JPH025348A - Separation of planar body from holder - Google Patents
Separation of planar body from holderInfo
- Publication number
- JPH025348A JPH025348A JP63152513A JP15251388A JPH025348A JP H025348 A JPH025348 A JP H025348A JP 63152513 A JP63152513 A JP 63152513A JP 15251388 A JP15251388 A JP 15251388A JP H025348 A JPH025348 A JP H025348A
- Authority
- JP
- Japan
- Prior art keywords
- holder
- plate
- pressurized gas
- planar body
- packing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000926 separation method Methods 0.000 title abstract description 3
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000012856 packing Methods 0.000 claims abstract description 16
- 238000001179 sorption measurement Methods 0.000 claims abstract 3
- 238000009423 ventilation Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 abstract description 16
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 3
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 3
- 239000011148 porous material Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 3
- 238000010884 ion-beam technique Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
この発明は、ホルダにシート状のパッキングを介して真
空吸着により密着された半導体ウェハ等の板状体を、イ
オンビーム照射等の処理の終了後にホルダから離脱させ
る板状体のホルダからの離脱方法に関するものである。Detailed Description of the Invention (Industrial Field of Application) The present invention is directed to a plate-like object such as a semiconductor wafer that is tightly attached to a holder by vacuum suction through a sheet-like packing, after a process such as ion beam irradiation is completed. The present invention relates to a method for removing a plate-shaped body from a holder, which is later removed from the holder.
従来、半導体ウェハ等の板状体をイオンビームでエツチ
ングする場合や、その他種々の処理を施す場合に、真空
吸着により板状体をパッキングを介してホルダに吸着し
、パッキングの密着力により板状体を保持している。Conventionally, when etching a plate-shaped object such as a semiconductor wafer with an ion beam or performing various other treatments, the plate-shaped object is adsorbed to a holder via packing using vacuum suction, and the adhesive force of the packing causes the plate-shaped object to be attached to the holder. holding the body.
第３図はそのホルダの一例を示す。板状体ｌはウェハ等
である。ホルダ２は、板状体１を載せて吸着するもので
あり、真空引きする多数の細孔３を有している。ホルダ
２の上面にはシリコンゴム等からなるシート状のパッキ
ング４を載せる。パッキング４はホルダ２の細孔３に連
通ずる多数の通気孔４ａを有する。FIG. 3 shows an example of the holder. The plate-like body l is a wafer or the like. The holder 2 is for placing and adsorbing the plate-shaped body 1, and has a large number of pores 3 for vacuuming. A sheet-like packing 4 made of silicone rubber or the like is placed on the upper surface of the holder 2. The packing 4 has a large number of ventilation holes 4 a communicating with the pores 3 of the holder 2 .
このホルダ２を用いて第４図に示す工程で処理を行う、
３１〜Ｓ、は、各工程のステップを示す。Using this holder 2, the process shown in FIG. 4 is carried out.
31 to S indicate the steps of each process.
ホルダー２にパッキング４を載せ、その上に板状体１を
置＜ （Ｓ、）。この状態で細孔３を介して真空排気装
置（図示せず）により排気し、板状体１を真空吸着する
（Ｓり。この吸着により、シリコンゴム等からなるパッ
キング４の粘着性のため、板状体ｌはパッキング４に密
着し、パッキング４はホルダ２に密着する。真空吸着を
解き、板状体１を密着したホルダ２を処理室である真空
室内に搬入する（Ｓ３）−真空室内で、板状体１にイオ
ンビーム等のビームの照射を行い、エツチング等の処理
を施す（Ｓ４）。処理の終了後、真空室から板状体ｌの
載せられたホルダ２を取り出しくＳＳ）、ホルダ２から
板状体１を離脱させる。Place the packing 4 on the holder 2, and place the plate-like body 1 on top of it (S,). In this state, the air is evacuated through the pores 3 using a vacuum evacuation device (not shown), and the plate-shaped body 1 is vacuum-adsorbed (S). The plate-shaped body 1 is brought into close contact with the packing 4, and the packing 4 is brought into close contact with the holder 2.The vacuum suction is released, and the holder 2 with the plate-shaped body 1 in close contact with it is carried into a vacuum chamber which is a processing chamber (S3) - Vacuum chamber Then, the plate-shaped body 1 is irradiated with a beam such as an ion beam and subjected to processing such as etching (S4).After the process is completed, the holder 2 on which the plate-shaped body 1 is placed is taken out from the vacuum chamber (SS). , the plate-like body 1 is removed from the holder 2.
この場合に、板状体ｌおよびホルダ２はビームの照射に
より高い湿度（例えば１００°Ｃ）に加熱されているた
め、−旦冷媒を用いて室温程度まで板状体１およびホル
ダ２を冷却する（Ｓ、’ ）。この後、細孔３を通して
加圧した気体（例えば窒素ガス）を吹き付け、板状体ｌ
をホルダ２から離脱させる。In this case, since the plate-like body 1 and the holder 2 are heated to high humidity (for example, 100°C) by the beam irradiation, the plate-like body 1 and the holder 2 are first cooled to about room temperature using a refrigerant. (S,'). After that, pressurized gas (for example, nitrogen gas) is blown through the pores 3 to
is removed from holder 2.
しかし、前記の冷却を行う七、パッキング４の粘着力が
増加するため、前記の気体の吹き込みを行っても容易に
離脱しない場合がある０例えば、１、０ ｋｇ ／ ｃ
ｄ程度の加圧気体を用いても離脱しないことがある。そ
のため加圧気体の圧力を上げることが必要であるが、板
状体ｌは薄くて脆いウェハ等であるため、圧力を上げる
と８りれを生じる恐れがある。However, because the adhesive force of the packing 4 increases when performing the above cooling, it may not be easily released even if the above gas is blown.For example, 1,0 kg/c
Even if pressurized gas of about d is used, separation may not occur. Therefore, it is necessary to increase the pressure of the pressurized gas, but since the plate-like body l is a thin and fragile wafer or the like, increasing the pressure may cause warpage.
この発明の目的は、板状体に割れ等を生じさせずに、容
易にシ１１脱させることのできる板状体のホルダからの
離脱方法を提供することである。An object of the present invention is to provide a method for removing a plate-shaped body from a holder, which allows the plate-shaped body to be easily removed from the holder without causing any cracks or the like in the plate-shaped body.
ごの発明の板状体のホルダからの離脱方法は、ホルダで
真空吸着した高温の板状体をホルダから離脱させるに際
して、ホルダおよび板状体を室ｌＬｌまで冷却せずに所
定湿度に保持し、この状態で＋’＋ｉｌ記ホルダの吸着
面に加圧気体を供給し、板状体をホルダから離脱させる
方法である。In the method of detaching a plate-like body from a holder according to the invention, when a high-temperature plate-like body vacuum-adsorbed by the holder is detached from the holder, the holder and the plate-like body are kept at a predetermined humidity without being cooled to the chamber 1L1. In this state, pressurized gas is supplied to the suction surface of the +'+il holder, and the plate-shaped body is separated from the holder.
この方法によると、板状体およびホルダを室温まで冷却
せずに、所定湿度に保つことにより、パッキングの粘着
力が増加せずに小さい範囲で保持される。そのため、ホ
ルダに加圧気体を供給して板状体を離脱させるときに、
気体の圧力が小さくても容易に離脱させることができる
。According to this method, by keeping the plate-shaped body and the holder at a predetermined humidity without cooling them to room temperature, the adhesive strength of the packing is maintained within a small range without increasing. Therefore, when supplying pressurized gas to the holder to release the plate,
Even if the gas pressure is low, it can be easily released.
この発明の一実施例を第１図および第２図に基づいて説
明する。An embodiment of the present invention will be described based on FIGS. 1 and 2.
板状体ｌ、ホルダ２．およびパッキング４は、第３図の
例と同様であるので、その説明を省略する。加熱室５は
、ホルダ２を加熱するものであり、ホルダ２を載せる金
属板６およびヒータ７を内部に設けである。加熱室５は
断熱材で構成しである。Plate body l, holder 2. Since the packing 4 and the packing 4 are the same as those in the example shown in FIG. 3, their explanation will be omitted. The heating chamber 5 is for heating the holder 2, and has a metal plate 6 on which the holder 2 is placed and a heater 7 provided therein. The heating chamber 5 is made of a heat insulating material.
第２図はこの実施例の各工程を示し、ステップ３１〜Ｓ
、までの工程は第４図の例と同様である。FIG. 2 shows each process of this embodiment, and shows steps 31 to S.
The steps up to , are similar to the example shown in FIG.
この実施例の方法では、ホルダ２を真空室から取出す工
程（Ｓ、）の後、ホルダ２を加熱室５に入れ、ホルダ２
および板状体１を室温よりも高い所定の湿度（例えば７
０°Ｃ程度）に保つ（Ｓ６）。In the method of this embodiment, after the step (S,) of taking out the holder 2 from the vacuum chamber, the holder 2 is put into the heating chamber 5, and the holder 2 is
and the plate-shaped body 1 at a predetermined humidity higher than room temperature (for example, 7
(about 0°C) (S6).
この状態でホルダ２の細孔３に窒素ガス等の加圧気体を
供給し、板状体１をホルダ２から離脱させる（Ｓ？）。In this state, pressurized gas such as nitrogen gas is supplied to the pores 3 of the holder 2, and the plate-shaped body 1 is separated from the holder 2 (S?).
この方法によると、板状体１およびホルダ２を室温まで
冷却せずに、所定湿度に保つので、バンキング４の粘着
力が小さい範囲で保持され、板状体１とバンキング４あ
るいはホルダ２との密着面における粘着力が余り大きく
ならない。そのため、ホルダ２に加圧気体を供給して板
状体１を離脱させるときに、加圧気体の圧力が小さくて
も容易に離脱させることができ、板状体１に割れ等を生
じることがない０例えば、加圧気体の圧力が０．５ｋｇ
／（、ｄ程度であっても、容易に板状体１を離脱させる
ことができる。離脱を行うときに、板状体ｌおよびホル
ダ２は、処理した時の高温状態よりもある程度冷めてい
るので、作業が行い易い。According to this method, the plate-shaped body 1 and the holder 2 are kept at a predetermined humidity without being cooled to room temperature, so that the adhesive strength of the banking 4 is maintained within a small range, and the bond between the plate-shaped body 1 and the banking 4 or the holder 2 is kept at a low level. Adhesive force on the contact surface does not become too large. Therefore, when pressurized gas is supplied to the holder 2 and the plate-shaped body 1 is detached, it can be easily detached even if the pressure of the pressurized gas is small, and the plate-shaped body 1 is prevented from being cracked. No 0 For example, the pressure of pressurized gas is 0.5 kg
/(, even if it is about d, the plate-like body 1 can be easily detached. When detaching, the plate-like body l and the holder 2 are cooled down to some extent from the high temperature state at the time of processing. Therefore, the work is easy.
なお、前記実施例ではヒータ７を有する加熱室５を用い
たが、ヒータを有しない保温室でホルダ２の湿度維持を
行うようにしても良い。Although the heating chamber 5 having the heater 7 was used in the above embodiment, the humidity of the holder 2 may be maintained in an insulating chamber without a heater.
この発明の板状体のホルダからの離脱方法は、板状体お
よびホルダを室温まで冷却せずに、所定湿度に保つこと
により、パッキングの粘着力が小さい範囲で保持される
。そのため、ホルダに加圧気体を供給して板状体を離脱
させるときに、加圧気体の圧力が小さくても容易に離脱
させることができ、板状体に割れ等を生しることがない
という効県がある。The method of detaching a plate from a holder according to the present invention maintains the adhesive force of the packing within a small range by keeping the plate and the holder at a predetermined humidity without cooling them to room temperature. Therefore, when pressurized gas is supplied to the holder and the plate-shaped body is released, it can be easily detached even if the pressure of the pressurized gas is low, and the plate-shaped body will not be cracked. There is an effective prefecture.
第１図（Ａ）、 （Ｂ）はこの発明の一実施例の各工
程の説明図、第２図はその離脱方法を採用した処理工程
の流れ図、第３図は従来のホルダの断面図、第４図は従
来の離脱方法を採用した処理工程の流れ図である。
ｌ・・・板状体、２・・・ホルダ、３・・・細孔、４・
・・パッキング、５・・・加熱室、７・・・ヒータ第
図
３糸叱1(A) and 1(B) are explanatory diagrams of each process of an embodiment of the present invention, FIG. 2 is a flowchart of the processing steps employing the detachment method, and FIG. 3 is a sectional view of a conventional holder. FIG. 4 is a flowchart of the processing steps employing the conventional detachment method. l... plate-shaped body, 2... holder, 3... pore, 4...
... Packing, 5... Heating chamber, 7... Heater Diagram 3 Thread scolding
Claims (1)
より真空吸着した高温の板状体を前記ホルダから離脱さ
せる離脱方法において、前記ホルダおよび板状体を室温
よりも高い所定湿度に保持した状態で、前記ホルダの吸
着面に加圧気体を供給し、板状体をホルダから離脱させ
ることを特徴とする板状体のホルダからの離脱方法。In a detachment method in which a high-temperature plate-like body vacuum-adsorbed by a holder is detached from the holder through a sheet-like packing having ventilation holes, the holder and the plate-like body are maintained at a predetermined humidity higher than room temperature, A method for detaching a plate-like body from a holder, comprising supplying pressurized gas to an adsorption surface of the holder to detach the plate-like body from the holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63152513A JPH025348A (en) | 1988-06-20 | 1988-06-20 | Separation of planar body from holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63152513A JPH025348A (en) | 1988-06-20 | 1988-06-20 | Separation of planar body from holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH025348A true JPH025348A (en) | 1990-01-10 |
Family
ID=15542093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63152513A Pending JPH025348A (en) | 1988-06-20 | 1988-06-20 | Separation of planar body from holder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025348A (en) |
-
1988
- 1988-06-20 JP JP63152513A patent/JPH025348A/en active Pending
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