WO2019010607A1 - Peeling method and peeling device for flexible substrate - Google Patents
Peeling method and peeling device for flexible substrate Download PDFInfo
- Publication number
- WO2019010607A1 WO2019010607A1 PCT/CN2017/092372 CN2017092372W WO2019010607A1 WO 2019010607 A1 WO2019010607 A1 WO 2019010607A1 CN 2017092372 W CN2017092372 W CN 2017092372W WO 2019010607 A1 WO2019010607 A1 WO 2019010607A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flexible substrate
- glass substrate
- section
- intercepting
- substrate
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
Definitions
- the present invention relates to the field of display technologies, and in particular, to a peeling method and a stripping device for a flexible substrate.
- the manufacturing process of the flexible substrate in order to peel the flexible substrate from the glass substrate, it is usually required to irradiate the contact surface of the flexible substrate and the glass substrate by laser, thereby destroying the adsorption force of the contact surface, and then cutting the glass substrate and the flexible display by using a cutter.
- the flexible substrate is further peeled off, and the peeling process and the peeling apparatus of the flexible substrate are complicated, and the manufacturing cost of the flexible substrate is high.
- Embodiments of the present invention provide a peeling method and a peeling apparatus for a flexible substrate.
- the peeling method of the flexible substrate according to the embodiment of the present invention is for peeling off the flexible substrate and the glass substrate, and the peeling method includes:
- the clipped section and the flexible substrate are moved to separate the cut-out section from the glass substrate and peel off the flexible substrate from the glass substrate.
- the stripping method further comprises: before the intercepting the predetermined size of the glass substrate as an intercepting segment:
- the glass substrate and the flexible substrate are placed on a carrying platform, the flexible substrate being located between the glass substrate and the carrying platform.
- the cutting the predetermined size of the glass substrate is a cutting section by applying pressure to a side of the glass substrate opposite to the flexible substrate to form a crack on the glass substrate.
- the crack separates the glass substrate into the intercepting section and the retaining section.
- the stripping method further comprises: after the intercepting the predetermined size of the glass substrate as an intercepting segment:
- the glass substrate and the flexible substrate are moved to separate the flexible substrate from the carrier platform.
- the glass substrate further includes a retention segment, the moving the glass substrate and the flexible substrate being achieved by moving the glass substrate and the flexible substrate after adsorbing the retention segment.
- the stripping method further comprises:
- the intercepting segment and the flexible substrate corresponding to the intercepting segment are cut.
- the stripping device of the flexible substrate of the embodiment of the present invention is used for peeling off the flexible substrate and the glass substrate, and the stripping device comprises:
- An intercepting device for intercepting the glass substrate of a predetermined size as an intercepting segment
- a clamping device for clamping the intercepting section and the flexible substrate corresponding to the intercepting section, and moving the clipped section and the flexible substrate to be The intercepting section separates from the glass substrate and peels off the flexible substrate and the glass substrate.
- the stripping apparatus further includes a carrying platform for carrying the glass substrate and the flexible substrate, the flexible substrate being located between the glass substrate and the carrying platform.
- the intercepting device includes a cutter wheel for applying pressure on a side of the glass substrate opposite the flexible substrate to form a crack on the glass substrate, The crack separates the glass substrate into the intercepting section and the retaining section.
- the stripping apparatus further includes a gripping device for gripping the glass substrate and moving the glass substrate and the flexible substrate such that the flexible substrate The carrier platform is separated.
- the glass substrate further includes a retention section, the gripping device including an adsorption platform for generating a negative pressure and adsorbing the retention section to grasp the retention section.
- the stripping apparatus further includes a carrier platform for carrying the separated section and the stripped flexible substrate, the stripping apparatus further comprising a cutting device, A cutting device is used to cut the intercepting segment and the flexible substrate corresponding to the intercepting segment.
- the flexible substrate and the glass substrate are directly peeled off by sandwiching the cut-off section and the corresponding flexible substrate, and the peeling process and the peeling apparatus are relatively simple, and the manufacturing cost of the flexible substrate is low.
- FIG. 1 is a schematic flow chart of a peeling method according to an embodiment of the present invention.
- FIG. 2 is a schematic flow chart of a peeling method according to an embodiment of the present invention.
- FIG. 3 is a schematic flow chart of a peeling method according to an embodiment of the present invention.
- FIG. 4 is a schematic flow chart of a peeling method according to an embodiment of the present invention.
- FIG. 5 is a schematic view showing a peeling scene of a flexible substrate according to an embodiment of the present invention.
- FIG. 6 is a schematic view showing a peeling scene of a flexible substrate according to an embodiment of the present invention.
- FIG. 7 is a schematic view showing a peeling scene of a flexible substrate according to an embodiment of the present invention.
- FIG. 8 is a schematic view showing a peeling scene of a flexible substrate according to an embodiment of the present invention.
- Stripping device 10 cutting device 11, cutter wheel 111, clamping device 12, upper clamping plate 121, lower clamping plate 122, carrying platform 13, gripping device 14, adsorption platform 141, suction cup 1411, cutting device 15, flexible substrate 20, edge The region 21, the glass substrate 30, the intercepting section 31, and the retaining section 32.
- the first feature "on” or “under” the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact.
- the first feature "above”, “above” and “above” the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature.
- the first feature “below”, “below” and “below” the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.
- the peeling method of the flexible substrate 20 of the embodiment of the present invention is used for peeling off the flexible substrate 20 and the glass substrate 30 .
- the peeling method includes the following steps:
- the peeling apparatus 10 of the flexible substrate 20 of the embodiment of the present invention can be used to peel off the flexible substrate 20 and the glass substrate 30, and the peeling apparatus 10 includes the cutting device 11 and the holding device 12.
- the intercepting device 11 can be used to implement step S1, and the clamping device 12 can be used to implement steps S3 and S5. That is, the intercepting device 11 can be used to intercept the glass substrate 30 of a predetermined size as the intercepting segment 31.
- the clamping device 12 can be used to grip the intercepting section 31 and the flexible substrate 20 corresponding to the intercepting section 31, and to move the clamped section 31 and the flexible substrate 20 to separate the cutting section 31 from the glass substrate 30 and peel off the flexible substrate. 20 and glass substrate 30.
- the peeling method and the peeling device 10 of the flexible substrate 20 according to the embodiment of the present invention directly peel the flexible substrate 20 from the glass substrate 30 by sandwiching the cut-off section 31 and the corresponding flexible substrate 20, and the peeling process and the peeling apparatus 10 are relatively simple and flexible.
- the manufacturing cost of the substrate 20 is low.
- the flexible substrate 20 may be an OLED screen.
- a flexible substrate is required to be fabricated on the glass substrate 30, and a device layer, a protective layer, and the like are prepared on the flexible substrate to form the flexible substrate 20. Then, the flexible substrate 20 needs to be removed from the glass substrate. 30 peeled off.
- the peeling method of the embodiment of the present invention does not need to first break the bonding force between the flexible substrate 20 and the glass substrate 30 by laser irradiation or the like, and does not need to be cut between the glass substrate 30 and the flexible substrate 20 by using a special cutter.
- the peeling process of the flexible substrate 20 is relatively simple.
- the stripping apparatus 10 does not need to be provided with a laser that emits laser light, and does not need to be equipped with a cutter that cuts between the glass substrate 30 and the flexible substrate 20, and the structure of the peeling device 10 It is simpler and saves the manufacturing cost of the flexible substrate 20.
- the intercepting section 31 may be reserved when the flexible substrate 20 is attached to the glass substrate 30, and the intercepting section 31 may be reserved at the edge position of the glass substrate 30 so that the intercepting section 31 is intercepted and clamped.
- the flexible substrate 20 includes an edge region 21 corresponding to the intercepting segment 31, and the edge region 21 is located at an edge position of the flexible substrate 20.
- the edge region 21 facilitates the operation of the flexible substrate 20 by the stripping device 10, such as fixing, clamping, The operation of moving the flexible substrate 20 or the like prevents the remaining area of the flexible substrate 20 from being too much contact with the peeling device 10 during the production process to be damaged.
- no device layer is prepared on the edge region 21, and the edge region 21 does not affect the use function of the flexible substrate 20.
- the flexible substrate 20 can be edged before leaving the factory. 21 cut.
- the thickness of the flexible substrate 20 is thin and soft, that is, the flexible substrate 20 is relatively weak and easily deformed and difficult to be clamped separately, and since the hardness of the cutting section 31 is relatively large and flat, the clamping device 12 is At the same time, the intercepting section 31 and the edge section 21 are relatively stable, so that the edge region 21 can pull the entire flexible substrate 20 away from the glass substrate 30 when the clamping device 12 is moved.
- the stripping method further includes step S0 before step S1: placing the glass substrate 30 and the flexible substrate 20 on the carrying platform 13, the flexible substrate 20 being located on the glass substrate 30 and carrying Between platforms 13.
- the stripping device 10 of the embodiment of the present invention further includes a carrying platform 13 for carrying the glass substrate 30 and the flexible substrate 20, and the flexible substrate 20 is located between the glass substrate 30 and the carrying platform 13.
- the glass substrate 30 can be fixed on the carrying platform 13, for example, a fixing groove can be formed on the carrying platform 13, and the glass substrate 30 can be placed on the carrying platform 13, and the air in the fixing groove can be extracted. A negative pressure is formed in the fixing groove to adsorb the glass substrate 30.
- the flexible substrate 20 is then prepared on the glass substrate 30.
- the preparation of the flexible substrate 20 is completed, when the flexible substrate 20 and the glass substrate 30 need to be peeled off, the glass substrate 30 is flat from the carrier. After the stage 13 is removed, the glass substrate 30 and the flexible substrate 20 are turned over, and then the glass substrate 30 and the flexible substrate 20 are placed on the carrying platform 13. At this time, the flexible substrate 20 is brought into contact with the carrier platform 13, and the glass substrate 30 is placed above the flexible substrate 20, and the glass substrate 30 is easily taken out.
- step S1 is performed by applying pressure to a side of the glass substrate 30 opposite to the flexible substrate 20 to form a crack on the glass substrate 30, and the crack separates the glass substrate 30.
- the segment 31 and the reserved segment 32 are intercepted.
- the intercepting device 11 further includes a cutter wheel 11 for applying pressure on a side of the glass substrate 30 opposite to the flexible substrate 20 to form a crack on the glass substrate 30, the crack will be glass
- the substrate 30 is divided into a cut-out section 31 and a retaining section 32.
- the cutter wheel 11 is a cutting tool, and the cutter wheel 11 can form a crack on the article to be cut, so that the object to be cut is separated along the crack.
- the material of the cutter wheel 11 can be a hard material such as diamond, and the cutter wheel 11 can be It has a disc shape. It can be understood that the material of the glass substrate 30 may be glass, and the glass has greater brittleness. After a crack is cut on the surface of the glass substrate 30, the crack easily extends in the thickness direction of the glass substrate 30, that is, the glass substrate 30 is easily removed. Split along the crack. The crack divides the glass substrate 30 into the intercepting section 31 and the retaining section 32.
- the area of the intercepting section 31 can be minimized and increased on the basis of ensuring the peeling effect.
- the area of the segment 32 is largely retained, and the retention segment 32 is easily recycled after the flexible substrate 20 is peeled off from the glass substrate 30.
- the retention segment 32 can be used as the glass substrate 30 for manufacturing another flexible substrate 20.
- step S1 the intercepting segment 31 may not be completely separated from the retaining segment 32, for example, only a crack is formed between the intercepting segment 31 and the retaining segment 32, so as to separate the two by external force in the subsequent process.
- the intercepting segment 31 and the retaining segment 32 can be completely separated, which is not limited herein.
- the stripping method further includes step S2 after step S1 : moving the glass substrate 30 and the flexible substrate 20 to separate the flexible substrate 20 from the carrying platform 13 .
- the stripping device 10 further includes a gripping device 14 that can be used to implement step S2. That is, the gripping device 14 is used to grasp the glass substrate 30 and move the glass substrate 30 and the flexible substrate 20 to separate the flexible substrate 20 from the carrying platform 13.
- the flexible substrate 20 Since the flexible substrate 20 is relatively weak, the flexible substrate 20 is easily damaged by contact with the carrying platform 13 for a long time. Therefore, after the intercepting of the cutting section 31 is completed, the flexible substrate 20 needs to be separated from the carrying platform 13 to avoid the flexible substrate 20 being subjected to. damage. Moreover, since the glass substrate 30 is less susceptible to damage than the flexible substrate 20, the gripping device 14 is preferably used to grasp the glass substrate 30 to drive the flexible substrate 20 away from the carrier platform 13.
- the glass substrate 30 and the flexible substrate 20 can be moved upward to separate the flexible substrate 20 from the carrying platform 13 to avoid friction between the flexible substrate 20 and the carrying platform 13 and damage the flexible substrate 20 during the moving process.
- sufficient operating space can be reserved for the subsequent clamping, moving intercepting section 31 and edge zone 31.
- the glass substrate 30 further includes a retention section 32.
- the moving glass substrate 30 and the flexible substrate 20 are realized by moving the glass substrate 30 and the flexible substrate 20 after adsorbing the retention section 32.
- the gripping device 14 includes an adsorption platform 141 for generating a negative pressure and adsorbing the retention section 32 to grasp the retention section 32.
- the adsorption platform 141 includes a plurality of suction cups 1411, each of which is in communication with a vacuum pump. Opening the vacuum pump can evacuate the air in the suction cup 1411 to form a negative pressure in the suction cup 1411, and the adsorption platform 141 is close to the glass substrate 30 until the retention section 32 is adsorbed on the suction cup 1411, and then the adsorption platform 141 is moved to move the glass substrate 30 and the flexibility. Substrate 20.
- the suction force of the suction cup 1411 can be adjusted by adjusting the power of the vacuum pump.
- the retention section 32 can be placed on the carrier platform 13, and then the vacuum pump can be closed and the suction cup 1411 communicated with the atmosphere. After the adsorption force of the retaining section 32 disappears, the adsorption stage 141 is removed.
- the adsorption platform 141 Since the adsorption platform 141 passes the adsorption retention section 32 to fix the glass substrate 30, the adsorption platform 141 does not affect the operation of the subsequent stripping device 10 on the intercepting section 31.
- the clamping device 12 can be a movable robot.
- the clamping device 12 includes an upper clamping plate 121 and a lower clamping plate 122.
- the clamping device 12 is first moved, so that the cutting section 31 and The edge region 21 is located between the upper and lower plates 121 and 122.
- the upper plate 121 or the lower plate 122 is moved again, or the upper plate 121 and the lower plate 122 are simultaneously moved, so that the upper plate 121 comes into contact with the intercepting section 31, and the lower plate 122 contacts the flexible substrate 20 and clamps the cutting section 31 and the edge section 21.
- the overall rotation of the clamping device 12 can be controlled to completely separate the intercepting section 31 from the retaining section 32. Specifically, since the glass substrate 30 has formed a crack in the step S1, when the cutting section 31 is held and the intercepting section 31 is broken by an external force, the crack extends in the thickness direction of the glass substrate 30 and the glass substrate 30 is completely divided into the intercepting section. 31 and retain segment 32.
- the clamping device 12 can be controlled to move to disengage the flexible substrate 20 from the retention section 32.
- the position of the flexible substrate 20 to be peeled off from the glass substrate 30 is D
- the length of the flexible substrate 20 that has been peeled off is L
- the tangent of the arc of the holding device 12 along the circle D and with the radius of L can be controlled.
- the flexible substrate 20 After clamping the intercepting section 31 and the edge zone 21, and during the movement of the intercepting section 31 and the edge zone 21, the flexible substrate 20 is never in contact with the carrying platform 13, reducing the flexible substrate 20 and the carrying platform 13 during the peeling process.
- the interaction force reduces the likelihood of the flexible substrate 20 being damaged by the carrier platform 13.
- the peeling method further comprises the steps of:
- the stripping apparatus 10 further includes a carrier platform 13 for carrying the separated cut-out section 31 and the stripped flexible substrate 20, the stripping apparatus 10 further comprising a cutting device 15.
- the clamping device 12 and the cutting device 15 can be used to implement steps S6 and S7. That is, the gripping device 12 can be used to place the separated cut-out section 31 and the peeled flexible substrate 20 on the carrier platform 13.
- the cutting device 15 can be used to cut off the cut-out section 31 and the flexible substrate 20 corresponding to the cut-out section 31.
- the edge region 21 is directly cut away together with the intercepting segment 31, eliminating the need to separate the edge region 21 from the intercepting segment 31, simplifying the peeling process of the flexible substrate 20, and the edge region 21 does not affect the subsequent manufacture and use of the flexible substrate 20.
- first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
- features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
- a plurality means at least two, for example two, three, unless specifically defined otherwise.
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
A peeling method and a peeling device (10) for a flexible substrate (20). The peeling method is used for peeling apart the flexible substrate (20) and a glass substrate (30); the peeling method comprises: (S1) cutting off a predetermined size of the glass substrate (30) to serve as a cut-off section (31); (S3) clamping the cut-off section (31) and the flexible substrate (20) corresponding to the cut-off section (31); and (S5) moving the clamped cut-off section (31) and the flexible substrate (20), so that the cut-off section (31) is separated from the glass substrate (30), and the flexible substrate (20) and the glass substrate (30) are peeled apart.
Description
本发明涉及显示屏技术领域，特别涉及一种柔性基板的剥离方法和剥离设备。The present invention relates to the field of display technologies, and in particular, to a peeling method and a stripping device for a flexible substrate.
在柔性基板的制造过程中，为了将柔性基板从玻璃基板上剥离，通常需要通过激光照射柔性基板和玻璃基板的接触面，从而破坏接触面的吸附力，再采用刀具切入玻璃基板和柔性显示屏之间并进一步将柔性基板剥离，柔性基板的剥离工序和剥离设备较复杂，柔性基板的制造成本高。In the manufacturing process of the flexible substrate, in order to peel the flexible substrate from the glass substrate, it is usually required to irradiate the contact surface of the flexible substrate and the glass substrate by laser, thereby destroying the adsorption force of the contact surface, and then cutting the glass substrate and the flexible display by using a cutter. The flexible substrate is further peeled off, and the peeling process and the peeling apparatus of the flexible substrate are complicated, and the manufacturing cost of the flexible substrate is high.
发明内容Summary of the invention
本发明的实施方式提供了一种柔性基板的剥离方法和剥离设备。Embodiments of the present invention provide a peeling method and a peeling apparatus for a flexible substrate.
本发明实施方式的柔性基板的剥离方法用于剥离柔性基板与玻璃基板，所述剥离方法包括：The peeling method of the flexible substrate according to the embodiment of the present invention is for peeling off the flexible substrate and the glass substrate, and the peeling method includes:
截取预定大小的所述玻璃基板为截取段；Obscuring the glass substrate of a predetermined size as an intercepting section;
夹持所述截取段和与所述截取段对应的所述柔性基板；和Holding the intercepting section and the flexible substrate corresponding to the intercepting section; and
移动被夹持的所述截取段和所述柔性基板，以使所述截取段从所述玻璃基板分离且剥离所述柔性基板与所述玻璃基板。The clipped section and the flexible substrate are moved to separate the cut-out section from the glass substrate and peel off the flexible substrate from the glass substrate.
在某些实施方式中，所述剥离方法在所述截取预定大小的所述玻璃基板为截取段之前还包括：In some embodiments, the stripping method further comprises: before the intercepting the predetermined size of the glass substrate as an intercepting segment:
将所述玻璃基板和所述柔性基板放置在承载平台上，所述柔性基板位于所述玻璃基板与所述承载平台之间。The glass substrate and the flexible substrate are placed on a carrying platform, the flexible substrate being located between the glass substrate and the carrying platform.
在某些实施方式中，所述截取预定大小的所述玻璃基板为截取段是通过对所述玻璃基板的与所述柔性基板相背的一侧施加压力，以在所述玻璃基板上形成裂痕实现的，所述裂痕将所述玻璃基板分隔为所述截取段和保留段。In some embodiments, the cutting the predetermined size of the glass substrate is a cutting section by applying pressure to a side of the glass substrate opposite to the flexible substrate to form a crack on the glass substrate. Implemented, the crack separates the glass substrate into the intercepting section and the retaining section.
在某些实施方式中，所述剥离方法在所述截取预定大小的所述玻璃基板为截取段之后还包括：In some embodiments, the stripping method further comprises: after the intercepting the predetermined size of the glass substrate as an intercepting segment:
移动所述玻璃基板和所述柔性基板，以使所述柔性基板与所述承载平台分离。The glass substrate and the flexible substrate are moved to separate the flexible substrate from the carrier platform.
在某些实施方式中，所述玻璃基板还包括保留段，所述移动所述玻璃基板和所述柔性基板是通过吸附所述保留段后，移动所述玻璃基板和所述柔性基板实现的。In some embodiments, the glass substrate further includes a retention segment, the moving the glass substrate and the flexible substrate being achieved by moving the glass substrate and the flexible substrate after adsorbing the retention segment.
在某些实施方式中，所述剥离方法还包括：
In some embodiments, the stripping method further comprises:
将被分离的所述截取段和被剥离的所述柔性基板放置在承载平台上；和Disposing the separated section and the peeled flexible substrate on a carrying platform; and
切除所述截取段和与所述截取段对应的所述柔性基板。The intercepting segment and the flexible substrate corresponding to the intercepting segment are cut.
本发明实施方式的柔性基板的剥离设备，用于剥离柔性基板与玻璃基板，所述剥离设备包括：The stripping device of the flexible substrate of the embodiment of the present invention is used for peeling off the flexible substrate and the glass substrate, and the stripping device comprises:
截取装置，所述截取装置用于截取预定大小的所述玻璃基板为截取段；和An intercepting device for intercepting the glass substrate of a predetermined size as an intercepting segment; and
夹持装置，所述夹持装置用于夹持所述截取段和与所述截取段对应的所述柔性基板，和移动被夹持的所述截取段和所述柔性基板，以使所述截取段从所述玻璃基板分离且剥离所述柔性基板与所述玻璃基板。a clamping device for clamping the intercepting section and the flexible substrate corresponding to the intercepting section, and moving the clipped section and the flexible substrate to be The intercepting section separates from the glass substrate and peels off the flexible substrate and the glass substrate.
在某些实施方式中，所述剥离设备还包括承载平台，所述承载平台用于承载所述玻璃基板和所述柔性基板，所述柔性基板位于所述玻璃基板与所述承载平台之间。In some embodiments, the stripping apparatus further includes a carrying platform for carrying the glass substrate and the flexible substrate, the flexible substrate being located between the glass substrate and the carrying platform.
在某些实施方式中，所述截取装置包括刀轮，所述刀轮用于在所述玻璃基板的与所述柔性基板相背的一侧施加压力，以在所述玻璃基板上形成裂痕，所述裂痕将所述玻璃基板分隔为所述截取段和保留段。In some embodiments, the intercepting device includes a cutter wheel for applying pressure on a side of the glass substrate opposite the flexible substrate to form a crack on the glass substrate, The crack separates the glass substrate into the intercepting section and the retaining section.
在某些实施方式中，所述剥离设备还包括抓取装置，所述抓取装置用于抓取所述玻璃基板，并移动所述玻璃基板和所述柔性基板，以使所述柔性基板与所述承载平台分离。In some embodiments, the stripping apparatus further includes a gripping device for gripping the glass substrate and moving the glass substrate and the flexible substrate such that the flexible substrate The carrier platform is separated.
在某些实施方式中，所述玻璃基板还包括保留段，所述抓取装置包括吸附平台，所述吸附平台用于产生负压并吸附所述保留段，以抓取所述保留段。In certain embodiments, the glass substrate further includes a retention section, the gripping device including an adsorption platform for generating a negative pressure and adsorbing the retention section to grasp the retention section.
在某些实施方式中，所述剥离设备还包括承载平台，所述承载平台用于承载被分离的所述截取段和被剥离的所述柔性基板，所述剥离设备还包括切除装置，所述切除装置用于切除所述截取段和与所述截取段对应的所述柔性基板。In some embodiments, the stripping apparatus further includes a carrier platform for carrying the separated section and the stripped flexible substrate, the stripping apparatus further comprising a cutting device, A cutting device is used to cut the intercepting segment and the flexible substrate corresponding to the intercepting segment.
本发明实施方式的柔性基板的剥离方法和剥离设备，通过夹持截取段和对应的柔性基板后直接将柔性基板与玻璃基板剥离，剥离工序和剥离设备较简单，柔性基板的制造成本较低。In the peeling method and the peeling apparatus of the flexible substrate according to the embodiment of the present invention, the flexible substrate and the glass substrate are directly peeled off by sandwiching the cut-off section and the corresponding flexible substrate, and the peeling process and the peeling apparatus are relatively simple, and the manufacturing cost of the flexible substrate is low.
本发明的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实施方式的实践了解到。The additional aspects and advantages of the embodiments of the present invention will be set forth in part in the description which follows.
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from
图1是本发明实施方式的剥离方法的流程示意图；1 is a schematic flow chart of a peeling method according to an embodiment of the present invention;
图2是本发明实施方式的剥离方法的流程示意图；2 is a schematic flow chart of a peeling method according to an embodiment of the present invention;
图3是本发明实施方式的剥离方法的流程示意图；
3 is a schematic flow chart of a peeling method according to an embodiment of the present invention;
图4是本发明实施方式的剥离方法的流程示意图；4 is a schematic flow chart of a peeling method according to an embodiment of the present invention;
图5是本发明实施方式的柔性基板的剥离场景示意图；5 is a schematic view showing a peeling scene of a flexible substrate according to an embodiment of the present invention;
图6是本发明实施方式的柔性基板的剥离场景示意图；6 is a schematic view showing a peeling scene of a flexible substrate according to an embodiment of the present invention;
图7是本发明实施方式的柔性基板的剥离场景示意图；7 is a schematic view showing a peeling scene of a flexible substrate according to an embodiment of the present invention;
图8是本发明实施方式的柔性基板的剥离场景示意图。8 is a schematic view showing a peeling scene of a flexible substrate according to an embodiment of the present invention.
主要元件符号附图说明：The main component symbol drawing description:
剥离设备10、截取装置11、刀轮111、夹持装置12、上夹板121、下夹板122、承载平台13、抓取装置14、吸附平台141、吸盘1411、切除装置15、柔性基板20、边缘区21、玻璃基板30、截取段31、保留段32。Stripping device 10, cutting device 11, cutter wheel 111, clamping device 12, upper clamping plate 121, lower clamping plate 122, carrying platform 13, gripping device 14, adsorption platform 141, suction cup 1411, cutting device 15, flexible substrate 20, edge The region 21, the glass substrate 30, the intercepting section 31, and the retaining section 32.
以下结合附图对本发明的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings denote the same or similar elements or elements having the same or similar functions.
另外，下面结合附图描述的本发明的实施方式是示例性的，仅用于解释本发明的实施方式，而不能理解为对本发明的限制。In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are merely illustrative of the embodiments of the invention, and are not to be construed as limiting.
在本发明中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。In the present invention, the first feature "on" or "under" the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact. Moreover, the first feature "above", "above" and "above" the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.
请参阅图1和图5-图7，本发明实施方式的柔性基板20的剥离方法用于剥离柔性基板20与玻璃基板30，剥离方法包括步骤：Referring to FIG. 1 and FIG. 5 to FIG. 7 , the peeling method of the flexible substrate 20 of the embodiment of the present invention is used for peeling off the flexible substrate 20 and the glass substrate 30 . The peeling method includes the following steps:
S1：截取预定大小的玻璃基板30为截取段31；S1: intercepting the predetermined size of the glass substrate 30 as the intercepting section 31;
S3：夹持截取段31和与截取段31对应的柔性基板20；和S3: clamping the intercepting section 31 and the flexible substrate 20 corresponding to the intercepting section 31; and
S5：移动被夹持的截取段31和柔性基板20，以使截取段31从玻璃基板30分离且剥离柔性基板20与玻璃基板30。S5: The clamped section 31 and the flexible substrate 20 are moved to separate the cut section 31 from the glass substrate 30 and peel off the flexible substrate 20 and the glass substrate 30.
本发明实施方式的柔性基板20的剥离设备10可用于剥离柔性基板20与玻璃基板30，剥离设备10包括截取装置11和夹持装置12。截取装置11可用于实施步骤S1，夹持装置12可用于实施步骤S3和S5。也就是说，截取装置11可用于截取预定大小的玻璃基板30为截取段31。夹持装置12可用于夹持截取段31和与截取段31对应的柔性基板20，和移动被夹持的截取段31和柔性基板20，以使截取段31从玻璃基板30分离且剥离柔性基板
20与玻璃基板30。The peeling apparatus 10 of the flexible substrate 20 of the embodiment of the present invention can be used to peel off the flexible substrate 20 and the glass substrate 30, and the peeling apparatus 10 includes the cutting device 11 and the holding device 12. The intercepting device 11 can be used to implement step S1, and the clamping device 12 can be used to implement steps S3 and S5. That is, the intercepting device 11 can be used to intercept the glass substrate 30 of a predetermined size as the intercepting segment 31. The clamping device 12 can be used to grip the intercepting section 31 and the flexible substrate 20 corresponding to the intercepting section 31, and to move the clamped section 31 and the flexible substrate 20 to separate the cutting section 31 from the glass substrate 30 and peel off the flexible substrate.
20 and glass substrate 30.
本发明实施方式的柔性基板20的剥离方法和剥离设备10，通过夹持截取段31和对应的柔性基板20后直接将柔性基板20与玻璃基板30剥离，剥离工序和剥离设备10较简单，柔性基板20的制造成本较低。The peeling method and the peeling device 10 of the flexible substrate 20 according to the embodiment of the present invention directly peel the flexible substrate 20 from the glass substrate 30 by sandwiching the cut-off section 31 and the corresponding flexible substrate 20, and the peeling process and the peeling apparatus 10 are relatively simple and flexible. The manufacturing cost of the substrate 20 is low.
柔性基板20可以是OLED屏，一般需要在玻璃基板30上制造一层柔性衬底，并在柔性衬底上制备器件层、保护层等以形成柔性基板20，然后需要将柔性基板20从玻璃基板30上剥离下来。The flexible substrate 20 may be an OLED screen. Generally, a flexible substrate is required to be fabricated on the glass substrate 30, and a device layer, a protective layer, and the like are prepared on the flexible substrate to form the flexible substrate 20. Then, the flexible substrate 20 needs to be removed from the glass substrate. 30 peeled off.
具体地，本发明实施方式的剥离方法不需要通过激光照射等方式先破坏柔性基板20与玻璃基板30之间的结合力，也不需要利用特殊的刀具切入玻璃基板30和柔性基板20之间将两者进行剥离，柔性基板20的剥离工序较简单，同理，剥离设备10不需要设置发射激光的激光器，也不需要配备切入玻璃基板30和柔性基板20之间的刀具，剥离设备10的结构较简单，节约柔性基板20的制造成本。Specifically, the peeling method of the embodiment of the present invention does not need to first break the bonding force between the flexible substrate 20 and the glass substrate 30 by laser irradiation or the like, and does not need to be cut between the glass substrate 30 and the flexible substrate 20 by using a special cutter. The peeling process of the flexible substrate 20 is relatively simple. Similarly, the stripping apparatus 10 does not need to be provided with a laser that emits laser light, and does not need to be equipped with a cutter that cuts between the glass substrate 30 and the flexible substrate 20, and the structure of the peeling device 10 It is simpler and saves the manufacturing cost of the flexible substrate 20.
截取段31可以是在将柔性基板20贴合在玻璃基板30上时就预留的，可以将截取段31预留在玻璃基板30的边缘位置，以便于截取段31被截取和被夹持。柔性基板20包括与截取段31对应的边缘区21，边缘区21位于柔性基板20的边缘位置，在生产过程中，边缘区21便于剥离设备10对柔性基板20进行操作，例如固定、夹持、移动柔性基板20等的操作，避免柔性基板20的其余区域在生产过程中与剥离设备10接触太多而被损坏。在一个例子中，在柔性基板20的生产过程中，在边缘区21上不制备器件层，边缘区21对柔性基板20的使用功能不会产生影响，柔性基板20在出厂前，可将边缘区21切除。The intercepting section 31 may be reserved when the flexible substrate 20 is attached to the glass substrate 30, and the intercepting section 31 may be reserved at the edge position of the glass substrate 30 so that the intercepting section 31 is intercepted and clamped. The flexible substrate 20 includes an edge region 21 corresponding to the intercepting segment 31, and the edge region 21 is located at an edge position of the flexible substrate 20. During the production process, the edge region 21 facilitates the operation of the flexible substrate 20 by the stripping device 10, such as fixing, clamping, The operation of moving the flexible substrate 20 or the like prevents the remaining area of the flexible substrate 20 from being too much contact with the peeling device 10 during the production process to be damaged. In one example, in the production process of the flexible substrate 20, no device layer is prepared on the edge region 21, and the edge region 21 does not affect the use function of the flexible substrate 20. The flexible substrate 20 can be edged before leaving the factory. 21 cut.
可以理解，柔性基板20的厚度较薄且质地较软，也就是柔性基板20较脆弱且容易发生形变而难以单独被夹持，而由于截取段31的硬度较大且较平整，夹持装置12同时夹持截取段31和边缘区21时较稳定，以使得当移动夹持装置12时边缘区21可牵动整个柔性基板20与玻璃基板30剥离。It can be understood that the thickness of the flexible substrate 20 is thin and soft, that is, the flexible substrate 20 is relatively weak and easily deformed and difficult to be clamped separately, and since the hardness of the cutting section 31 is relatively large and flat, the clamping device 12 is At the same time, the intercepting section 31 and the edge section 21 are relatively stable, so that the edge region 21 can pull the entire flexible substrate 20 away from the glass substrate 30 when the clamping device 12 is moved.
请参阅图2和图5，在某些实施方式中，剥离方法在步骤S1之前还包括步骤S0：将玻璃基板30和柔性基板20放置在承载平台13上，柔性基板20位于玻璃基板30与承载平台13之间。Referring to FIG. 2 and FIG. 5, in some embodiments, the stripping method further includes step S0 before step S1: placing the glass substrate 30 and the flexible substrate 20 on the carrying platform 13, the flexible substrate 20 being located on the glass substrate 30 and carrying Between platforms 13.
本发明实施方式的剥离设备10还包括承载平台13，承载平台13用于承载玻璃基板30和柔性基板20，柔性基板20位于玻璃基板30与承载平台13之间。The stripping device 10 of the embodiment of the present invention further includes a carrying platform 13 for carrying the glass substrate 30 and the flexible substrate 20, and the flexible substrate 20 is located between the glass substrate 30 and the carrying platform 13.
在生产柔性基板20的过程中，可以先将玻璃基板30固定在承载平台13上，例如可以在承载平台13上开设固定槽，将玻璃基板30放置在承载平台13上，抽取固定槽内的空气以使固定槽内形成负压并吸附玻璃基板30。然后在玻璃基板30上制备柔性基板20。在柔性基板20制备完成，需要将柔性基板20与玻璃基板30剥离时，将玻璃基板30从承载平
台13上取下，翻转玻璃基板30和柔性基板20后，再将玻璃基板30和柔性基板20放置在承载平台13上。此时，将柔性基板20与承载平台13接触，玻璃基板30置于柔性基板20的上方，容易对玻璃基板30进行截取操作。In the process of producing the flexible substrate 20, the glass substrate 30 can be fixed on the carrying platform 13, for example, a fixing groove can be formed on the carrying platform 13, and the glass substrate 30 can be placed on the carrying platform 13, and the air in the fixing groove can be extracted. A negative pressure is formed in the fixing groove to adsorb the glass substrate 30. The flexible substrate 20 is then prepared on the glass substrate 30. When the preparation of the flexible substrate 20 is completed, when the flexible substrate 20 and the glass substrate 30 need to be peeled off, the glass substrate 30 is flat from the carrier.
After the stage 13 is removed, the glass substrate 30 and the flexible substrate 20 are turned over, and then the glass substrate 30 and the flexible substrate 20 are placed on the carrying platform 13. At this time, the flexible substrate 20 is brought into contact with the carrier platform 13, and the glass substrate 30 is placed above the flexible substrate 20, and the glass substrate 30 is easily taken out.
请参阅图5，在某些实施方式中，步骤S1是通过对玻璃基板30的与柔性基板20相背的一侧施加压力，以在玻璃基板30上形成裂痕实现的，裂痕将玻璃基板30分隔为截取段31和保留段32。Referring to FIG. 5, in some embodiments, step S1 is performed by applying pressure to a side of the glass substrate 30 opposite to the flexible substrate 20 to form a crack on the glass substrate 30, and the crack separates the glass substrate 30. The segment 31 and the reserved segment 32 are intercepted.
在某些实施方式中，截取装置11还包括刀轮11，刀轮11用于在玻璃基板30的与柔性基板20相背的一侧施加压力，以在玻璃基板30上形成裂痕，裂痕将玻璃基板30分隔为截取段31和保留段32。In some embodiments, the intercepting device 11 further includes a cutter wheel 11 for applying pressure on a side of the glass substrate 30 opposite to the flexible substrate 20 to form a crack on the glass substrate 30, the crack will be glass The substrate 30 is divided into a cut-out section 31 and a retaining section 32.
刀轮11是一种切割工具，刀轮11可以在待切割物品上形成裂痕，以便于待切割物品沿着裂痕分离，刀轮11的材料可以是金刚石等硬度较大的材料，刀轮11可以呈圆盘状。可以理解，玻璃基板30的材料可以是玻璃，玻璃具有较大的脆性，在玻璃基板30表面切割出一条裂痕后，裂痕容易沿玻璃基板30的厚度方向延伸，也就是说，容易将玻璃基板30沿裂痕分割。裂痕将玻璃基板30分隔为截取段31和保留段32，由于截取段31在后序的制造工序中较难回收利用，因此在保证剥离效果的基础上，可以尽量减少截取段31的面积并增大保留段32的面积，而保留段32容易在柔性基板20与玻璃基板30剥离后再回收利用，例如保留段32可以作为制造另一个柔性基板20的玻璃基板30。The cutter wheel 11 is a cutting tool, and the cutter wheel 11 can form a crack on the article to be cut, so that the object to be cut is separated along the crack. The material of the cutter wheel 11 can be a hard material such as diamond, and the cutter wheel 11 can be It has a disc shape. It can be understood that the material of the glass substrate 30 may be glass, and the glass has greater brittleness. After a crack is cut on the surface of the glass substrate 30, the crack easily extends in the thickness direction of the glass substrate 30, that is, the glass substrate 30 is easily removed. Split along the crack. The crack divides the glass substrate 30 into the intercepting section 31 and the retaining section 32. Since the intercepting section 31 is difficult to recycle in the subsequent manufacturing process, the area of the intercepting section 31 can be minimized and increased on the basis of ensuring the peeling effect. The area of the segment 32 is largely retained, and the retention segment 32 is easily recycled after the flexible substrate 20 is peeled off from the glass substrate 30. For example, the retention segment 32 can be used as the glass substrate 30 for manufacturing another flexible substrate 20.
需要说明的是，在步骤S1中，截取段31可以尚未与保留段32完全分离，例如只是在截取段31和保留段32之间形成裂痕，以在后序制程中再通过外力将二者分离。当然，步骤S1中，也可以将截取段31与保留段32完全分离，在此不作限定。It should be noted that, in step S1, the intercepting segment 31 may not be completely separated from the retaining segment 32, for example, only a crack is formed between the intercepting segment 31 and the retaining segment 32, so as to separate the two by external force in the subsequent process. . Of course, in the step S1, the intercepting segment 31 and the retaining segment 32 can be completely separated, which is not limited herein.
请参阅图3和图6，在某些实施方式中，剥离方法在步骤S1之后还包括步骤S2：移动玻璃基板30和柔性基板20，以使柔性基板20与承载平台13分离。Referring to FIG. 3 and FIG. 6 , in some embodiments, the stripping method further includes step S2 after step S1 : moving the glass substrate 30 and the flexible substrate 20 to separate the flexible substrate 20 from the carrying platform 13 .
在某些实施方式中，剥离设备10还包括抓取装置14，抓取装置14可用于实施步骤S2。也就是说，抓取装置14用于抓取玻璃基板30，并移动玻璃基板30和柔性基板20，以使柔性基板20与承载平台13分离。In certain embodiments, the stripping device 10 further includes a gripping device 14 that can be used to implement step S2. That is, the gripping device 14 is used to grasp the glass substrate 30 and move the glass substrate 30 and the flexible substrate 20 to separate the flexible substrate 20 from the carrying platform 13.
由于柔性基板20较脆弱，柔性基板20与承载平台13接触时间过久容易被损坏，因此，在将截取段31截取完成后，需要先将柔性基板20与承载平台13分离以避免柔性基板20受到损坏。且由于玻璃基板30较柔性基板20不易受到损坏，所以抓取装置14优选地用于抓取玻璃基板30以带动柔性基板20与承载平台13分离。Since the flexible substrate 20 is relatively weak, the flexible substrate 20 is easily damaged by contact with the carrying platform 13 for a long time. Therefore, after the intercepting of the cutting section 31 is completed, the flexible substrate 20 needs to be separated from the carrying platform 13 to avoid the flexible substrate 20 being subjected to. damage. Moreover, since the glass substrate 30 is less susceptible to damage than the flexible substrate 20, the gripping device 14 is preferably used to grasp the glass substrate 30 to drive the flexible substrate 20 away from the carrier platform 13.
具体地，可以将玻璃基板30和柔性基板20往上移以使柔性基板20与承载平台13分离，一来避免在移动过程中，柔性基板20与承载平台13之间发生摩擦而损坏柔性基板20，二来可以为后序夹持、移动截取段31和边缘区31预留足够的操作空间。
Specifically, the glass substrate 30 and the flexible substrate 20 can be moved upward to separate the flexible substrate 20 from the carrying platform 13 to avoid friction between the flexible substrate 20 and the carrying platform 13 and damage the flexible substrate 20 during the moving process. Secondly, sufficient operating space can be reserved for the subsequent clamping, moving intercepting section 31 and edge zone 31.
请再参阅图6，在某些实施方式中，玻璃基板30还包括保留段32，移动玻璃基板30和柔性基板20是通过吸附保留段32后，移动玻璃基板30和柔性基板20实现的。Referring to FIG. 6 again, in some embodiments, the glass substrate 30 further includes a retention section 32. The moving glass substrate 30 and the flexible substrate 20 are realized by moving the glass substrate 30 and the flexible substrate 20 after adsorbing the retention section 32.
在某些实施方式中，抓取装置14包括吸附平台141，吸附平台141用于产生负压并吸附保留段32，以抓取保留段32。In certain embodiments, the gripping device 14 includes an adsorption platform 141 for generating a negative pressure and adsorbing the retention section 32 to grasp the retention section 32.
具体地，吸附平台141包括多个吸盘1411，每个吸盘1411均与真空泵连通。开启真空泵可抽离吸盘1411内的空气以使吸盘1411内形成负压，将吸附平台141靠近玻璃基板30直至保留段32被吸附在吸盘1411上，再移动吸附平台141以移动玻璃基板30和柔性基板20。通过调整真空泵的功率可调整吸盘1411的吸附力的大小，当不需要固定保留段32时，可将保留段32放置在承载平台13上，然后关闭真空泵并使吸盘1411与大气连通，吸盘1411对保留段32的吸附力消失后将吸附平台141移开。Specifically, the adsorption platform 141 includes a plurality of suction cups 1411, each of which is in communication with a vacuum pump. Opening the vacuum pump can evacuate the air in the suction cup 1411 to form a negative pressure in the suction cup 1411, and the adsorption platform 141 is close to the glass substrate 30 until the retention section 32 is adsorbed on the suction cup 1411, and then the adsorption platform 141 is moved to move the glass substrate 30 and the flexibility. Substrate 20. The suction force of the suction cup 1411 can be adjusted by adjusting the power of the vacuum pump. When the fixed retention section 32 is not required, the retention section 32 can be placed on the carrier platform 13, and then the vacuum pump can be closed and the suction cup 1411 communicated with the atmosphere. After the adsorption force of the retaining section 32 disappears, the adsorption stage 141 is removed.
由于吸附平台141通过吸附保留段32以固定玻璃基板30，吸附平台141不会影响后续剥离设备10对截取段31的操作。Since the adsorption platform 141 passes the adsorption retention section 32 to fix the glass substrate 30, the adsorption platform 141 does not affect the operation of the subsequent stripping device 10 on the intercepting section 31.
夹持装置12可以是一个可活动的机械手，夹持装置12包括上夹板121和下夹板122，在需要夹持截取段31和边缘区21时，先移动夹持装置12，使得截取段31和边缘区21位于上夹板121和下夹板122之间。再移动上夹板121或下夹板122，或者同时移动上夹板121和下夹板122，使得上夹板121与截取段31接触，下夹板122与柔性基板20接触并夹紧截取段31和边缘区21。The clamping device 12 can be a movable robot. The clamping device 12 includes an upper clamping plate 121 and a lower clamping plate 122. When the cutting section 31 and the edge region 21 need to be clamped, the clamping device 12 is first moved, so that the cutting section 31 and The edge region 21 is located between the upper and lower plates 121 and 122. The upper plate 121 or the lower plate 122 is moved again, or the upper plate 121 and the lower plate 122 are simultaneously moved, so that the upper plate 121 comes into contact with the intercepting section 31, and the lower plate 122 contacts the flexible substrate 20 and clamps the cutting section 31 and the edge section 21.
请参阅图7，夹紧截取段31和边缘区21后，可以先控制夹持装置12整体转动，以将截取段31与保留段32完全分离。具体地，由于玻璃基板30在步骤S1中已经形成了裂痕，当夹持截取段31并用外力折断截取段31时，裂痕沿玻璃基板30的厚度方向延伸并使得玻璃基板30被完全分割成截取段31和保留段32。Referring to FIG. 7, after clamping the intercepting section 31 and the edge zone 21, the overall rotation of the clamping device 12 can be controlled to completely separate the intercepting section 31 from the retaining section 32. Specifically, since the glass substrate 30 has formed a crack in the step S1, when the cutting section 31 is held and the intercepting section 31 is broken by an external force, the crack extends in the thickness direction of the glass substrate 30 and the glass substrate 30 is completely divided into the intercepting section. 31 and retain segment 32.
紧接着，可以控制夹持装置12移动以带动柔性基板20与保留段32剥离。具体地，柔性基板20即将与玻璃基板30剥离的位置为D，已经被剥离的柔性基板20的长度为L，可以控制夹持装置12沿以D为圆心，以L为半径的弧线的切线方向移动，如图所示的方向B。可以理解，随着柔性基板20与玻璃基板30逐渐剥离，位置D、长度L和方向B也在实时地变化，以便于剥离柔性基板20且对柔性基板20的拉扯作用较小。Next, the clamping device 12 can be controlled to move to disengage the flexible substrate 20 from the retention section 32. Specifically, the position of the flexible substrate 20 to be peeled off from the glass substrate 30 is D, and the length of the flexible substrate 20 that has been peeled off is L, and the tangent of the arc of the holding device 12 along the circle D and with the radius of L can be controlled. Move in the direction, as shown in direction B. It can be understood that as the flexible substrate 20 and the glass substrate 30 are gradually peeled off, the position D, the length L, and the direction B also change in real time, so as to peel off the flexible substrate 20 and have a small pulling effect on the flexible substrate 20.
在夹持截取段31和边缘区21后，且在移动截取段31和边缘区21的过程中，柔性基板20始终未与承载平台13接触，减少了在剥离过程中柔性基板20与承载平台13的相互作用力，降低了柔性基板20被承载平台13损坏的可能性。After clamping the intercepting section 31 and the edge zone 21, and during the movement of the intercepting section 31 and the edge zone 21, the flexible substrate 20 is never in contact with the carrying platform 13, reducing the flexible substrate 20 and the carrying platform 13 during the peeling process. The interaction force reduces the likelihood of the flexible substrate 20 being damaged by the carrier platform 13.
请参阅图4和图8，在某些实施方式中，剥离方法还包括步骤：Referring to FIG. 4 and FIG. 8, in some embodiments, the peeling method further comprises the steps of:
S6：将被分离的截取段31和被剥离的柔性基板20放置在承载平台13上；和S6: placing the separated intercepting section 31 and the peeled flexible substrate 20 on the carrying platform 13; and
S7：切除截取段31和与截取段31对应的柔性基板20。
S7: The intercepting section 31 and the flexible substrate 20 corresponding to the intercepting section 31 are cut off.
在某些实施方式中，剥离设备10还包括承载平台13，承载平台13用于承载被分离的截取段31和被剥离的柔性基板20，剥离设备10还包括切除装置15。夹持装置12和切除装置15可用于实施步骤S6和S7。也就是说，夹持装置12可用于将被分离的截取段31和被剥离的柔性基板20放置在承载平台13上。切除装置15可用于切除截取段31和与截取段31对应的柔性基板20。In certain embodiments, the stripping apparatus 10 further includes a carrier platform 13 for carrying the separated cut-out section 31 and the stripped flexible substrate 20, the stripping apparatus 10 further comprising a cutting device 15. The clamping device 12 and the cutting device 15 can be used to implement steps S6 and S7. That is, the gripping device 12 can be used to place the separated cut-out section 31 and the peeled flexible substrate 20 on the carrier platform 13. The cutting device 15 can be used to cut off the cut-out section 31 and the flexible substrate 20 corresponding to the cut-out section 31.
直接将边缘区21与截取段31一起切除，无需再将边缘区21与截取段31分离，简化柔性基板20的剥离工序，且边缘区21不影响柔性基板20的后续制造和使用。The edge region 21 is directly cut away together with the intercepting segment 31, eliminating the need to separate the edge region 21 from the intercepting segment 31, simplifying the peeling process of the flexible substrate 20, and the edge region 21 does not affect the subsequent manufacture and use of the flexible substrate 20.
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of the present specification, the description with reference to the terms "some embodiments", "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. Particular features, structures, materials or features described in the examples or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms is not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, various embodiments or examples described in the specification and features of various embodiments or examples may be combined and combined without departing from the scope of the invention.
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个，除非另有明确具体的限定。Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include at least one of the features, either explicitly or implicitly. In the description of the present invention, "a plurality" means at least two, for example two, three, unless specifically defined otherwise.
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。
Although the embodiments of the present invention have been shown and described, it is understood that the above-described embodiments are illustrative and are not to be construed as limiting the scope of the invention. The scope of the invention is defined by the claims and their equivalents.
Claims (12)
- 一种柔性基板的剥离方法，用于剥离柔性基板与玻璃基板，其特征在于，所述剥离方法包括：A peeling method for a flexible substrate for peeling off a flexible substrate and a glass substrate, wherein the peeling method comprises:截取预定大小的所述玻璃基板为截取段；Obscuring the glass substrate of a predetermined size as an intercepting section;夹持所述截取段和与所述截取段对应的所述柔性基板；和Holding the intercepting section and the flexible substrate corresponding to the intercepting section; and移动被夹持的所述截取段和所述柔性基板，以使所述截取段从所述玻璃基板分离且剥离所述柔性基板与所述玻璃基板。The clipped section and the flexible substrate are moved to separate the cut-out section from the glass substrate and peel off the flexible substrate from the glass substrate.
- 根据权利要求1所述的剥离方法，其特征在于，所述剥离方法在所述截取预定大小的所述玻璃基板为截取段之前还包括：The stripping method according to claim 1, wherein the stripping method further comprises: before the intercepting the predetermined size of the glass substrate as an intercepting segment:将所述玻璃基板和所述柔性基板放置在承载平台上，所述柔性基板位于所述玻璃基板与所述承载平台之间。The glass substrate and the flexible substrate are placed on a carrying platform, the flexible substrate being located between the glass substrate and the carrying platform.
- 根据权利要求1或2所述的剥离方法，其特征在于，所述截取预定大小的所述玻璃基板为截取段是通过对所述玻璃基板的与所述柔性基板相背的一侧施加压力，以在所述玻璃基板上形成裂痕实现的，所述裂痕将所述玻璃基板分隔为所述截取段和保留段。The stripping method according to claim 1 or 2, wherein the cutting the predetermined size of the glass substrate is a cutting section by applying pressure to a side of the glass substrate opposite to the flexible substrate, The crack is achieved by forming a crack on the glass substrate, the crack separating the glass substrate into the intercepting section and the retaining section.
- 根据权利要求2所述的剥离方法，其特征在于，所述剥离方法在所述截取预定大小的所述玻璃基板为截取段之后还包括：The stripping method according to claim 2, wherein the stripping method further comprises: after the intercepting the glass substrate of the predetermined size as an intercepting segment:移动所述玻璃基板和所述柔性基板，以使所述柔性基板与所述承载平台分离。The glass substrate and the flexible substrate are moved to separate the flexible substrate from the carrier platform.
- 根据权利要求4所述的剥离方法，其特征在于，所述玻璃基板还包括保留段，所述移动所述玻璃基板和所述柔性基板是通过吸附所述保留段后，移动所述玻璃基板和所述柔性基板实现的。The stripping method according to claim 4, wherein the glass substrate further comprises a retention segment, the moving the glass substrate and the flexible substrate are: after adsorbing the retention segment, moving the glass substrate and The flexible substrate is implemented.
- 根据权利要求1所述的剥离方法，其特征在于，所述剥离方法还包括：The peeling method according to claim 1, wherein the peeling method further comprises:将被分离的所述截取段和被剥离的所述柔性基板放置在承载平台上；和Disposing the separated section and the peeled flexible substrate on a carrying platform; and切除所述截取段和与所述截取段对应的所述柔性基板。The intercepting segment and the flexible substrate corresponding to the intercepting segment are cut.
- 一种柔性基板的剥离设备，用于剥离柔性基板与玻璃基板，其特征在于，所述剥离设备包括： A stripping device for a flexible substrate for stripping a flexible substrate and a glass substrate, wherein the stripping device comprises:截取装置，所述截取装置用于截取预定大小的所述玻璃基板为截取段；和An intercepting device for intercepting the glass substrate of a predetermined size as an intercepting segment; and夹持装置，所述夹持装置用于夹持所述截取段和与所述截取段对应的所述柔性基板，和移动被夹持的所述截取段和所述柔性基板，以使所述截取段从所述玻璃基板分离且剥离所述柔性基板与所述玻璃基板。a clamping device for clamping the intercepting section and the flexible substrate corresponding to the intercepting section, and moving the clipped section and the flexible substrate to be The intercepting section separates from the glass substrate and peels off the flexible substrate and the glass substrate.
- 根据权利要求7所述的剥离设备，其特征在于，所述剥离设备还包括承载平台，所述承载平台用于放置所述玻璃基板和所述柔性基板，所述柔性基板位于所述玻璃基板与所述承载平台之间。The stripping apparatus according to claim 7, wherein the stripping apparatus further comprises a carrying platform for placing the glass substrate and the flexible substrate, the flexible substrate being located on the glass substrate Between the carrying platforms.
- 根据权利要求7或8所述的剥离设备，其特征在于，所述截取装置包括刀轮，所述刀轮用于在所述玻璃基板的与所述柔性基板相背的一侧施加压力，以在所述玻璃基板上形成裂痕，所述裂痕将所述玻璃基板分隔为所述截取段和保留段。The stripping apparatus according to claim 7 or 8, wherein the cutting device comprises a cutter wheel for applying pressure on a side of the glass substrate opposite to the flexible substrate, A crack is formed on the glass substrate, the crack separating the glass substrate into the intercepting section and the retaining section.
- 根据权利要求8所述的剥离设备，其特征在于，所述剥离设备还包括抓取装置，所述抓取装置用于抓取所述玻璃基板，并移动所述玻璃基板和所述柔性基板，以使所述柔性基板与所述承载平台分离。The stripping apparatus according to claim 8, wherein the stripping apparatus further comprises a gripping device for gripping the glass substrate and moving the glass substrate and the flexible substrate, The flexible substrate is separated from the carrier platform.
- 根据权利要求10所述的剥离设备，其特征在于，所述玻璃基板还包括保留段，所述抓取装置包括吸附平台，所述吸附平台用于产生负压并吸附所述保留段，以抓取所述保留段。The stripping apparatus according to claim 10, wherein the glass substrate further comprises a retaining section, the gripping device comprises an adsorption platform for generating a negative pressure and adsorbing the retaining section to grasp Take the reserved segment.
- 根据权利要求7所述的剥离设备，其特征在于，所述剥离设备还包括承载平台，所述承载平台用于承载被分离的所述截取段和被剥离的所述柔性基板，所述剥离设备还包括切除装置，所述切除装置用于切除所述截取段和与所述截取段对应的所述柔性基板。 The stripping apparatus according to claim 7, wherein the stripping apparatus further comprises a carrying platform for carrying the separated section and the peeled flexible substrate, the stripping apparatus Also included is a cutting device for cutting the truncated segment and the flexible substrate corresponding to the truncated segment.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201780058750.6A CN109791319B (en) | 2017-07-10 | 2017-07-10 | Method and apparatus for peeling flexible substrate |
| PCT/CN2017/092372 WO2019010607A1 (en) | 2017-07-10 | 2017-07-10 | Peeling method and peeling device for flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/092372 WO2019010607A1 (en) | 2017-07-10 | 2017-07-10 | Peeling method and peeling device for flexible substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2019010607A1 true WO2019010607A1 (en) | 2019-01-17 |
Family
ID=65001015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2017/092372 WO2019010607A1 (en) | 2017-07-10 | 2017-07-10 | Peeling method and peeling device for flexible substrate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109791319B (en) |
| WO (1) | WO2019010607A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022178677A1 (en) * | 2021-02-23 | 2022-09-01 | 京东方科技集团股份有限公司 | Peeling system and peeling method for flexible fingerprint module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347449A (en) * | 2013-07-24 | 2015-02-11 | 上海和辉光电有限公司 | Peeling apparatus and peeling method |
| CN105511130A (en) * | 2016-02-01 | 2016-04-20 | 京东方科技集团股份有限公司 | Peeling device and peeling method for display substrate |
| JP2016096218A (en) * | 2014-11-13 | 2016-05-26 | 三菱化学株式会社 | Method of manufacturing lamination substrate, and method of manufacturing electronic device |
| CN106098550A (en) * | 2016-08-19 | 2016-11-09 | 京东方科技集团股份有限公司 | The preparation method of flexible display panels and the preparation method of flexible display apparatus |
| CN106486598A (en) * | 2016-12-29 | 2017-03-08 | 上海天马微电子有限公司 | Flexible display panels, flexible display apparatus and preparation method thereof |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004064018A1 (en) * | 2003-01-15 | 2004-07-29 | Semiconductor Energy Laboratory Co., Ltd. | Separating method and method for manufacturing display device using the separating method |
| JP2010165879A (en) * | 2009-01-16 | 2010-07-29 | Fujifilm Corp | Scribing apparatus and scribing method |
| CN102654807A (en) * | 2011-10-10 | 2012-09-05 | 京东方科技集团股份有限公司 | Manufacturing method of touch panel |
| KR102292148B1 (en) * | 2014-03-13 | 2021-08-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method for manufacturing display device and method for manufacturing electronic device |
| CN203850300U (en) * | 2014-05-27 | 2014-09-24 | 京东方科技集团股份有限公司 | Flexible display panel and display apparatus |
| CN104465479B (en) * | 2014-12-19 | 2017-03-01 | 京东方科技集团股份有限公司 | Flexible display substrates motherboard and the preparation method of flexible display substrates |
| CN105137634A (en) * | 2015-08-05 | 2015-12-09 | 深圳市华星光电技术有限公司 | Flexible display panel manufacturing method and substrate assembly for making display panel |
| CN105702625B (en) * | 2016-04-12 | 2017-11-03 | 武汉华星光电技术有限公司 | The stripping means of flexible base board |
| CN106098939A (en) * | 2016-08-26 | 2016-11-09 | 武汉华星光电技术有限公司 | The method of laser nondestructively peeling flexible base board |
| CN106711175B (en) * | 2016-12-14 | 2020-06-16 | 武汉华星光电技术有限公司 | Method for peeling flexible substrate |
-
2017
- 2017-07-10 WO PCT/CN2017/092372 patent/WO2019010607A1/en active Application Filing
- 2017-07-10 CN CN201780058750.6A patent/CN109791319B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347449A (en) * | 2013-07-24 | 2015-02-11 | 上海和辉光电有限公司 | Peeling apparatus and peeling method |
| JP2016096218A (en) * | 2014-11-13 | 2016-05-26 | 三菱化学株式会社 | Method of manufacturing lamination substrate, and method of manufacturing electronic device |
| CN105511130A (en) * | 2016-02-01 | 2016-04-20 | 京东方科技集团股份有限公司 | Peeling device and peeling method for display substrate |
| CN106098550A (en) * | 2016-08-19 | 2016-11-09 | 京东方科技集团股份有限公司 | The preparation method of flexible display panels and the preparation method of flexible display apparatus |
| CN106486598A (en) * | 2016-12-29 | 2017-03-08 | 上海天马微电子有限公司 | Flexible display panels, flexible display apparatus and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022178677A1 (en) * | 2021-02-23 | 2022-09-01 | 京东方科技集团股份有限公司 | Peeling system and peeling method for flexible fingerprint module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109791319B (en) | 2022-05-17 |
| CN109791319A (en) | 2019-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI787535B (en) | Wafer Processing Method | |
| TWI410329B (en) | Apparatus for releasing a flexible device and method thereof | |
| JP5422767B1 (en) | Bonding separation method and separation apparatus | |
| TWI409127B (en) | Verfahren und vorrichtung zum trennen einer planplatte aus sproedbruechigem material in mehrere einzelplatten mittels laser | |
| KR102356595B1 (en) | A flexible display device manufacturing method and manufacturing apparatus | |
| WO2015056303A1 (en) | Semiconductor-element manufacturing method and wafer mounting device | |
| JP2004153193A (en) | Processing method for semiconductor wafer | |
| US10249527B2 (en) | Method of manufacturing flexible display device | |
| TW200416853A (en) | Semiconductor device manufacturing apparatus and its manufacturing method | |
| JP2002270542A (en) | Method of picking up die, and picking-up apparatus | |
| KR101990650B1 (en) | Machining method | |
| CN108257913B (en) | Preparation method of flexible display | |
| CN110571362B (en) | Flexible display panel and preparation method thereof | |
| JP2002280330A (en) | Pickup method of chip-type component | |
| KR20060123462A (en) | Wafer transcription method | |
| US20130039733A1 (en) | Pick and place tape release for thin semiconductor dies | |
| JP2014007217A (en) | Method for processing wafer | |
| WO2019010607A1 (en) | Peeling method and peeling device for flexible substrate | |
| JP4924316B2 (en) | Semiconductor manufacturing apparatus and semiconductor manufacturing method | |
| JP6366223B2 (en) | Semiconductor chip pickup device | |
| JP6290010B2 (en) | Wafer dividing method | |
| JP2005243910A (en) | Manufacturing method of semiconductor chip | |
| CN105810634B (en) | Method for processing semiconductor substrate and semiconductor chip | |
| JPS6181652A (en) | Dicing film | |
| JPH04354352A (en) | Die pickup device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17917717 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 17917717 Country of ref document: EP Kind code of ref document: A1 |