JPH0278166A - Electronic parts mounting substrate - Google Patents
Electronic parts mounting substrateInfo
- Publication number
- JPH0278166A JPH0278166A JP63229174A JP22917488A JPH0278166A JP H0278166 A JPH0278166 A JP H0278166A JP 63229174 A JP63229174 A JP 63229174A JP 22917488 A JP22917488 A JP 22917488A JP H0278166 A JPH0278166 A JP H0278166A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic component
- board
- drift
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 230000002265 prevention Effects 0.000 claims description 9
- 239000004020 conductor Substances 0.000 abstract description 26
- 239000011347 resin Substances 0.000 abstract description 22
- 229920005989 resin Polymers 0.000 abstract description 22
- 229910000679 solder Inorganic materials 0.000 abstract description 16
- 238000007789 sealing Methods 0.000 abstract description 12
- 239000011521 glass Substances 0.000 abstract description 8
- 239000012212 insulator Substances 0.000 abstract description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011810 insulating material Substances 0.000 abstract description 2
- 125000001905 inorganic group Chemical group 0.000 abstract 1
- 230000003449 preventive effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 13
- 239000004642 Polyimide Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電子部品搭載用基板に関し、特に配線基板上
に形成した導体パターンと、外部接続端子となる配線基
板から突出したリードとを電気的に接続した電子部品搭
載用基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a board for mounting electronic components, and in particular, the present invention relates to a board for mounting electronic components, and in particular, the present invention relates to a board for mounting electronic components, and in particular, a conductive pattern formed on a wiring board and a lead protruding from the wiring board that serves as an external connection terminal. The present invention relates to a board for mounting electronic components that is connected to the board.
（従来の技術）
近年の高密度化された電子部品は、そのままでは各Ｎ″
ｒｒｉ子機器を構成することができないから。(Prior art) In recent years, high-density electronic components are
Because I can't configure the rri child device.
これを基板に実装してから使用することとなる。This will be used after being mounted on the board.
そのために、従来より種々の形式の電子部品搭載用基板
あるいは、装置が開発され提案されてきている。To this end, various types of electronic component mounting boards or devices have been developed and proposed.
電子部品とリード等の外部に接続するための端子とを、
基板において接続する形式としては種々なものかある。Connect electronic components to external terminals such as leads,
There are various types of connections on the board.
この電子部品とリード等の外部に接続するための端子と
を所定配列にして接続する形式としては１例えば、所定
配列にして植設した多数の導体ピンと基板との導体回路
を介して電子部品とを接続する所謂ＰＧＡ、基板ト基板
体回路の一部を電子部品か直接搭載されるフィンガーリ
ートとする所謂ＴＡＢ、リートと電子部品とをワイヤー
ボンディングして、その全体をモールドする所謂ＤＩＲ
あるいはＱＦＰ等がある。One way to connect this electronic component to external terminals such as leads in a predetermined arrangement is, for example, to connect the electronic component through a conductor circuit between a board and a large number of conductor pins implanted in a predetermined arrangement. The so-called PGA connects the substrate to the circuit board, the so-called TAB uses a finger REIT on which electronic components are directly mounted, and the so-called DIR uses wire bonding between the REIT and the electronic component and molds the whole.
Alternatively, there is a QFP, etc.
これらのうち、例えば互いに電気的に独＼ｒした複数の
リードを基材から突出させるとともに、この基材、トに
搭載した電子部品の接ｔｈｉ！部と各ソートとを電気的
に接続したＱＦＰ形式の基板を例にとってみてし、特開
昭５９−９８５４５号公報等においてその具体化された
ものか種々提案されている。この特開昭５９−９８５４
５号公報等において提案されているのは、
「導′ｒ１ｔ、層を形成したベレット取付は基板の上に
ベレ・ソトを取り付け、前記ベレットのボンディングバ
ットと前記導電層とをワイヤーボンディングにより電気
的に接続し、前記ベレット取付板の前記導電層をリード
フレームに接合してなる・に導体装置」
であるか、このような混成集積回路′！Ａ置を代表とす
る従来の電子部品搭載用基板の基本構成としては、第７
図に示すようなものかあげられる。また、その装置とし
ては第８図に示すようなものがあげられる。Among these, for example, a plurality of leads that are electrically connected to each other may be protruded from the base material, and electronic components mounted on the base material may be connected to each other. Taking as an example a QFP-type board in which a part and each sort are electrically connected, various embodiments have been proposed in Japanese Patent Laid-Open Publication No. 59-98545 and others. This Japanese Patent Publication No. 59-9854
What has been proposed in Publication No. 5 and other publications is that "In the case of mounting a conductive layer, a bullet is attached on the board, and the bonding butt of the bullet and the conductive layer are electrically connected by wire bonding. A conductor device formed by connecting the conductive layer of the pellet mounting plate to the lead frame, or such a hybrid integrated circuit'! The basic configuration of conventional electronic component mounting boards, typically A-type, is the 7th
I can name something like the one shown in the figure. Further, as an example of such a device, there is a device as shown in FIG.
（発明か解決しようとするａ題）
ところか、以にのような構成をとると、リフロー法にお
いてはんたづけする場合、ｖｃ続信頒性を得るためには
、充分な場のはんだか必要であるか、逆に、絶対的な量
か多かったりすると、過剰のはんだは、ソートの導体パ
ターンに接続される部分の反対方向へ流れるといった現
象か現われることとなる。このような状態において得ら
れる電子部品搭載用基板は、その後電ｆ部品か搭載され
、８４而劃市し、電子部品搭載装置としたとき、Ｍ１ヒ
樹脂とリートの界面にはんだか電子部品搭載装置の外周
近くまて存在することとなる。つまり、電子部品搭・佐
装訝の外周から、リートと配線ノフ板りの導体パターン
の接続部をなすはんたまての距離か短くなるわけである
。(Problem to be solved by the invention) However, when using the configuration shown below, when soldering is performed using the reflow method, sufficient field solder is required to obtain VC continuity. If it is necessary or, conversely, the absolute amount is large, a phenomenon will occur in which the excess solder flows in the opposite direction of the part connected to the conductor pattern of the sort. The electronic component mounting board obtained in such a state is then mounted with electronic components, and when it is processed into an electronic component mounting device, there is no solder on the interface between the M1 resin and the lead. It will exist near the outer periphery. In other words, the distance from the outer periphery of the electronic component tower and mounting plate to the solder pad that forms the connection between the conductor pattern of the lead and the wiring nozzle board becomes shorter.
ところで、こういった形式の電子部品搭載装置の故障の
主原因の一つに、リードと封止樹脂の界面から水分か侵
入し、配線基板上の電子部品の電極を腐食させ故障に至
らしめるというモードかある。また５はんたの熱膨張係
数は、リードあるいは封止樹脂のそれと大きく異なるた
め、リートと封１Ｆ樹脂の界面から侵入した水分は、は
んだまで到達すると、そこから電子部品の電極までは容
易に到達し故障に至らしめることとなる。つまり、はん
たが、リードの導体パターンに接続される部分の反対方
向へ流れるような場合、電子部品搭載装置の外部からは
んだまでの距離が短く、よって電子部品電極へのリード
と封止樹脂の界面からの水分の到達は、より容易なもの
になるのである。By the way, one of the main causes of failures in this type of electronic component mounting equipment is that moisture enters through the interface between the leads and the sealing resin, corroding the electrodes of the electronic components on the wiring board and causing failures. There is a mode. In addition, the coefficient of thermal expansion of solder 5 is significantly different from that of the lead or sealing resin, so once moisture that has entered from the interface between the lead and the sealing resin reaches the solder, it can easily reach the electrodes of the electronic component. This can lead to failure. In other words, if the solder flows in the opposite direction of the part of the lead that is connected to the conductor pattern, the distance from the outside of the electronic component mounting device to the solder is short, and therefore the lead to the electronic component electrode and the sealing resin This makes it easier for moisture to reach the interface.
ここに述べた現象は、はんだに限らず、＊、銅、金フィ
ラー、あるいはそれらの複合フィラー等を含む樹脂系導
電性接着剤を用いても同様に発生するものである。The phenomenon described here occurs not only with solder, but also with resin-based conductive adhesives containing *, copper, gold filler, or composite fillers thereof.
そこで１本発明者等は以上の課題を解決すべく鋭意研究
した結果、リートの電子部品か搭載される配線基板」；
の導体パターンとの接続部の近傍に、導電性接着剤の流
動防止壁を設けることか良い結果を生むことを新たに知
見し、本発明を完成したのである。Therefore, as a result of intensive research to solve the above-mentioned problems, the inventors of the present invention and others have found that the wiring board on which electronic components of the REIT are mounted.
The present invention was completed based on the new finding that good results can be obtained by providing a wall to prevent the conductive adhesive from flowing near the connection part with the conductor pattern.
そして、本発明の目的とするところは、特に耐湿性を向
上させたことにより、信頼性の高い電子部品搭載用基板
を提供することにある。An object of the present invention is to provide a highly reliable substrate for mounting electronic components, particularly by improving moisture resistance.
（課題を解決するための手段）
以上の課題を解決するために本発明が採った手段は、実
施例に対応する第１図〜第６図を参照して説明すると、
［外部接続端子（２）となるリード（１）を、導電性接
着剤（１２）によって電子部品（７）か搭載される配線
基板（４）上の導体パターン（３）に接続した電子部品
搭載用基板において、
リード（１）七であって、導体パターン（３）に接続さ
れる部分の近傍に、導電性接着剤（１２）の流動を防止
するｆＩｉ、動防Ｗ壁（５）を設けたことを特徴とする
電子部品搭載用基板（９）」
である。(Means for Solving the Problems) The means taken by the present invention to solve the above problems will be explained with reference to FIGS. 1 to 6 corresponding to the embodiments. ) is connected to the conductor pattern (3) on the wiring board (4) on which the electronic component (7) is mounted using a conductive adhesive (12). 1) 7, characterized in that an fIi and a dynamic wall (5) for preventing the flow of the conductive adhesive (12) are provided near the part connected to the conductor pattern (3). "Substrate for mounting electronic components (9)".
以上の本発明が採った子役を、図面に示した具体例に従
って詳細に説明すると、次の通りである。The child actor employed in the above-mentioned present invention will be explained in detail according to the specific example shown in the drawings as follows.
まず、この電子部品搭載用基板（９）は、これに搭載す
る各電子部品（７）を、その配線基板（４）から外部に
突出する各リード（１）によって他の大型基板等に実装
する形式のものであり、この電子部品搭載用基板（９）
は外部接続端子（２）となるリード（１）を、導電性接
着剤（１２）によって、電子部品（７）か搭載される配
線基板（４）上の導体パターン（３）に接続したもので
ある。なお、この配線基板（４）はガラスエポキシ等の
樹脂系材料の材料の片面あるいは両面にあらかじめ、必
要な導体パターン（３）か形成されたものを使用するこ
とかできる。First, this electronic component mounting board (9) is used to mount each electronic component (7) to be mounted on another large board, etc. using each lead (1) protruding from the wiring board (4) to the outside. This electronic component mounting board (9)
The lead (1), which becomes the external connection terminal (2), is connected to the conductor pattern (3) on the electronic component (7) or the wiring board (4) on which it is mounted, using a conductive adhesive (12). be. The wiring board (4) may be made of a resin-based material such as glass epoxy, and the necessary conductor pattern (3) may be formed on one or both sides thereof in advance.
また、導電性接着剤（１２）により電気的接続か完了後
、この接続部（５）をソルダーレジスト、封止樹脂等の
絶縁物（８）で覆うことも可能である。Further, after the electrical connection is completed using the conductive adhesive (12), it is also possible to cover the connecting portion (5) with an insulating material (8) such as a solder resist or a sealing resin.
これは、特に導体パターン（３）等の高密度化か進み、
リート（１）が細かくなると、リード（１）の−木あた
りの導体パターン（３）との接続面積か大幅に減少し、
接着強度が著しく低下する場合にはその補強という観点
から非常に有効である。This is especially due to the increasing density of conductor patterns (3), etc.
When the lead (1) becomes finer, the connection area between the lead (1) and the conductor pattern (3) per wood decreases significantly.
It is very effective from the viewpoint of reinforcement when the adhesive strength is significantly reduced.
本発明に使用できる配線基板材料としては、上述したも
のの他に、シリコン、ポリイミド、アルミナ、ガラスト
リアジン、あるいは金属ベース上にポリイミド、ガラス
トリアジン等の絶縁層を有する所謂金属ベース基板等、
要するに絶縁層ヒに導体パターンを形成できるものであ
れば何でも良い。リード（１）の材料においても、必要
な導電性を有していれば何ても良く、銅系、鉄系あるい
は４２アロイ等でも何ら問題はない。In addition to the above-mentioned materials, wiring board materials that can be used in the present invention include silicon, polyimide, alumina, glass triazine, or a so-called metal base substrate having an insulating layer of polyimide, glass triazine, etc. on a metal base.
In short, any material may be used as long as a conductive pattern can be formed on the insulating layer. As for the material of the lead (1), any material may be used as long as it has the necessary conductivity, and there is no problem with copper-based, iron-based, 42 alloy, etc.
さらに、リート（１）と導体パターン（３）を接続する
導電性接着剤（１２）としては、前述のはんだ。Furthermore, the conductive adhesive (12) for connecting the lead (1) and the conductive pattern (3) is the aforementioned solder.
銀等の金属フィラー入りの樹脂系導電性接着剤、あるい
は、それらのＬにメツキをして、導電性を強化したもの
を使用してもかまわず、神々のものが考えられる。A resin-based conductive adhesive containing a metal filler such as silver, or one whose L is plated to enhance conductivity may be used, and God's adhesive may be used.
最後に導電性接着剤の流動防止壁（６）としては、ｄ常
のソルダーレジスト、あるいは封１ト樹脂等の樹脂系の
絶縁物、ガラス、アルミナ等の無機系の絶縁物苓絶縁性
を有するものであれば何でもよく、また、リードとなる
べき材料に加工を施し、リート加工と同時にあるいはリ
ード加工後に流動防止壁（６）を直接、一体的に設けて
も何らさしつかえない。Finally, the conductive adhesive flow prevention wall (6) may be a conventional solder resist, a resin insulator such as sealing resin, or an inorganic insulator such as glass or alumina. Any material may be used, and there is no problem even if the material to be the lead is processed and the flow prevention wall (6) is directly and integrally provided at the same time as the lead processing or after the lead processing.
（発明の作用）
本発明が以上のような手段をとることにより次のような
作用かある。(Actions of the Invention) By taking the above measures, the present invention has the following effects.
リート（１）の導体パターン（３）に接続される部分の
反対方向へ流れることを防止する流動防止壁（６）かあ
るため、導電性接着剤（１２）の流動を確実に防１トシ
ているのである。従って、電子部品搭載装置（１０）の
外周部から導電性接着剤（１２）までの距離か短くなる
ことはなく、シかも設計通りに確保されるため、リード
（１）とＭｄ−樹脂（１１）の界面からの水分の侵入に
よる故障を大幅に低下させるのであり、上値性の高い電
子部品搭載用基板（’ｌ）、あるいは装ｆｆ１（１０）
とすることが可能となっているのである。Since there is a flow prevention wall (6) that prevents the conductive adhesive (12) from flowing in the opposite direction of the part connected to the conductor pattern (3) of the lead (1), it is possible to reliably prevent the conductive adhesive (12) from flowing. There is. Therefore, the distance from the outer periphery of the electronic component mounting device (10) to the conductive adhesive (12) is not shortened, and the distance between the lead (1) and the Md-resin (12) is secured as designed. ), it greatly reduces failures due to moisture intrusion from the interface of
It is now possible to do so.
（実施例）
次に、本発明を図面に示した各実施例に従って詳細に説
明する。(Example) Next, the present invention will be described in detail according to each example shown in the drawings.
χ夏声」− 第１図、第２図に本発明の第１実施例を示す。χ Summer Voice”− 1 and 2 show a first embodiment of the present invention.
このうち第１図は、電子部品搭載用基板（９）であり、
第２図かそれを用いた電子部品搭載装置（１０）である
、これらの図において、配線基板（４）としては片面ガ
ラストリアジン基板を使用して、必要な導体パターン（
３）を片面に形成したものを使用した。リート（１）と
しては、厚み０．２５ｍｍｔの銅系のもので、リート（
１）の導体パターン（３）に接続される部分の近傍には
、流動防１Ｆ壁（６）としてソルダーレジストか塗布さ
れているものを使用した。そして、導体パターン（３）
上に導電性接着剤（１２）としてはんだクリームを印刷
し、ＩＲ炉でリフローし１本発明による電子部品搭載用
基板（９）を完成した。Of these, FIG. 1 shows a board (9) for mounting electronic components,
In these figures, a single-sided glass triazine substrate is used as the wiring board (4), and the necessary conductor patterns (
3) formed on one side was used. The REET (1) is a copper-based material with a thickness of 0.25 mm.
In the vicinity of the part connected to the conductor pattern (3) in 1), a solder resist coated was used as a flow prevention 1F wall (6). And conductor pattern (3)
Solder cream was printed as a conductive adhesive (12) on top and reflowed in an IR furnace to complete a substrate (9) for mounting electronic components according to the present invention.
その後、この電子部品Ｉ＆俄用基板（９）は電子部品（
７）か搭載され樹脂封止され、電子部品搭ａ装ｍ（Ｉｎ
）となるものである。After that, this electronic component I & other board (9) is attached to the electronic component (
7) is mounted and sealed with resin, and is equipped with electronic components (In
).
実施例２ 第３図、第４図は本発明の第２実施例を示す。Example 2 3 and 4 show a second embodiment of the invention.
第３ Ｌｊｌは電子部品搭載用基板（９）であり、第４
図はそれを用いた電子部品搭載装置（ｌＯ）である、こ
れらの図において配線基板（４）としては、４２７０イ
ベースの片面に絶縁層としてガラスポリイミドを積層し
たものを使用し、この上に必要な導体パターン（３）を
形成した。また、リード（１）としては、厚み０．１５
ｍｍＬの４２７０イに、導電性接着剤（１２）の流動を
防止する流動防止壁（６）を一体重に設けたものを使用
した。そして、導体パターン（３）上に導電性接着剤（
１２）としてはんだクリームを塗布し、リフローさせ１
本発明による°電子部品搭載用基板（９）か完成した。The third Ljl is a board (9) for mounting electronic components, and the fourth
The figure shows an electronic component mounting device (lO) using this. In these figures, the wiring board (4) is a 4270 base with glass polyimide laminated as an insulating layer on one side, and the necessary A conductive pattern (3) was formed. In addition, the lead (1) has a thickness of 0.15
mmL 4270B was used, which was equipped with a flow prevention wall (6) for preventing the conductive adhesive (12) from flowing. Then, conductive adhesive (
12) Apply solder cream and reflow 1
The electronic component mounting board (9) according to the present invention has been completed.
その後、この基板（９）には電子部品（７）が搭載され
て樹脂封止さ、れ、電子部品搭載装置（ｌＯ）となるも
のである。Thereafter, electronic components (7) are mounted on this substrate (9) and sealed with resin, thereby forming an electronic component mounting apparatus (1O).
尚、ここで使用される配線基板（４）として４２アロイ
ベースの所謂金属ベース基板を使用したのは、加熱時に
発生する配線基板（４）とり一ト（１）の８ｒＭ張係数
の不整合による応力を少なくするためである。The reason why a so-called metal base board based on 42 alloy was used as the wiring board (4) used here was due to the mismatch in the 8 rM tensile coefficient of the wiring board (4) and (1) that occurs during heating. This is to reduce stress.
衷」１１ユ 第５図、第６図は本発明の第３実施例を示す。11 yu 5 and 6 show a third embodiment of the present invention.
第５図は電子部品搭載用基板（９）であり、第６図はそ
れを用いた電子部品ｇａ装置（１０）である。これらの
図において配線基板（４）としては、ガラスポリイミド
材料の片面に必要な導体パターン（３）を形成したもの
を使用した。リード（１）は、厚み０．１５ｍｍＬの４
２アロイ系のもので、リード（＋）の導体パターン（３
）に接続される部分の近傍には、流動を防暑トする流動
防止壁（６）として、封止樹脂と略凹−組成のものか塗
布されている。そして、導体パターン（］）、ｈに導電
性接着剤（１２）としてダイボンデインク用銀ペースト
をＰＪ！布し、加熱硬化させた。さらにこのリート（り
と導体パターン（１）の接続部の−ｑ１！性接着剤（１
２）のまわりには、封１樹脂と略凹−組成の絶縁物（８
）か内置塗布され１本発明による電子部品＃５藏用基板
（９）が完成した。FIG. 5 shows an electronic component mounting board (9), and FIG. 6 shows an electronic component GA device (10) using the same. In these figures, the wiring board (4) used was a glass polyimide material with a necessary conductor pattern (3) formed on one side. Lead (1) has a thickness of 0.15 mmL.
2 alloy type, lead (+) conductor pattern (3
) is coated with a sealing resin and a material having a substantially concave composition as a flow prevention wall (6) for heat-proofing the flow. Then, apply silver paste for die bonding ink as a conductive adhesive (12) to the conductor pattern (]) and h. It was coated and cured by heating. Furthermore, -q1! property adhesive (1
2) is surrounded by the sealing resin 1 and an insulator (8) having a substantially concave composition.
) was coated internally to complete a substrate (9) for electronic component #5 according to the present invention.
その後、この基板（９）には電子部品（７）か搭載され
て樹脂封＋ｈされ、電子部品搭載装置（１０）となるの
である。Thereafter, an electronic component (7) is mounted on this board (9) and sealed with resin to form an electronic component mounting device (10).
尚、ここで導電性接着剤（１２）のまわりに絶縁物（８
）を９ｉ存するのは、リード（＋）と導体パターン（３
）の必要十分な接続強度を確保するためである。Incidentally, here, an insulator (8) is placed around the conductive adhesive (12).
) exists in the lead (+) and conductor pattern (3
) to ensure sufficient connection strength.
（発明の効果）
以Ｅ要するに１本発明にあっては、Ｌ記各実施例にて例
示した如く、
「外部接続端子（２）となるリート（１）を、導電性接
着剤（１２）によって電子部品（７）が＃＆藏される配
線基板（４）Ｆの導体パターン（３）に接続した電子部
品搭載用基板において。(Effects of the Invention) In summary, in the present invention, as exemplified in each embodiment described in L, "the lead (1) which becomes the external connection terminal (2) is bonded with a conductive adhesive (12). In the electronic component mounting board connected to the conductor pattern (3) of the wiring board (4) F on which the electronic component (7) is mounted.
リート（１）上であって、導体パターン（コ）に接続さ
れる部分の近傍に、導電性接着剤（１２）の流動を防止
する流動防止壁（６）を設けたこと」−にその構成上の
特徴があり、次に示す具体的効果を有するものである。A flow prevention wall (6) that prevents the conductive adhesive (12) from flowing is provided on the lead (1) near the part connected to the conductive pattern (c). It has the above characteristics and has the following specific effects.
つまり、リード（１）の導体パターン（３）に接続され
る部分の真近に、導電性接着剤（Ｉ２）の流動を防１１
ニする流動防止壁（５）か設けられているため、電子部
品格・峻装置（１０）の外周部から接着剤（１２）まで
の距離か短くなることなく設計通りに確保されるため、
リード（１）と封止樹脂（１１）の界面からの水分の侵
入による故障を大幅に低ｆさせることかできる信頼性の
高い、電子部品搭載用基板（９）を得ることができる。In other words, the flow of the conductive adhesive (I2) is prevented from flowing in the vicinity of the part of the lead (1) that is connected to the conductor pattern (3).
Since the flow prevention wall (5) is provided, the distance from the outer periphery of the electronic component rack/steep device (10) to the adhesive (12) is secured as designed without being shortened.
It is possible to obtain a highly reliable electronic component mounting board (9) that can significantly reduce failures due to moisture intrusion from the interface between the lead (1) and the sealing resin (11).
第１図は本発明の第一実施例に係る電子部品搭載用基板
の断面図、第２図は本発明の第一実施例に係る電子部品
搭載用基板を用いた電子部品搭載装置の断面図、第３図
は本発明の第二実施例に係る電子部品搭載用基板の断面
図、第４図は本発明の第二実施例に係る電子部品搭載用
基板な用いた電子部品ｇ藏装置の断面図、第５図は本発
明の第三実施例に係る電子部品搭載用基板の断面図、第
６図は本発明の第三実施例に係る電子部品搭載用基板を
用いた電子部品搭載装置の断面図である。
第７図及び第８１２のそれぞれは従来の電子部品搭載用
基板及び装置を示す断面ＩＡである。
符 号 の 説 明
ｌ・・・リート、２・・・外部接続端子、３・・・導体
パターン、４・・・配線基板、５・・・接続部、６・・
・流動病１１二壁、７・・・電子部品、８・・・絶縁物
、９・・・電子部品搭載用基板、１０・・・電子部品基
Ｊｉｔ装置、１１・・・封ｉＪ：樹脂、１２・・・導電
性接着剤。
以 上FIG. 1 is a sectional view of an electronic component mounting board according to the first embodiment of the present invention, and FIG. 2 is a sectional view of an electronic component mounting apparatus using the electronic component mounting board according to the first embodiment of the present invention. 3 is a sectional view of the electronic component mounting board according to the second embodiment of the present invention, and FIG. 4 is a sectional view of an electronic component storage device using the electronic component mounting board according to the second embodiment of the present invention. 5 is a sectional view of an electronic component mounting board according to a third embodiment of the present invention, and FIG. 6 is an electronic component mounting apparatus using an electronic component mounting board according to a third embodiment of the present invention. FIG. 7 and 812 are cross sections IA showing a conventional electronic component mounting board and device, respectively. Explanation of symbols 1...Lead, 2...External connection terminal, 3...Conductor pattern, 4...Wiring board, 5...Connection part, 6...
・Flow disease 11 two walls, 7... Electronic component, 8... Insulator, 9... Electronic component mounting board, 10... Electronic component base JIT device, 11... Sealing iJ: Resin, 12... Conductive adhesive. that's all
Claims (1)
子部品が搭載される配線基板上の導体パターンに接続し
た電子部品搭載用基板において、前記リード上であって
、前記導体パターンに接続される部分の近傍に、前記導
電性接着剤の流動を防止する流動防止壁を設けたことを
特徴とする電子部品搭載用基板。In an electronic component mounting board in which a lead serving as an external connection terminal is connected to a conductive pattern on a wiring board on which an electronic component is mounted using a conductive adhesive, a portion on the lead that is connected to the conductive pattern. A board for mounting an electronic component, characterized in that a flow prevention wall for preventing the conductive adhesive from flowing is provided near the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63229174A JP2775262B2 (en) | 1988-09-13 | 1988-09-13 | Electronic component mounting board and electronic component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63229174A JP2775262B2 (en) | 1988-09-13 | 1988-09-13 | Electronic component mounting board and electronic component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0278166A true JPH0278166A (en) | 1990-03-19 |
| JP2775262B2 JP2775262B2 (en) | 1998-07-16 |
Family
ID=16887950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63229174A Expired - Lifetime JP2775262B2 (en) | 1988-09-13 | 1988-09-13 | Electronic component mounting board and electronic component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2775262B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177273A (en) * | 1992-12-04 | 1994-06-24 | Nec Corp | Package for semiconductor device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998545A (en) * | 1982-11-26 | 1984-06-06 | Hitachi Ltd | Semiconductor device |
| JPS60133646U (en) * | 1984-02-15 | 1985-09-06 | オムロン株式会社 | terminal structure |
| JPS6162378U (en) * | 1984-09-29 | 1986-04-26 | ||
| JPS63213954A (en) * | 1987-03-02 | 1988-09-06 | Nec Corp | Resin sealed component |
-
1988
- 1988-09-13 JP JP63229174A patent/JP2775262B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998545A (en) * | 1982-11-26 | 1984-06-06 | Hitachi Ltd | Semiconductor device |
| JPS60133646U (en) * | 1984-02-15 | 1985-09-06 | オムロン株式会社 | terminal structure |
| JPS6162378U (en) * | 1984-09-29 | 1986-04-26 | ||
| JPS63213954A (en) * | 1987-03-02 | 1988-09-06 | Nec Corp | Resin sealed component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177273A (en) * | 1992-12-04 | 1994-06-24 | Nec Corp | Package for semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2775262B2 (en) | 1998-07-16 |
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