JPH03138096A - Brazing material for electronic parts - Google Patents

Abstract

PURPOSE:To prevent migration and to assure high and stable brazing strength by using the specifically composed brazing material for brazing of electronic parts. CONSTITUTION:The brazing member consisting of an Au alloy contg. 10 to 35wt.% Ag, 3 to 15wt.% in total of at least one kind among In, Ge and Ga and consisting of the blanace Au alloy is used for brazing of the electronic parts, such as IC packages and external leads. The generation of the so-called electromigration that the whisker-like and dendrite-like products of the brazing material components are formed and grown by the voltage at the time of use and moisture in the use environment arising from the narrowing of in the lead spacings by the reduction in the size and the increase in the density of the electronic parts and short to adjacent leads is prevented and the high and stable brazing strength is thus obtd. by using this brazing material.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は、電子部品のろう付けに用いるろう材に関する
。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a brazing material used for brazing electronic components.

（従来技術とその課題） 従来、ＩＣパッケージ等の電子部品と外部ＩＪ−ド等と
のろう付けには一般にＡ　ｇ　Ｃｕ　２８ｗｔ％、Ａ　
ｇ　Ｃｕ　１５ｗｔ％が多く用いられている。(Prior art and its problems) Conventionally, A g Cu 28wt%, A g Cu 28 wt%, A
g Cu 15wt% is often used.

これらろう付げにおいては、近年の小型化、高密度化に
ともない、リード間隔が狭くなるについて、使用時の電
圧及び使用雰囲気中の湿気により、ろう相成分のヒゲ状
、デンドライト状生成物が生成、成長し隣りのリードと
短絡する、いわゆるエレクトロマイグレーションが生じ
て短絡が発生し機能を損なう頻度が高（なっている。In these brazing processes, as the lead spacing becomes narrower due to miniaturization and higher density in recent years, whisker-like and dendrite-like products of the wax phase component are generated due to the voltage during use and the humidity in the use atmosphere. , so-called electromigration, which grows and short-circuits with neighboring leads, occurs, resulting in short-circuits and loss of functionality.

（発明の目的） 本発明は、上記課題を解決すべ（なされたもので、マイ
グレーションの発生を防止でき、強固で安定したろう付
は強度の得られるろう材を提供するものである。(Objective of the Invention) The present invention has been made to solve the above-mentioned problems, and provides a brazing material that can prevent migration and provide strong and stable brazing strength.

（発明の構成） 本発明のろう材は、Ａｇ１Ｏ〜３５ｗｔ％、Ｉｎ、Ｇｅ
及びＧａのうち少な（とも１種類を合計で３〜１５ｗｔ
％及び残部ＡｕのＡｕ合金から成ることを特徴とするも
のである。(Structure of the Invention) The brazing filler metal of the present invention contains Ag1O to 35wt%, In, Ge
and a small amount of Ga (each type is 3 to 15 wt in total)
% and the balance is Au.

（作用） 上記のように構成された本発明のろう材においては、Ａ
ｕを主成分とすることでエレクトロマイグレーションを
防止できるもので、Ａｇを１０〜３５ｗｔ％加えるのは
、゛ろう付は強度を得る為である。(Function) In the brazing material of the present invention configured as described above, A
Electromigration can be prevented by having u as the main component, and the reason why 10 to 35 wt% of Ag is added is to obtain strength during brazing.

ここでＡｇが１０ｗｔ％未満ではろう付は強度が得られ
ず、Ａｇ３５ｗｔ％を超えるとエレクト口マイグレ−ジ
ョンが発生するからである。This is because if the Ag content is less than 10 wt%, brazing strength cannot be obtained, and if the Ag content exceeds 35 wt%, electric port migration will occur.

またＩｎ、Ｇｅ及びＧａのうち少なくとも１種類を合計
で３〜１５ｗｔ％加えるのは、融点を下げる為でａｗｔ
％未満では、効果が期待できず、１５ｗｔ％を超えると
加工性に問題が発生するからである。Also, the reason why at least one of In, Ge, and Ga is added in a total of 3 to 15 wt% is to lower the melting point.
If it is less than 15 wt%, no effect can be expected, and if it exceeds 15 wt%, problems will occur in workability.

（実施例） 以下に実施例と従来例について説明し、本発明の効果を
明瞭にならしめる。(Example) Examples and conventional examples will be described below to clearly demonstrate the effects of the present invention.

表に示す材料組織のろう材を作成し、これら材料でのエ
レクトロマイグレーションの程度及びろう付は強度を試
験し、以下の結果を得た。Brazing materials having the material structure shown in the table were prepared, and the degree of electromigration and brazing strength of these materials were tested, and the following results were obtained.

（以下余白） （以下余白） なお、エレクトロマイグレーションは、以下のＷａｔｅ
ｒ　Ｄｒｏｐ　Ｔｅ５ｔ　　（マイグレーション加速試
験）により行った。これは第１図のように、ガラス板３
の上に前記ろう材からなる板ｌ、■をその間隔が約１ｍ
ｍになるように、平行に配置し、その間に純水を保持し
つつこのろう材の板ｌ、１間に５ｖの直流電圧を印加し
、マイグレーションが発生して短絡するまでの時間を測
定した。(Hereafter the margin) (Hereafter the margin) Electromigration is the following Wate
r Drop Te5t (migration accelerated test). This is the glass plate 3 as shown in Figure 1.
Place the plates l and ■ made of the brazing filler metal on top with a spacing of about 1 m.
A DC voltage of 5V was applied between the brazing filler metal plates L and 1 while pure water was held between them, and the time until migration occurred and a short circuit occurred was measured. .

ろう付は強度は、材質ＦｅＮｉ４２％、寸法５ＷＸ１ｔ
Ｘ５０１と材質ＦｅＮｉ４２％、寸法５Ｗ×１１ｘ５０
１をろう付は後のろう付は強度（ｋｇ／ｎｖ＋ｆ）及び
１％ＮａＣ１溶液中で１００時間放置後のろう付は強度
を測定した。The strength of brazing is 42% FeNi, and the dimensions are 5W x 1t.
X501 and material FeNi 42%, dimensions 5W x 11 x 50
The strength (kg/nv+f) of brazing after brazing No. 1 and the strength (kg/nv+f) of brazing after standing in a 1% NaCl solution for 100 hours were measured.

（発明の効果） 以上の説明から明らかなように本発明のろう材は強固で
安定したろう付は強度で、マイグレーションも生じに（
いという優れた効果を有するもので、ＩＣパッケージ等
の電子部品のろう付けに好適である。(Effects of the Invention) As is clear from the above explanation, the brazing material of the present invention has a strong and stable brazing strength, and does not cause migration (
It has an excellent effect of being flexible and is suitable for brazing electronic components such as IC packages.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はエレクトロマイグレーションの試験方法を模式
的に示す説明図である。FIG. 1 is an explanatory diagram schematically showing an electromigration test method.

Claims (1)

【特許請求の範囲】[Claims] １）Ａｇ１０〜３５ｗｔ％、Ｉｎ、Ｇｅ及びＧａのうち
少なくとも１種類を合計で３〜１５ｗｔ％及び残部Ａｕ
のＡｕ合金から成ることを特徴とする電子部品用ろう材
。1) 10 to 35 wt% of Ag, a total of 3 to 15 wt% of at least one of In, Ge, and Ga, and the balance is Au
A brazing filler metal for electronic parts, characterized in that it is made of an Au alloy.