JPH0250990B2 - - Google Patents

Info

Publication number: JPH0250990B2
Authority: JP; Japan
Prior art keywords: bath; mol; electroless; tin; potassium
Prior art date: 1985-03-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP5856785A

Other languages

English (en)

Japanese (ja)

Other versions

JPS61217582A (ja

Inventor

Hidekatsu Koyano

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

TOKYO METSUKI KK

Original Assignee

TOKYO METSUKI KK

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-03-25

Filing date

1985-03-25

Publication date

1990-11-06

1985-03-25 Application filed by TOKYO METSUKI KK filed Critical TOKYO METSUKI KK

1985-03-25 Priority to JP5856785A priority Critical patent/JPS61217582A/ja

1986-09-27 Publication of JPS61217582A publication Critical patent/JPS61217582A/ja

1990-11-06 Publication of JPH0250990B2 publication Critical patent/JPH0250990B2/ja

Status Granted legal-status Critical Current

Links

ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 56
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 51
229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 19
-1 stannite ions Chemical class 0.000 claims description 10
239000002244 precipitate Substances 0.000 claims description 9
238000000034 method Methods 0.000 claims description 7
239000007769 metal material Substances 0.000 claims description 6
CVNKFOIOZXAFBO-UHFFFAOYSA-J tin(4+);tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Sn+4] CVNKFOIOZXAFBO-UHFFFAOYSA-J 0.000 claims description 6
238000011221 initial treatment Methods 0.000 claims description 4
239000007788 liquid Substances 0.000 claims description 4
239000011591 potassium Substances 0.000 claims description 4
229910052700 potassium Inorganic materials 0.000 claims description 4
238000006467 substitution reaction Methods 0.000 claims description 3
241000287127 Passeridae Species 0.000 claims 1
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 48
238000007747 plating Methods 0.000 description 32
238000012360 testing method Methods 0.000 description 15
239000000203 mixture Substances 0.000 description 14
TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 13
239000001119 stannous chloride Substances 0.000 description 13
235000011150 stannous chloride Nutrition 0.000 description 13
230000000052 comparative effect Effects 0.000 description 9
238000001556 precipitation Methods 0.000 description 8
239000001509 sodium citrate Substances 0.000 description 8
NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 8
KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 7
229910001379 sodium hypophosphite Inorganic materials 0.000 description 7
238000006243 chemical reaction Methods 0.000 description 6
230000008021 deposition Effects 0.000 description 6
229910052708 sodium Inorganic materials 0.000 description 6
239000003638 chemical reducing agent Substances 0.000 description 5
239000001508 potassium citrate Substances 0.000 description 5
229960002635 potassium citrate Drugs 0.000 description 5
QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 5
235000011082 potassium citrates Nutrition 0.000 description 5
239000011734 sodium Substances 0.000 description 5
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
229910052802 copper Inorganic materials 0.000 description 4
239000010949 copper Substances 0.000 description 4
238000007772 electroless plating Methods 0.000 description 4
UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
229910000881 Cu alloy Inorganic materials 0.000 description 3
230000000694 effects Effects 0.000 description 3
239000000463 material Substances 0.000 description 3
239000000243 solution Substances 0.000 description 3
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
239000002253 acid Substances 0.000 description 2
239000000956 alloy Substances 0.000 description 2
150000001734 carboxylic acid salts Chemical class 0.000 description 2
239000011248 coating agent Substances 0.000 description 2
238000000576 coating method Methods 0.000 description 2
230000007423 decrease Effects 0.000 description 2
150000002500 ions Chemical class 0.000 description 2
229960003975 potassium Drugs 0.000 description 2
KYKNRZGSIGMXFH-ZVGUSBNCSA-M potassium bitartrate Chemical compound [K+].OC(=O)[C@H](O)[C@@H](O)C([O-])=O KYKNRZGSIGMXFH-ZVGUSBNCSA-M 0.000 description 2
239000001472 potassium tartrate Substances 0.000 description 2
229940111695 potassium tartrate Drugs 0.000 description 2
235000011005 potassium tartrates Nutrition 0.000 description 2
150000003839 salts Chemical class 0.000 description 2
XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 1
KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
239000004327 boric acid Substances 0.000 description 1
150000001639 boron compounds Chemical class 0.000 description 1
229910010293 ceramic material Inorganic materials 0.000 description 1
239000008139 complexing agent Substances 0.000 description 1
230000002596 correlated effect Effects 0.000 description 1
238000000354 decomposition reaction Methods 0.000 description 1
CVOQYKPWIVSMDC-UHFFFAOYSA-L dipotassium;butanedioate Chemical compound [K+].[K+].[O-]C(=O)CCC([O-])=O CVOQYKPWIVSMDC-UHFFFAOYSA-L 0.000 description 1
IRXRGVFLQOSHOH-UHFFFAOYSA-L dipotassium;oxalate Chemical compound [K+].[K+].[O-]C(=O)C([O-])=O IRXRGVFLQOSHOH-UHFFFAOYSA-L 0.000 description 1
238000011549 displacement method Methods 0.000 description 1
238000007323 disproportionation reaction Methods 0.000 description 1
238000007654 immersion Methods 0.000 description 1
229910021645 metal ion Inorganic materials 0.000 description 1
229910052755 nonmetal Inorganic materials 0.000 description 1
XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
WFIZEGIEIOHZCP-UHFFFAOYSA-M potassium formate Chemical compound [K+].[O-]C=O WFIZEGIEIOHZCP-UHFFFAOYSA-M 0.000 description 1
BWILYWWHXDGKQA-UHFFFAOYSA-M potassium propanoate Chemical compound [K+].CCC([O-])=O BWILYWWHXDGKQA-UHFFFAOYSA-M 0.000 description 1
239000004331 potassium propionate Substances 0.000 description 1
235000010332 potassium propionate Nutrition 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
239000000047 product Substances 0.000 description 1
239000002994 raw material Substances 0.000 description 1
239000012266 salt solution Substances 0.000 description 1
159000000000 sodium salts Chemical class 0.000 description 1
239000001433 sodium tartrate Substances 0.000 description 1
229960002167 sodium tartrate Drugs 0.000 description 1
235000011004 sodium tartrates Nutrition 0.000 description 1
ANOBYBYXJXCGBS-UHFFFAOYSA-L stannous fluoride Chemical compound F[Sn]F ANOBYBYXJXCGBS-UHFFFAOYSA-L 0.000 description 1
229960002799 stannous fluoride Drugs 0.000 description 1
239000000758 substrate Substances 0.000 description 1
229910001432 tin ion Inorganic materials 0.000 description 1
238000004065 wastewater treatment Methods 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)

JP5856785A 1985-03-25 1985-03-25 無電解すずめつき浴とその使用方法 Granted JPS61217582A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP5856785A JPS61217582A (ja)	1985-03-25	1985-03-25	無電解すずめつき浴とその使用方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP5856785A JPS61217582A (ja)	1985-03-25	1985-03-25	無電解すずめつき浴とその使用方法

Publications (2)

Publication Number	Publication Date
JPS61217582A JPS61217582A (ja)	1986-09-27
JPH0250990B2 true JPH0250990B2 (fr)	1990-11-06

Family

ID=13088018

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP5856785A Granted JPS61217582A (ja)	1985-03-25	1985-03-25	無電解すずめつき浴とその使用方法

Country Status (1)

Country	Link
JP (1)	JPS61217582A (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE644713T1 (de) *	1992-06-02	1996-01-18	Ibiden Co Ltd	Mit loetmetall vorbeschichtete leiterplatte und verfahren zur herstellung.
JPH06181381A (ja) *	1992-12-11	1994-06-28	Nec Corp	はんだ膜形成方法
CN102925878B (zh) *	2012-10-25	2014-09-24	南京大地冷冻食品有限公司	一种常温化学锡镀液

1985
- 1985-03-25 JP JP5856785A patent/JPS61217582A/ja active Granted

Also Published As

Publication number	Publication date
JPS61217582A (ja)	1986-09-27

Publication	Publication Date	Title
US4269625A (en)	1981-05-26	Bath for electroless depositing tin on substrates
US4374876A (en)	1983-02-22	Process for the immersion deposition of gold
US4337091A (en)	1982-06-29	Electroless gold plating
US3032436A (en)	1962-05-01	Method and composition for plating by chemical reduction
JPS5818430B2 (ja)	1983-04-13	無電解メツキ浴およびメツキ方法
JPH0247551B2 (fr)	1990-10-22
US4780342A (en)	1988-10-25	Electroless nickel plating composition and method for its preparation and use
US3436233A (en)	1969-04-01	Method and composition for autocatalytically depositing copper
TW200416299A (en)	2004-09-01	Electroless gold plating solution
US5435838A (en)	1995-07-25	Immersion plating of tin-bismuth solder
CA1188458A (fr)	1985-06-11	Dorure sans electrolyse
US6911230B2 (en)	2005-06-28	Plating method
US3274022A (en)	1966-09-20	Palladium deposition
US3697296A (en)	1972-10-10	Electroless gold plating bath and process
US4474838A (en)	1984-10-02	Electroless direct deposition of gold on metallized ceramics
US3915718A (en)	1975-10-28	Chemical silver bath
EP0156167A2 (fr)	1985-10-02	Procédé de dépôt chimique de métaux
JPH0250990B2 (fr)	1990-11-06
US3305389A (en)	1967-02-21	Process of coating lead with tin
US3667991A (en)	1972-06-06	Processes for nickel plating metals
JPH0214430B2 (fr)	1990-04-09
US5296268A (en)	1994-03-22	Pretreatment process of tin lead plating
JP2004323963A (ja)	2004-11-18	金めっき液
JP2000345359A (ja)	2000-12-12	無電解金めっき液
JPS6141774A (ja)	1986-02-28	水性・無電解ニツケル改良浴及び方法