to the present invention, the central part of the IC chip is adsorbed on the printed circuit board placed on the sample stage by the collector that can reflect the laser light from the surrounding area. position the IC chip so that the solder bumps on the IC chip correspond to the electrodes on the printed circuit board, and in this state press the IC chip against the printed circuit board.
The laser beam reflected from the surrounding area of the collector is
Since the solder bumps are irradiated onto the back side of the chip to melt the solder bumps, unnecessary heat is not supplied to the printed circuit board.
It is suitable for soldering IC chips and does not cause problems such as thermal deformation or thermal deterioration. Furthermore, it is also possible to prevent misalignment between the IC chip and the flexible printed circuit board.
第１図は本発明の一実施例を示す説明図、第２
図は従来例の説明図、第３Ａ図、第３Ｂ図および
第３Ｃ図は従来例による位置決め状態、リフロー
加熱状態およびレーザ加熱状態をそれぞれ示す説
明図である。
１……試料台、２……フレキシブルプリント回
路基板、３……ICチツプ、４……吸着孔、６…
…はんだバンプ、７……電極パターン、８……レ
ーザ光、１５……コレツト、１６……反射面。
FIG. 1 is an explanatory diagram showing one embodiment of the present invention, and FIG.
The figure is an explanatory diagram of a conventional example, and FIGS. 3A, 3B, and 3C are explanatory diagrams showing a positioning state, a reflow heating state, and a laser heating state, respectively, according to the conventional example. 1... Sample stage, 2... Flexible printed circuit board, 3... IC chip, 4... Suction hole, 6...
... Solder bump, 7 ... Electrode pattern, 8 ... Laser light, 15 ... Collet, 16 ... Reflection surface.
Claims (1)
んだバンプをはんだ付けするにあたり、前記プリ
ント回路基板を試料台上に載置し、レーザ光を周
囲部から反射させるようにしたコレツトにより前
記ICチツプの中心部を吸着し、該ICチツプのは
んだバンプを前記プリント回路基板上の電極に対
応させるように位置決めして圧接した後、前記レ
ーザ光を前記コレツトの周囲部に照射して、その
反射光を前記コレツトに吸着させた前記ICチツ
プの前記はんだバンプの裏面部に入射させ、前記
はんだバンプを溶融させてはんだ付けを行うこと
を特徴とするICチツプのはんだ付け方法。1. When soldering the solder bumps of an IC chip to electrodes on a printed circuit board, the printed circuit board is placed on a sample stage, and the center of the IC chip is set using a collector that reflects laser light from the surrounding area. After positioning and pressing the solder bumps of the IC chip so as to correspond to the electrodes on the printed circuit board, the laser beam is irradiated onto the periphery of the collector, and the reflected light is reflected from the collector. 1. A method for soldering an IC chip, characterized in that soldering is carried out by making the solder bumps enter the back side of the solder bumps of the IC chip adsorbed to a collector and melting the solder bumps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1097476A JPH02280961A (en) | 1989-04-19 | 1989-04-19 | Soldering method of ic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1097476A JPH02280961A (en) | 1989-04-19 | 1989-04-19 | Soldering method of ic chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02280961A JPH02280961A (en) | 1990-11-16 |
| JPH0313944B2 true JPH0313944B2 (en) | 1991-02-25 |
Family
ID=14193349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1097476A Granted JPH02280961A (en) | 1989-04-19 | 1989-04-19 | Soldering method of ic chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02280961A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0737911A (en) * | 1993-07-19 | 1995-02-07 | Mitsubishi Electric Corp | Apparatus and method for die bonding semiconductor element |
| US6098271A (en) * | 1994-10-04 | 2000-08-08 | Fujitsu Limited | Method for assembling a magnetic disk drive with a relaying flexible printed circuit sheet |
| JPH08106617A (en) | 1994-10-04 | 1996-04-23 | Fujitsu Ltd | Magnetic disk device |
| US7271364B1 (en) * | 2004-03-22 | 2007-09-18 | Cardiac Pacemakers, Inc. | Laser welding fixture and method |
| JP5126711B2 (en) * | 2007-09-11 | 2013-01-23 | 澁谷工業株式会社 | Bonding equipment |
| US8168920B2 (en) * | 2007-09-11 | 2012-05-01 | Shibuya Kogyo Co., Ltd. | Bonding device |
-
1989
- 1989-04-19 JP JP1097476A patent/JPH02280961A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02280961A (en) | 1990-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |