JPH0270451U - - Google Patents

Info

Publication number
JPH0270451U
JPH0270451U JP15061488U JP15061488U JPH0270451U JP H0270451 U JPH0270451 U JP H0270451U JP 15061488 U JP15061488 U JP 15061488U JP 15061488 U JP15061488 U JP 15061488U JP H0270451 U JPH0270451 U JP H0270451U
Authority
JP
Japan
Prior art keywords
fixing plates
heat conductive
conductive fixing
semiconductor elements
lead terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15061488U
Other languages
English (en)
Other versions
JPH0638429Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988150614U priority Critical patent/JPH0638429Y2/ja
Publication of JPH0270451U publication Critical patent/JPH0270451U/ja
Application granted granted Critical
Publication of JPH0638429Y2 publication Critical patent/JPH0638429Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案の原理構造図、第２図は本考案
の一実施例を示す斜視図、第３図は側面図、第４
図は第１図の―線矢視断面図、第５図は押さ
え板４ａの要部断面図、第６図はトランジスタの
構造図、第７図は要部平面図、第８図は本考案の
他の実施例の要部断面図、第９図は本考案の回路
パターン図、第１０図は従来例の回路パターン図
、第１１図は本考案のトランジスタ配置図、第１
２図は従来例のトランジスタ配置図、第１３図は
半導体トランジスタの取付け方法の説明図、第１
４図は従来例の断面図、第１５図は他の従来例の
断面図である。 第１図乃至第８図において、１は放熱器、１１
は基部、２はプリント基板、１ｂ，１ｃは伝熱性
固定板、３ａ，３ｂは半導体素子（パワートラン
ジスタ）、９は配線パターン部である。

Claims (1)

  1. 【実用新案登録請求の範囲】 放熱フイン１ａを有する放熱器１の基部１１か
    ら互いに離間して同一方向に延設された伝熱性固
    定板１ｂ，１ｃを設け、 その伝熱性固定板１ｂ，１ｃの同一側板面に同
    一配列のリード端子を有する半導体素子３ａ，３
    ｂを装着し、各伝熱性固定板１ｂ，１ｃへの装着
    位置を同一とする半導体素子３ａ，３ｂの各対応
    リード端子をプリント基板２上の対応回路パター
    ン部９へ接続したことを特徴とする半導体素子取
    付け構造。
JP1988150614U 1988-11-18 1988-11-18 半導体素子取付け構造 Expired - Lifetime JPH0638429Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988150614U JPH0638429Y2 (ja) 1988-11-18 1988-11-18 半導体素子取付け構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988150614U JPH0638429Y2 (ja) 1988-11-18 1988-11-18 半導体素子取付け構造

Publications (2)

Publication Number Publication Date
JPH0270451U true JPH0270451U (ja) 1990-05-29
JPH0638429Y2 JPH0638429Y2 (ja) 1994-10-05

Family

ID=31423918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988150614U Expired - Lifetime JPH0638429Y2 (ja) 1988-11-18 1988-11-18 半導体素子取付け構造

Country Status (1)

Country Link
JP (1) JPH0638429Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57950U (ja) * 1980-05-30 1982-01-06
JPS61171258U (ja) * 1985-04-10 1986-10-24

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57950B2 (ja) * 1973-12-12 1982-01-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57950U (ja) * 1980-05-30 1982-01-06
JPS61171258U (ja) * 1985-04-10 1986-10-24

Also Published As

Publication number Publication date
JPH0638429Y2 (ja) 1994-10-05

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