JPH03133762A - Carrier tape for semiconductor device - Google Patents
Carrier tape for semiconductor deviceInfo
- Publication number
- JPH03133762A JPH03133762A JP26596389A JP26596389A JPH03133762A JP H03133762 A JPH03133762 A JP H03133762A JP 26596389 A JP26596389 A JP 26596389A JP 26596389 A JP26596389 A JP 26596389A JP H03133762 A JPH03133762 A JP H03133762A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- carrier tape
- pedestal
- groove
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 88
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 34
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 3
- 239000011295 pitch Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Packages (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野１
本発明は、半導体装置特にＤＩＰ型半導体装置例えば、
通常のＤＩＰ（デュアルインラインパッケージ）、５−
ＤＩＰ （シュリンクＤＩＰ）、５Ｋ−Ｄ Ｉ Ｐ（ス
キニーＤＩＰ）などを収納するキャリアテープに関する
ものであり、特に、これに収納された半導体装置の輸送
中にリードの変形及び損傷がなく、該テープ内の半導体
装置をロボットが自動的に電子機器に装着するのに適し
た半導体装置のキャリアテープに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to semiconductor devices, particularly DIP type semiconductor devices, such as
Normal DIP (Dual Inline Package), 5-
This relates to carrier tapes for storing DIPs (shrink DIPs), 5K-DIPs (skinny DIPs), etc., and is particularly designed to ensure that the leads are not deformed or damaged during transportation of semiconductor devices stored therein, and that the inside of the tape remains intact. The present invention relates to a semiconductor device carrier tape suitable for automatically mounting the semiconductor device on electronic equipment by a robot.
［従来の技術］
ＤＩＰ型半導体装置は、第６図に示すような半導体を内
臓している縦長の直方体形状のモールド部Ａ及びこのモ
ールドの両側面から引き出されているリードＢが総て下
方に蟹足状に曲げられた形状となっている。[Prior Art] In a DIP type semiconductor device, as shown in FIG. 6, a vertically long rectangular parallelepiped mold part A containing a semiconductor and leads B drawn out from both sides of this mold are all directed downward. It has a bent crab-like shape.
従来より、実開昭５９−１０１４９９号公報第６図に示
されるように、プラスチックシート製テープにＤＩＰ型
半導体装置を収納する多数のキャビティ凹部を設け、該
キャビティが半導体装置のモールド部を支える台座とそ
の両側にある凹溝部からなるＤＩＰ型半導体装置のキャ
リアテープは知られている。Conventionally, as shown in Figure 6 of Japanese Utility Model Application Publication No. 59-101499, a plastic sheet tape is provided with a large number of cavity recesses for accommodating DIP type semiconductor devices, and the cavities support a pedestal for supporting the molded portion of the semiconductor device. A carrier tape for a DIP type semiconductor device is known, which includes a groove portion and groove portions on both sides thereof.
このキャリアテープのキャビティの台座に半導体装置の
リードをまたがらせて多数収納し、その上から別の蓋テ
ープを重合する。その両縁を接着剤で接合して、該キャ
ビティを蓋テープで閉じ、多数の半導体装置をキャビテ
ィ内に収納包装後、このキャリアテープを巻いてリール
状にして運搬する。これを使用するときにキャリアテー
プを自動装着機に挿入して、蓋テープを剥がしながら、
ロボットハンドが半導体装置をキャビティから取り出し
電子機器の所定位置に差し込み装着する。A large number of semiconductor device leads are accommodated in the pedestal of the cavity of this carrier tape, and another lid tape is superposed on top of the leads. Both edges are joined with an adhesive, the cavity is closed with a lid tape, and after a large number of semiconductor devices are stored and packaged in the cavity, the carrier tape is wound around the cavity and the semiconductor device is transported in the form of a reel. When using this, insert the carrier tape into the automatic mounting machine and peel off the lid tape.
A robot hand takes out the semiconductor device from the cavity, inserts it into a predetermined position of the electronic device, and mounts it.
しかし、これらの半導体装置用キャリアテープに半導体
装置を収納した場合に、包装時の挿入操作上からキャビ
ティの大きさに若干のゆとりが必要なため、キャビティ
内で半導体装置がキャビティの長手方向又は横手方向に
移動しやすい。However, when a semiconductor device is stored in these carrier tapes for semiconductor devices, the size of the cavity requires some space for the insertion operation during packaging, so the semiconductor device cannot be placed inside the cavity in the longitudinal or lateral direction of the cavity. Easy to move in direction.
そしてキャビティ内で半導体装置が移動すると該半導体
装置をロボットハンドが挟み、電子機器に自動装着する
場合に、ロボットが挟む位置が一定しないため、自動装
着が円滑に作動しない欠点がある。When the semiconductor device moves within the cavity, the semiconductor device is pinched by a robot hand, and when the semiconductor device is automatically mounted on an electronic device, the position at which the semiconductor device is clamped by the robot is not constant, so that the automatic mounting does not operate smoothly.
特に、キャビティの縦寸法より大幅に小さい半導体装置
を使用した場合に収納半導体装置のキャビティ内の位置
に大きなバラツキが生じ不都合である。In particular, when a semiconductor device is used that is significantly smaller than the vertical dimension of the cavity, the position of the accommodated semiconductor device within the cavity may vary greatly, which is inconvenient.
［発明が解決しようとする課題］
本発明は、半導体装置をキャリアテープのキャビティ内
の一定の位置に正確に収納して、円滑な自動装着を容易
にする半導体装置キャリアテープを提供することを目的
とするものである。[Problems to be Solved by the Invention] An object of the present invention is to provide a semiconductor device carrier tape that allows semiconductor devices to be accurately housed in a predetermined position within a cavity of the carrier tape to facilitate smooth automatic mounting. That is.
［課題を解決するための手段１
本発明者らは、キャリアテープのキャビティ内の一定の
位置に半導体装置を収納するために、鋭意研究した結果
、半導体装置の特有の形状に着目して、その特定のリー
ドの位置決めを凹溝部に設けたリード固定リブにより達
成する方法を案出して本発明を完成した。[Means for Solving the Problems 1] As a result of intensive research, the present inventors focused on the unique shape of semiconductor devices in order to store the semiconductor devices in a fixed position within the cavity of the carrier tape. The present invention was completed by devising a method for positioning a specific lead using a lead fixing rib provided in a recessed groove.
すなわち、本発明は、モールド部とリードからなる形状
の半導体装置が収納される多数のキャビティを一定間隔
毎に設けたプラスチックテープであって、該キャビティ
が中央に該半導体装置のモールド底面を支持する台座と
該台座の両側に配置する２列の凹溝部からなり、該両凹
溝部の少なくともいずれか一方に該凹溝部を略垂直に横
切るリード固定リブを設けたことを特徴とする半導体装
置用キャリアテープを提供するものである。That is, the present invention provides a plastic tape in which a number of cavities are provided at regular intervals in which a semiconductor device having a shape consisting of a mold part and a lead is housed, and the cavities support the bottom surface of the mold of the semiconductor device at the center. A semiconductor device carrier comprising a pedestal and two rows of grooves arranged on both sides of the pedestal, and at least one of the two grooves is provided with a lead fixing rib that crosses the groove substantially perpendicularly. The tape is provided.
本発明を実施例の図面によりさらに詳細に説明゛する。The present invention will be explained in more detail with reference to drawings of embodiments.
ただし、本発明は実施例の具体的な態様に限定されるも
のではない。However, the present invention is not limited to the specific embodiments of the examples.
本発明の典型的な実施例の半導体装置用キャリアテープ
は、第１図及び第２区に示す構造からなる。A carrier tape for a semiconductor device according to a typical embodiment of the present invention has the structure shown in FIG. 1 and Section 2.
本実施例は、長尺のプラスチックシート製テープの中央
線上に、収納する半導体装置の寸法に対応した寸法１６
Ｘ３０ｍｒＡの凹部キャビティ１を一定間隔で多数設け
てあり、各キャビティ１は台座２とその台座の左右両側
に設けた凹溝部３．４からなり、この台座２の寸法は６
．６×３０．０ｍｍとして収納すべき半導体装置のモー
ルド部底面に合わせて設定し、台座２の高さは３．０ｍ
ｍだけ側縁７より低い高さにしである。本実施例の収納
すべき半導体装置のモールド部の厚さは、３．５ｍｍで
あるので、半導体装置の上面がキャリアテープの面から
０．５ｍｍ突出することになり、この突出部分を蓋テー
プにより押さえ、その結果台座２にモールド底面が弱い
力で押し付けられる。In this embodiment, a length of 16 mm, which corresponds to the size of the semiconductor device to be housed, is placed on the center line of a long plastic sheet tape.
A large number of recessed cavities 1 with a diameter of
．． The height of the pedestal 2 is set to 6 x 30.0 mm to match the bottom of the mold part of the semiconductor device to be stored, and the height of the pedestal 2 is 3.0 m.
The height is lower than the side edge 7 by m. Since the thickness of the mold part of the semiconductor device to be stored in this example is 3.5 mm, the top surface of the semiconductor device protrudes 0.5 mm from the surface of the carrier tape, and this protruding portion is covered by the lid tape. As a result, the bottom of the mold is pressed against the pedestal 2 with a weak force.
本発明の特徴であるリード固定リブ５は、本実施例の各
凹溝部の端から約１／３の位置に、凹溝部の底面からの
高さが４．３ｍｍで凹溝部を略垂直に横切るリード固定
リブ５として設けてあり、第２図のように、互いに隣接
するリードＢ、及びＢ２の間にちょうど嵌合するリード
固定リブ５を設けることができる。The lead fixing rib 5, which is a feature of the present invention, is located approximately 1/3 from the end of each groove in this embodiment, and extends approximately perpendicularly across the groove with a height of 4.3 mm from the bottom of the groove. The lead fixing ribs 5 are provided as lead fixing ribs 5, and as shown in FIG. 2, the lead fixing ribs 5 that fit exactly between the adjacent leads B and B2 can be provided.
収納されるリードの先端の水準で、このリブの厚さを本
実施例に用いた半導体装置の隣接リードの側縁との間隔
２４．５ｍｍより短い２４．３ｍｍにすると、±０ 、
１ ｍｍの範囲で半導体装置はキャビティ内に固定され
る。If the thickness of this rib is set to 24.3 mm, which is shorter than the 24.5 mm distance from the side edge of the adjacent lead of the semiconductor device used in this example, at the level of the tip of the lead to be stored, ±0,
The semiconductor device is fixed within the cavity within a range of 1 mm.
この場合は、リード固定リブ５の先端を第２図のように
細くすることができるので、挿入の際に、第２図におい
て左右に挿入位置がブしても、リード固定リブ５は隣接
リードの間に円滑に嵌合させることができる利点がある
。In this case, the tip of the lead fixing rib 5 can be made thin as shown in FIG. 2, so even if the insertion position is shifted to the left or right in FIG. This has the advantage of being able to fit smoothly between the two.
しかし、この方式では、リードのピッチ間隔の狭い半導
体装置にリード固定リブの厚さをあわせるとピッチの大
きい半導体装置を収納するときは半導体装置の位置の正
確度が多少低下するので、ピッチの相違する半導体装置
に該キャリアテープを兼用する場合は第３図の態様が望
ましい。However, with this method, if the thickness of the lead fixing rib is matched to a semiconductor device with a narrow lead pitch, the accuracy of the position of the semiconductor device will decrease somewhat when storing a semiconductor device with a large pitch. When the carrier tape is also used for a semiconductor device, the embodiment shown in FIG. 3 is preferable.
本実施例のキャリアテープの両側縁７には、ガイド穴８
が一定間隔で設けられ、この穴に歯車を嵌合させてキャ
リアテープを自動包装機器及び自動装着機器の中に正確
に移動させることができる。Guide holes 8 are provided on both side edges 7 of the carrier tape in this embodiment.
are provided at regular intervals, and gears can be fitted into the holes to accurately move the carrier tape into automatic packaging equipment and automatic loading equipment.
自動包装の際にキャリアテープのキャビティに半導体装
置を収納後、キャリアテープのガイド穴の幅より狭い幅
の蓋フィルムをかぶせて、両側縁７において、蓋テープ
とキャリアテープは感圧接着剤で接着する。After storing the semiconductor device in the cavity of the carrier tape during automatic packaging, cover with a lidding film whose width is narrower than the width of the guide hole of the carrier tape, and adhere the lidding tape and the carrier tape at both side edges 7 with a pressure-sensitive adhesive. do.
本実施例のキャリアテープに半導体装置を収納した状態
は第２図に示すようになり、半導体装置のモールド底面
が台座２の上に乗って、リードは両側凹溝部の中に収納
され、半導体装置のリードは、凹溝部の宙に浮いており
、その隣接したリードの間に、両側の凹溝部のリード固
定リブ５の稜線部が嵌合している。The state in which the semiconductor device is housed in the carrier tape of this embodiment is as shown in FIG. 2, with the bottom surface of the mold of the semiconductor device resting on the pedestal 2, the leads being housed in the grooves on both sides, and the semiconductor device The leads are suspended in the air in the groove, and the ridgeline portions of the lead fixing ribs 5 of the groove on both sides fit between the adjacent leads.
さらに別の態様として、第３図のように、２列のリブを
設け、これにより、所定のリードを挟んで、半導体装置
の位置を固定することもできる。In yet another embodiment, as shown in FIG. 3, two rows of ribs may be provided to fix the position of the semiconductor device by sandwiching a predetermined lead.
この場合は、２列のリブの先端の内側間隔がり−ドの幅
より少し余裕があるようにして、かつ、台座２に半導体
装置のモールドＡの底が乗った場合には、リブの傾斜面
４１と４２がリードの先端に近付くように設定しである
。In this case, the inner spacing between the tips of the two rows of ribs should be slightly larger than the width of the ribs, and when the bottom of the mold A of the semiconductor device is placed on the pedestal 2, the inclined surface of the ribs should be 41 and 42 are set so that they are close to the tip of the lead.
また、２列のリブの外側の幅を、通常使用されている半
導体装置の一番狭いリードピッチの場合に隣接するリー
ドＢ、とＢ４との間に余裕があるように設定すれば、あ
らゆるピッチ間隔の半導体装置にも好適に使用すること
ができる。Furthermore, if the outer width of the two rows of ribs is set so that there is a margin between adjacent leads B and B4 in the case of the narrowest lead pitch of normally used semiconductor devices, any pitch can be achieved. It can also be suitably used for spaced semiconductor devices.
この場合も、第３図の場合と同じように両リブの先端を
細くすることにより、両リブの先端の間に特定のリード
が入りやすくすることができる。In this case as well, by making the tips of both ribs thinner as in the case of FIG. 3, it is possible to make it easier for a specific lead to fit between the tips of both ribs.
本発明のリブの態様は上記のように種々あるが、凹溝部
に設ける場合には、片方の凹溝部に１個だけ設けること
もできるが、台座などに他の固定手段のない場合は、半
導体装置が斜めになることを防ぐため、両凹溝部に少な
くとも各１個のリード固定リブを設ける方がさらに望ま
しい。There are various aspects of the rib of the present invention as described above, but when provided in a groove, only one rib can be provided in one groove, but if there is no other fixing means on the pedestal etc. In order to prevent the device from being tilted, it is more desirable to provide at least one lead fixing rib in each of both grooves.
さらに、本発明においては、片方又は両方の凹溝部に、
２個以上のリードを固定するように固定リブを設けるこ
とができる。また、種々の型のリード固定リブを混合し
て採用することができる。Furthermore, in the present invention, in one or both of the groove portions,
Fixing ribs can be provided to fix two or more leads. Further, a mixture of various types of lead fixing ribs can be employed.
また、本発明において、固定すべきリードとして、最端
部のリードから真ん中のリードまで、所望に応じてどれ
でも適宜選択することができる。Further, in the present invention, any lead to be fixed can be selected as desired, from the endmost lead to the middle lead.
最端部のリードを選択した場合には、例えば、第１図の
実施例の穴あき型リード固定リブの一方の面はキャビテ
ィの側面と融合させて、リブとしての形状は片方面だけ
の***となるが、これも本発明の一態様として有効であ
る。When selecting the endmost lead, for example, one side of the perforated lead fixing rib in the embodiment shown in Fig. 1 is fused with the side surface of the cavity, so that the shape of the rib is a bulge on only one side. However, this is also effective as an embodiment of the present invention.
本発明の該台座上面の左及び右の外側に台座の面より突
出した点状又は線状の突隆部を設け、左突隆部及び右該
突隆部の間隔を半導体装置のモールド部の底面部を挟持
するように形成することにより、半導体装置を台座の横
方向に対して正確に位置決めをすることができる。Point-like or linear protrusions protruding from the surface of the pedestal are provided on the left and right outer sides of the upper surface of the pedestal according to the present invention, and the interval between the left ridge and the right ridge is set to the mold part of the semiconductor device. By sandwiching the bottom portion, the semiconductor device can be accurately positioned in the lateral direction of the pedestal.
さらに、台座の形状の別の態様として、縦断面で表して
、第７図の（ａ）及び（ｂ）の形状にすることができる
。Furthermore, as another aspect of the shape of the pedestal, it can be expressed in the shape of FIGS. 7(a) and 7(b) in longitudinal section.
第７図（ａ）のように台座と凸隆部との間に溝５３．５
４を設けた台座の両縁を欠落させた形状にすることによ
り、半導体装置のモールド底面の角が嵌合するときに、
その角縁が台座の面に引っ掛かるのを防ぎ、蓋テープの
弱い圧力によっても正確にモールド底面を台座に水平に
嵌合させることができる。As shown in Fig. 7(a), there is a groove 53.5 between the pedestal and the convex part.
By making both edges of the pedestal with 4 missing, when the corners of the bottom of the mold of the semiconductor device are fitted,
The corner edge is prevented from getting caught on the surface of the pedestal, and even with the weak pressure of the lid tape, the bottom surface of the mold can be fitted horizontally to the pedestal accurately.
また、第７図（ｂ）のように台座の中央がへこんで、２
本のレール５５．５６からなる形状では、上記利点に加
えて、半導体装置のモールド底面が２本の線接触で支え
られるので面接触よりかえって水平に保持できる効果が
ある。Also, as shown in Figure 7(b), the center of the pedestal is recessed, and 2
In addition to the above-mentioned advantages, the shape of the book rails 55 and 56 has the effect that the bottom surface of the mold of the semiconductor device is supported by two line contacts, so that it can be held horizontally rather than by surface contact.
第４図と第５図の実施例では、左右の線状突隆部５１と
５２が設けられ、この同突隆部の間隔は、半導体装置の
モールドの底面がちょうど同突隆部で挟持される間隔に
設定しである。In the embodiments shown in FIGS. 4 and 5, left and right linear protrusions 51 and 52 are provided, and the interval between the protrusions is such that the bottom surface of the semiconductor device mold is just held between the protrusions. Set the interval accordingly.
そのため、半導体装置のモールドの底面がこの２本の突
隆部の間と台座上面で形成される面に嵌合して、台座の
上に正確に固定される。Therefore, the bottom surface of the mold of the semiconductor device fits into the surface formed between the two protrusions and the top surface of the pedestal, and is accurately fixed onto the pedestal.
この突隆部５１と５２の内側面は、傾斜しているので、
上から落とし込むと傾斜面によつゼ、正確な台座上の位
置に誘導される。Since the inner surfaces of these protrusions 51 and 52 are inclined,
If dropped from above, it will fall onto the slope and be guided to the correct position on the pedestal.
該突隆部の台座面からの高さは、非常に僅かであり、第
１図の実施例の寸法の台座の場合で、０．３〜１．３ｍ
ｍ程度の高さが適当である。The height of the protrusion from the pedestal surface is very small, and in the case of a pedestal with the dimensions of the embodiment shown in FIG. 1, it is 0.3 to 1.3 m.
A height of about m is appropriate.
また、本発明において、この線状突隆部に代えて、点状
突隆部を台座の左右角側縁の上に設けることができる。Furthermore, in the present invention, instead of the linear protrusions, dotted protrusions can be provided on the left and right corner side edges of the base.
この点状突隆部は、左及び右の向側縁に分かれて、３点
以上必要である。Three or more point-like protrusions are required, divided into left and right opposite edges.
これらの突隆部の作用により、半導体装置の位置が台座
の幅方向にも正確になる。Due to the effects of these protrusions, the position of the semiconductor device is also accurate in the width direction of the pedestal.
本発明の半導体装置用キャリアテープは、熱可塑性プラ
スチックシートを真空成形又は圧空成形することにより
正確な形状に製造することができる。The carrier tape for semiconductor devices of the present invention can be manufactured into a precise shape by vacuum forming or pressure forming a thermoplastic sheet.
熱可塑性樹脂としては、例えば、ポリプロピレン、ポリ
エチレン、ポリスチレン、ポリ塩化ビニル、ポリ塩化ビ
ニリデン、エチレンさく酸ビニル共重合体ケン化物、ポ
リエステル、ナイロンなどの熱可塑性樹脂又はこれらの
２層以上の多層フィルムなどを使用することができる。Examples of thermoplastic resins include thermoplastic resins such as polypropylene, polyethylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, saponified ethylene-vinyl sulfate copolymers, polyester, and nylon, or multilayer films of two or more layers thereof. can be used.
１
２
また、帯電防止剤を添加したものは、防塵の点で好まし
く、特に、カーボンブラックなどの電導性物質を添加し
てシートに電導性を持たせたものを好適に使用すること
ができる。1 2 Further, sheets to which an antistatic agent is added are preferable from the viewpoint of dustproofing, and in particular, sheets to which a conductive substance such as carbon black is added to impart conductivity to the sheet can be suitably used.
［発明の効果］
本発明は、半導体装置のキャビティ内の位置が正確に維
持されるので、自動装着機のロボットハンドによる装着
が円滑にできる利点が大きい。[Effects of the Invention] The present invention has a great advantage in that the position of the semiconductor device in the cavity is maintained accurately, so that mounting by the robot hand of an automatic mounting machine can be performed smoothly.
また、半導体装置を包装した該キャリアテープは、蓋テ
ープを内側にして巻き付け、リール状にして運搬して、
これを繰りだしながら自動装着機器に挿入されるが、本
発明のキャリアテープは、半導体装置のリード部を凹溝
部の中で宙に浮かして包装でき、そのままの状態で巻き
付けられるので、リードが運搬中に曲がったりすること
がない利点もある。Further, the carrier tape packaging the semiconductor device is wrapped with the lid tape inside and transported in the form of a reel.
The carrier tape of the present invention is unrolled and inserted into an automatic mounting device, but the carrier tape of the present invention can be packaged with the leads of the semiconductor device suspended in the groove, and the leads can be wrapped in that state. It also has the advantage of not bending inside.
さらに、本発明の半導体装置用キャリアテープは、キャ
ビティの長さより短い、例えば、半分の長さの半導体装
置でも、又はリードのピッチ間隔が相違する半導体装置
でも、モールドの輻及び各リードの形状寸法は規格化さ
れて同一であるので、本発明のリード固定リブが固定す
べき特定のリードを決めれば、常に、台座上の所望の一
定の位置に半導体装置を収納することができるのが大き
な特徴である。Furthermore, the carrier tape for a semiconductor device of the present invention can be applied to a semiconductor device having a length shorter than the length of a cavity, for example, a half length, or a semiconductor device having a lead pitch that is different from the mold radius and the shape and size of each lead. Since the leads are standardized and the same, a major feature is that once the lead fixing rib of the present invention determines a specific lead to be fixed, the semiconductor device can always be housed at a desired fixed position on the pedestal. It is.
この効果により、幅が同じで長さ又はリードピッチの相
違する２種類以上の半導体装置を同時に収納することが
でき、このことは、半導体装置を装着すべき電子機器に
応じて、一定の順序で、２種以上の半導体装置を収納し
ておけば、１本のキャリアテープを自動装着機に仕込む
だけで、数種の半導体装置の装着が同一のロボット／１
ンドで同時にできる利点がある。This effect allows two or more types of semiconductor devices with the same width but different lengths or lead pitches to be housed at the same time. , if you store two or more types of semiconductor devices, you can mount several types of semiconductor devices on the same robot/one by simply loading one carrier tape into the automatic mounting machine.
It has the advantage that it can be done at the same time.
また、このことは、キャリアテープを半導体装置の長さ
に応じて数種類用意しておく必要がない点及び自動包装
及び自動装着の機械の仕込みテープの寸法を統一できる
利点もある。This also has the advantage that it is not necessary to prepare several types of carrier tapes depending on the length of the semiconductor device, and that the dimensions of the tapes for automatic packaging and automatic mounting machines can be standardized.
第１図は本発明の一実施例の半導体装置用キャリアテー
プの構造を示す平面図であり、第２図は第１図の実施例
のキャリアテープに半導体装置を収納した状態を示す側
断面図であり、第３図は別の実施例の半導体装置を収納
した状態を示す側断面図であり、第４図は所望により使
用する台座の形状を示す平面図面であり、第５図はその
縦断面図であり、第６図は本発明キャリアテープに収納
される半導体装置の形状を示す図面であり、（ａ）は縦
側面図であり、（ｂ）は横側面図であり、第７図（ａ）
及び（ｂ）は所望により使用する台座の他の形状を示す
縦断面図である。
図中の符号は、ｌ；半導体装置収納キャビティ、２；台
座、３．４；凹溝部、５；リード固定リブ、７；側縁部
、８；ガイド穴、５１．５２；突隆部、Ａ；半導体装置
のモールド部、Ｂ：リードである。FIG. 1 is a plan view showing the structure of a carrier tape for a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a side sectional view showing a state in which a semiconductor device is housed in the carrier tape according to the embodiment of FIG. FIG. 3 is a side sectional view showing a state in which a semiconductor device of another embodiment is housed, FIG. 4 is a plan view showing the shape of a pedestal used if desired, and FIG. 5 is a longitudinal section thereof. FIG. 6 is a drawing showing the shape of a semiconductor device accommodated in the carrier tape of the present invention, (a) is a vertical side view, (b) is a horizontal side view, and FIG. (a)
and (b) is a vertical cross-sectional view showing another shape of the pedestal that may be used as desired. The symbols in the figure are l: semiconductor device storage cavity, 2: pedestal, 3.4: groove, 5: lead fixing rib, 7: side edge, 8: guide hole, 51.52: protrusion, A ; Mold part of the semiconductor device, B: Lead.
Claims (1)
納される多数のキャビティを一定間隔毎に設けたプラス
チックテープであって、該キャビティが中央に該半導体
装置のモールド底面を支持する台座と該台座の両側に配
置する２列の凹溝部からなり、該両凹溝部の少なくとも
いずれか一方に該凹溝部を略垂直に横切るリード固定リ
ブを設けたことを特徴とする半導体装置用キャリアテー
プ。 ２ リード固定リブが、収納すべき半導体装置の互いに
隣接するリードの側縁の幅に嵌合するものである請求項
１記載の半導体装置用キャリアテープ。 ３ リード固定リブが２列のリブからなり、該両リブの
間の間隔が収納すべき半導体装置のリードを嵌合させる
ように設けたものである請求項１記載の半導体装置用キ
ャリアテープ。 ４ 台座が該台座上面の左及び右の外側に点状又は線状
の台座の面より突出した突隆部を設け、左突隆部及び右
該突隆部の間隔を半導体装置のモールド部の底面部を挟
持するように形成したものである請求項１〜３記載の半
導体装置用キャリアテープ。[Scope of Claims] 1. A plastic tape having a number of cavities arranged at regular intervals in which a semiconductor device having a shape of a mold part and leads is housed, the cavities supporting the bottom surface of the mold of the semiconductor device in the center. A semiconductor device comprising a pedestal and two rows of grooves disposed on both sides of the pedestal, and a lead fixing rib provided on at least one of the two grooves and extending substantially perpendicularly across the groove. carrier tape. 2. The carrier tape for a semiconductor device according to claim 1, wherein the lead fixing rib fits into the width of the side edges of adjacent leads of the semiconductor device to be stored. 3. The carrier tape for a semiconductor device according to claim 1, wherein the lead fixing ribs include two rows of ribs, and the gap between the two ribs is provided so that the leads of the semiconductor device to be accommodated fit therein. 4. The pedestal is provided with point-like or linear protrusions protruding from the surface of the pedestal on the left and right outer sides of the upper surface of the pedestal, and the interval between the left protrusion and the right protrusion is adjusted to the same extent as that of the mold part of the semiconductor device. 4. A carrier tape for a semiconductor device according to claim 1, wherein the carrier tape is formed so as to sandwich the bottom portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26596389A JPH03133762A (en) | 1989-10-12 | 1989-10-12 | Carrier tape for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26596389A JPH03133762A (en) | 1989-10-12 | 1989-10-12 | Carrier tape for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03133762A true JPH03133762A (en) | 1991-06-06 |
Family
ID=17424486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26596389A Pending JPH03133762A (en) | 1989-10-12 | 1989-10-12 | Carrier tape for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03133762A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5351821A (en) * | 1992-04-30 | 1994-10-04 | Minnesota Mining And Manufacturing Company | Carrier tape with generic pockets |
| US5361901A (en) * | 1991-02-12 | 1994-11-08 | Minnesota Mining And Manufacturing Company | Carrier tape |
| US5396988A (en) * | 1992-04-30 | 1995-03-14 | Minnesota Mining And Manufacturing Company | Electronic component carrier tape with generic pockets |
| US6016917A (en) * | 1997-04-24 | 2000-01-25 | Peak International, Inc. | Component carrier having a pocket including a pedestal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6015856B2 (en) * | 1982-04-02 | 1985-04-22 | 矢崎総業株式会社 | Corrosion protection structure of branch line |
| JPS60113998A (en) * | 1983-11-26 | 1985-06-20 | 松下電器産業株式会社 | Electronic part assembly |
| JPS61127474A (en) * | 1984-11-20 | 1986-06-14 | 松下電器産業株式会社 | Molded shape for conveying electronic part |
-
1989
- 1989-10-12 JP JP26596389A patent/JPH03133762A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6015856B2 (en) * | 1982-04-02 | 1985-04-22 | 矢崎総業株式会社 | Corrosion protection structure of branch line |
| JPS60113998A (en) * | 1983-11-26 | 1985-06-20 | 松下電器産業株式会社 | Electronic part assembly |
| JPS61127474A (en) * | 1984-11-20 | 1986-06-14 | 松下電器産業株式会社 | Molded shape for conveying electronic part |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5361901A (en) * | 1991-02-12 | 1994-11-08 | Minnesota Mining And Manufacturing Company | Carrier tape |
| US5351821A (en) * | 1992-04-30 | 1994-10-04 | Minnesota Mining And Manufacturing Company | Carrier tape with generic pockets |
| US5396988A (en) * | 1992-04-30 | 1995-03-14 | Minnesota Mining And Manufacturing Company | Electronic component carrier tape with generic pockets |
| US6016917A (en) * | 1997-04-24 | 2000-01-25 | Peak International, Inc. | Component carrier having a pocket including a pedestal |
| US6168026B1 (en) | 1997-04-24 | 2001-01-02 | Paek International, Inc. | Component carrier having high strength pocket |
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