JPH03130606A - Inspecting apparatus - Google Patents

Inspecting apparatus

Info

Publication number
JPH03130606A
JPH03130606A JP26769389A JP26769389A JPH03130606A JP H03130606 A JPH03130606 A JP H03130606A JP 26769389 A JP26769389 A JP 26769389A JP 26769389 A JP26769389 A JP 26769389A JP H03130606 A JPH03130606 A JP H03130606A
Authority
JP
Japan
Prior art keywords
leads
qfp
image
mirror
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26769389A
Other languages
Japanese (ja)
Inventor
Tadao Isono
礒野　忠雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mamiya Denshi Co Ltd
Original Assignee
Mamiya Denshi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mamiya Denshi Co Ltd filed Critical Mamiya Denshi Co Ltd
Priority to JP26769389A priority Critical patent/JPH03130606A/en
Publication of JPH03130606A publication Critical patent/JPH03130606A/en
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)

Abstract

PURPOSE:To measure the floating of leads by mounting a QFP at the upper part of a camera, providing a light source which illuminates a mirror that is inclined by approximately 45 degrees and the end surfaces of the leads of the QFP that are provided at the back surface of the mirror, picking up the images of the ends of the leads, and processing the images. CONSTITUTION:An IC 3 which is sucked to a sucking head 2 is moved to the upper part of a camera 1. The image is processed with an image processing device 4, and the lead pitch and the X-Y and the angle of the IC 3 are detected. Namely, A semitransparent mirror 5 is attached to an apparatus at the angle of approximately 45 degrees. The end surfaces of the lead wires of a QFP are illuminated with a light source 6. The IC 3 is lowered from a point A to a point B. The image of the IC is picked up. The floating of the leads is detected based on the dispersion of the end surfaces of the leads. At this time, a plurality of the mirrors 5 and the light sources 6 are provided, and the leads of the sides can be inspected at the same time.

Description

【発明の詳細な説明】 技術分野 本発明は画像処理による検査方法の改良に係り、特に電
子回路に使用されるＱＦＰ装着機等に使用されるリード
端子の曲り検査に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to an improvement in an inspection method using image processing, and more particularly to a bend inspection of a lead terminal used in a QFP mounting machine used in an electronic circuit.

従来技術 従来電子回路に使用されるＱＦＰの足囲り、特に足の浮
き検査は簡単な方法がなく、複雑な光学系や画像処理に
より行っていた。本発明は照明装置の改良により、リー
ドピッチ、ＩＣ位置検査用画像処理装置を共用してリー
ドの浮き検査をも行えるようにしたものである。PRIOR ART There is no simple method for inspecting the foot surroundings of QFPs used in electronic circuits, especially the legs, and it has been done using complicated optical systems and image processing. The present invention improves the illumination device so that the lead pitch and IC position inspection image processing device can also be used to inspect lead floating.

実施例 図−１に於てカメラ１上に吸着ヘッド２に吸着されたＩ
Ｃ３を移送し、画像処理装置４により図−２Ａの如く処
理し、リードピッチ、ＩＣのＸＹ及び角度を検出するの
は公知の方法である。In Example Figure-1, I was attracted by the suction head 2 onto the camera 1.
It is a known method to transfer the C3, process it as shown in FIG. 2A by the image processing device 4, and detect the lead pitch, IC XY and angle.

本発明は、この装置に半透明ミラー５をほぼ４５°の角
度で取り付け、裏面より光源６によりＱＦＰリード線の
端面を照明し、ＩＣをＡ点よりＢ点へ下降させ、その像
を図−２Ｂの如くに取りこみ、この各リード端面のバラ
ツキよりリードの浮きを検出するものである。この時ミ
ラー５及び光源６を複数個設け、各辺のリードを同時に
検査してもよい。また、ＩＣが大きく、リード端面の像
がカメラ視野内に入らない場合は、吸着ヘッド及びミラ
ーを移動させ、像がカメラ中心に来るようにしてもよい
。In the present invention, a translucent mirror 5 is attached to this device at an angle of approximately 45°, the end face of the QFP lead wire is illuminated from the back side by a light source 6, the IC is lowered from point A to point B, and its image is captured in the figure. 2B, and the floating of the leads is detected from the variations in the end faces of each lead. At this time, a plurality of mirrors 5 and light sources 6 may be provided to simultaneously inspect the leads on each side. Furthermore, if the IC is large and the image of the lead end face does not fit within the field of view of the camera, the suction head and mirror may be moved to bring the image to the center of the camera.

この様に構成することにより、ＱＦＰのリード浮きの検
査が容易に行えるようになった。With this configuration, it is now possible to easily inspect QFP leads for floating.

４、4,

【図面の簡単な説明】[Brief explanation of the drawing]

図−１は本発明の概念構成図である。 カ メラ ミラー 光源 図−２は従来技術及び本発明による取り込まれた画像側
である。 従来の画像 本発明による画像FIG. 1 is a conceptual diagram of the present invention. Camera mirror light source diagram-2 is the captured image side according to the prior art and the present invention. Conventional image Image according to the present invention

Claims (1)

【特許請求の範囲】[Claims] 吸着ヘッドに吸着したＱＦＰをカメラ上方に置き、少な
くとも一組のほぼ４５゜傾斜したミラーとその裏面にあ
るＱＦＰリード端面を照明する光源を設け、リード端画
像を取りこみ画像処理することによりリードの浮きを測
定する検査装置。The QFP adsorbed to the suction head is placed above the camera, and at least one set of mirrors tilted at approximately 45 degrees and a light source that illuminates the QFP lead end face on the back side are installed.The lead end image is captured and image processed to determine if the lead is floating. An inspection device that measures
JP26769389A 1989-10-13 1989-10-13 Inspecting apparatus Pending JPH03130606A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26769389A JPH03130606A (en) 1989-10-13 1989-10-13 Inspecting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26769389A JPH03130606A (en) 1989-10-13 1989-10-13 Inspecting apparatus

Publications (1)

Publication Number Publication Date
JPH03130606A true JPH03130606A (en) 1991-06-04

Family

ID=17448224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26769389A Pending JPH03130606A (en) 1989-10-13 1989-10-13 Inspecting apparatus

Country Status (1)

Country Link
JP (1) JPH03130606A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5452080A (en) * 1993-06-04 1995-09-19 Sony Corporation Image inspection apparatus and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5452080A (en) * 1993-06-04 1995-09-19 Sony Corporation Image inspection apparatus and method

Similar Documents

Publication Publication Date Title
US4688939A (en) Method and apparatus for inspecting articles
US6141040A (en) Measurement and inspection of leads on integrated circuit packages
KR960001824B1 (en) Wire bonding inspecting apparatus
KR20110046901A (en) Substrate inspection system and substrate inspection method
JPH03130606A (en) Inspecting apparatus
JPH07135400A (en) Inspection method for mounted component
JPH05288527A (en) Appearance inspecting method for mounted board and its device
US6211959B1 (en) Method of checking for the presence of connection balls
JP2946570B2 (en) Coplanarity measuring device
JPH04208803A (en) Apparatus for inspecting mounting of printed circuit board
KR0179758B1 (en) Detection method of surface mounting device of pcb
JPH08128816A (en) Lead inspection method
JP2600320B2 (en) Parts inspection method
JP2818347B2 (en) Appearance inspection device
JPH07119705B2 (en) Electronic component inspection device
KR950010190B1 (en) Apparatus for testing a electronic parts
JPH0814855A (en) Inspection method for component mounting state
JPH05275900A (en) Method for inspection of state of mounted part lead
JPH07235800A (en) Part carrying device and part carrying method
JP2775500B2 (en) Board inspection screen position determination method
JP2684689B2 (en) Solder ball detection method
JPH10227745A (en) Method and device for inspecting side of top of rivet-shaped part
JPH02278105A (en) Inspecting apparatus for soldering
JPH09243570A (en) Method and apparatus for inspecting solder bridge
JP2830282B2 (en) Appearance inspection method of solder fillet