JPH028046U - - Google Patents
Info
- Publication number
- JPH028046U JPH028046U JP8353688U JP8353688U JPH028046U JP H028046 U JPH028046 U JP H028046U JP 8353688 U JP8353688 U JP 8353688U JP 8353688 U JP8353688 U JP 8353688U JP H028046 U JPH028046 U JP H028046U
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- ring groove
- watertight
- semiconductor
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
第１図ａ，ｂ及びｃは本考案の一実施例の側面
図、底面図及び使用状態を示す側面図、第２図ａ
，ｂ及びｃは従来の半導体パツケージの一例の側
面図、底面図及び使用状態を示す側面図である。
１……金属製基台、２……Ｏリング溝、３……
電気端子、４……取付穴、５……シヤーシ、６…
…Ｏリング、７……放熱媒体（水）、８……放熱
経路、９……放熱板、１０……放熱媒体（空気）
。
Figures 1a, b, and c are a side view, bottom view, and side view showing the state of use of an embodiment of the present invention, and Figure 2a is a side view of an embodiment of the present invention.
, b, and c are a side view, a bottom view, and a side view showing an example of a conventional semiconductor package in use. 1...Metal base, 2...O-ring groove, 3...
Electrical terminal, 4...Mounting hole, 5...Chassis, 6...
... O-ring, 7 ... Heat radiation medium (water), 8 ... Heat radiation path, 9 ... Heat radiation plate, 10 ... Heat radiation medium (air)
.
Claims (1)
の電気端子の周囲に設けられたＯリング溝と、該
Ｏリング溝に装着した水密用Ｏリングとを備える
ことを特徴とする水密型半導体パツケージ。 A watertight type characterized by comprising a metal base on which a semiconductor is mounted, an O-ring groove provided around an electric terminal of the metal base, and a watertight O-ring attached to the O-ring groove. Semiconductor package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8353688U JPH028046U (en) | 1988-06-23 | 1988-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8353688U JPH028046U (en) | 1988-06-23 | 1988-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028046U true JPH028046U (en) | 1990-01-18 |
Family
ID=31308249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8353688U Pending JPH028046U (en) | 1988-06-23 | 1988-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028046U (en) |
-
1988
- 1988-06-23 JP JP8353688U patent/JPH028046U/ja active Pending