JPH03102729U - - Google Patents
Info
- Publication number
- JPH03102729U JPH03102729U JP1057890U JP1057890U JPH03102729U JP H03102729 U JPH03102729 U JP H03102729U JP 1057890 U JP1057890 U JP 1057890U JP 1057890 U JP1057890 U JP 1057890U JP H03102729 U JPH03102729 U JP H03102729U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- semiconductor device
- metal wiring
- outer periphery
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000002955 isolation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000000605 extraction Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は本考案によるチツプの平面図、第２図
は従来のチツプの平面図である。
１……ＩＣチツプ、２……電極取出しパツド、
３……周囲電極配線、４……ＩＣチツプ端部。
FIG. 1 is a plan view of a chip according to the present invention, and FIG. 2 is a plan view of a conventional chip. 1...IC chip, 2...electrode extraction pad,
3... Surrounding electrode wiring, 4... IC chip end.
Claims (1)
の周囲のエツジより所定間隔をとつた内側に該エ
ツジの外周に添つて、金属配線を設けかつ、当該
金属配線は該チツプの素子分離領域を介して下部
のサブストレートに接続された半導体装置。 In a semiconductor device chip, a metal wiring is provided inside the chip surface at a predetermined distance from the surrounding edges along the outer periphery of the edge, and the metal wiring is connected to the lower part of the chip through an element isolation region. A semiconductor device connected to a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1057890U JPH03102729U (en) | 1990-02-07 | 1990-02-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1057890U JPH03102729U (en) | 1990-02-07 | 1990-02-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102729U true JPH03102729U (en) | 1991-10-25 |
Family
ID=31514137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1057890U Pending JPH03102729U (en) | 1990-02-07 | 1990-02-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102729U (en) |
-
1990
- 1990-02-07 JP JP1057890U patent/JPH03102729U/ja active Pending