JPH0267332A - Manufacture of laminate - Google Patents
Manufacture of laminateInfo
- Publication number
- JPH0267332A JPH0267332A JP21723188A JP21723188A JPH0267332A JP H0267332 A JPH0267332 A JP H0267332A JP 21723188 A JP21723188 A JP 21723188A JP 21723188 A JP21723188 A JP 21723188A JP H0267332 A JPH0267332 A JP H0267332A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- aramid fiber
- laminate
- dried
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 29
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 22
- 229920006231 aramid fiber Polymers 0.000 claims abstract description 20
- 229920003986 novolac Polymers 0.000 claims abstract description 15
- 238000001035 drying Methods 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 4
- 229930003836 cresol Natural products 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 5
- 239000002966 varnish Substances 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 238000000465 moulding Methods 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000004760 aramid Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229920003235 aromatic polyamide Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- 235000010469 Glycine max Nutrition 0.000 description 1
- 244000068988 Glycine max Species 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は抵抗ＩＣ等のチップ部品の面実装用プリント配
線板として適した積層板の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a laminate suitable as a printed wiring board for surface mounting of chip components such as resistor ICs.
従来の技術
近年、電子機器の小形軽量化、高密度化の点より、これ
に組込んで使用される電子部品はリード付部品からチッ
プ部品へ２．速に移行している。そして、その実装方式
もプリプレグ配線板への面実装が主流になりつつある。2. Conventional Technology In recent years, due to the miniaturization, weight reduction, and higher density of electronic devices, the electronic components used in these devices have changed from leaded components to chip components. It is moving quickly. As for the mounting method, surface mounting on prepreg wiring boards is becoming mainstream.
この背景の中で、プリント配線板の材料である銅張積層
板上
に対して下記の如き厳しい特性が要求されてφだ。Against this background, the following strict characteristics are required for copper-clad laminates, which are the material for printed wiring boards.
これを、−船釣なチップ部品搭載時の問題と共に第１図
の参考図をもって説明する。チップ部品１の熱膨張係数
とプリント配線板の基板４、例えばエポキシ樹脂−ガラ
ス不織布基材積層板の熱膨張係数とが大きく異なると、
チップ部品１と銅回路２を接続している半田接合部３に
冷熱サイクル等の負荷により亀裂を生じ、実用上使用出
来ない状態に至る。市販のＩＣやトランジスタ等のチッ
プ部品の熱膨張係数は、２〜７×１０−”／”Ｃであり
、一方、該チップの搭載される基板の線膨張係数は、従
来の銅張積層板、例えば前記のエポキシ樹脂−ガラス不
織布基材積層板の場合、１７〜２０Ｘ１０−’／’Ｃと
大きく、半田接合部の信頼性を確保することは困難であ
る。ガラス不織布基材に代えて、アラミド繊維不織布基
材を用いた積層板が提案され、このものは、線膨張係数
が前記チップ部品の線膨張係数と近似している。This will be explained with reference to FIG. 1 as well as problems when mounting chip components on a boat. If the coefficient of thermal expansion of the chip component 1 and the coefficient of thermal expansion of the substrate 4 of the printed wiring board, for example, an epoxy resin-glass nonwoven fabric base material laminate, are significantly different,
The solder joint 3 connecting the chip component 1 and the copper circuit 2 cracks due to loads such as cooling/heating cycles, resulting in a state where it cannot be used practically. The coefficient of thermal expansion of commercially available chip components such as ICs and transistors is 2 to 7 × 10-''/''C, while the coefficient of linear expansion of the substrate on which the chip is mounted is that of conventional copper-clad laminates, For example, in the case of the above-mentioned epoxy resin-glass nonwoven fabric base material laminate, it is as large as 17 to 20 x 10-'/'C, making it difficult to ensure the reliability of the solder joints. A laminate using an aramid fiber nonwoven fabric base material in place of the glass nonwoven fabric base material has been proposed, and the linear expansion coefficient of this laminate is close to that of the chip component.
発明が解決しようとする課題
しかし、３００°Ｃでの半田耐熱性等、高温での耐熱性
能は、従来の銅張積層板と同レベルにあるものの、耐熱
性に対する要求が近年ますます厳しくなってきており、
高耐熱用途として考えた場合、十分満足出来るものでは
なかった。Problems to be Solved by the Invention However, although the heat resistance performance at high temperatures, such as soldering heat resistance at 300°C, is on the same level as conventional copper-clad laminates, the requirements for heat resistance have become increasingly strict in recent years. and
When considered as a high heat resistant application, it was not fully satisfactory.
本発明は、前記の如き従来の欠点を改善し、チップ部品
の面実装信頼性に優れ、かつ耐熱性に優れた、チップ部
品実装用として適した積層板を提供することを目的とす
る。SUMMARY OF THE INVENTION An object of the present invention is to improve the conventional drawbacks as described above, and to provide a laminate suitable for mounting chip components, which has excellent reliability in surface mounting of chip components, and excellent heat resistance.
課題を解決するための手段
上記目的を達成するために、本発明は、アラミド繊維不
繊布基材にエポキシ樹脂を含浸乾燥したプリプレグを積
層成形するに際して、次の（イ）、（＋１）の点を特徴
とする。Means for Solving the Problems In order to achieve the above objects, the present invention solves the following points (a) and (+1) when laminating and molding a prepreg obtained by impregnating and drying an epoxy resin on an aramid fiber nonwoven fabric base material. It is characterized by
（イ）エポキシ樹脂を含浸させるに際して、アラミド繊
維不織布基材の含有水分を１型理％以下にしておくこと
。(a) When impregnating with the epoxy resin, the moisture content of the aramid fiber nonwoven fabric base material should be 1% or less.
（（１）エポキシ樹脂の硬化剤として、フェノールノボ
ラックまたはタレゾールノボラック樹脂を配合すること
。((1) Blending phenol novolac or talesol novolac resin as a curing agent for epoxy resin.
作用
アラミド繊維不織布を基材とした積層板の熱膨脹係数は
、前記チップ部品のそれと近似しているため、冷熱サイ
クルにおける半田接合部の信頼性を大きく向上させるこ
とができる。そして、エポキシ樹脂の硬化剤として、フ
ェノールノボラックまたはタレゾールノボラック樹脂を
使用する事により、エポキシ樹脂とアラミド繊維との親
和性あるいは結合性が高められ、熱時におけるエポキシ
樹脂の寸法変化およびエポキシ樹脂とアラミド繊維の剥
離が抑制され、ヒートショック時の積層板の破壊が起こ
りにくくなる。しかし、これは、予めアラミド繊維不織
布に乾燥処理を施して含有水分を少なくした状態でエポ
キシ樹脂の含浸をすることによって初めてエポキシ樹脂
とアラミド繊維の十分な親和性あるいは結合性が確保出
来、可能となるものである。Function: Since the thermal expansion coefficient of the laminate based on the aramid fiber nonwoven fabric is similar to that of the chip component, the reliability of the solder joints during cooling and heating cycles can be greatly improved. By using phenol novolac or Talezol novolak resin as a curing agent for epoxy resin, the affinity or bonding between the epoxy resin and aramid fibers is increased, and the dimensional change of the epoxy resin when heated is reduced. Peeling of the aramid fibers is suppressed, making it difficult for the laminate to break during heat shock. However, this is only possible by drying the aramid fiber nonwoven fabric in advance to reduce the moisture content and then impregnating it with epoxy resin to ensure sufficient affinity or bonding between the epoxy resin and the aramid fibers. It is what it is.
実施例
本発明を実施するに当り、エポキシ樹脂は市販のビスフ
ェノール型エポキシ樹脂を使用できる。EXAMPLE In carrying out the present invention, a commercially available bisphenol type epoxy resin can be used as the epoxy resin.
硬化剤としてのフェノールノボラック樹脂、クレゾール
ノボラック樹脂も市販のものが使用出来、その配合量は
ベースとなるエポキシ樹脂のエポキシ当量に対応する形
で用いる。アラミド繊維不織布は、メタ型アラミド繊維
、あるいはパラ型アラミド繊維をベースとする不織布で
あり、厚さと密度は樹脂の含浸性、塗工作業性により適
宜選択出来る。その乾燥処理方法は、真空乾燥あるいは
加熱乾燥等が適用出来る。乾燥処理をしたアラミド繊維
不織布基材の含有水分が１％を越えている場合は、アラ
ミド繊維とエポキシ樹脂との界面に存在する水分子によ
って、アラミド繊維とエポキシ樹脂の結合性が阻害され
、目的の効果が出ない。Commercially available phenol novolac resins and cresol novolak resins can be used as curing agents, and the amount of the resin to be blended is determined in accordance with the epoxy equivalent of the base epoxy resin. The aramid fiber nonwoven fabric is a nonwoven fabric based on meta-aramid fibers or para-aramid fibers, and the thickness and density can be appropriately selected depending on resin impregnability and coating workability. As the drying method, vacuum drying, heat drying, etc. can be applied. If the moisture content of the dried aramid fiber nonwoven base material exceeds 1%, the water molecules present at the interface between the aramid fiber and epoxy resin will inhibit the bonding between the aramid fiber and the epoxy resin, and the desired purpose will not be achieved. There is no effect.
プリプレグの製造は、まずエポキシ樹脂にフェノールノ
ボラックもしくはクレゾールノボラック樹脂と硬化促進
剤を所定看配合したエポキシ樹脂ワニスを用意する。そ
して、予め乾燥処理を施したアラミド繊維不織布に前記
ワニス含浸し、乾燥することにより行なう。得られたプ
リプレグは、積層板の板厚に必要なプライ数を積層成形
する。To manufacture a prepreg, first, an epoxy resin varnish is prepared by mixing an epoxy resin with a phenol novolac or cresol novolac resin and a curing accelerator in a predetermined manner. Then, an aramid fiber nonwoven fabric that has been previously dried is impregnated with the varnish and dried. The obtained prepreg is laminated and molded in the number of plies necessary for the thickness of the laminate.
実施例１ エポキシ樹脂ワニスを下記の配合比で調整した。Example 1 An epoxy resin varnish was prepared with the following blending ratio.
ビスフェノール型エポキシ樹脂（商品名ＥＳＡ００１、
住友化学！！！り１００重量部フェノールノボラック樹
脂 （商品名バーカム、大日本インキ製）２０重量部
ジシアンジアミド １重量部ユ
ベンジルジメチルアミン ０．４”ｌｌｆｆｉ部メ
チルセロソルブ ４０重置部上記エポキシ
樹脂ワニスを、加熱乾燥処理を施して含有水分を１重量
％としたパラ型アラミド繊維不織布（坪４ｉｔ６０ ｇ
／ ｒｒｆ ）に含浸、乾燥して、樹脂量６０重量％
のプリプレグを得た。Bisphenol type epoxy resin (product name ESA001,
Sumitomo Chemical! ! ! 100 parts by weight of phenol novolak resin (trade name: Barkum, manufactured by Dainippon Ink) 20 parts by weight of dicyandiamide 1 part by weight Jubenzyldimethylamine 0.4"llffi part Methyl cellosolve 40 parts of epoxy resin was heated and dried. Para-type aramid fiber non-woven fabric with moisture content of 1% by weight (4 tsubo 60 g
/rrf) and dried to a resin content of 60% by weight.
prepreg was obtained.
上記のプリプレグを１０プライ重ね、その両面に３５μ
厚銅箔を載置して鏡面板で挟み、プレスにて湿度１６０
°Ｃ１圧力６０ｋｇ１０＋１の条件で１時間加熱加圧し
て１０胴厚の銅張積層板を製造した。Layer 10 plies of the above prepreg, and 35 μm on both sides.
Place a thick copper foil, sandwich it between mirror plates, and press it to a humidity of 160.
A copper clad laminate having a body thickness of 10 mm was manufactured by heating and pressing at 10 °C, 60 kg of pressure, and 10+1 for 1 hour.
該銅張積層板の特性を第１表に示した。The properties of the copper-clad laminate are shown in Table 1.
実施例２ エポキシ樹脂フェスを下記の配合比で調整した。Example 2 An epoxy resin face was prepared with the following blending ratio.
ビスフェノール型エポキシ樹脂（商品名ＥＳＡ００１、
住人化学製）１００重量部
クレゾールノボラック樹脂 （商品名プライオーフェン
、大日本インキ製）１５重量部ジシアンジアミド
１重量部ヘンシルジメチルアミン ０．２
重量部節して含有水分を１重量％としたメタ型アラミド
繊維不織布（坪量７０ｇ／ｒｒｆ）に含浸、乾燥して、
樹脂量６０重量％のプリプレグを得た。Bisphenol type epoxy resin (product name ESA001,
100 parts by weight of cresol novolac resin (trade name: Pryophen, manufactured by Dainippon Ink) 15 parts by weight of dicyandiamide
1 part by weight Hensyldimethylamine 0.2
Impregnated into a meta-aramid fiber nonwoven fabric (basis weight 70 g/rrf) with a water content of 1% by weight, dried,
A prepreg with a resin content of 60% by weight was obtained.
上記のプリプレグを５プライ重ね、その両面に３５μ厚
銅箔を載置して鏡面板で挟み、実施例１と同様の成形条
件でプレスし、１．０叩厚の銅張積層板を製造した。Five plies of the above prepreg were stacked, 35 μ thick copper foil was placed on both sides, sandwiched between mirror plates, and pressed under the same molding conditions as in Example 1 to produce a copper clad laminate with a thickness of 1.0. .
該銅張積層板の特性を第１表に示した。The properties of the copper-clad laminate are shown in Table 1.
実施例３
実施例１においてパラ型アラミド繊維不繊布をさらに加
熱乾燥処理して、含有水分を０．７重層板を製造した。Example 3 The para-aramid fiber nonwoven fabric in Example 1 was further heat-dried to produce a multilayer board with a water content of 0.7.
該銅張積層板の特性を第１表に示した。The properties of the copper-clad laminate are shown in Table 1.
比較例１
実施例１において、パラ型アラミド繊維不織布の加熱乾
燥処理を行なわず、そのままエポキシ樹脂フェスを含浸
、乾燥して調製したプリプレグを用いて１．０ｍｍ厚の
銅張積層板を製造した。Comparative Example 1 A 1.0 mm thick copper clad laminate was manufactured using prepreg prepared in Example 1 by directly impregnating an epoxy resin face and drying the para-aramid fiber nonwoven fabric without performing the heat drying process.
加熱乾燥処理を行わない場合のパラ型アミド繊維不織布
の含有水分は１．７重量％であった。The moisture content of the para-type amide fiber nonwoven fabric without heat drying treatment was 1.7% by weight.
該銅張積層板の特性を第１表に示した。The properties of the copper-clad laminate are shown in Table 1.
比較例２
実施例１において、パラ型アラミド繊維不織布に加熱乾
燥処理を施すに際して、実施例１よりも処理時間を短く
して含有水分を１．２重量％に調整した以外は実施例１
と同じにして１．０ｍｍ厚の銅張積層板を製造した。Comparative Example 2 Example 1 except that when heat drying the para-aramid fiber nonwoven fabric in Example 1, the treatment time was shorter than in Example 1 and the water content was adjusted to 1.2% by weight.
A 1.0 mm thick copper clad laminate was manufactured in the same manner as above.
該銅張積層板の特性を第１表に示した。The properties of the copper-clad laminate are shown in Table 1.
比較例３
実施例２において、エポキシ樹脂フェスにタレゾールノ
ボラック樹脂を配合せずに、ジシアンジアミド硬化剤を
４重量部配合したものを用いてプリプレグを調製し、１
．Ｏｎｎ厚の銅張積層板を製造した。Comparative Example 3 In Example 2, a prepreg was prepared using an epoxy resin face in which 4 parts by weight of dicyandiamide curing agent was blended without blending Talesol novolac resin, and 1
．． A copper-clad laminate of Onn thickness was manufactured.
該銅張積層板の特性を第１表に示した。The properties of the copper-clad laminate are shown in Table 1.
比較例４
予め加熱乾燥処理を施して含有水分を１重量％にしたガ
ラス不織布（坪量１３５ｇ／ｍ）に実施例１で用いたエ
ポキシ樹脂フェスを含浸、乾燥し、樹脂量６０重量％の
プリプレグを調製した。Comparative Example 4 The epoxy resin face used in Example 1 was impregnated into a glass nonwoven fabric (basis weight 135 g/m) that had been heat-dried in advance to have a moisture content of 1% by weight, and then dried to produce a prepreg with a resin content of 60% by weight. was prepared.
該プリプレグを５ブライ重ね、実施例１と同様の成形条
件でプレスし、１ 、０ ｍｍ厚の銅張積層板を製造し
た。Five sheets of the prepreg were stacked and pressed under the same molding conditions as in Example 1 to produce a copper-clad laminate having a thickness of 1.0 mm.
該銅張積層板の特性を第１表に示した。The properties of the copper-clad laminate are shown in Table 1.
双糧狛
表面の粗さが小さく、高密度実装回路用出しても適用外
大である。The roughness of the surface of the soybean paste is so small that it is not applicable even if it is used in high-density packaging circuits.
第１図はプリント配線板にチップ部品を実装した状態を
示す説明図である。
ｌはチップ部品、２は銅回路、３は半田接合部、４は基
板FIG. 1 is an explanatory diagram showing a state in which chip components are mounted on a printed wiring board. l is a chip component, 2 is a copper circuit, 3 is a solder joint, 4 is a board
Claims (1)
得たプリプレグを積層成形する積層板の製造において、
次の（イ）、（ロ）の点と特徴とする積層板の製造法。 （イ）エポキシ樹脂を含浸させるに際して、アラミド繊
維不織布基材の含有水分を１重量％以下にしておくこと
。 （ロ）エポキシ樹脂の硬化剤として、フェノールノボラ
ックまたはクレゾールノボラック樹脂を配合すること。[Claims] In the production of a laminate in which a prepreg obtained by impregnating and drying an aramid fiber nonwoven fabric base material with an epoxy resin is laminated and molded,
A method for manufacturing a laminate having the following points and features (a) and (b). (a) When impregnating with epoxy resin, the moisture content of the aramid fiber nonwoven fabric base material should be 1% by weight or less. (b) Phenol novolak or cresol novolac resin is blended as a curing agent for epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21723188A JPH0267332A (en) | 1988-08-31 | 1988-08-31 | Manufacture of laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21723188A JPH0267332A (en) | 1988-08-31 | 1988-08-31 | Manufacture of laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267332A true JPH0267332A (en) | 1990-03-07 |
Family
ID=16700903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21723188A Pending JPH0267332A (en) | 1988-08-31 | 1988-08-31 | Manufacture of laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267332A (en) |
-
1988
- 1988-08-31 JP JP21723188A patent/JPH0267332A/en active Pending
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