JPH0276078U - - Google Patents
Info
- Publication number
- JPH0276078U JPH0276078U JP15626288U JP15626288U JPH0276078U JP H0276078 U JPH0276078 U JP H0276078U JP 15626288 U JP15626288 U JP 15626288U JP 15626288 U JP15626288 U JP 15626288U JP H0276078 U JPH0276078 U JP H0276078U
- Authority
- JP
- Japan
- Prior art keywords
- board
- information card
- chip component
- card body
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図は本考案による情報カードを示す部分的
断面図、第２図は情報カードの全体構成を示す平
面図、第３図は情報カード読取システムの構成を
示す略線図、第４図はその情報カードの電気的構
成を示す略線的ブロツク図、第５図は従来の情報
カードの構成を示す部分的断面図である。
４……情報カード、４Ａ……配線基板、４Ｂ…
…ダイポールアンテナ、４Ｃ……情報信号発生回
路、４Ｅ……配線パターン、４Ｄ……電源電池、
３１……カード本体、３２……絶縁性プラスチツ
ク板、３５……基板、３４……配線パターン、３
６……落し込み用開口、３８……ボンデイングワ
イヤ、４１……ワイヤボンデイング作業用開口。
Fig. 1 is a partial sectional view showing the information card according to the present invention, Fig. 2 is a plan view showing the overall structure of the information card, Fig. 3 is a schematic diagram showing the structure of the information card reading system, and Fig. 4 is a partial cross-sectional view showing the information card according to the present invention. FIG. 5 is a schematic block diagram showing the electrical structure of the information card, and FIG. 5 is a partial sectional view showing the structure of the conventional information card. 4...Information card, 4A...Wiring board, 4B...
...dipole antenna, 4C...information signal generation circuit, 4E...wiring pattern, 4D...power battery,
31... Card body, 32... Insulating plastic board, 35... Board, 34... Wiring pattern, 3
6... Opening for dropping, 38... Bonding wire, 41... Opening for wire bonding work.
Claims (1)
用開口内にチツプ部品を設け、上記チツプ部品の
上面に形成された端子及び上記基板上に付着され
ている配線パターン間にボンデイング用ワイヤを
ボンデイングした状態で封止材によつて封止して
なるカード本体を具える ことを特徴とする情報カード。[Claims for Utility Model Registration] A chip component is provided in a drop-in opening made in a board constituting a wiring board, and a terminal formed on the top surface of the chip component and wiring attached to the board. An information card comprising a card body formed by bonding a bonding wire between patterns and sealing the card body with a sealing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15626288U JPH0276078U (en) | 1988-11-30 | 1988-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15626288U JPH0276078U (en) | 1988-11-30 | 1988-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0276078U true JPH0276078U (en) | 1990-06-11 |
Family
ID=31434647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15626288U Pending JPH0276078U (en) | 1988-11-30 | 1988-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0276078U (en) |
-
1988
- 1988-11-30 JP JP15626288U patent/JPH0276078U/ja active Pending