JPH0250412A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPH0250412A JPH0250412A JP20127088A JP20127088A JPH0250412A JP H0250412 A JPH0250412 A JP H0250412A JP 20127088 A JP20127088 A JP 20127088A JP 20127088 A JP20127088 A JP 20127088A JP H0250412 A JPH0250412 A JP H0250412A
- Authority
- JP
- Japan
- Prior art keywords
- printing
- semiconductor device
- dust
- printing surface
- hot air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000007639 printing Methods 0.000 claims abstract description 31
- 238000004140 cleaning Methods 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- 239000000428 dust Substances 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 3
- 238000007664 blowing Methods 0.000 abstract description 2
- 238000007667 floating Methods 0.000 abstract description 2
- 238000010792 warming Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 1
- 230000001684 chronic effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の製造装置に関し、とくに半導体装
置用印刷前処理工程を含む半導体装置の製造装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for manufacturing a semiconductor device, and more particularly to an apparatus for manufacturing a semiconductor device including a printing pretreatment process for semiconductor devices.
従来の半導体装置用印刷前処理装置は、第２図に示すよ
うに、レール１にて搬送された半導体装置２の表面と平
行な回転軸を持つ横型ブラシ１３を回転させることによ
り、半導体装置２の印刷面に付着しているごみの除去を
行い、しかる後にマーク等の印刷を行っていた。なお、
ブラシ３の軸はモータ４の軸に直結されている。As shown in FIG. 2, the conventional printing pre-processing device for semiconductor devices rotates a horizontal brush 13 having a rotation axis parallel to the surface of the semiconductor device 2 transported on the rail 1, thereby cleaning the semiconductor device 2. The dust adhering to the printed surface was removed, and then marks, etc., were printed. In addition,
The shaft of the brush 3 is directly connected to the shaft of the motor 4.
上述した従来のブラッシング機構は、印刷面とブラシ軸
が平行なため、回転振れ、接触量が少ないなどの問題が
あり、印刷面のごみをうまく除去できず、印刷不良が慢
性化しているという欠点があった。The conventional brushing mechanism described above has problems such as rotational vibration and small amount of contact because the printing surface and the brush axis are parallel, and the disadvantage is that it cannot remove dust from the printing surface effectively, resulting in chronic printing defects. was there.
本発明の目的は、半導体装置の印刷不良を起すことのな
い、印刷性の良い半導体装置の製造装置を提供すること
にある。SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus for manufacturing semiconductor devices with good printability and without causing printing defects in semiconductor devices.
本発明は、半導体装置の表面に印刷を行う前の前処理工
程を含む半導体装置の製造装置において、前記半導体装
置の表面を清浄する手段と、しかる後に該半導体装置の
表面を熱する手段とを有している。The present invention provides a semiconductor device manufacturing apparatus including a pretreatment step before printing on the surface of the semiconductor device, which includes means for cleaning the surface of the semiconductor device and means for subsequently heating the surface of the semiconductor device. have.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.
第１図において、印刷前の半導体装置２が送り込まれる
レール１の上部に、印刷面のごみを除去する、ブラシ３
．エアーブロー５及び浮遊しているごみをファン８によ
って吸い込む吸引ダクト７、さらに印刷面を温めるため
のホットエアロを設ける。In FIG. 1, a brush 3 for removing dust from the printing surface is placed on the top of the rail 1 into which the semiconductor device 2 is fed before printing.
．． An air blow 5, a suction duct 7 for sucking floating dust by a fan 8, and a hot air heater for warming the printing surface are provided.
印刷前の半導体装置２がレール１に送り込まれるとモー
タ４に直結した竪型ブラシ３の面接触回転により、印刷
面に付着したごみは除去され、同時に、エアーブロー５
によりごみを吹き飛ばし、ファン８を回転させ、吸引ダ
クト７で吸引する。When the semiconductor device 2 before printing is sent onto the rail 1, dust adhering to the printing surface is removed by surface contact rotation of the vertical brush 3 directly connected to the motor 4, and at the same time, the air blow 5
The dust is blown away, the fan 8 is rotated, and the suction duct 7 sucks the dust.
しかる後にホットエアロによって印刷面を温め、次工程
で印刷を行う。After that, the printing surface is heated using hot air, and printing is carried out in the next process.
以上説明したように本発明は、竪型ブラシを使用するこ
とにより、印刷面とブラシの接触量が大きくなり、さら
に、エアーブローと吸引ダクトによって印刷質に付着し
たごみを多く除去できる。As explained above, in the present invention, by using a vertical brush, the amount of contact between the printing surface and the brush is increased, and furthermore, the air blow and suction duct can remove a large amount of dust attached to the print quality.
従って、従来装置に比べ、印刷面のごみ付着による印刷
不良が少なくなるという効果がある。また、ホットエア
を吹きつけ、印刷面を温めることにより、印刷性も良好
となる効果もある。Therefore, compared to conventional devices, there is an effect that printing defects due to dust adhesion on the printing surface are reduced. Furthermore, by blowing hot air to warm the printing surface, there is also the effect of improving printability.
第１図は本発明の一実施例を示す斜視図、第２図は従来
の半導体装置の製造装置の一例を示す斜視図である。
１・・・レール、２・・・半導体装置、３・・・竪型ブ
ラシ、４・・・モータ、５・・・エアーブロー、６・・
・ホットエア、７・・・吸引ダクト、８・・・ファン、
１３・・・横型ブラシ。FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing an example of a conventional semiconductor device manufacturing apparatus. DESCRIPTION OF SYMBOLS 1...Rail, 2...Semiconductor device, 3...Vertical brush, 4...Motor, 5...Air blow, 6...
・Hot air, 7... Suction duct, 8... Fan,
13...Horizontal brush.
Claims (1)
半導体装置の製造装置において、前記半導体装置の表面
を清浄する手段と、しかる後に該半導体装置の表面を熱
する手段とを有することを特徴とする半導体装置の製造
装置。A semiconductor device manufacturing apparatus including a pretreatment step before printing on the surface of the semiconductor device, characterized by comprising means for cleaning the surface of the semiconductor device and means for subsequently heating the surface of the semiconductor device. Manufacturing equipment for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20127088A JP2702169B2 (en) | 1988-08-12 | 1988-08-12 | Semiconductor device manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20127088A JP2702169B2 (en) | 1988-08-12 | 1988-08-12 | Semiconductor device manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0250412A true JPH0250412A (en) | 1990-02-20 |
| JP2702169B2 JP2702169B2 (en) | 1998-01-21 |
Family
ID=16438172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20127088A Expired - Fee Related JP2702169B2 (en) | 1988-08-12 | 1988-08-12 | Semiconductor device manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2702169B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109595575A (en) * | 2018-12-08 | 2019-04-09 | 万天霞 | Full-automatic blowing apparatus for ash for biomass boiler soot blower system |
-
1988
- 1988-08-12 JP JP20127088A patent/JP2702169B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109595575A (en) * | 2018-12-08 | 2019-04-09 | 万天霞 | Full-automatic blowing apparatus for ash for biomass boiler soot blower system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2702169B2 (en) | 1998-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |