JPH0271412A - Manufacture of thin-film magnetic head - Google Patents
Manufacture of thin-film magnetic headInfo
- Publication number
- JPH0271412A JPH0271412A JP22237588A JP22237588A JPH0271412A JP H0271412 A JPH0271412 A JP H0271412A JP 22237588 A JP22237588 A JP 22237588A JP 22237588 A JP22237588 A JP 22237588A JP H0271412 A JPH0271412 A JP H0271412A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive resin
- pattern
- film
- thin
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000011347 resin Substances 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000001678 irradiating effect Effects 0.000 claims abstract description 8
- 239000010408 film Substances 0.000 claims description 60
- 239000000463 material Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 4
- 238000000992 sputter etching Methods 0.000 abstract description 13
- 239000000758 substrate Substances 0.000 abstract description 11
- 239000006185 dispersion Substances 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は薄膜磁気ヘッドの製造方法に係り、特に、高精
度に形成されたトラック幅をもつ薄膜磁気ヘッドの製造
方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a thin film magnetic head, and more particularly to a method of manufacturing a thin film magnetic head having a track width formed with high precision.
磁気ディスク装置の高記録密度化が進むにつれて、薄膜
磁気ヘットのトラック幅も微細化しつつある。第２図は
、薄膜磁気ヘッドの構造の一例を表わした側断面図であ
る。基板２１の上には下部磁性膜２２が形成されており
、後から構成される上部磁性膜２３と共に磁気回路を構
成している。As the recording density of magnetic disk devices continues to increase, the track width of thin film magnetic heads is also becoming finer. FIG. 2 is a side sectional view showing an example of the structure of a thin film magnetic head. A lower magnetic film 22 is formed on the substrate 21, and forms a magnetic circuit together with an upper magnetic film 23 that will be formed later.
先端部２４では、ギャップ材２５を磁性膜２２及び２３
の間に介在して磁気ギャップを形成し、このギャップを
用いて記録媒体に対する読み出し及び書き込みを行なう
。一方、磁気コアの中央部では、導体コイル２６が磁気
回路と交差するように設けてあり、この導体コイル２６
は、磁性膜２２、及び、２３と樹脂絶縁膜２７により絶
縁されている。At the tip 24, the gap material 25 is connected to the magnetic films 22 and 23.
A magnetic gap is formed between them, and this gap is used to read and write to the recording medium. On the other hand, in the center of the magnetic core, a conductor coil 26 is provided so as to intersect with the magnetic circuit.
are insulated from the magnetic films 22 and 23 by a resin insulating film 27.
この薄膜磁気ヘットの記録密度を決める１−ラック幅は
１通常、ヘット先端部２４における上部磁性膜２３の幅
によって決められる。このため、高精度なトラック幅寸
法を実現するには、約１０μｍの高さの樹脂絶縁膜２７
の段差下部で、±０．５μｍ以下の高精度で磁性膜２３
をパターニングする必要がある。このため、エツチング
量のコントロールが容易で、かつ、高い精度が期待でき
るドライエツチング法が用いられることが多く、特に、
加速したイオンを用いるイオンミリング法がよく用いら
れる。The 1-rack width, which determines the recording density of this thin film magnetic head, is usually determined by the width of the upper magnetic film 23 at the head tip 24. Therefore, in order to realize highly accurate track width dimensions, it is necessary to have a resin insulating film 27 with a height of about 10 μm.
At the bottom of the step, the magnetic film 23 is
need to be patterned. For this reason, dry etching methods are often used because they allow easy control of the etching amount and can be expected to have high accuracy.
Ion milling methods using accelerated ions are often used.
例えば、特開昭６０−３７１３０号公報には、感光性樹
脂をマスク材として、 −（オンミリング法を用いて段
差部の薄膜をパターニングする方法の例があげられてお
り、これを第３図に示す。まず、（ａ）に示すように、
基板３上の上部に段差３２を形成し、その上部にパター
ニングされるべき薄膜３３を形成する。次いで第３図（
ｂ）に示したように、感光性樹脂膜３４を塗布し、パタ
ーン形成した後、第３図（ｃ）に示すように、イオンミ
リング法を用いて薄膜３３をエツチングし、目的とする
パターン形状を得ている。For example, JP-A No. 60-37130 gives an example of a method of patterning a thin film at a stepped portion using a photosensitive resin as a mask material and using an on-milling method, which is shown in Figure 3. First, as shown in (a),
A step 32 is formed on the top of the substrate 3, and a thin film 33 to be patterned is formed on the step. Next, Figure 3 (
As shown in b), after coating the photosensitive resin film 34 and forming a pattern, the thin film 33 is etched using the ion milling method to form the desired pattern shape, as shown in FIG. I am getting .
また、特開昭６０−３７１３０号公報には、第３図に示
すプロセスよりも高精度なパターニングを実現する方法
もあげられており、これを第４図に示す。Furthermore, Japanese Patent Application Laid-Open No. 60-37130 also discloses a method for realizing patterning with higher precision than the process shown in FIG. 3, which is shown in FIG.
まず、（ａ）に示すように、第３図（、）と同様の構造
を形成した後、その上部にアルミナ膜４５を形成する。First, as shown in (a), a structure similar to that shown in FIG. 3 (,) is formed, and then an alumina film 45 is formed on the structure.
次いで、（ｂ）に示すように、感光性樹脂膜４４を形成
した後、（ｃ）に示すように、弗素系ガスを用いた反応
性イオンミリング法でアルミナ［４５をパターニングす
る。その後、（ｄ）に示すように、感光性樹脂膜４４を
除去した後、アルミナ膜４５をマスク材にしてイオンミ
リング法で薄膜４３をパターニングして、目的とする形
状を得ている。図中、４１は基板、４２は段差。Next, as shown in (b), a photosensitive resin film 44 is formed, and then, as shown in (c), alumina [45] is patterned by a reactive ion milling method using a fluorine-based gas. Thereafter, as shown in (d), after removing the photosensitive resin film 44, the thin film 43 is patterned by ion milling using the alumina film 45 as a mask material to obtain the desired shape. In the figure, 41 is a substrate, and 42 is a step.
上記従来技術のうち、第３図に示す方法では、マスク材
となる感光性樹脂膜の厚さが段差下部では約１０〜１５
μｍと厚くなってしまうため、イオンミリング時に、第
５図に示すような再付着層３５が発生してしまい、段差
下部における薄膜３３の寸法精度が悪くなり、かつ、目
的とするパターニング形状が得られないという問題があ
った。Among the above conventional techniques, in the method shown in FIG. 3, the thickness of the photosensitive resin film serving as the mask material is approximately 10 to 15
As the thickness becomes as thick as μm, a redeposition layer 35 as shown in FIG. 5 is generated during ion milling, which deteriorates the dimensional accuracy of the thin film 33 at the bottom of the step and makes it difficult to obtain the desired patterned shape. The problem was that I couldn't do it.
なお、第５図は、第３図（ｃ）で得られた段差下部の薄
膜パターンを正面から見た正断面図である。Note that FIG. 5 is a front sectional view of the thin film pattern at the bottom of the step obtained in FIG. 3(c) when viewed from the front.
また、第４図に示す方法では、マスク材となるアルミナ
膜の厚さが約２μｍと薄くできるためこのような再付着
層は発生しないものの、感光性樹脂膜の幅をアルミナ膜
に転写してから、さらに、これを目的とする薄膜に転写
してパターン形成するという二重の工程が必要であり、
従って、寸法精度が悪くなってしまうという問題があっ
た。すなわち、第４図に示した方法ではパターン精度は
±０．８μｍが限界であり、±０．５μｍ以下の高精度
なパターンを得ることは困難であった。In addition, in the method shown in Figure 4, the thickness of the alumina film serving as the mask material can be made as thin as approximately 2 μm, so such a redeposition layer does not occur, but the width of the photosensitive resin film is transferred to the alumina film. This requires a double process of transferring it to the desired thin film and forming a pattern.
Therefore, there was a problem in that the dimensional accuracy deteriorated. That is, in the method shown in FIG. 4, the pattern accuracy is limited to ±0.8 μm, and it is difficult to obtain a highly accurate pattern of ±0.5 μm or less.
本発明の目的は、高精度なトランク幅寸法をもつＷｌ膜
磁気ヘッドの製造方法を提供することにある。An object of the present invention is to provide a method for manufacturing a Wl film magnetic head having a highly accurate trunk width dimension.
上記目的は、絶縁膜段差のある基板」二に上部磁性膜を
堆積した後、感光性樹脂膜を塗布・形成して露出する工
程において、高い寸法精度を必要とする段差下部と、そ
れ以外の段差上部とを別の工程でパターン作製し、段差
下部の感光性樹脂膜厚を薄くして、イオンミリング時の
再付着発生を防ぐこと、及び、この二工程で形成した感
光性樹脂膜パターンの少なくとも一つに対して、紫外光
、もしくは、遠紫外光を照射して感光性樹脂を硬化させ
、パターン形成後の変形を防ぎ、高い寸法精度を保つこ
とにより達成される。The above purpose is to deposit the upper magnetic film on a substrate with insulating film steps, and then apply and form a photosensitive resin film to expose the lower part of the step, which requires high dimensional accuracy, and the other parts. The pattern for the upper part of the step is made in a separate process, and the photosensitive resin film thickness at the lower part of the step is made thinner to prevent redeposition during ion milling, and the photosensitive resin film pattern formed in these two steps is This is achieved by curing the photosensitive resin by irradiating at least one of them with ultraviolet light or deep ultraviolet light to prevent deformation after pattern formation and maintain high dimensional accuracy.
具体的な方法として、まず、絶縁膜段差のある基板上に
上部磁性膜を堆積した後、基板全体に薄い感光性樹脂膜
を塗布し、主として段差下部にのみ樹脂が残存するよう
にパターニングする工程と、基板全体に厚い感光性樹脂
膜を塗布し、主として段差」二部にのみ樹脂が残存する
ようにパターニングする工程と、これら二つの感光性樹
脂のうち少なくとも一つに対して紫外光、もしくは、遠
紫外光を照射して感光性樹脂を硬化させることにより、
イオンミリング時に再付着が発生せず、かつ、段差下部
でも寸法精度の良いパターンの形成が可能になる。The specific method is to first deposit an upper magnetic film on a substrate with insulating film steps, then apply a thin photosensitive resin film to the entire substrate, and pattern it so that the resin remains mainly at the bottom of the steps. There is a step of applying a thick photosensitive resin film to the entire substrate and patterning it so that the resin remains mainly only on the two parts of the step, and at least one of these two photosensitive resins is exposed to ultraviolet light or By curing the photosensitive resin by irradiating it with far ultraviolet light,
Redeposition does not occur during ion milling, and a pattern with good dimensional accuracy can be formed even at the bottom of a step.
これら二つの感光性樹脂パターンの形成順序は、段差下
部、段差上部のいずれを先に形成しても問題ないが、段
差部分の膜厚をできるだけ薄くするためには、まず、段
差部分のパターンを形成した後で段差上部のパターンを
形成するのが望ましい。Regarding the order of formation of these two photosensitive resin patterns, it does not matter whether the bottom part of the step or the top part of the step is formed first, but in order to make the film thickness at the step part as thin as possible, it is necessary to first form the pattern at the step part. It is desirable to form a pattern on the upper part of the step after the formation.
また、二つの感光性樹脂パターンを形成するには、感光
性樹脂を重ね塗りする必要があるが、この時、最初に形
成したパターンが感光性樹脂溶媒に溶解して変形してし
まうことを防ぎ、さらに、イオンミリング時のエツチン
グ速度を遅くしたり、感光性樹脂パターン形状の経時変
化を防ぐために、感光性樹脂パターンに遠紫外光等のエ
ネルギー線を照射して樹脂を硬化させる手法が有効であ
る。この遠紫外光の照射は、樹脂の硬化を効率良く進め
るために、５０〜１２０℃に加熱しながら実施するのが
望ましく、また、 １Ｔｏｒｒ以下の真空中で照射す
るのが有効である。In addition, in order to form two photosensitive resin patterns, it is necessary to overcoat the photosensitive resin, but at this time, it is possible to prevent the first formed pattern from being dissolved in the photosensitive resin solvent and deformed. Furthermore, in order to slow down the etching speed during ion milling and prevent changes in the shape of the photosensitive resin pattern over time, it is effective to irradiate the photosensitive resin pattern with energy rays such as deep ultraviolet light to harden the resin. be. In order to efficiently cure the resin, this irradiation with far ultraviolet light is desirably carried out while being heated to 50 to 120°C, and it is effective to irradiate in a vacuum of 1 Torr or less.
一方、イオンミリング時の再付着を防ぐために、感光性
樹脂パターンに１００〜１５０℃の熱処理を施して、パ
ターン側面のテーパ角度を小さくしても良い。On the other hand, in order to prevent redeposition during ion milling, the photosensitive resin pattern may be subjected to heat treatment at 100 to 150° C. to reduce the taper angle of the side surface of the pattern.
この手段を適用することにより、段差下部でも薄い感光
性樹脂膜をマスク材として、上部磁性膜をイオンミリン
グすることが可能となるため、再付着層の発生が無くな
る。By applying this means, the upper magnetic film can be ion-milled using the thin photosensitive resin film as a mask material even at the lower part of the step, thereby eliminating the generation of a re-deposition layer.
また、薄い感光性樹脂膜パターンの幅をそのまま上部磁
性膜に転写できるため、絶縁膜段差下部でも高い寸法精
度が実現でき、トラック幅の作成精度が向上する。Furthermore, since the width of the thin photosensitive resin film pattern can be directly transferred to the upper magnetic film, high dimensional accuracy can be achieved even under the step of the insulating film, and the accuracy of creating the track width is improved.
一方、段差上部でも、イオンミリング時のマスク材とし
て充分な厚さを持つ感光性樹脂パターンが得られるため
、膜減りやパターン欠けの無い高精度な磁性膜パターン
が得られる。On the other hand, since a photosensitive resin pattern with sufficient thickness as a mask material during ion milling can be obtained even above the step, a highly accurate magnetic film pattern without film loss or pattern chipping can be obtained.
また、感光性樹脂膜パターンに対して遠紫外線等のエネ
ルギー線を照射することによって、パターン形状が安定
化し、樹脂を重ね塗りしたり、イオンミリングを施した
りしても高い寸法精度が保たれる。In addition, by irradiating the photosensitive resin film pattern with energy rays such as far ultraviolet rays, the pattern shape is stabilized, and high dimensional accuracy is maintained even when overcoating resin or performing ion milling. .
以下、本発明の一実施例を第１図を用いて説明する。第
１図は１本発明を適用した薄膜磁気ヘッドの製造方法を
表わす側断面図である。An embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a side sectional view showing a method of manufacturing a thin film magnetic head to which the present invention is applied.
まず、第１図（ａ）に示すように、セラミック基板１上
上に、下部磁性膜１２．ギャップ膜１３゜絶縁膜１４、
及び、導体コイル１５を形成した後、上部磁性膜１６を
スパッタリングした。次いで。First, as shown in FIG. 1(a), a lower magnetic film 12. gap film 13° insulating film 14,
After forming the conductor coil 15, the upper magnetic film 16 was sputtered. Next.
第１図（ｂ）に示すように、ポジ型ホトレジスト１７を
薄く塗布し、主として段差下部にのみホトレジストが残
存するように、パターン形成した。As shown in FIG. 1(b), a positive type photoresist 17 was applied thinly, and a pattern was formed so that the photoresist remained mainly at the lower part of the step.
この時、段差下部のホトレジスト厚さは３μｍとなった
。このホトレジストパターン１７に対して、Ｑ 、 ２
Ｔｏｒｒの真空中でセラミック基板１１を９０℃に加
熱しながら、照度２５ｍｗ／ａＪの遠紫外光を３分間照
射し、樹脂を硬化させた。次いで、第１図（ｃ）に示す
ように、ポジ型ホトレジスト１８を厚く塗布した。この
時、ホトレジストパターン１７は遠紫外光処理によって
硬化しているため、重ね塗りしたホトレジスト１８の溶
媒に溶けず、パターン形状の変化は認められなかった。At this time, the thickness of the photoresist at the bottom of the step was 3 μm. For this photoresist pattern 17, Q, 2
While heating the ceramic substrate 11 to 90° C. in a vacuum of Torr, it was irradiated with deep ultraviolet light with an illuminance of 25 mw/aJ for 3 minutes to harden the resin. Next, as shown in FIG. 1(c), a positive photoresist 18 was applied thickly. At this time, since the photoresist pattern 17 had been cured by deep ultraviolet light treatment, it did not dissolve in the solvent of the overcoated photoresist 18, and no change in pattern shape was observed.
次いで、第１図（ｄ）に示すように、主として段差上部
にのみホトレジスト１８が残存するようにパターン形成
した。次いで、第１図（ｅ）に示すようにホトレジスト
１７及び１８をマスク材として、イオンミリング法によ
り上部磁性膜１６をパターニングして、目的とする形状
を得た。この時、マスク材として用いたホトレジスト１
７、及び、１８の厚さが薄いため、再付着は発生しなか
った。Next, as shown in FIG. 1(d), a pattern was formed so that the photoresist 18 remained mainly only on the top of the step. Next, as shown in FIG. 1(e), the upper magnetic film 16 was patterned by ion milling using the photoresists 17 and 18 as mask materials to obtain a desired shape. At this time, photoresist 1 used as a mask material
Since the thicknesses of samples 7 and 18 were thin, re-deposition did not occur.
第６図に、本発明の方法を用いて、！−ラック幅１０μ
ｍの薄膜磁気ヘッドを作製した時の、トラック幅寸法の
ばらつき（ｂ）を従来法（ａ）と比較して示す。本実施
例によれば従来は困難であったトラック幅寸法のばらつ
きの±０．５μｍ以内の精度が実現できることがわかっ
た。In FIG. 6, using the method of the present invention,! -Rack width 10μ
The variation (b) in the track width dimension when a thin film magnetic head of m is fabricated is shown in comparison with the conventional method (a). It has been found that according to this example, it is possible to achieve accuracy within ±0.5 μm of variation in track width dimension, which has been difficult in the past.
また、あらかじめ形成した感光性樹脂パターンに遠紫外
光を照射して硬化させることにより、さらに、その上部
に感光性樹脂を重ね塗りしてもパターンの変形が無く、
高い寸法精度が保たれる。In addition, by irradiating the pre-formed photosensitive resin pattern with deep ultraviolet light and curing it, the pattern does not deform even if the photosensitive resin is coated on top of it.
High dimensional accuracy is maintained.
本発明によれば、トラック幅寸法のばらつきが小さく、
かつ、再付着の無いパターンが形成できる。According to the present invention, variations in track width dimensions are small;
Moreover, a pattern without redeposition can be formed.
第１図（ａ）〜（ｅ）は、本発明の一実施例としての製
造方法を示す側断面図、第２図は、薄膜磁気ヘッドの構
造を示す側断面図、第３図（ａ）〜（ｃ）及び第４図（
ａ）〜（ｄ）は、従来の製造方法を示す側断面図、第５
図は、第３図（ｃ）で得られた薄膜パターンの正断面図
、第６図（ａ）、（ｂ）は、トラック幅寸法のばらつき
を示したグラフである。
１１・・・セラミック鋸板、１２・・・下部磁性膜、１
３・・ギャップ膜、１４・・絶縁膜、１５・・・導体コ
イル、１６・・・上部磁性膜、１７．１８・・・ホトレ
ジスト。1(a) to (e) are side sectional views showing a manufacturing method as an embodiment of the present invention, FIG. 2 is a side sectional view showing the structure of a thin film magnetic head, and FIG. 3(a) ~ (c) and Figure 4 (
a) to (d) are side sectional views showing the conventional manufacturing method;
The figure is a front cross-sectional view of the thin film pattern obtained in FIG. 3(c), and FIGS. 6(a) and (b) are graphs showing variations in track width dimensions. 11... Ceramic saw plate, 12... Lower magnetic film, 1
3... Gap film, 14... Insulating film, 15... Conductor coil, 16... Upper magnetic film, 17.18... Photoresist.
Claims (1)
、 前記段差の下部に第一の感光性樹脂膜パターンを形成す
る工程と、前記段差の上部に第二の感光性樹脂膜パター
ンを形成する工程と、前記第一及び前記第二の感光性樹
脂膜パターンのうち、少なくとも一つに対して紫外光、
もしくは、遠紫外光を照射して硬化させる工程と、前記
第一及び第二の感光性樹脂膜パターンをマスク材として
磁性膜をエッチングする工程とを含むことを特徴とする
薄膜磁気ヘッドの製造方法。 ２、段差部分に磁性膜パターンを形成する方法において
、第一の感光性樹脂膜パターンを形成する工程と第一の
感光性樹脂膜パターンに対して紫外光、もしくは、遠紫
外光を照射して硬化させる工程と、第二の感光性樹脂膜
パターンを形成する工程と、前記第一及び第二の感光性
樹脂膜パターンをマスク材として磁性膜をエッチングす
る工程とを含むことを特徴とする薄膜磁気ヘッドの製造
方法。 ３、前記感光性樹脂膜パターンに対して紫外光もしくは
遠紫外光を照射して硬化させる工程を、１Ｔｏｒｒ以下
の真空中で施すことを特徴とする特許請求の範囲第１項
または第２項記載の薄膜磁気ヘッドの製造方法。[Claims] 1. A method for forming a magnetic film pattern on a stepped portion, comprising: forming a first photosensitive resin film pattern below the step; and forming a second photosensitive resin film pattern above the step. forming a film pattern; and applying ultraviolet light to at least one of the first and second photosensitive resin film patterns.
Alternatively, a method for manufacturing a thin-film magnetic head comprising the steps of curing the magnetic film by irradiating it with deep ultraviolet light, and etching the magnetic film using the first and second photosensitive resin film patterns as mask materials. . 2. In the method of forming a magnetic film pattern on a stepped portion, the step of forming a first photosensitive resin film pattern and the step of irradiating the first photosensitive resin film pattern with ultraviolet light or deep ultraviolet light. A thin film comprising the steps of curing, forming a second photosensitive resin film pattern, and etching a magnetic film using the first and second photosensitive resin film patterns as mask materials. A method of manufacturing a magnetic head. 3. The step of curing the photosensitive resin film pattern by irradiating it with ultraviolet light or deep ultraviolet light is performed in a vacuum of 1 Torr or less, as set forth in claim 1 or 2. A method for manufacturing a thin film magnetic head.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22237588A JPH0810483B2 (en) | 1988-09-07 | 1988-09-07 | Method of manufacturing thin film magnetic head |
| US07/280,828 US4971896A (en) | 1987-12-08 | 1988-12-07 | Method for forming thin film pattern and method for fabricating thin film magnetic head using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22237588A JPH0810483B2 (en) | 1988-09-07 | 1988-09-07 | Method of manufacturing thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0271412A true JPH0271412A (en) | 1990-03-12 |
| JPH0810483B2 JPH0810483B2 (en) | 1996-01-31 |
Family
ID=16781370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22237588A Expired - Lifetime JPH0810483B2 (en) | 1987-12-08 | 1988-09-07 | Method of manufacturing thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810483B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0621583A2 (en) * | 1993-04-19 | 1994-10-26 | Read-Rite Corporation | Process of making thin film magnetic head |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103485231B (en) * | 2013-10-10 | 2015-04-22 | 刘同烟 | Special papermaking device for producing mulberry paper according to traditional technology |
-
1988
- 1988-09-07 JP JP22237588A patent/JPH0810483B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0621583A2 (en) * | 1993-04-19 | 1994-10-26 | Read-Rite Corporation | Process of making thin film magnetic head |
| EP0621583A3 (en) * | 1993-04-19 | 1995-11-15 | Read Rite Corp | Process of making thin film magnetic head. |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0810483B2 (en) | 1996-01-31 |
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