JPH0267522A - Electronic device - Google Patents
Electronic deviceInfo
- Publication number
- JPH0267522A JPH0267522A JP21859988A JP21859988A JPH0267522A JP H0267522 A JPH0267522 A JP H0267522A JP 21859988 A JP21859988 A JP 21859988A JP 21859988 A JP21859988 A JP 21859988A JP H0267522 A JPH0267522 A JP H0267522A
- Authority
- JP
- Japan
- Prior art keywords
- film
- conductive film
- electroless
- drive circuit
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000004020 conductor Substances 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 229920000642 polymer Polymers 0.000 claims abstract description 17
- 238000007639 printing Methods 0.000 claims description 16
- 239000011521 glass Substances 0.000 abstract description 26
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 21
- 238000005530 etching Methods 0.000 abstract description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 98
- 239000010931 gold Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000011195 cermet Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 206010063836 Atrioventricular septal defect Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001211 electron capture detection Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009528 severe injury Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はディスプレイ表示部と駆動回路部とをガラス基
板上へ一体化した電子装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic device in which a display section and a drive circuit section are integrated on a glass substrate.
第７図はディスプレイ表示部として例えば液晶表示素子
とその駆動回路基板との接続構造を示す要部断面図であ
る。同図において、情報をパターン表示する液晶表示素
子１は、内面に透光性セグメント電極２″ｆｔ：有しか
つこのセグメント電極２の一端を端部に延長させて電極
端子３を形成した透光性上ガラス基板４と、このセグメ
ント電極２に対向して内面に透光性コモン電極５を形成
した透光性下ガラス基板６とが周縁部にクール材７を介
して対向配置され、両ガラス基板４，６間には液晶配向
膜８を介して液晶９が封入されて構成されている。一方
、この液晶表示素子１に対向してその背面には、駆動回
路基板１０として例えば半導体素子１１および電子部品
１２ｔ−搭載したガラスエポキシ材からなる駆動回路実
装基板１３が対向配置されており、半導体素子１１およ
び電子部品１２は駆動回路実装基板１３の表裏面に銅箔
膜により形成された配線パターン［４ａ 、 １４ｂに
半田１５により接続され、この表面側の配線パターン１
４＆の一端は駆動回路実装基板１３の端部に延長されて
その表面に金箔膜により電極端子１６が形成されている
。そして、液晶表示素子１の電極端子３と駆動回路基板
１０の電極端子１６との間には導電性ゴム１７が介在さ
れて電気的に接続されている。FIG. 7 is a sectional view of a main part showing a connection structure between, for example, a liquid crystal display element and its driving circuit board as a display section. In the figure, a liquid crystal display element 1 for displaying information in a pattern has a translucent segment electrode 2"ft on its inner surface, and an electrode terminal 3 is formed by extending one end of the segment electrode 2 to the end. An upper glass substrate 4 and a lower translucent glass substrate 6 on which a translucent common electrode 5 is formed on the inner surface facing the segment electrodes 2 are arranged facing each other with a cooling material 7 interposed in the periphery. A liquid crystal 9 is sealed between the substrates 4 and 6 via a liquid crystal alignment film 8. On the other hand, on the back side facing the liquid crystal display element 1, for example, a semiconductor element 11 is provided as a drive circuit board 10. and electronic component 12t - mounted drive circuit mounting board 13 made of glass epoxy material are arranged facing each other, and semiconductor element 11 and electronic component 12 have wiring patterns formed with copper foil film on the front and back surfaces of drive circuit mounting board 13 [Connected to 4a and 14b by solder 15, and the wiring pattern 1 on the front side
One end of the drive circuit mounting board 13 is extended to the end of the drive circuit mounting board 13, and an electrode terminal 16 is formed on the surface thereof using a gold foil film. A conductive rubber 17 is interposed between the electrode terminal 3 of the liquid crystal display element 1 and the electrode terminal 16 of the drive circuit board 10 to electrically connect them.
しかしながら、このような構成によると、液晶表示素子
１と駆動回路基板１０との電気的接続に導電性ゴム１７
を用いているので、両者の電極端子３，１６が微細なピ
ッチで配列形成されているため、その位置合わせが極め
て困難であるとともに振動および衝撃等の付与により電
気的接続性を劣化させ、信頼性を低下させるという問題
があった。また、駆動回路基板１０の駆動回路実装基板
１３としてガラスエポキシ材などからなるプリント配線
基板を用いているので、半導体素子１１および電子部品
１２を実装するに当っては基板の熱膨張係数（１２Ｘ１
０ ／’Ｃ）および吸水性（０，０６〜０．１５％）
が大きいことから、信頼性の高いディスプレイ表示装置
の実現が困難であった。さらにディスプレイ表示装置と
して液晶表示素子１と駆動回路基板１０とを積層配置す
る二層構造となるので、薄型化および小型化には限界が
あった。However, according to such a configuration, the conductive rubber 17 is used for electrical connection between the liquid crystal display element 1 and the drive circuit board 10.
Since the electrode terminals 3 and 16 on both sides are arranged at a fine pitch, it is extremely difficult to align them, and the electrical connectivity deteriorates due to vibrations and shocks, resulting in poor reliability. There was a problem of lowering sex. Furthermore, since a printed wiring board made of glass epoxy material or the like is used as the drive circuit mounting board 13 of the drive circuit board 10, the coefficient of thermal expansion of the board (12X1
0/'C) and water absorption (0.06-0.15%)
It has been difficult to realize a highly reliable display device because of the large amount of . Furthermore, since the display device has a two-layer structure in which the liquid crystal display element 1 and the drive circuit board 10 are stacked, there is a limit to reduction in thickness and size.
なお、液晶表示素子１と駆動回路基板１０とをガラス基
板上へ一体化して液晶ディスプレイ表示装置を構成する
場合、表面に透光性導電膜を形成してなるガラス基板に
グレーズ系貴金属ペーストを使用して導体パターンをス
クリーン印刷し、５５０℃〜６５０℃で焼成して駆動回
路部を形成した後、このガラス基板上に液晶表示素子１
を作製するとともにこの駆動回路部上に電子部品１２を
実装して形成されるが、この場合、グレーズ系貴金属ペ
ーストの焼成温度が約６００℃と極めて高く、焼成によ
り透光性導電膜の抵抗値の増大等の劣化およびガラス基
板の反りなどの問題があった。また、駆動回路部を透光
性導電膜および無電解メツキ膜のみで形成した場合、低
電流領域での使用に限られ、また、大型電子部品を実装
した場合、機械的強度等で接続上の問題があった。Note that when a liquid crystal display device is constructed by integrating the liquid crystal display element 1 and the drive circuit board 10 on a glass substrate, a glaze-based noble metal paste is used on the glass substrate formed with a transparent conductive film on the surface. After screen printing a conductor pattern and baking at 550°C to 650°C to form a drive circuit section, a liquid crystal display element 1 is placed on this glass substrate.
At the same time, the electronic component 12 is mounted on this drive circuit section. In this case, the firing temperature of the glaze-based noble metal paste is extremely high at approximately 600°C, and the resistance value of the transparent conductive film is reduced by firing. There were problems such as deterioration such as an increase in the amount of water and warpage of the glass substrate. In addition, if the drive circuit section is formed only with a transparent conductive film and an electroless plating film, its use will be limited to low current ranges, and if large electronic components are mounted, mechanical strength etc. may cause connection problems. There was a problem.
したがって本発明は、前述した従来の問題に鑑みてなさ
れ友ものであり、その目的は、ディスプレイ表示部とそ
の駆動回路部とを一体化し、電気的接続性および組み合
せ構造を改善し、信頼性を向上させるとともに薄型化、
小型化を実現可能とした電子装＋１を提供することにあ
る。Therefore, the present invention has been made in view of the above-mentioned conventional problems, and its purpose is to integrate a display section and its driving circuit section, improve electrical connectivity and combination structure, and improve reliability. Improved and thinner
The purpose is to provide electronic equipment +1 that can be made smaller.
本発明による電子装置は、ディスプレイ用透光性基板上
に透光性導電膜により表示部および駆動回路部の少なく
とも一部を一体形成し、この駆動回路部の透光性導電膜
上に少なくとも一部を接触させてポリマ形銅ペーストを
印刷し硬化してなる導体パターンを設けたものである。In the electronic device according to the present invention, at least part of the display part and the drive circuit part are integrally formed with a light-transparent conductive film on a light-transparent substrate for display, and at least part of the display part and the drive circuit part are formed on the light-transparent conductive film of the drive circuit part. A conductor pattern is provided by printing and curing polymer-type copper paste with the parts in contact with each other.
本発明による他の電子装置は、駆動回路部の透光性導電
膜上に無電解Ｎｉ膜を少なくとも一部に形成し、この透
光性導電膜に少なくとも一部を接触させてポリマ形銅ペ
ーストラ印刷し硬化してなる導体パターンを設けたもの
である。In another electronic device according to the present invention, an electroless Ni film is formed on at least a portion of the transparent conductive film of the drive circuit section, and at least a portion of the electroless Ni film is brought into contact with the transparent conductive film to form a polymer copper paste. It is provided with a conductor pattern that is printed and cured.
本発明によるさらに他の電子装置は、駆動回路部の透光
性導電膜上に無電解Ｎｉ膜を少なくとも一部に形成し、
この無電解Ｎｉ膜に少なくとも一部を接触させてポリマ
形銅ベース）ｆ印刷し硬化してなる導体パターンを設け
たものでおる。Still another electronic device according to the present invention includes forming an electroless Ni film on at least a portion of the transparent conductive film of the drive circuit section,
A conductive pattern is provided by printing and curing at least a portion of this electroless Ni film on a polymeric copper base.
本発明による他の電子装置は、駆動回路部の透光性導電
膜上に無電解Ｎｉ膜？少なくとも一部に形成し、この無
′Ｉ！を解Ｎｉ膜上の少なくとも一部に無電解Ａｕ膜を
形成し、この透光性導電膜に少なくとも一部を接触させ
てポリマ形銅ペーストを印刷し硬化してなる導体パター
ンを設けたものである。Another electronic device according to the present invention includes an electroless Ni film on a transparent conductive film in a drive circuit section. Formed at least in part, this no 'I! An electroless Au film is formed on at least a portion of the Ni film, and a conductor pattern is provided by printing and curing a polymeric copper paste on at least a portion of the transparent conductive film. be.
本発明による他の電子装置は、駆動回路部の透光性導電
膜上に無電解Ｎｉ膜を少なくとも一部に形成し、この無
電解Ｎｉ 膜上の少なくとも一部に無電解Ａｕ膜を形成
し、この無電解Ｎｉ［に少なくとも一部を接触させてポ
リマ形箋ペーストヲ印刷し硬化してなる導体パターンを
設けたものである。Another electronic device according to the present invention includes forming an electroless Ni film on at least a portion of the transparent conductive film of the drive circuit portion, and forming an electroless Au film on at least a portion of the electroless Ni film. A conductive pattern is provided by printing and curing a polymer stamp paste on at least a portion of the electroless Ni.
本発明による他の電子装置は、′１Ｉｌｈ勅回路部の透
光性導電膜上に無電解Ｎｉ膜を少なくとも一部に形成し
、この無？ｌ！解Ｎｉ膜上の少なくとも一部に無電解Ａ
ｕ膜を形成し、この無電解Ａｕ膜に少なくとも一部を接
触させてポリマ形銅ペーストラ印刷し硬化してなる導体
パターン全役けたものである。In another electronic device according to the present invention, an electroless Ni film is formed on at least a part of the transparent conductive film of the '1Ilh circuit section, l! Electroless A on at least a portion of the Ni film
A conductive pattern is formed by forming a U film, and printing and hardening a polymer type copper paste on at least a portion of the electroless Au film in contact with the conductive pattern.
本発明においては、ディスプレイ用透光性基板上に透光
性導ｔＩＸにより、表示部および駆動回路部の少なくと
も一部を形成し、駆動回路部の透光性導電膜の上部にポ
リマ形銅ペーストを印刷し硬化してなる導体パターンが
形成されて厚膜回路部が構成されるので、表示部と駆動
回路部の薄膜導体部と厚膜導体部とが同一基板上で一体
形成できる。In the present invention, at least a part of the display part and the drive circuit part are formed on a light-transparent substrate for a display using a light-transparent conductive TIX, and a polymer-shaped copper paste is applied to the upper part of the light-transparent conductive film of the drive circuit part. Since the thick film circuit section is formed by printing and curing the conductor pattern, the thin film conductor section and the thick film conductor section of the display section and the drive circuit section can be integrally formed on the same substrate.
以下、図面を用いて本発明の詳細な説明する。 Hereinafter, the present invention will be explained in detail using the drawings.
第１図は本発明による電子装置の一実施例を説明するた
めのディスプレイ表示装置の要部断面図であり、前述の
図と同一部分には同一符号を付しである。同図において
、液晶表示素子１を形成する例えば透光性下ガラス基板
６の表面を清浄化し次後、透光性導ｔｇとして例えばＩ
ＴＯもしくはＩｎ２Ｏ３、５ｎＯ１などをスパッタリン
グ法もしくは蒸着法により厚さが２５０Ｘ〜３００Ｘの
透光性導電膜を形成し友後、必要な形状のパターンにエ
ツチングして透光性セグメント電極２お工び透明導電膜
回路２０が形成されている。なお、この場合、対向する
透光性上ガラス基板４にはコモン電極５が形成されてい
る。ここで下ガラス基板６からのアルカリ溶出による悪
影響が懸念される場合は、ＳｔＯ，などのアルカリ防止
膜を下地処理膜として予め形成しておいても曳い。また
、この下ガラス基板６上のセグメント電極２を除く透明
導電膜回路２０上にはポリマ形銅ペーストラ印刷し硬化
させて厚さ約３０μｍ程度の導体パターン２１が積層さ
れて厚膜回路部２２が形成されている。なお、この導体
パターン２１は、下ガラス基板６０表面に形成され念透
明導電膜回路２０上にポリマ形銅ペースト（Ｐ−４００
０、Ｓ−５０００：三片金属鉱業製）をスクリーン印刷
法により印刷して回路形成を行なって約１６０℃で３０
分間加熱硬化させて形成する。また、この厚膜回路部２
２は、第２図（ａ） 、 （ｂ）に示すように透明導電
膜回路２０の一端に導体パターン２１の一端を接触させ
組み合わせて形成しても良い。FIG. 1 is a sectional view of a main part of a display device for explaining an embodiment of an electronic device according to the present invention, and the same parts as in the previous figures are given the same reference numerals. In the figure, for example, the surface of a transparent lower glass substrate 6 forming the liquid crystal display element 1 is cleaned, and then, for example, I
A transparent conductive film with a thickness of 250X to 300X is formed using TO, In2O3, 5nO1, etc. by sputtering or vapor deposition, and then etched into a pattern of the required shape to form transparent segment electrodes 2. A conductive film circuit 20 is formed. In this case, a common electrode 5 is formed on the opposing light-transmitting upper glass substrate 4. If there is a concern about the adverse effects of alkali elution from the lower glass substrate 6, an alkali prevention film such as StO may be formed in advance as a base treatment film. Further, on the transparent conductive film circuit 20 excluding the segment electrodes 2 on the lower glass substrate 6, a conductor pattern 21 having a thickness of about 30 μm is laminated by printing and curing a polymer copper paste to form a thick film circuit portion 22. It is formed. The conductor pattern 21 is formed on the surface of the lower glass substrate 60 and is coated with polymer copper paste (P-400) on the transparent conductive film circuit 20.
0, S-5000: Mikata Metal Mining Co., Ltd.) was printed using the screen printing method to form a circuit, and the circuit was formed at approximately 160°C for 30 minutes.
Formed by heating and curing for a minute. In addition, this thick film circuit section 2
2 may be formed by bringing one end of the conductor pattern 21 into contact with one end of the transparent conductive film circuit 20 as shown in FIGS. 2(a) and 2(b).
このようにして形成された厚膜回路部２２には、半導体
索子１１および電子部品１２などを半田１５により表面
実装することによって液晶表示素子１の下ガラス基板６
上にその駆動回路部が一体化されて液晶ディスプレイ表
示装置が構成される。The semiconductor cables 11, electronic components 12, etc. are surface mounted on the thick film circuit portion 22 formed in this manner using solder 15, and thereby the lower glass substrate 6 of the liquid crystal display element 1 is mounted.
A liquid crystal display device is constructed by integrating the driving circuit portion thereon.
このような構成によれば、液晶表示素子１を構成する下
ガラス基板６を使用して導体パターン２１が形成できる
ので、透光性セグメント電極２および透明導電膜回路２
０と厚膜回路部２２との接続の信頼性が向上できるとと
もに小形化、薄形化が可能となり、コストダウンも可能
となる。また、透光性導電膜により形成されるセグメン
ト電極２および透明導電膜回路２０は低電流領域での作
用に限られ、また半導体素子１１および電子部品１２な
どの半田付けが不可能であるが、駆動回路部を厚膜構成
とする厚膜回路部２２を形成し念ことにより機械的強度
が大きくなり、重量の大きい半導体素子１１および電子
部品１２などの実装が可能となるとともに大電流を必要
とする回路部が一体形成できる。また、厚膜導体として
は、大きく別けてサーメット形とポリマ形との２種類が
あるが、サーメット形は、６００〜１０００℃の高温度
焼成を必要とし、ガラス基板および透光性導電膜への損
傷が大きい。このため、低温度（約１６０℃）硬化でマ
イグレーションなどの少ないポリマ形銅ペーストからな
る導体パターン２１を用いた厚膜構成とすることにより
、下ガラス基板６．セグメント電極２および透明導電膜
回路２０などの損傷が皆無となるとともにＡｇ、Ａｇ−
Ｐｄなどの貴金属ペーストを使用しないので、コストも
安く、高密度実装が可能な一体化電子装置が作製できる
。また、透明導電膜回路２０上にポリマ形銅ペーストを
積層して導体パターン２１を形成することにより、外気
雰囲気による透明導電膜回路２０への悪影響も防止し、
化学的安定性の向上が図れる。According to such a configuration, the conductor pattern 21 can be formed using the lower glass substrate 6 constituting the liquid crystal display element 1, so that the transparent segment electrode 2 and the transparent conductive film circuit 2 can be formed.
It is possible to improve the reliability of the connection between 0 and the thick film circuit section 22, and also to make it smaller and thinner, which also makes it possible to reduce costs. Furthermore, the segment electrodes 2 and the transparent conductive film circuit 20 formed of a transparent conductive film are limited to their operation in a low current region, and cannot be soldered to the semiconductor element 11 and electronic components 12. By forming the thick film circuit part 22 in which the drive circuit part has a thick film structure, the mechanical strength is increased, and it is possible to mount heavy semiconductor elements 11 and electronic components 12, etc., and also to avoid the need for large currents. The circuit section can be integrally formed. In addition, there are two main types of thick film conductors: cermet type and polymer type, but cermet type requires high temperature firing of 600 to 1000°C and is difficult to coat glass substrates and transparent conductive films. Severe damage. For this reason, the lower glass substrate 6. There is no damage to the segment electrodes 2, the transparent conductive film circuit 20, etc., and Ag, Ag-
Since no noble metal paste such as Pd is used, an integrated electronic device can be manufactured at low cost and capable of high-density mounting. In addition, by laminating polymer copper paste on the transparent conductive film circuit 20 to form the conductor pattern 21, it is possible to prevent the outside atmosphere from adversely affecting the transparent conductive film circuit 20.
Chemical stability can be improved.
第３図は本発明による電子装置の他の実施例を説明する
ためのディスプレイ表示装置の要部断面図であり、前述
の図と同一部分には同一符号を付しである。同図におい
て、第１図と異なる点は、透光性下ガラス基板６上に形
成された透明導電膜回路２０上に無電Ｗ４Ｎ ｉ メツ
キ（トップＩＴＯプロセス：奥野製薬工業製）により約
５０００ Ｘ〜６０００Ｘの厚さで少なくとも一部にＮ
ｉ膜２３が形成され、このＮｉ膜２３上の少なくとも一
部にポリマ形銅ペース）１−印刷し熱硬化させて導体パ
ターン２１が形成されて厚膜回路部２４が構成されてい
る。また、透明導電膜回路２０とＮｉ膜２３および導体
パターン２１との構成は、第４図（＆） ｅ （ｂ）
１（ｅ） 、 （ｄ）に示す組合せで形成しても良い。FIG. 3 is a cross-sectional view of a main part of a display device for explaining another embodiment of the electronic device according to the present invention, and the same parts as in the previous figures are given the same reference numerals. In this figure, the difference from FIG. 1 is that the transparent conductive film circuit 20 formed on the transparent lower glass substrate 6 is coated with about 5000X~ by electroless W4N i plating (Top ITO process: manufactured by Okuno Pharmaceutical Co., Ltd.). N at least in part with a thickness of 6000X
An i film 23 is formed, and a conductor pattern 21 is formed by printing a polymer copper paste (1) on at least a portion of this Ni film 23 and thermally curing it to form a thick film circuit portion 24. Furthermore, the configuration of the transparent conductive film circuit 20, the Ni film 23, and the conductor pattern 21 is shown in FIG.
The combinations shown in 1(e) and 1(d) may be used.
このような構成によれば、下ガラス基板６上の液晶表示
素子１を除く透明導電膜回路２０上に無電解メツキによ
るＮｉ膜２３を形成したことにより、透光性導電膜のエ
ツチングによる微細かつファインラインで形成でき、し
かもその表面が無電解Ｎｉ膜２３の薄膜構成となるので
、微細な回路構成が得られるとともに半田のぬれ性、ボ
ンディング性も良好となり、さらに半導体素子１１のペ
アチップの実装（バンプ、ワイヤボンディング。According to such a configuration, by forming the Ni film 23 by electroless plating on the transparent conductive film circuit 20 excluding the liquid crystal display element 1 on the lower glass substrate 6, fine and fine patterns can be formed by etching the transparent conductive film. Since it can be formed in a fine line, and the surface thereof has a thin film structure of the electroless Ni film 23, a fine circuit structure can be obtained, and the solder wettability and bonding properties are also good. Bump, wire bonding.
ＴＡＢ法）などに適し良導電膜回路ができ、その導体抵
抗も低減できる。さらに外気雰囲気による透明導電膜回
路２０への悪影響も防止でき、化学的安定性の向上が因
れる。ま九、このような構成としたことにより、前述し
た実施例よりも良い効果が得られることは勿論である。A highly conductive film circuit suitable for TAB method etc. can be produced, and its conductor resistance can be reduced. Furthermore, it is possible to prevent the adverse effects of the outside atmosphere on the transparent conductive film circuit 20, and this results in improved chemical stability. Of course, by adopting such a configuration, better effects than those of the above-mentioned embodiments can be obtained.
第５図は本発明による電子装置のさらに他の実施例を説
明するためのディスプレイ表示装置の要部断面図であり
、前述の図゛と同一部分には同一符号を付しである。同
図において、第３図と異なる点は、下ガラス基板６上に
形成された透明導電膜回路２０．Ｎｉ膜２３の少なくと
も一部に無電解Ａｕメツキ（プレジャスＣＧ３５：中央
化学産業！！りにより厚さ約ｓｏｏ １程度のＡｕ膜２
５が形成され、とのＡｕ膜２５上の少なくとも一部にポ
リマ形銅ペーストを印刷し熱硬化させて導体パターン２
１が形成されて厚膜回路部２６が構成されている。FIG. 5 is a sectional view of a main part of a display device for explaining still another embodiment of the electronic device according to the present invention, and the same parts as in the previous figure are given the same reference numerals. This figure differs from FIG. 3 in that a transparent conductive film circuit 20 is formed on a lower glass substrate 6. At least a part of the Ni film 23 is coated with electroless Au plating (Pleasure CG35: Chuo Kagaku Sangyo!! Au film 2 with a thickness of about soo 1).
A conductor pattern 2 is formed by printing a polymer copper paste on at least a part of the Au film 25 and curing it with heat.
1 is formed to constitute the thick film circuit section 26.
また、この厚膜回路部２６は、第６図（、）〜（ｊ）に
示すような透明導電膜回路２０．Ｎｉ膜２３．Ａｕ膜２
５および導体パターン２１の組合せで形成しても良い。Further, this thick film circuit portion 26 is a transparent conductive film circuit 20 as shown in FIGS. 6(a) to (j). Ni film 23. Au film 2
5 and conductor pattern 21 in combination.
このような構成によれば、下ガラス基板６上の液晶表示
素子１ｔ−除く透明導電膜回路２０上に無電解メツキに
よるＮｉ膜２３およびＡｕ膜２５ｔ−形成したことによ
り、透光性導電膜のエツチングにより微細かつファイン
ラインが形成できるとともに表面がＡｕ膜２５の金薄膜
構成となるので、Ｎｉ膜と比較して不動態皮膜を形成し
にくいため、半田のぬれ性がさらに改善され、ボンディ
ング性も極めて良好となり、半導体素子１１のベアチッ
プの実装（バンプ、ワイヤボンド、ＴＡＢ法）などに最
も適した電極回路が形成できる。また、半田付けに際し
ては活性度の低いフラックス使用できる之め、洗浄工程
を省略することができる。ま之、外気雰囲気による透明
導電膜回路２０およびＮｉ膜２３の悪影響も防止でき、
さらに高い化学的安定性が得られる。このような構成と
したことにより、前述した実施例よりもさらに良い効果
が得られることは勿論である。According to this configuration, by forming the Ni film 23 and the Au film 25t by electroless plating on the transparent conductive film circuit 20 excluding the liquid crystal display element 1t on the lower glass substrate 6, the transparent conductive film is Etching allows the formation of fine and fine lines, and since the surface is composed of a thin gold film (Au film 25), it is difficult to form a passive film compared to a Ni film, which further improves solder wettability and bonding properties. The results are extremely good, and an electrode circuit most suitable for bare chip mounting (bump, wire bond, TAB method) of the semiconductor element 11 can be formed. Furthermore, since a flux with low activity can be used during soldering, a cleaning step can be omitted. Moreover, it is possible to prevent the harmful effects of the outside atmosphere on the transparent conductive film circuit 20 and the Ni film 23.
Even higher chemical stability is obtained. Of course, by adopting such a configuration, even better effects than the above-mentioned embodiment can be obtained.
なお、前述した実施例においては、液晶表示素子を搭載
した電子装置について説明したが、ＥＬ。In the above-mentioned embodiments, an electronic device equipped with a liquid crystal display element was described, but an EL.
ＥＣＤ、ＰＤＰ、ＶＦＤなどを搭載した回路基板にも同
様に適用できることは勿論である。Of course, the present invention can also be applied to circuit boards equipped with ECDs, PDPs, VFDs, etc.
以上説明したように本発明によれば、ディスプレイ用透
光性基板上に透光性導電膜により表示部および駆動回路
部の少なくとも一部を一体形成し、この駆動回路部の透
光性導電膜上に少なくとも一部を接触させてポリマ形銅
ペーストを印刷し硬化してなる導体パターンを設は之こ
とにより、表示素子と回路基板とが一体化され、薄形化
、小形化が可能となるとともに透光性電極の接続の信頼
性が高く、低価格で高密度実装を可能とした電子装置が
得られる。また、機械的強度が必要な大聖電子部品の実
装が可能となるとともに大電流を流すことができるよう
になる。さらに透光性導電膜上にＮｉ膜ＩＡｕｇｌポリ
マ形銅ペーストを形成したことにより、化学的安定性の
向上が得られるなどの極めて優れた効果が得られる。As explained above, according to the present invention, at least a part of the display section and the drive circuit section are integrally formed using a light-transmitting conductive film on a light-transmitting substrate for display, and the light-transmitting conductive film of the drive circuit section is formed integrally with the display section and the drive circuit section. By printing and curing a conductive pattern with polymeric copper paste in contact with at least a portion of the display element, the display element and the circuit board are integrated, making it possible to make the display element thinner and smaller. At the same time, it is possible to obtain an electronic device in which the connection of the light-transmitting electrodes is highly reliable, and high-density packaging is possible at low cost. Furthermore, it becomes possible to mount Daisei Electronics components that require mechanical strength, and it also becomes possible to flow a large current. Furthermore, by forming the Ni film IAugl polymer type copper paste on the transparent conductive film, extremely excellent effects such as improved chemical stability can be obtained.
第１図は本発明による電子装置の一実施例を示す断面図
、第２図（ａ） ｌ （ｂ）は透明導電膜回路と導体パ
ターンとの接続構造を示す要部平面図、その断面図、第
３図は本発明の他の実施例企示ｆＩ！子装置の断面図、
第４図（、）〜（ｄ）Ｆｉｉｌｃ３図の薄膜導体部と厚
膜導体部との接続構造を示す断面図、第５図は本発明の
さらに他の実施例を示−ｊ電子装置の断面図、第６図（
ａ）〜（ｊ）は第５図の薄膜導体部と厚膜導体部との接
続構造を示す断面図、第７図は従来の液晶ディスプレイ
表示装置を示す断面図である。
１・拳・・液晶表示素子、２・・・・セグメント電極、
４＃＃−・上ガラス基板、５・・・・コモン電極、６・
・・・下ガラス基板、１１・・・・半導体素子、１２拳
・・・電子部品、２０−・Φ・透明導電膜回路、２１・
・・・導体パターン、２２・・・・厚膜回路部、２３・
番・・Ｎｉ膜、２４・・・・厚膜回路部、２５Φ・・・
Ａｕ膜、２６・−・・厚膜回路部。
第１図FIG. 1 is a sectional view showing an embodiment of an electronic device according to the present invention, and FIGS. 2(a) and 2(b) are plan views of main parts showing a connection structure between a transparent conductive film circuit and a conductor pattern, and sectional views thereof. , FIG. 3 shows another embodiment of the invention fI! A cross-sectional view of the child device,
Figures 4 (,) to (d) are sectional views showing the connection structure between the thin film conductor part and the thick film conductor part in Figure 3, and Figure 5 shows still another embodiment of the present invention -j Cross section of an electronic device Figure, Figure 6 (
a) to (j) are cross-sectional views showing the connection structure between the thin film conductor part and the thick film conductor part in FIG. 5, and FIG. 7 is a cross-sectional view showing a conventional liquid crystal display device. 1. Fist: Liquid crystal display element, 2: Segment electrode,
4##-・Top glass substrate, 5・・Common electrode, 6・
...Lower glass substrate, 11..Semiconductor element, 12.Electronic component, 20-.Φ.Transparent conductive film circuit, 21.
...Conductor pattern, 22...Thick film circuit section, 23.
Number...Ni film, 24...Thick film circuit section, 25Φ...
Au film, 26... Thick film circuit section. Figure 1
Claims (6)
り表示部および駆動回路部の少なくとも一部を一体形成
し、この駆動回路部の透光性導電膜上に少なくとも一部
を接触させてポリマ形銅ペーストを印刷し硬化してなる
導体パターンを設け、表示部と駆動回路部とを同一基板
上に一体化したことを特徴とする電子装置。(1) At least a part of a display part and a drive circuit part are integrally formed with a light-transparent conductive film on a light-transparent substrate for a display, and at least part of the drive circuit part is brought into contact with the light-transparent conductive film of the drive circuit part. 1. An electronic device characterized in that a conductive pattern formed by printing and curing polymer copper paste is provided, and a display section and a drive circuit section are integrated on the same substrate.
透光性導電膜上に無電解Ｎｉ膜を少なくとも一部に形成
し、この透光性導電膜に少なくとも一部を接触させてポ
リマ形銅ペーストを印刷し硬化してなる導体パターンを
設け、表示部と駆動回路部とを同一基板上に一体化した
ことを特徴とする電子装置。(2) In the electronic device according to claim 1, an electroless Ni film is formed on at least a part of the light-transmitting conductive film of the drive circuit section, and at least a part of the film is brought into contact with the light-transmitting conductive film to form a polymer. 1. An electronic device comprising a conductor pattern formed by printing and hardening shaped copper paste, and integrating a display section and a drive circuit section on the same substrate.
透光性導電膜上に無電解Ｎｉ膜を少なくとも一部に形成
し、この無電解Ｎｉ膜に少なくとも一部を接触させてポ
リマ形銅ペーストを印刷し硬化してなる導体パターンを
設け、表示部と駆動回路部とを同一基板上に一体化した
ことを特徴とする電子装置。(3) In the electronic device according to claim 1, an electroless Ni film is formed on at least a part of the light-transmitting conductive film of the drive circuit section, and at least a part of the electroless Ni film is brought into contact with the polymer. An electronic device characterized in that a conductor pattern formed by printing and hardening copper paste is provided, and a display section and a drive circuit section are integrated on the same substrate.
透光性導電膜上に無電解Ｎｉ膜を少なくとも一部に形成
し、この無電解Ｎｉ膜上の少なくとも一部に無電解Ａｕ
膜を形成し、この透光性導電膜に少なくとも一部を接触
させてポリマ形銅ペーストを印刷し硬化してなる導体パ
ターンを設け、表示部と駆動回路部とを同一基板上に一
体化したことを特徴とする電子装置。(4) In the electronic device according to claim 1, an electroless Ni film is formed on at least a part of the light-transmitting conductive film of the drive circuit section, and an electroless Au film is formed on at least a part of the electroless Ni film.
A conductor pattern is formed by printing and curing a polymer-shaped copper paste with at least a portion of the translucent conductive film in contact with the transparent conductive film, and the display section and the drive circuit section are integrated on the same substrate. An electronic device characterized by:
透光性導電膜上に無電解Ｎｉ膜を少なくとも一部に形成
し、この無電解Ｎｉ膜上の少なくとも一部に無電解Ａｕ
膜を形成し、この無電解Ｎｉ膜に少なくとも一部を接触
させてポリマ形銅ペーストを印刷し硬化してなる導体パ
ターンを設け、表示部と駆動回路部とを同一基板上に一
体化したことを特徴とする電子装置。(5) In the electronic device according to claim 1, an electroless Ni film is formed on at least a part of the light-transmitting conductive film of the drive circuit section, and an electroless Au film is formed on at least a part of the electroless Ni film.
A display section and a drive circuit section are integrated on the same substrate by forming a film, and providing a conductive pattern by printing and curing a polymer copper paste with at least a portion of the electroless Ni film in contact with the electroless Ni film. An electronic device featuring:
透光性導電膜上に無電解Ｎｉ膜を少なくとも一部に形成
し、この無電解Ｎｉ膜上の少なくとも一部に無電解Ａｕ
膜を形成し、この無電解Ａｕ膜に少なくとも一部を接触
させてポリマ形銅ペーストを印刷し硬化してなる導体パ
ターンを設け、表示部と駆動回路部とを同一基板上に一
体化したことを特徴とする電子装置。(6) In the electronic device according to claim 1, an electroless Ni film is formed on at least a part of the light-transmitting conductive film of the drive circuit section, and an electroless Au film is formed on at least a part of the electroless Ni film.
A conductor pattern is formed by forming a film, and printing and hardening a polymer copper paste on at least a portion of the electroless Au film in contact with the electroless Au film, thereby integrating the display part and the drive circuit part on the same substrate. An electronic device featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21859988A JPH0267522A (en) | 1988-09-02 | 1988-09-02 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21859988A JPH0267522A (en) | 1988-09-02 | 1988-09-02 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267522A true JPH0267522A (en) | 1990-03-07 |
Family
ID=16722484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21859988A Pending JPH0267522A (en) | 1988-09-02 | 1988-09-02 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267522A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0461908A2 (en) * | 1990-06-14 | 1991-12-18 | Fujitsu Limited | Process for preparing a transparent electrode and transparent electrode prepared by it |
| JPH04186229A (en) * | 1990-11-20 | 1992-07-03 | Matsushita Electric Ind Co Ltd | Transparent electrode with auxiliary electrode and its manufacture |
| WO2005098801A1 (en) * | 2004-03-31 | 2005-10-20 | Fuji Photo Film Co., Ltd. | Display |
| US8307549B2 (en) * | 2001-11-20 | 2012-11-13 | Touchsensor Technologies, Llc | Method of making an electrical circuit |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60232531A (en) * | 1984-05-02 | 1985-11-19 | Alps Electric Co Ltd | Manufacture of liquid crystal display element |
| JPS60238817A (en) * | 1984-05-12 | 1985-11-27 | Citizen Watch Co Ltd | Liquid crystal display device |
-
1988
- 1988-09-02 JP JP21859988A patent/JPH0267522A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60232531A (en) * | 1984-05-02 | 1985-11-19 | Alps Electric Co Ltd | Manufacture of liquid crystal display element |
| JPS60238817A (en) * | 1984-05-12 | 1985-11-27 | Citizen Watch Co Ltd | Liquid crystal display device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0461908A2 (en) * | 1990-06-14 | 1991-12-18 | Fujitsu Limited | Process for preparing a transparent electrode and transparent electrode prepared by it |
| JPH04186229A (en) * | 1990-11-20 | 1992-07-03 | Matsushita Electric Ind Co Ltd | Transparent electrode with auxiliary electrode and its manufacture |
| US8307549B2 (en) * | 2001-11-20 | 2012-11-13 | Touchsensor Technologies, Llc | Method of making an electrical circuit |
| WO2005098801A1 (en) * | 2004-03-31 | 2005-10-20 | Fuji Photo Film Co., Ltd. | Display |
| WO2005101352A1 (en) * | 2004-03-31 | 2005-10-27 | Fuji Photo Film Co., Ltd. | Display |
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