JPH0291360U - - Google Patents
Info
- Publication number
- JPH0291360U JPH0291360U JP1988170776U JP17077688U JPH0291360U JP H0291360 U JPH0291360 U JP H0291360U JP 1988170776 U JP1988170776 U JP 1988170776U JP 17077688 U JP17077688 U JP 17077688U JP H0291360 U JPH0291360 U JP H0291360U
- Authority
- JP
- Japan
- Prior art keywords
- solar cell
- terminal
- external terminal
- wiring board
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000012943 hotmelt Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/2939—Base material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/29393—Base material with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29399—Coating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29399—Coating material
- H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29438—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29444—Gold [Au] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29399—Coating material
- H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29438—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29455—Nickel [Ni] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0233—Deformable particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
- Y10T29/49915—Overedge assembling of seated part
- Y10T29/49922—Overedge assembling of seated part by bending over projecting prongs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
- Y10T29/49924—Joining by deforming of parallel side-by-side elongated members
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Photovoltaic Devices (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Combinations Of Printed Boards (AREA)
Description
図面はそれぞれこの考案の一実施例を示し、第
1図は太陽電池の外部端子が配線基板の接続端子
に接続された状態を示した断面図、第2図は同太
陽電池が取り付けられた配線基板全体の分解平面
図、第3図は同第2図における―線に沿つた
部位の拡大断面図である。 1……配線基板、3……太陽電池、7,8……
太陽電池の外部端子、9,10……配線基板の接
続端子、13……異方導電性接着剤、14……ホ
ツトメルト型絶縁性接着剤、15……熱可塑性樹
脂粒子の外周を金属で被覆した粒子、15a……
熱可塑性樹脂粒子、15b……金属、16……カ
ーボン粒子。
1図は太陽電池の外部端子が配線基板の接続端子
に接続された状態を示した断面図、第2図は同太
陽電池が取り付けられた配線基板全体の分解平面
図、第3図は同第2図における―線に沿つた
部位の拡大断面図である。 1……配線基板、3……太陽電池、7,8……
太陽電池の外部端子、9,10……配線基板の接
続端子、13……異方導電性接着剤、14……ホ
ツトメルト型絶縁性接着剤、15……熱可塑性樹
脂粒子の外周を金属で被覆した粒子、15a……
熱可塑性樹脂粒子、15b……金属、16……カ
ーボン粒子。
Claims (1)
- 【実用新案登録請求の範囲】 太陽電池の外部端子を配線基板の接続端子に接
続する太陽電池の接続構造において、 前記太陽電池の外部端子および該外部端子の周
辺部分を、ホツトメルト型絶縁性接着剤中に熱可
塑性樹脂粒子の外周を金属で被覆した粒子とカー
ボン粒子とが加熱圧縮時に厚さ方向に導電性を呈
し、面方向には絶縁性を呈する割合に分散混合さ
れた異方導電性接着剤により前記配線基板の接続
端子に接着したことを特徴とする太陽電池の接続
構造。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988170776U JPH0291360U (ja) | 1988-12-29 | 1988-12-29 | |
KR2019890010785U KR920004280Y1 (ko) | 1988-12-29 | 1989-07-25 | 전자부품의 접속구조 |
US07/436,295 US5001302A (en) | 1988-12-29 | 1989-11-13 | Connecting structure for an electronic part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988170776U JPH0291360U (ja) | 1988-12-29 | 1988-12-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0291360U true JPH0291360U (ja) | 1990-07-19 |
Family
ID=15911167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988170776U Pending JPH0291360U (ja) | 1988-12-29 | 1988-12-29 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5001302A (ja) |
JP (1) | JPH0291360U (ja) |
KR (1) | KR920004280Y1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011003938A (ja) * | 2007-08-24 | 2011-01-06 | Sanyo Electric Co Ltd | 太陽電池及び太陽電池モジュール |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5180888A (en) * | 1989-08-10 | 1993-01-19 | Casio Computer Co., Ltd. | Conductive bonding agent and a conductive connecting method |
JPH0817109B2 (ja) * | 1989-08-18 | 1996-02-21 | 株式会社半導体エネルギー研究所 | 電気配線およびその接続方法 |
US5235741A (en) * | 1989-08-18 | 1993-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Electrical connection and method for making the same |
US5130833A (en) | 1989-09-01 | 1992-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal device and manufacturing method therefor |
US5611140A (en) * | 1989-12-18 | 1997-03-18 | Epoxy Technology, Inc. | Method of forming electrically conductive polymer interconnects on electrical substrates |
JPH07123179B2 (ja) * | 1990-10-05 | 1995-12-25 | 信越ポリマー株式会社 | 異方導電接着剤による回路基板の接続構造 |
JPH0652745A (ja) * | 1991-09-03 | 1994-02-25 | Nitto Denko Corp | 接合部形成用シート又はテープ |
US5371327A (en) * | 1992-02-19 | 1994-12-06 | Shin-Etsu Polymer Co., Ltd. | Heat-sealable connector sheet |
US5259770A (en) * | 1992-03-19 | 1993-11-09 | Amp Incorporated | Impedance controlled elastomeric connector |
US5613862A (en) * | 1992-07-18 | 1997-03-25 | Central Research Laboratories Limited | Anisotropic electrical connection |
GB2269059A (en) * | 1992-07-18 | 1994-01-26 | Central Research Lab Ltd | Insulation displacement anisotropic electrical connection. |
US5273441A (en) * | 1992-11-12 | 1993-12-28 | The Whitaker Corporation | SMA burn-in socket |
DE9315490U1 (de) * | 1993-10-13 | 1994-11-10 | Hoechst Ag, 65929 Frankfurt | Formkörper mit elektrischem Kontakt |
JPH07115096A (ja) * | 1993-10-18 | 1995-05-02 | Fujitsu Ltd | バンプ電極 |
US5431571A (en) * | 1993-11-22 | 1995-07-11 | W. L. Gore & Associates, Inc. | Electrical conductive polymer matrix |
KR950020972A (ko) * | 1993-12-21 | 1995-07-26 | 쯔지 하루오 | 전극 단자가 미소 피치를 갖는 경우에도 전극 단자의 고신뢰성 접속을 달성할 수 있는 패널 실장 구조 및 패널 실장 방법 |
US5543585A (en) * | 1994-02-02 | 1996-08-06 | International Business Machines Corporation | Direct chip attachment (DCA) with electrically conductive adhesives |
US5545473A (en) * | 1994-02-14 | 1996-08-13 | W. L. Gore & Associates, Inc. | Thermally conductive interface |
US5591034A (en) * | 1994-02-14 | 1997-01-07 | W. L. Gore & Associates, Inc. | Thermally conductive adhesive interface |
JP2737647B2 (ja) * | 1994-03-10 | 1998-04-08 | カシオ計算機株式会社 | 異方導電性接着剤およびそれを用いた導電接続構造 |
US5531942A (en) * | 1994-06-16 | 1996-07-02 | Fry's Metals, Inc. | Method of making electroconductive adhesive particles for Z-axis application |
US5637176A (en) * | 1994-06-16 | 1997-06-10 | Fry's Metals, Inc. | Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials |
US5652055A (en) * | 1994-07-20 | 1997-07-29 | W. L. Gore & Associates, Inc. | Matched low dielectric constant, dimensionally stable adhesive sheet |
JP3186925B2 (ja) * | 1994-08-04 | 2001-07-11 | シャープ株式会社 | パネルの実装構造並びに集積回路搭載テープおよびその製造方法 |
EP0715489A3 (en) * | 1994-11-30 | 1997-02-19 | Ncr Int Inc | Assembly of printed circuit boards |
US5839188A (en) | 1996-01-05 | 1998-11-24 | Alliedsignal Inc. | Method of manufacturing a printed circuit assembly |
US6147870A (en) * | 1996-01-05 | 2000-11-14 | Honeywell International Inc. | Printed circuit assembly having locally enhanced wiring density |
US5738936A (en) * | 1996-06-27 | 1998-04-14 | W. L. Gore & Associates, Inc. | Thermally conductive polytetrafluoroethylene article |
JP4168488B2 (ja) * | 1998-08-28 | 2008-10-22 | ソニー株式会社 | 液晶表示装置 |
DE19957609A1 (de) * | 1998-12-30 | 2000-07-06 | Giesecke & Devrient Gmbh | Verfahren zum Herstellen einer zugleich haftenden und elektrisch leitfähigen Verbindung zwischen einem Modul und einem elektronischen Bauelement |
JP2000199915A (ja) * | 1999-01-06 | 2000-07-18 | Matsushita Electric Ind Co Ltd | 液晶表示パネル |
JP2000207943A (ja) * | 1999-01-11 | 2000-07-28 | Sony Corp | 異方性導電膜及び異方性導電膜を用いた電気的接続装置 |
JP3575001B2 (ja) | 1999-05-07 | 2004-10-06 | アムコー テクノロジー コリア インコーポレーティド | 半導体パッケージ及びその製造方法 |
US6323432B1 (en) | 1999-08-10 | 2001-11-27 | International Business Machines Corporation | Manufacture of dendrites and their use |
JP3427086B2 (ja) * | 2000-02-23 | 2003-07-14 | Necエレクトロニクス株式会社 | Icソケット |
JP2002151532A (ja) * | 2000-11-08 | 2002-05-24 | Sharp Corp | 電子部品、半導体装置の実装方法および半導体装置の実装構造 |
US6840777B2 (en) * | 2000-11-30 | 2005-01-11 | Intel Corporation | Solderless electronics packaging |
AU2002301252B2 (en) * | 2001-10-12 | 2007-12-20 | Bayer Aktiengesellschaft | Photovoltaic modules with a thermoplastic hot-melt adhesive layer and a process for their production |
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
US7281931B2 (en) * | 2003-07-28 | 2007-10-16 | Japan Electronics Industry Ltd. | Electrical connector for connecting electrical units, electrical device, and production method for producing electrical device |
KR100637429B1 (ko) * | 2003-10-24 | 2006-10-20 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
US7078095B2 (en) * | 2004-07-07 | 2006-07-18 | Xerox Corporation | Adhesive film exhibiting anisotropic electrical conductivity |
JP2006206833A (ja) * | 2005-01-31 | 2006-08-10 | Toshiba Matsushita Display Technology Co Ltd | 異方導電性接着剤及びこれを用いた接続構造、接続方法 |
KR101081163B1 (ko) * | 2006-10-10 | 2011-11-07 | 히다치 가세고교 가부시끼가이샤 | 접속 구조 및 그의 제조 방법 |
DE102009006999A1 (de) * | 2009-01-30 | 2010-08-12 | Schott Solar Ag | Alarmsystem für Photovoltaikmodule sowie Verfahren zum Schutz einer Photovoltaikanlage vor Diebstahl |
DE102010027953A1 (de) * | 2010-04-20 | 2011-12-01 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Photovoltaikmoduls mit rückseitenkontaktierten Halbleiterzellen und Photovoltaik-Modul |
US8338698B2 (en) * | 2010-08-27 | 2012-12-25 | Primestar Solar, Inc. | Anisotropic conductive layer as a back contact in thin film photovoltaic devices |
US8187912B2 (en) * | 2010-08-27 | 2012-05-29 | Primestar Solar, Inc. | Methods of forming an anisotropic conductive layer as a back contact in thin film photovoltaic devices |
CN203134778U (zh) * | 2011-10-26 | 2013-08-14 | 日立化成株式会社 | 电路零件 |
CN108922407B (zh) * | 2018-09-11 | 2023-11-24 | 合肥京东方光电科技有限公司 | 显示屏及显示装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60121604A (ja) * | 1983-12-02 | 1985-06-29 | 株式会社昭和ゴム化学工業所 | 異方導電性組成物 |
JPS60263250A (ja) * | 1984-06-11 | 1985-12-26 | Sharp Corp | 薄形電子機器 |
JPS6279281A (ja) * | 1985-10-03 | 1987-04-11 | Casio Comput Co Ltd | 異方導電性接着剤 |
JPS63110506A (ja) * | 1986-10-27 | 1988-05-16 | ダイセル化学工業株式会社 | 異方性導電シ−ト |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4113981A (en) * | 1974-08-14 | 1978-09-12 | Kabushiki Kaisha Seikosha | Electrically conductive adhesive connecting arrays of conductors |
DE2831984A1 (de) * | 1977-07-21 | 1979-02-01 | Sharp Kk | Elektrische verbindung zwischen zwei auf getrennte traeger aufgebrachten elektrischen schaltkreisen |
GB2068645A (en) * | 1980-01-31 | 1981-08-12 | Rogers Corp | Electrical interconnection |
US4496475A (en) * | 1980-09-15 | 1985-01-29 | Potters Industries, Inc. | Conductive paste, electroconductive body and fabrication of same |
US4362903A (en) * | 1980-12-29 | 1982-12-07 | General Electric Company | Electrical conductor interconnect providing solderable connections to hard-to-contact substrates, such as liquid crystal cells |
JPS5964685A (ja) * | 1982-10-05 | 1984-04-12 | Shin Etsu Polymer Co Ltd | 異方導電熱接着性フイルム |
GB2152060B (en) * | 1983-12-02 | 1987-05-13 | Osaka Soda Co Ltd | Electrically conductive adhesive composition |
US4642421A (en) * | 1984-10-04 | 1987-02-10 | Amp Incorporated | Adhesive electrical interconnecting means |
JPH0751390B2 (ja) * | 1985-07-10 | 1995-06-05 | カシオ計算機株式会社 | Icカ−ド |
JPS6241277A (ja) * | 1985-08-16 | 1987-02-23 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤 |
US4868637A (en) * | 1985-11-26 | 1989-09-19 | Clements James R | Electronic device including uniaxial conductive adhesive and method of making same |
US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
JPS63249393A (ja) * | 1987-04-03 | 1988-10-17 | シャープ株式会社 | 電子部品の接続方法 |
-
1988
- 1988-12-29 JP JP1988170776U patent/JPH0291360U/ja active Pending
-
1989
- 1989-07-25 KR KR2019890010785U patent/KR920004280Y1/ko not_active IP Right Cessation
- 1989-11-13 US US07/436,295 patent/US5001302A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60121604A (ja) * | 1983-12-02 | 1985-06-29 | 株式会社昭和ゴム化学工業所 | 異方導電性組成物 |
JPS60263250A (ja) * | 1984-06-11 | 1985-12-26 | Sharp Corp | 薄形電子機器 |
JPS6279281A (ja) * | 1985-10-03 | 1987-04-11 | Casio Comput Co Ltd | 異方導電性接着剤 |
JPS63110506A (ja) * | 1986-10-27 | 1988-05-16 | ダイセル化学工業株式会社 | 異方性導電シ−ト |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011003938A (ja) * | 2007-08-24 | 2011-01-06 | Sanyo Electric Co Ltd | 太陽電池及び太陽電池モジュール |
Also Published As
Publication number | Publication date |
---|---|
KR920004280Y1 (ko) | 1992-06-25 |
KR900013972U (ko) | 1990-07-06 |
US5001302A (en) | 1991-03-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0291360U (ja) | ||
EP1067611A4 (en) | ELECTRODE FOR CELL, PROCESS FOR PRODUCING THE SAME, AND CELL | |
MY112280A (en) | Electrically connecting structure | |
JPS6099566U (ja) | プリント基板端子部の接続構造 | |
JPS61231066A (ja) | 異方導電性ホツトメルト接着剤 | |
JPH10106726A (ja) | 面状発熱体の製造方法 | |
JPS586313U (ja) | 導電性接着テ−プ | |
JPS5890640U (ja) | 温度ヒユ−ズ | |
JPH0431708Y2 (ja) | ||
JPS60163672U (ja) | 電路材の接続構造 | |
JPH0416399Y2 (ja) | ||
JPS60181996U (ja) | 電極端子取り出し構造体 | |
JPH03128937U (ja) | ||
JPH01272010A (ja) | 熱融着型接続ケーブル | |
JPS6251285A (ja) | 回路接続構造 | |
JPS61264604A (ja) | 異方導電性シ−ト | |
JPS61149368U (ja) | ||
JPH046212Y2 (ja) | ||
JPS62126836U (ja) | ||
JPH02108338U (ja) | ||
JPH05182709A (ja) | ヒートシールコネクター | |
JPH0421070U (ja) | ||
JPH01130592U (ja) | ||
JPS6258812U (ja) | ||
JPH036944U (ja) |