JPH0259188A - Interactive nc controller - Google Patents
Interactive nc controllerInfo
- Publication number
- JPH0259188A JPH0259188A JP63210251A JP21025188A JPH0259188A JP H0259188 A JPH0259188 A JP H0259188A JP 63210251 A JP63210251 A JP 63210251A JP 21025188 A JP21025188 A JP 21025188A JP H0259188 A JPH0259188 A JP H0259188A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- beam processing
- setting
- laser processing
- processing conditions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002452 interceptive effect Effects 0.000 title claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000003754 machining Methods 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 3
- 230000003993 interaction Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004040 coloring Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
Landscapes
- Numerical Control (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、レーザ加工機の制御に用いられ様々なワーク
の材質、板厚に対し、レーザ加工の指令速度に応じて、
レーザ加工条件の設定の自動化を可能とする対話型ＮＣ
制御装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is used to control a laser processing machine, and is used to control various workpiece materials and thicknesses according to the command speed of laser processing.
Interactive NC that enables automation of laser processing condition settings
Regarding a control device.
従来の技術
レーザ加工による板金加工ではレーザの加工条件の設定
は作業者の経験で行なっていた。レーザ加工においては
同図において１はワーク、２は焼けこげ部＞３はドロス
、４は切り残こし部である。In conventional sheet metal processing using laser processing, the laser processing conditions were set based on the operator's experience. In the laser processing, in the figure, 1 is a workpiece, 2 is a burnt part>3 is dross, and 4 is an uncut part.
レーザ加工条件の設定が正しく行なわｊていない場合第
６図に示すような不都合が生じる。If the laser processing conditions are not set correctly, problems as shown in FIG. 6 will occur.
すなわち、例えばレーザ出力が大き過ぎた場合、同図色
に示すようにバーニングが発生したり、同図すに示すよ
うにドロス３が付着する。寸た出力が小さい場合同図Ｃ
に示すようにカウジングが発生する。従って同一の加工
を行なう場合でも板厚。That is, for example, if the laser output is too large, burning may occur as shown in the color of the figure, or dross 3 may adhere as shown in the color of the figure. If the dimensional output is small, use C in the same diagram.
Couging occurs as shown in . Therefore, even if the same processing is performed, the plate thickness.
材質が変われはレーザ加工条件を設定し直す必要があっ
た。更に卸１密な加工を行なう場合は高速では輪郭形状
の精度を欠く恐れがあるため速度を落とさなければなら
ないが、その場合も加工条件を速度に適したものに設定
し直していた。When the material changed, it was necessary to reset the laser processing conditions. Furthermore, when performing dense machining, the speed must be reduced because there is a risk of losing the precision of the contour shape at high speeds, but even in such cases, the machining conditions are reset to suit the speed.
発明が解決しようとする課題
板金加工の業界でも、多品種小量生産の傾向がます１す
進み、加工形状も更に複雑なものになっている。ＮＣプ
ログラムは加工物が変わるたびに組替えが必要になって
ぐるが、レーザ加工機はレーザ加工の条件設定に時間が
掛かり、また作業者の熟練を要するため誰でもすぐに使
えるというものではない。更に、同一形状の加工におい
てもワークの板厚、材質が変われば、また複雑な加工を
行なうため速度の設定を変更する度に加工条件の再設定
を行なわなければならず手間がかかつていた。Problems to be Solved by the Invention In the sheet metal processing industry, the trend toward high-mix, low-volume production is progressing even further, and processed shapes are becoming more complex. NC programs need to be rearranged every time the workpiece changes, but laser processing machines require time to set laser processing conditions and require operator skill, so not everyone can use them right away. Furthermore, even when machining the same shape, if the thickness or material of the workpiece changes, or when performing complex machining, the machining conditions must be reset every time the speed setting is changed, which is time-consuming.
課題を解決するための手段
神々の板厚、材質に対して指令速度の変化に応じたレー
ザ加工条件を記憶するメモリーテーブルを有する記憶装
置と、上記レーザ加工条件を入力編集、及び表示できる
対話装置と、板厚、相性より選択される加工条件テーブ
ルから指令速度に応じた加工条件を切り換える機能を備
えた演哀処理装置により購成し、板厚、材質と指令速度
に応じてレーザ加工条件を最適制御すること全特徴とし
たレーザ加工□□□用対話型ＮＣ制御装置においてＰ髄
、板厚を設定することによりそｔらのテーブルをアクセ
スし、またＮＣプログラム内の速度指令によりアクセス
されたテーブルから速度に適した加工条件をＮＣ制御装
置内で自動的に設定を行なう。Means for solving the problem: A storage device that has a memory table that stores laser processing conditions according to changes in command speed for divine board thickness and material, and an interaction device that can input, edit, and display the above laser processing conditions. Then, a processing device equipped with a function to switch the machining conditions according to the command speed from a machining condition table selected based on the plate thickness and compatibility, and laser machining conditions are changed according to the plate thickness, material and command speed. In the interactive NC control device for laser processing, which is fully characterized by optimal control, those tables can be accessed by setting the thickness and plate thickness, and can also be accessed by speed commands in the NC program. Machining conditions suitable for the speed are automatically set in the NC control device from the table.
作用
レーザ加工条件の設定は各板ｐ、材質の条件テーブルで
速度の変化に対して一度設定するだけでその後の設定は
不用になる。加工に際しては板厚。The working laser processing conditions are set only once in the condition table for each plate p and material for changes in speed, and subsequent settings are unnecessary. When processing, check the plate thickness.
材質を選択するだけでよい。また、複雑な形状、精密な
加工を行なう場合にＮＧプログラム内で速度指令を変更
してもレーザ加工条件の設定は不用になＺｏ
実施例
本発明の一実施例による溝成を第１図に示す。Just choose the material. Furthermore, when processing complex shapes and precision, even if the speed command is changed in the NG program, there is no need to set the laser processing conditions. show.
入カキ−にレーザ加工条件を設定するスイッチを設けて
いる。The input key is equipped with a switch for setting laser processing conditions.
これにより第２図、第３図に示すようなレーザ加工条件
テーブルを表示することが可能となる。This makes it possible to display laser processing condition tables as shown in FIGS. 2 and 3.
手順は１ず、材質選択キーを押すことにより材質−覧表
から材質を選択する。画面は第２図のように表示される
。材質には番号がついており、この番号をテンキーによ
り設定する。設定されると画面は板厚を聞いて来るので
板片を入力する（板厚はＰ種類の設定ができ薄いもの、
厚いものは前ベージ、後ベージキーにより表示できる）
。速度に対してのデータの設定、及び編集にはこの時に
テンキー、及びカーソルキーにより行なう。速度のの分
割幅も自由に設定できるため速度に対し細かい範囲でレ
ーザ加工条件の設定ができる。このようにして設定され
たデータはＮＣプログラムの実行時、速度データ（Ｆ）
により選択さｒする。実行の手’ｌｌ■す材質、板厚を
設定する（同一のレーザ加工条件の場合はこの操作の必
要はない）。次にプログラムを実行させる。ＮＣ装置の
内部で速度の設定があり、かつ設定値がｙ化した時にこ
のレーザ加工条件テーブルの祭服を行なう。速度に対シ
。The first step is to select a material from the material list by pressing the material selection key. The screen is displayed as shown in Figure 2. Each material has a number, and this number is set using the numeric keypad. Once set, the screen will ask for the board thickness, so enter the board piece (the board thickness can be set to P types, thin,
Thick items can be displayed using the front page and back page keys)
. Setting and editing of data for speed is performed using the numeric keypad and cursor keys at this time. Since the speed division width can also be set freely, laser processing conditions can be set within a fine range for speed. The data set in this way is used as speed data (F) when executing the NC program.
Selected by r. Set the material and plate thickness for execution (if the laser processing conditions are the same, this operation is not necessary). Next, run the program. When the speed is set inside the NC device and the set value becomes y, the ritual of this laser processing condition table is performed. Against speed.
てその値を越えないデータを設定するようになっている
（第４図）。例えば速度指令Ｆ３０００と設定された場
合、第３図のレーザ出力１００Ｏ（Ｗ）、発振周波数ｅ
ｏｏ（Ｈｚ）、チューティ８０（罰、ガス圧５ｃｋｑ／
ｃｄ）の値が設定されるようになっている。(Figure 4). For example, when the speed command is set to F3000, the laser output is 100O (W) and the oscillation frequency e as shown in Fig. 3.
oo (Hz), Chuty 80 (punishment, gas pressure 5ckq/
cd) value is set.
発明の効果
レーザ加工の作業者より煩雑なレーザ加工条件の設定を
解放（７プログラム作成作業の大幅な時間短縮を図るこ
とができ、また、レーザ加工の条件設定を知らたい作業
者にも簡単にレーザ加工が行えるようになった効果は非
常に大なるものである。Effects of the invention Frees laser processing workers from setting complicated laser processing conditions (7) Significantly reduces the time required to create programs, and also makes it easy for workers who want to know how to set laser processing conditions. The effect of being able to perform laser processing is enormous.
第１図は本発明の一実施例による描成図、第２図は同実
施例による材９選択画面を示す説明図、第３図は同実施
例による板厚画面と速度に対する加工条件データを示す
説明図、第４図は同実施例によるテーブル判断ＰＡＤ図
、第６図はレーザ加工時に生じる切断面不良例を示す説
明図である。
６・・・・・・対話装置、６・・・−・・演算処理装色
、７・・・・・・記憶装置。
代理人の丘名 弁理士 粟 野 重 孝 ほか１名１１
−一−テ′Ｊ″＋−
１２−−−ｖ−ツルキー
ｔ３−−−へ′−じキー
ド“Ｄスっ１丁１
カウラソフ゛FIG. 1 is a drawing diagram according to an embodiment of the present invention, FIG. 2 is an explanatory diagram showing a material 9 selection screen according to the same embodiment, and FIG. 3 is a diagram showing processing condition data for the plate thickness screen and speed according to the same embodiment. FIG. 4 is a table judgment PAD diagram according to the same embodiment, and FIG. 6 is an explanatory diagram showing an example of a defective cut surface that occurs during laser processing. 6... Dialogue device, 6...-- Arithmetic processing coloring, 7... Storage device. Agent Okana Patent attorney Shigetaka Awano and 1 other person 11
-1-te'J''+- 12---v-Turkey t3--To'-ji key "D Su 1 Chou 1 Kaura Soph
Claims (1)
ザ加工条件を記憶するメモリーテーブルを有する記憶装
置と、上記レーザ加工条件を入力編集、及び表示できる
対話装置と、板厚、材質より選択される加工条件テーブ
ルから指令速度に応じた加工条件を切り換える機能を備
えた演算処理装置とより構成した対話型ＮＣ制御装置。A storage device that has a memory table that stores laser processing conditions according to changes in command speed for various plate thicknesses and materials, an interaction device that can input, edit, and display the laser processing conditions, and a An interactive NC control device comprising an arithmetic processing unit having a function of switching machining conditions according to a command speed from a selected machining condition table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63210251A JP2590539B2 (en) | 1988-08-24 | 1988-08-24 | Interactive NC controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63210251A JP2590539B2 (en) | 1988-08-24 | 1988-08-24 | Interactive NC controller |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0259188A true JPH0259188A (en) | 1990-02-28 |
| JP2590539B2 JP2590539B2 (en) | 1997-03-12 |
Family
ID=16586283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63210251A Expired - Lifetime JP2590539B2 (en) | 1988-08-24 | 1988-08-24 | Interactive NC controller |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2590539B2 (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439706A (en) * | 1990-06-05 | 1992-02-10 | Mitsubishi Electric Corp | Nc program generating method |
| JPH04305386A (en) * | 1991-03-29 | 1992-10-28 | Shin Meiwa Ind Co Ltd | Method for controlling machining conditions of laser bean machining robot |
| JPH106048A (en) * | 1996-06-21 | 1998-01-13 | Amada Co Ltd | Method and device for indicating machining condition of laser beam machine |
| KR19990072840A (en) * | 1998-02-24 | 1999-09-27 | 죠우치 다카시 | Processing apparatus having laser unit |
| JP2000183432A (en) * | 1998-12-14 | 2000-06-30 | Amada Eng Center Co Ltd | Method for setting up working conditions for yag laser |
| US7705268B2 (en) * | 2004-11-11 | 2010-04-27 | Gsi Group Corporation | Method and system for laser soft marking |
| WO2015072107A1 (en) | 2013-11-15 | 2015-05-21 | パナソニックＩｐマネジメント株式会社 | Laser welding condition determination method and laser welding device |
| WO2019188155A1 (en) * | 2018-03-26 | 2019-10-03 | パナソニックＩｐマネジメント株式会社 | Laser cutting device and laser cutting method |
| WO2020218269A1 (en) * | 2019-04-26 | 2020-10-29 | 株式会社アマダ | Laser processor and processing condition setting method |
| JP2021028088A (en) * | 2020-11-20 | 2021-02-25 | 株式会社アマダ | Laser beam machine |
| JP2021049545A (en) * | 2019-09-25 | 2021-04-01 | 株式会社アマダ | Laser beam machine |
| CN112975164A (en) * | 2021-04-29 | 2021-06-18 | 湖南大捷智能装备有限公司 | Laser cutting method and laser cutting platform |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61123490A (en) * | 1984-11-19 | 1986-06-11 | Yamazaki Mazak Corp | Determination controlling method of laser output in laser working machine |
-
1988
- 1988-08-24 JP JP63210251A patent/JP2590539B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61123490A (en) * | 1984-11-19 | 1986-06-11 | Yamazaki Mazak Corp | Determination controlling method of laser output in laser working machine |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439706A (en) * | 1990-06-05 | 1992-02-10 | Mitsubishi Electric Corp | Nc program generating method |
| JPH04305386A (en) * | 1991-03-29 | 1992-10-28 | Shin Meiwa Ind Co Ltd | Method for controlling machining conditions of laser bean machining robot |
| JPH106048A (en) * | 1996-06-21 | 1998-01-13 | Amada Co Ltd | Method and device for indicating machining condition of laser beam machine |
| KR19990072840A (en) * | 1998-02-24 | 1999-09-27 | 죠우치 다카시 | Processing apparatus having laser unit |
| JP2000183432A (en) * | 1998-12-14 | 2000-06-30 | Amada Eng Center Co Ltd | Method for setting up working conditions for yag laser |
| US7705268B2 (en) * | 2004-11-11 | 2010-04-27 | Gsi Group Corporation | Method and system for laser soft marking |
| WO2015072107A1 (en) | 2013-11-15 | 2015-05-21 | パナソニックＩｐマネジメント株式会社 | Laser welding condition determination method and laser welding device |
| US10207364B2 (en) | 2013-11-15 | 2019-02-19 | Panasonic Intellectual Property Management Co., Ltd. | Laser welding condition determination method and laser welding device |
| WO2019188155A1 (en) * | 2018-03-26 | 2019-10-03 | パナソニックＩｐマネジメント株式会社 | Laser cutting device and laser cutting method |
| JPWO2019188155A1 (en) * | 2018-03-26 | 2021-03-25 | パナソニックＩｐマネジメント株式会社 | Laser cutting equipment and laser cutting method |
| WO2020218269A1 (en) * | 2019-04-26 | 2020-10-29 | 株式会社アマダ | Laser processor and processing condition setting method |
| JP2020179420A (en) * | 2019-04-26 | 2020-11-05 | 株式会社アマダ | Laser processing machine and processing condition setting method |
| JP2021049545A (en) * | 2019-09-25 | 2021-04-01 | 株式会社アマダ | Laser beam machine |
| JP2021028088A (en) * | 2020-11-20 | 2021-02-25 | 株式会社アマダ | Laser beam machine |
| CN112975164A (en) * | 2021-04-29 | 2021-06-18 | 湖南大捷智能装备有限公司 | Laser cutting method and laser cutting platform |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2590539B2 (en) | 1997-03-12 |
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