JPH0250214A - Touch panel - Google Patents
Touch panelInfo
- Publication number
- JPH0250214A JPH0250214A JP63223778A JP22377888A JPH0250214A JP H0250214 A JPH0250214 A JP H0250214A JP 63223778 A JP63223778 A JP 63223778A JP 22377888 A JP22377888 A JP 22377888A JP H0250214 A JPH0250214 A JP H0250214A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- film
- conductive
- insulating
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Abstract
Description
【発明の詳細な説明】
発明の技術分野
本発明は、コンピューターなどの入力時に使用されるタ
ッチパネルに関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a touch panel used for inputting information into a computer or the like.
発明の技術的背景ならびにその問題点
コンピューターの入力機器は、多数開発されている。そ
の代表的なものに、キーボード、トラックボール、マウ
ス、感圧パッド、デジタイザータッチパネルがある。と
ころが、表示画面を見ながら直接表示画面上で所定の情
報を人力できるタッチパネルは、他の入力機器より使い
やすく便利なことが多い。Technical background of the invention and its problems Many input devices for computers have been developed. Typical examples include keyboards, trackballs, mice, pressure-sensitive pads, and digitizer touch panels. However, touch panels, which allow users to input specific information directly on a display screen while looking at the display screen, are often easier to use and more convenient than other input devices.
代表的なタッチパネルとしては、マトリックス型とアナ
ログ型がある。マトリックス型のタッチパネルでは、透
明絶縁基材上の透明電極を短冊状にエツチング加工した
物を二枚用い、これらの間にスペーサーを介在させ、前
記透明電極を縦と横に交差させて対向させている。また
、アナログ型のタッチパネルでは、透明電極を短冊状に
加工せずに、透明電極の両端に銀ペーストなどで電極を
設け、これら透明電極間にスペーサーを介在して縦横に
対向させて、アナログ／デジタル（Ａ／Ｄ）変換器で位
置座標を検出するようにしている。マトリックス型は、
短冊の幅によって位置検出分解能が左右されるため、文
字・図形入力時に適さず、もっばらタッチスイッチ的に
使用される。これに対して、アナログ型は、Ａ／Ｄ変換
器の能力により、高分解能が期待できるため、文字・図
形入力の主流になっている。Typical touch panels include matrix type and analog type. A matrix-type touch panel uses two sheets of transparent electrodes etched into strips on a transparent insulating base material, a spacer is interposed between them, and the transparent electrodes are crossed vertically and horizontally to face each other. There is. In addition, in analog type touch panels, the transparent electrodes are not processed into strips, but electrodes are provided at both ends of the transparent electrodes using silver paste, etc., and spacers are interposed between these transparent electrodes to make them face each other vertically and horizontally. The position coordinates are detected using a digital (A/D) converter. The matrix type is
Since the position detection resolution is affected by the width of the strip, it is not suitable for inputting characters and graphics, and is mostly used as a touch switch. On the other hand, the analog type is expected to provide high resolution due to the ability of the A/D converter, so it has become the mainstream for inputting characters and graphics.
ところが、このようなアナログ型のタッチパネルにあっ
ては、誤入力などを防止するために透明電極間に絶縁体
であるスペーサーを印刷などの手段で介在させる必要が
あるが、これでは、スペーサ一部分での入力ができない
。またスペーサーの幅が広いため分解能が制限され、高
精細な文字、あるいは図形の入力は不可能であった。さ
らにスペーサーは幅が広いため透明電極の透明性を低下
し易く、それを防止するには、スペーサー同士の間隔を
大きくしなければならなかった。ところがそのために、
透明絶縁基材のたわみが発生したり、誤ってタッチパネ
ルに触れた際（以下誤入力という）スペーサーによって
保たれる間隙がなくなったりして、透明電極同士が接触
し、誤動作を起こすこともあった。However, in such analog touch panels, it is necessary to insert a spacer, which is an insulator, between the transparent electrodes by printing or other means in order to prevent erroneous input. cannot be entered. Furthermore, the wide width of the spacer limited the resolution, making it impossible to input high-definition characters or figures. Furthermore, since the spacers are wide, they tend to reduce the transparency of the transparent electrode, and to prevent this, it is necessary to increase the distance between the spacers. However, for that reason,
The transparent insulating base material may sag, or when the touch panel is accidentally touched (hereinafter referred to as erroneous input), the gap maintained by the spacer may disappear, causing the transparent electrodes to come into contact with each other, causing malfunctions. .
さらに、このようなアナログ型のタッチパネルは、入力
時に加えられる圧力、あるいは、透明電極の接触時に生
じるアークによって、透明電極が傷ついたり、あるいは
透明電極の表面抵抗が悪くなったりして、電極としての
機能が保てなくなることもあった。Furthermore, in such analog touch panels, the pressure applied during input or the arc generated when the transparent electrodes come into contact can damage the transparent electrodes, or deteriorate the surface resistance of the transparent electrodes, making them difficult to use as electrodes. Sometimes it could no longer function properly.
発明の目的
本発明は、上記のようなアナログ型のタッチパネルにお
ける従来技術に伴う問題点を主として解決するものであ
る。すなわち、高精細な文字・図形などの人力を可能と
するにもかかわらず、誤人力が少なく、耐久性に優れた
タッチパネルの提供を目的としている。OBJECTS OF THE INVENTION The present invention primarily solves the problems associated with the prior art in analog touch panels as described above. In other words, the objective is to provide a touch panel that is highly durable and less likely to be erroneously applied, even though it allows manual input of high-definition characters and graphics.
発明の概要
本発明に係るタッチパネルは、絶縁基材の一方の表面に
主として抵抗膜からなる導電層が形成された２枚の基材
を用い、それぞれの導電層を対向させ、略平行で所定の
間隔に配置し、いずれか−方の前記基材の一部を押圧す
ることにより、該導電層同士の一部を接触して電気的に
導通させ、高精細な文字・図形を入力するものであって
、以下の構成の導電層を有する基材を組み合わせた構造
からなることを特徴としている。Summary of the Invention A touch panel according to the present invention uses two base materials in which a conductive layer mainly made of a resistive film is formed on one surface of an insulating base material, and the conductive layers are made to face each other and arranged in substantially parallel and predetermined directions. By placing the conductive layers at intervals and pressing a part of one of the base materials, parts of the conductive layers are brought into contact with each other and electrically conductive, thereby inputting high-definition characters and figures. It is characterized by having a structure in which base materials having conductive layers having the following configuration are combined.
まず基材は、次の１〜■である。First, the base materials are the following 1 to 2.
基材ｌ：絶縁基材の表面に抵抗膜を形成したもの。Base material 1: An insulating base material with a resistive film formed on its surface.
基材■：絶縁基材の表面に、導電粒子が分散した抵抗膜
を形成し、しかも抵抗膜表面に導電粒子の一部が露出し
ているもの。Base material ■: A resistive film in which conductive particles are dispersed is formed on the surface of an insulating base material, and a portion of the conductive particles are exposed on the surface of the resistive film.
基材■；基材■の上に、絶縁粒子が分散した被膜を形成
し、しかも被膜表面に絶縁粒子あるいは導電粒子と絶縁
粒子の一部が露出第７ているもの。Base material (1): A film in which insulating particles are dispersed is formed on the base material (2), and part of the insulating particles or conductive particles and insulating particles are exposed on the surface of the film.
基材■：箔基材の上に、導電粒子が分散した導電粒子分
散膜を形成し、しかも導電粒子分散膜表面に導電粒子の
一部が露出しているもの。Base material (2): A conductive particle-dispersed film in which conductive particles are dispersed is formed on a foil base material, and some of the conductive particles are exposed on the surface of the conductive particle-dispersed film.
基材Ｖ：基材■の上に、絶縁粒子が分散した絶縁粒子分
散膜を形成し、しかも絶縁粒子分散膜表面に絶縁粒子あ
るいは導電粒子と絶縁粒子の一部が露出しているもの。Base material V: An insulating particle dispersed film in which insulating particles are dispersed is formed on the base material (1), and insulating particles or conductive particles and a portion of the insulating particles are exposed on the surface of the insulating particle dispersed film.
基材■：絶縁基材の表面に、絶縁粒子が分散した抵抗膜
を形成し、しかも抵抗膜表面に絶縁粒子の一部が露出し
ているもの。Base material ■: A resistive film in which insulating particles are dispersed is formed on the surface of an insulating base material, and some of the insulating particles are exposed on the surface of the resistive film.
基材■２基材Ｉの上に、絶縁粒子が分散した導電性の絶
縁粒子分散膜を形成し、しかも導電性の絶縁粒子分散膜
表面に絶縁粒子の一部が露出しているもの。Base material (1) 2 A conductive insulating particle dispersed film in which insulating particles are dispersed is formed on the base material I, and a portion of the insulating particles are exposed on the surface of the conductive insulating particle dispersed film.
基材■：絶縁基材の表面に、絶縁粒子と導電粒子とが分
散した抵抗膜を形成し、しかも抵抗膜表面に絶縁粒子お
よび導電粒子の一部が露出しているもの。Substrate ■: A resistive film in which insulating particles and conductive particles are dispersed is formed on the surface of an insulating base material, and a portion of the insulating particles and conductive particles are exposed on the surface of the resistive film.
基材■：基材■の上に、絶縁粒子と導電粒子とが分散し
た被膜を形成し、しかも被膜表面に絶縁粒子および導電
粒子の一部が露出しているもの。Base material (■): A film in which insulating particles and conductive particles are dispersed is formed on the base material (2), and a portion of the insulating particles and conductive particles are exposed on the surface of the film.
ただし、絶縁粒子を含む基材では、露出している絶縁粒
子の先端が導電層の頂点でなければならない。すなわち
、導電層に絶縁粒子と導電粒子とが含まれる場合には、
絶縁粒子の露出による突出高さは、導電粒子の露出によ
る突出さよりも大きくなければならない。絶縁粒子の絶
縁機能を有効に作用させるためである。However, in a base material containing insulating particles, the exposed tip of the insulating particle must be the top of the conductive layer. That is, when the conductive layer contains insulating particles and conductive particles,
The protrusion height due to exposure of the insulating particles must be greater than the protrusion height due to exposure of the conductive particles. This is to make the insulating function of the insulating particles work effectively.
本発明に係る第１のタッチパネル（以下本第１タツチパ
ネルという）は、一方の基材として基材■を用い、他方
の基材として基材Ｉ〜■のうちから選ばれる一種を組み
合わせた構造からなる。The first touch panel according to the present invention (hereinafter referred to as the first touch panel) has a structure in which the base material ■ is used as one base material, and one type selected from the base materials I to ■ is used as the other base material. Become.
本発明に係る第２のタッチパネル（以下本第２タツチパ
ネルという）は、一方の基材として基材Ｖを用い、他方
の基材として基材Ｉ、■、■、Ｖ〜■のうちから選ばれ
る一種を組み合わせた構造からなる。The second touch panel according to the present invention (hereinafter referred to as the second touch panel) uses a base material V as one base material, and a base material selected from among base materials I, ■, ■, V~■ as the other base material. It consists of a structure that combines one type of structure.
本発明に係る第３のタッチパネル（以下本第３タツチパ
ネルという）は、一方の基材として基材■を用い、他方
の基材として基材１、■、■、■〜■のうちから選ばれ
る一種を組み合わせた構造からなる。The third touch panel according to the present invention (hereinafter referred to as the third touch panel) uses base material ■ as one base material, and base material 1 selected from among base materials 1, ■, ■, and ■ to ■ as the other base material. It consists of a structure that combines one type of structure.
本発明に係る第４のタッチパネル（以下本第４タツチパ
ネルという）は、一方の基材として基材■を用い、他方
の基材として基材■、■、■、■〜■のうちから選ばれ
る一種を組み合わせた構造からなる。The fourth touch panel according to the present invention (hereinafter referred to as the fourth touch panel) uses a base material ■ as one base material, and a base material selected from among base materials ■, ■, ■, and ■ to ■ as the other base material. It consists of a structure that combines one type of structure.
本発明に係る第５のタッチパネル（以下本第５タツチパ
ネルという）は、一方の基材として基材■を用い、他方
の基材として基材Ｉ、■、■、■、■のうちから選ばれ
る一種を組み合わせた構造からなる。The fifth touch panel according to the present invention (hereinafter referred to as the fifth touch panel) uses a base material ■ as one base material, and a base material selected from among base materials I, ■, ■, ■, and ■ as the other base material. It consists of a structure that combines one type of structure.
本発明に係る第６のタッチパネル（以下本第６タツチパ
ネルという）は、一方の基材として基材■を用い、他方
の基材として基材Ｉ、■、■、■のうちから選ばれる一
種を組み合わせた構造からなる。The sixth touch panel according to the present invention (hereinafter referred to as the sixth touch panel) uses a base material ■ as one base material, and a type selected from base materials I, ■, ■, ■ as the other base material. It consists of a combined structure.
本第１〜第６タツチパネルでは、絶縁粒子が従来のタッ
チパネルにおけるスペーサーの作用をなすため、誤入力
を有効に防止できる。しかも、絶縁粒子および導電粒子
は、微小な粒径であるため、従来のタッチパネルに比較
して分解能が向上し、高精細な文字・図形の人力が可能
である。本第１〜第６タツチパネルを製造するには、予
め導電粒子が均一に分散した抵抗膜形成用塗料および導
電粒子分散膜形成用塗料あるいは被膜形成用塗料と、絶
縁粒子が均一に分散した抵抗膜形成用塗料および絶縁粒
子分散膜形成用塗料あるいは被膜形成用塗料を用意する
。次に各塗料を前記基材Ｉ〜■の構造にそって絶縁基材
上に塗布すれば良い。そのため従来のタッチパネルのよ
うに、後工程でスペーサーだけをドツト状に印刷する必
要がない。In the first to sixth touch panels, the insulating particles function as spacers in conventional touch panels, so that erroneous input can be effectively prevented. Furthermore, since the insulating particles and conductive particles have minute particle sizes, the resolution is improved compared to conventional touch panels, and high-definition characters and graphics can be created manually. In order to manufacture the first to sixth touch panels, a resistive film-forming paint, a conductive particle-dispersed film-forming paint, or a film-forming paint in which conductive particles are uniformly dispersed, and a resistive film in which insulating particles are uniformly dispersed are used. Prepare a paint for forming a coating, a paint for forming an insulating particle dispersed film, or a coating for forming a film. Next, each coating material may be applied onto the insulating base material along the structure of the base materials I to (2). Therefore, unlike conventional touch panels, there is no need to print just the spacers in a dot shape in a later process.
また、本第１〜第６タツチパネルは、抵抗膜同士が直接
接触しないので、誤入力による誤動作等を確実に防止で
きる構造となっている。さらに、対向する一方の絶縁基
材で膜が形成された側の表面抵抗値を、他方の絶縁基材
で膜が形成された側の表面抵抗値以上に設定し、高い抵
抗値を有する抵抗膜側に電源を接続するように本第１〜
第６タツチパネルを構成すれば、従来のタッチパネルで
抵抗膜同士の接触時に生じていたアークを有効に防止す
ることができる。そのため抵抗膜が傷ついたり、剥がれ
たり、あるいはその表面抵抗が悪くなったりしないので
、長期間使用することができ、従来のタッチパネルと比
較して耐久性が大幅に向上する。Furthermore, since the resistive films of the first to sixth touch panels do not come into direct contact with each other, they have a structure that can reliably prevent malfunctions caused by erroneous inputs. Furthermore, the surface resistance value of the side on which the film is formed on one of the opposing insulating base materials is set to be higher than the surface resistance value on the side on which the film is formed on the other insulating base material, and the resistive film has a high resistance value. Book 1 to connect the power supply to the side
By configuring the sixth touch panel, it is possible to effectively prevent arcing that occurs when resistive films come into contact with each other in conventional touch panels. Therefore, the resistive film will not be damaged, peeled off, or its surface resistance will deteriorate, so it can be used for a long period of time, and its durability is significantly improved compared to conventional touch panels.
発明の詳細な説明
以下、本第１〜第６タツチパネルを図面に示す実施例を
参照しつつ説明する。DETAILED DESCRIPTION OF THE INVENTION Hereinafter, the first to sixth touch panels will be described with reference to embodiments shown in the drawings.
まず本第１〜第６タツチパネルに使用される基材Ｉ〜■
について説明する。第１図〜第９図は、基材Ｉ〜■の要
部断面図である。First of all, the base material I~■ used for the first to sixth touch panels
I will explain about it. FIGS. 1 to 9 are cross-sectional views of main parts of base materials I to (2).
第１図は、基材Ｉを示し、絶縁基材４，５の表面に所定
膜厚の抵抗膜６，７を形成している。FIG. 1 shows a base material I, in which resistive films 6 and 7 of a predetermined thickness are formed on the surfaces of insulating base materials 4 and 5.
第２図は、基材■を示し、絶縁基材４，５の表面に導電
粒子１５が分散した抵抗膜６，７を形成している。FIG. 2 shows a base material (2), in which resistive films 6, 7 in which conductive particles 15 are dispersed are formed on the surfaces of insulating base materials 4, 5.
第３図は、基材■を示し、絶縁基材４．５の表面に導電
粒子１５が分散した抵抗膜６，７を形成しく基材Ｉ）１
、さらにその上に、絶縁粒子１４が分散し、絶縁粒子１
４および導電粒子１５の一部が表面に露出する膜厚を有
する被［１２を形成している。FIG. 3 shows a base material (I) 1 in which resistive films 6 and 7 in which conductive particles 15 are dispersed are formed on the surface of an insulating base material 4.5.
, and further thereon, insulating particles 14 are dispersed, and insulating particles 1
4 and a portion of the conductive particles 15 form a coating [12] having a thickness such that a portion of the conductive particles 15 is exposed on the surface.
ただし、導電性を有した被膜１２の場合には、被膜１２
の表面に導電粒子１５が露出しなくても良い。However, in the case of the coating 12 having conductivity, the coating 12
The conductive particles 15 do not need to be exposed on the surface.
第４図は、基材■を示し、絶縁基材４，５の表面に所定
膜厚の抵抗膜６を形成しく基材Ｉ）、さらにその上に導
電粒子１５が分散した導電粒子分散膜８を形成している
。FIG. 4 shows a base material (I) on which a resistive film 6 of a predetermined thickness is formed on the surfaces of insulating base materials 4 and 5, and a conductive particle dispersed film 8 on which conductive particles 15 are dispersed. is formed.
第５図は、基材Ｖを示し、絶縁基材４，５の表面に所定
膜厚の抵抗膜６を形成し、その上に導電粒子１５が分散
した導電粒子分散膜８を形成している（基材■）。さら
にその上に絶縁粒子１４が分散し、絶縁粒子１４および
導電粒子１５の一部が表面に露出する膜厚を有する絶縁
粒子分散膜９を形成している。FIG. 5 shows a base material V, on which a resistive film 6 of a predetermined thickness is formed on the surfaces of insulating base materials 4 and 5, and a conductive particle dispersed film 8 in which conductive particles 15 are dispersed is formed thereon. (Base material ■). Furthermore, insulating particles 14 are dispersed thereon to form an insulating particle dispersed film 9 having a thickness such that some of the insulating particles 14 and conductive particles 15 are exposed on the surface.
ただし、導電性を有した絶縁粒子分散膜９の場合には、
絶縁粒子分散膜９の表面に導電粒子１５が露出しなくて
も良い。However, in the case of the insulating particle dispersed film 9 having conductivity,
The conductive particles 15 do not need to be exposed on the surface of the insulating particle dispersed film 9.
第６図は、基材■を示し、絶縁基材４，５の表面に絶縁
粒子１４が分散した抵抗膜６，７を形成している。FIG. 6 shows the base material (2), in which resistive films 6, 7 in which insulating particles 14 are dispersed are formed on the surfaces of the insulating base materials 4, 5.
１ｆｉ７図は、基材■を示し、絶縁基材４，５の表面に
所定膜厚の抵抗膜６（７）を形成しく基材Ｉ）、さらに
その上に絶縁粒子１４が分散した導電性の絶縁粒子分散
８９を形成している。Figure 1fi7 shows a base material (I) on which a resistive film 6 (7) of a predetermined thickness is formed on the surface of the insulating base materials 4 and 5, and a conductive material on which insulating particles 14 are dispersed. Insulating particle dispersion 89 is formed.
第８図は、基材■を示し、絶縁基材４．５の表面に絶縁
粒子１４および導電粒子１５が分散した抵抗膜６，７を
形成している。FIG. 8 shows a base material (2), in which resistive films 6, 7 in which insulating particles 14 and conductive particles 15 are dispersed are formed on the surface of an insulating base material 4.5.
第９図は、基材■を示し、絶縁基材４，５の表面に所定
膜厚の抵抗膜６を形成しく基材Ｉ）、さらにその上に絶
縁粒子１４および導電粒子１５が分散した被膜１２を形
成している。FIG. 9 shows a base material (I) in which a resistive film 6 of a predetermined thickness is formed on the surfaces of insulating base materials 4 and 5, and a coating on which insulating particles 14 and conductive particles 15 are dispersed. 12 is formed.
基材■、Ｖ〜■の基材では、露出している絶縁粒子１４
の先端が導電層の頂点でなければならない。すなわち、
導電層に絶縁粒子と導電粒子とが含まれる場合には、絶
縁粒子の露出による突出高さは、導電粒子の露出による
突出さよりも大きくなければならない。絶縁粒子の絶縁
機能を有効に作用させるためである。In the base material (■) and the base material (V) to (■), the exposed insulating particles 14
The tip of the conductive layer must be at the top of the conductive layer. That is,
When the conductive layer includes insulating particles and conductive particles, the protrusion height due to exposure of the insulating particles must be greater than the protrusion height due to exposure of the conductive particles. This is to make the insulating function of the insulating particles work effectively.
以下、基材１〜■に使用される絶縁基材、導電粒子、絶
縁粒子、抵抗膜、被膜、導電粒子分散膜、絶縁粒子分散
膜について説明する。The insulating base material, conductive particles, insulating particles, resistive film, film, conductive particle dispersion film, and insulating particle dispersion film used in base materials 1 to (2) will be described below.
絶縁基材は、板状であって、その材質としては、ガラス
製あるいはプラスチック製のものが使用できる。絶縁基
材は、透明のものでも不透明のものでも良いが、本第１
〜第６タツチパネルを表示装置等の上に配置して使用す
る時には、透明のものを用いる。その際には、抵抗膜、
被膜、導電粒子分散膜、絶縁粒子分散膜も透明なものを
使用する。The insulating base material is plate-shaped and can be made of glass or plastic. The insulating base material may be transparent or opaque;
~When using the sixth touch panel by placing it on a display device, etc., use a transparent one. In that case, resistive film,
Transparent coatings, conductive particle-dispersed films, and insulating particle-dispersed films are also used.
基材■〜■を適宜に組み合わせて構成される本第１〜第
６タツチパネルは、一方の絶縁基材を押圧して、当該絶
縁基材を撓ませ、絶縁基材上に形成された導電層を介し
て、対向する抵抗膜同士を一部接触させることで電気的
に導通させる構造である。したがって、基材Ｉ〜■を組
み合わせる際に、いずれか一方の絶縁基材は、可撓性を
有しているものを用いる。たとえばプラスチックフィル
ムあるいはプラスチックシートが好適である。The first to sixth touch panels, which are constructed by appropriately combining the base materials ■ to ■, are constructed by pressing one insulating base material to bend the insulating base material, and forming a conductive layer formed on the insulating base material. This is a structure in which opposing resistive films are electrically connected by partially contacting each other via the resistive film. Therefore, when combining the base materials I to (2), one of the insulating base materials is flexible. For example, plastic films or sheets are suitable.
次に導電粒子としては、それぞれの基材に形成される抵
抗膜、導電性を有さない被膜、導電粒子分散膜、導電性
を有さない絶縁粒子分散膜の各膜中に埋没しないように
、粒径を選択する。Next, as for conductive particles, be careful not to embed them in the resistive film, non-conductive film, conductive particle dispersed film, and non-conductive insulating particle dispersed film formed on each base material. , select the particle size.
同様に絶縁粒子もそれぞれの基材に形成される抵抗膜、
被膜、絶縁粒子分散膜の各膜中に埋没しないように、粒
径を選択する。Similarly, the insulating particles are also a resistive film formed on each base material,
The particle size is selected so as not to be buried in each film of the coating and the insulating particle dispersed film.
導電粒子は、電気抵抗の小さなものならばなんでも良い
が、好ましくは１００Ω・■以下、特に好ましくは１０
’Ω・（７）以下のものが良い。具体的には、Ａυ、Ａ
ｇ、Ｐｔ、Ｐｄ等の貴金属粒子、Ｓ ｎ ％ Ｃ［１％
Ｎ ｉ 、−Ｚ ｎ Ｎ Ｆ Ｏ％ Ｐ ｂ等の金属
粒子または前記貴金属、金属の合金が使用できる。The conductive particles may be of any type as long as they have a small electrical resistance, but preferably 100 Ω・■ or less, particularly preferably 10
'Ω・(7) or less is good. Specifically, Aυ, A
g, noble metal particles such as Pt, Pd, S n % C [1%
Metal particles such as Ni, -ZnNFO%Pb, or alloys of the above-mentioned noble metals and metals can be used.
また、貴金属・金属が無機物の粒子や樹脂粒子に鍍金さ
れたものでも使用することができる。Furthermore, inorganic particles or resin particles plated with noble metals can also be used.
抵抗膜または導電粒子分散膜あるいは被膜に含まれる導
電粒子間の距離ｄ２は、導電層が導電性を有さない被膜
、導電性を有さない導電粒子分散膜あるいは導電性を有
さない絶縁粒子分散膜を有する場合には、６２５３００
μｍが好ましい。The distance d2 between the conductive particles included in the resistive film or conductive particle dispersed film or coating is determined by the distance d2 between the conductive particles included in the resistive film or the conductive particle dispersion film or the film in which the conductive layer has no conductivity, the conductive particle dispersed film without conductivity, or the insulating particles without conductivity. 625300 if it has a dispersion membrane
μm is preferred.
３００μｍを超えると、入力できない部分がでてくるた
めである。また透明性の要求される用途では、５μ°ｍ
≦ｄ２が好ましい。５μｍ未満であると、基材■〜■の
全光線透過率およびヘーズ等の透明性が維持できない。This is because if it exceeds 300 μm, there will be parts where input cannot be made. In addition, in applications requiring transparency, 5μ°m
≦d2 is preferred. If it is less than 5 μm, the total light transmittance and transparency such as haze of the base materials (1) to (2) cannot be maintained.
絶縁粒子は、本第１〜第６タツチパネルの対向する抵抗
膜同士が常に接触しないように、両抵抗膜の間隙を保た
せるものである。その体積抵抗が１０ Ω・Ｃ以上好ま
しくは１０１２Ω・Ｃ以上のものが良い。絶縁粒子の材
質としては、樹脂あるいは無機物のものが使用できる。The insulating particles maintain a gap between the opposing resistive films of the first to sixth touch panels so that they do not always come into contact with each other. The volume resistivity is preferably 10 Ω·C or more, preferably 10 12 Ω·C or more. As the material of the insulating particles, resin or inorganic material can be used.
樹脂としては、熱可塑性樹脂、熱硬化性樹脂、紫外線硬
化性樹脂のいずれでも使用できる。また無機物としては
、酸化物、炭化物、窒化物が使用できる。As the resin, any of thermoplastic resins, thermosetting resins, and ultraviolet curable resins can be used. Further, as the inorganic substance, oxides, carbides, and nitrides can be used.
これら樹脂または無機物は、一種あるいは二種組み合わ
せて使用することが可能であり、または両者を混合して
も良い。前述したように、絶縁粒子の粒径は、抵抗膜、
被膜および絶縁粒子分散膜よりも大きいものを選択する
。さらに、それぞれの粒径が抵抗膜、被膜および絶縁粒
子分散膜より大きいならば、粒径の違う数種の絶縁粒子
を組み合わせて使用することもできる。この場合、タッ
チパネルの透明性や絶縁性を向上できたり、入力時の荷
重が入力面内のいずれの座標でも一定になったりするな
どの利点が生ずる。これは粒径の比較的小さい方の絶縁
粒子（小粒径の絶縁粒子）が、粒径の比較的大きい方の
絶縁粒子（大粒径の絶縁粒子）間に都合よく配置され、
この小粒径の絶縁粒子が大粒径の絶縁粒子の絶縁効果を
都合よく補助し、透明性を低下させる原因となる大粒径
の絶縁粒子を減らせるとともに、大粒径の絶縁粒子の間
隔を広くすることができるためである。These resins or inorganic substances can be used singly or in combination, or both may be mixed. As mentioned above, the particle size of the insulating particles depends on the resistance film,
Select one that is larger than the coating and the insulating particle dispersion film. Furthermore, it is also possible to use a combination of several types of insulating particles with different particle sizes, as long as each particle size is larger than the resistive film, coating, and insulating particle dispersed film. In this case, there are advantages such as the transparency and insulation of the touch panel can be improved, and the load during input can be constant at any coordinate on the input surface. This means that insulating particles with a relatively small particle size (small insulating particles) are conveniently arranged between insulating particles with a relatively large particle size (large insulating particles),
These small-sized insulating particles conveniently supplement the insulating effect of the large-sized insulating particles, reducing the number of large-sized insulating particles that cause a decrease in transparency, and the spacing between the large-sized insulating particles. This is because it is possible to widen the area.
抵抗膜または絶縁粒子分散膜あるいは被膜に含まれる絶
縁粒子間の距離ｄ は、ｄ１≦１０００μｍが好ましい
。さらに好ましくは、５００μｍ以下である。１０００
μｍを超えると、導電層を介して抵抗膜同士が常時接触
するためである。また透明性の要求される用途では、３
０μｍ≦ｄ１≦１０００μｍが好ましい。３０μｍ未満
であると、基材■、基材Ｖ〜■の全光線透過率およびヘ
ーズ等の透明性が維持できない。１０００μｍを超える
と、６膜を介して抵抗膜同士が常時接触するためである
。The distance d between the insulating particles included in the resistive film or the insulating particle dispersed film or coating is preferably d1≦1000 μm. More preferably, it is 500 μm or less. 1000
This is because when the thickness exceeds μm, the resistive films are constantly in contact with each other via the conductive layer. In addition, in applications requiring transparency, 3
Preferably, 0 μm≦d1≦1000 μm. If it is less than 30 μm, the transparency such as the total light transmittance and haze of the base material (1) and base materials V to (2) cannot be maintained. This is because when the thickness exceeds 1000 μm, the resistive films are constantly in contact with each other through the six films.
導電粒子あるいは絶縁粒子を６膜に均一に分散させる手
段としては、導電粒子または絶縁粒子を、前記各塗料中
に均一に配合しておき、この塗料を絶縁基材の表面に所
定膜厚に塗布するとよい。As a means of uniformly dispersing conductive particles or insulating particles in the six films, the conductive particles or insulating particles are uniformly mixed in each of the above-mentioned paints, and this paint is applied to the surface of the insulating base material to a predetermined thickness. It's good to do that.
抵抗膜は、蒸着法・スパッタリング法・ＣＶＤ法等の気
相法により、絶縁箔村上に、導電性酸化インジウム膜（
ＩＴＯ膜）、あるいは導電性酸化錫膜（ＮＥＳＡ膜）等
を被着することによって得ることができる。また銀ペー
スト、カーボンペースト等の不透明な電極ペーストある
いは（ａ）導電性酸化インジウムを、（ｂ）バインダー
樹脂（以下抵抗膜用バインダー樹脂という）中に分散し
た抵抗膜形成用塗料を塗布して絶縁箔村上に形成するこ
ともできる。（ａ）導電性酸化インジウムは、特に限定
しない。たとえば、球状粉末、鱗片状物質に導電性酸化
インジウムを被覆したもの、あるいは繊維状物質に導電
性酸化インジウムを被覆したものが使用できる。ただし
、球状粉末を用いる場合には、（ｂ）抵抗膜用バインダ
ー樹脂としてキャリアー移動速度が１０ ＝ｃｄ ／
Ｖ −ｓｅｅ以上のバインダー樹脂を使用する。さらに
（Ｃ）導電粒子および／または（ｄ）絶縁粒子が分散し
た抵抗膜の場合には、前記抵抗膜形成用塗料に（Ｃ）導
電粒子および／または（ｄ）絶縁粒子を混入してやれば
よい。The resistive film is made by depositing a conductive indium oxide film (
It can be obtained by depositing an ITO film) or a conductive tin oxide film (NESA film). In addition, opaque electrode paste such as silver paste or carbon paste or (a) conductive indium oxide and (b) resistive film forming paint dispersed in binder resin (hereinafter referred to as binder resin for resistive film) are applied for insulation. It can also be formed into a foil Murakami. (a) Conductive indium oxide is not particularly limited. For example, a spherical powder, a scaly material coated with conductive indium oxide, or a fibrous material coated with conductive indium oxide can be used. However, when using spherical powder, (b) carrier movement speed as binder resin for resistive film is 10 = cd /
Use a binder resin of V-see or higher. Furthermore, in the case of a resistive film in which (C) conductive particles and/or (d) insulating particles are dispersed, (C) conductive particles and/or (d) insulating particles may be mixed into the resistive film forming coating material.
この抵抗膜形成用塗料で用いられる（ｂ）抵抗膜用バイ
ンダー樹脂としては、熱可塑性樹脂、熱硬化性樹脂、紫
外線硬化性樹脂が使用できる。具体的には、メタクリル
樹脂などのアクリル系樹脂、ユリア樹脂、メラミン樹脂
などのアミノ系樹脂、ポリアミド系樹脂、ポリイミド系
樹脂、ポリアミドイミド系樹脂、ポリウレタン系樹脂、
ポリエーテル系樹脂、アルキッド樹脂などのポリエステ
ル系樹脂、エポキシ系樹脂、塩素化ポリエーテル樹脂な
どの塩素化物系樹脂、ポリエチレン樹脂、ポリプロピレ
ン樹脂などのポリオレフィン系樹脂、ポリカーボネート
系樹脂、シリコーン樹脂、ポリスチレン系樹脂、ＡＢＳ
系樹脂、ポリアミンスルフォン樹脂、ポリエーテルスル
フォン樹脂などのポリスルフォン系樹脂、塩化ビニル樹
脂、塩化ビニリデン樹脂、酢酸ビニル樹脂、ポリビニル
カルバゾール樹脂、ブチラール樹脂などのビニル系樹脂
、フッ素系樹脂、ポリフェニレンオキシド系樹脂、ポリ
ピロール系樹脂、ボリファラフエニレン系樹脂、紫外線
硬化性樹脂あるいはセルロース誘導体などが用いられる
。また、上記樹脂の共重合体等を、一種または二種以上
組み合わせて使用することもできる。またキャリアー移
動速度が１０−８ｃｊ ／ Ｖ−ｓｅｅ以上のバインダ
ー樹脂としては、ポリビロー・ル、ポリアセタール、ポ
リピリジン等の導電性樹脂、あるいはポリビニルカルバ
ゾール、ジフェニルアミノスチレン等の光導電性樹脂な
どが使用できる。キャリアー移動速度が、１０−８ｃｄ
／ Ｖ−ｓｅｅ未満であると、抵抗が高くなりすぎて
、抵抗膜の機能を保てない。さらに前記熱可塑性樹脂、
熱硬化性樹脂、紫外線硬化性樹脂のうちから、一種以上
を抵抗膜用バインダー樹脂と混合すると、抵抗膜形成用
塗料の塗工性を向上させたり、得られる抵抗膜と絶縁基
材との密着性を向上させたりすることができる。As the resistive film binder resin (b) used in this resistive film forming coating, thermoplastic resins, thermosetting resins, and ultraviolet curable resins can be used. Specifically, acrylic resins such as methacrylic resins, amino resins such as urea resins and melamine resins, polyamide resins, polyimide resins, polyamide-imide resins, polyurethane resins,
Polyester resins such as polyether resins and alkyd resins, chlorinated resins such as epoxy resins and chlorinated polyether resins, polyolefin resins such as polyethylene resins and polypropylene resins, polycarbonate resins, silicone resins, and polystyrene resins. , ABS
polysulfone resins such as polyamine sulfone resins and polyether sulfone resins, vinyl resins such as vinyl chloride resins, vinylidene chloride resins, vinyl acetate resins, polyvinyl carbazole resins, and butyral resins, fluorine resins, and polyphenylene oxide resins. , polypyrrole resin, borifalaphenylene resin, ultraviolet curable resin, cellulose derivative, etc. are used. Further, copolymers of the above resins can be used alone or in combination of two or more. Further, as the binder resin having a carrier movement speed of 10-8 cj/V-see or more, conductive resins such as polyvirol, polyacetal, polypyridine, etc., or photoconductive resins such as polyvinylcarbazole, diphenylaminostyrene, etc. can be used. Carrier movement speed is 10-8cd
/V-see, the resistance becomes too high and the function of the resistive film cannot be maintained. Furthermore, the thermoplastic resin,
Mixing one or more of thermosetting resins and ultraviolet curable resins with binder resins for resistive films can improve the coating properties of resistive film forming paints and improve the adhesion between the resulting resistive film and the insulating base material. It can improve your sexuality.
抵抗膜用バインダー樹脂と、熱可塑性樹脂、熱硬化性樹
脂、紫外線硬化性樹脂との混合割合は、混合されたバイ
ンダー樹脂でのキャリアー移動速度が１０−８ｃｄ ／
Ｖ−ｓｅｅ以上に保持すれば良い。The mixing ratio of the binder resin for resistive film, thermoplastic resin, thermosetting resin, and ultraviolet curable resin is such that the carrier movement speed in the mixed binder resin is 10-8 cd/
It is sufficient to maintain the voltage at V-see or higher.
（ａ）導電性酸化インジウム粉末は、酸化インジウムに
、錫、フッ素、塩素などの元素を、一種または二種以上
ドープした導電性酸化インジウム粉末が、あるいは、前
記元素がドープされた導電性酸化インジウムを被覆した
粉体が用いられる。(a) Conductive indium oxide powder is conductive indium oxide powder obtained by doping indium oxide with one or more elements such as tin, fluorine, or chlorine, or conductive indium oxide powder doped with the above elements. Powder coated with is used.
さらに（ａ）導電性酸化インジウム粉末と、導電性酸化
錫粉末とを、混合して使用することもできる。その時に
使用する導電性酸化錫粉末は、酸化錫に、アンチモン、
フッ素、リン、塩素などの元素を一種または二種以上ド
ープした導電性酸化錫粉末、あるいは前記元素がドープ
された導電性酸化錫を被覆した粉体である。これらの粉
末は、本出願人が先に出願した特開昭６０−５０８１３
号公報、特開昭８０−２５３１１２号公報、特開昭６３
−１１５１９号公報によって得られるものが好ましい。Furthermore, (a) conductive indium oxide powder and conductive tin oxide powder may be used in combination. The conductive tin oxide powder used at that time is tin oxide, antimony,
It is a conductive tin oxide powder doped with one or more elements such as fluorine, phosphorus, and chlorine, or a powder coated with conductive tin oxide doped with the above elements. These powders are disclosed in Japanese Patent Application Laid-Open No. 60-50813, which the present applicant previously filed.
Publication No. 80-253112, Japanese Patent Application Laid-Open No. 1988-63
The one obtained by the publication No.-11519 is preferred.
さらに、透明性を要求される用途では、塗料中における
導電性酸化インジウム粉末あるいは導電性酸化錫粉末の
平均粒径が、０．０１〜０．６μｍ好ましくは、０．０
１〜０．５μｍの範囲のものである。さらに０．８μｍ
以上の粗大粒子が、少量しか含まれていないものがよい
。これらの粉末は、本出願人が先に出願した特開昭６３
−１１５１９号公報によって得られるものが特に好まし
い。Furthermore, in applications requiring transparency, the average particle size of the conductive indium oxide powder or conductive tin oxide powder in the paint is 0.01 to 0.6 μm, preferably 0.0 μm.
It is in the range of 1 to 0.5 μm. Further 0.8 μm
It is preferable that the above-mentioned coarse particles are contained in only a small amount. These powders are disclosed in Japanese Unexamined Patent Application Publication No. 1988-63, which was previously filed by the present applicant.
Particularly preferred is that obtained according to Japanese Patent No.-11519.
（ａ）導電性酸化インジウム粉末と、（ｂ）抵抗膜用バ
インダー樹脂との混合割合は、それぞれの重量において
、７０≦（ａ） ／ （（ａ）＋ （ｂ））５９５重量
％が好ましい。（ａ）が（（ａ） ＋ （ｂ））に対し
て７０重量％未満では、得られる抵抗膜の導電性が悪く
なる。一方９５重量％を超えると抵抗膜と絶縁基材との
密着性および得られる抵抗膜の透明性が悪くなるので好
ましくない。The mixing ratio of (a) conductive indium oxide powder and (b) binder resin for a resistive film is preferably 70≦(a)/((a)+(b))595% by weight in each weight. If (a) is less than 70% by weight based on ((a) + (b)), the resulting resistive film will have poor conductivity. On the other hand, if it exceeds 95% by weight, the adhesion between the resistive film and the insulating base material and the transparency of the resulting resistive film will deteriorate, which is not preferable.
（ｅ）導電粒子と（ｂ）抵抗膜用バインダー樹脂とはそ
れぞれの容積において、０．１≦（Ｃ） ／ （（Ｃ）
＋ （ｂ））≦５Ｑｖｏ１％、好ましくは０．５≦（Ｃ
）／（（ｃ）＋ （ｂ））≦３Ｑｖｏ１％である。０．
１ ｖａｔ％未満であると、抵抗膜分解能が悪くな
る。また５０ ｖ０１％を超えると、透明性が悪くなる
。(e) Conductive particles and (b) resistive film binder resin each have a volume of 0.1≦(C) / ((C)
+ (b))≦5Qvo1%, preferably 0.5≦(C
)/((c)+(b))≦3Qvo1%. 0.
If it is less than 1 vat%, the resolution of the resistive film will be poor. Moreover, when it exceeds 50 v01%, transparency deteriorates.
（ｄ）絶縁粒子と（ｂ）抵抗膜用バインダー樹脂とは、
それぞれの容積において、０．１≦（ｄ）／（（ｄ）＋
（ｂ））≦５Ｑｖｏ１％、好ましくは０，５≦（ｄ）
／ （（ｄ）＋ （ｂ））≦２０ｖｏ１％である。０
．１ｖｏ１％未満であると、抵抗膜同士が被膜を介して
常に接触してしまう。ま・た５０ｖｏ１％を超えると、
透明性が悪くなる。(d) Insulating particles and (b) binder resin for resistive film are:
For each volume, 0.1≦(d)/((d)+
(b))≦5Qvo1%, preferably 0,5≦(d)
/ ((d)+(b))≦20vo1%. 0
．． If it is less than 1vo1%, the resistive films will always come into contact with each other through the coating. If it exceeds 50vo1%,
Transparency deteriorates.
（ｅ）導電粒子および／または（ｄ）絶縁粒子と不透明
な電極ペーストとの混合割合も同様である。The same applies to the mixing ratio of (e) conductive particles and/or (d) insulating particles and opaque electrode paste.
キャリアー移動速度とは、樹脂に電界をかけた場合に、
樹脂中で電子または正孔が動く速さを意味しており、モ
ビリティ（ｍｏｂｉｌｉｔｙ）ともいう。このキャリア
ー移動速度は、以下のようにして測定される。Carrier movement speed is when an electric field is applied to the resin.
It refers to the speed at which electrons or holes move in the resin, and is also called mobility. This carrier movement speed is measured as follows.
距離ｇの電極間に厚さｇの樹脂を差し込む。次に樹脂に
光を照射して樹脂内の電子を励起させ、正極に電子を移
動させる。この際、光を照射した時刻ｔ と、正極に電
子が到達した時刻１１との差を測定機器により計測する
。ここでキャリアー移動速度関数ν（Ｅ）は、次式で表
わされる。A resin with a thickness of g is inserted between electrodes with a distance of g. Next, the resin is irradiated with light to excite the electrons in the resin and move the electrons to the positive electrode. At this time, the difference between the time t when the light was irradiated and the time 11 when the electrons reached the positive electrode is measured by a measuring device. Here, the carrier movement speed function ν(E) is expressed by the following equation.
Ｒ，１１Ｒ２
したがって μ−
（ｔｌ−ｔｏ）Ｖ
（式中のμは、キャリアー移動速度、Ｅは電界、■は電
圧である。）
抵抗膜は、５０Ω／口≦表面抵抗≦３０００Ω／口を有
するものがよい。透明性を要求される用途では、前記表
面抵抗を有し、かつ抵抗膜が形成された絶縁基材の全光
線透過率が７０％以上、へ−ズが２０％未満であるのが
好ましい。R, 11R2 Therefore μ- (tl-to)V (In the formula, μ is the carrier movement speed, E is the electric field, and ■ is the voltage.) The resistive film has 50 Ω/port ≦ surface resistance ≦ 3000 Ω/port. Things are good. In applications requiring transparency, it is preferable that the insulating base material having the above-mentioned surface resistance and on which a resistive film is formed has a total light transmittance of 70% or more and a haze of less than 20%.
被膜は、絶縁粒子あるいは導電粒子と絶縁粒子とが分散
された被膜形成用塗料を用いて、抵抗膜上に塗布形成さ
れる。被膜自体は、導電性を有していても１．有してい
なくてもよい。導電性を有さない被膜では、導電粒子の
一部が露出するように被膜の膜厚を調製しなければなら
ない。導電粒子を介して抵抗膜相互を導通させることが
できるからである。なお、被膜自体が導電性を有した場
合には、タッチパネルの分解能をさらに向上させること
ができる。The film is formed by coating on the resistive film using a film-forming paint in which insulating particles or conductive particles and insulating particles are dispersed. Even if the film itself has conductivity, 1. It is not necessary to have it. For non-conductive films, the thickness of the film must be adjusted so that some of the conductive particles are exposed. This is because the resistive films can be electrically connected to each other via the conductive particles. Note that when the film itself has conductivity, the resolution of the touch panel can be further improved.
被膜自体に導電性をもたせるには、（ｅ）キャリアー移
動速度が１Ｏ−８ｃｄ／ｖ−８ｅＣ以上のバインダー樹
脂（以下導電性被膜用バインダー樹脂という）中に、（
ｄ）絶縁粒子あるいは（Ｃ）導電粒子と（ｄ）絶縁粒子
とが分散された導電性被膜形成用塗料を用いて、抵抗膜
上に塗布形成すればよい。導電性被膜用バインダー樹脂
とは、前記抵抗膜用バインダー樹脂でキャリアー移動速
度が１Ｏ−８ｃＪ／Ｖ ’ ８８８以上のバインダー樹
脂と同じものである。In order to impart conductivity to the film itself, (e) a binder resin with a carrier movement speed of 1O-8cd/v-8eC or higher (hereinafter referred to as binder resin for conductive film) contains (
A conductive film-forming paint in which d) insulating particles or (C) conductive particles and (d) insulating particles are dispersed may be used to coat the resistive film. The binder resin for the conductive film is the same as the binder resin for the resistive film and has a carrier movement speed of 10-8 cJ/V'888 or more.
さらに前記熱可塑性樹脂、熱硬化性樹脂、紫外線硬化性
樹脂史のうちから、一種以上を導電性波膜用バインダー
樹脂と混合すると、導電性被膜形成用塗料の塗工性を向
上させたり、得られる抵抗膜と被膜との密着性を向上さ
せたりすることができる。Furthermore, if one or more of the above thermoplastic resins, thermosetting resins, and ultraviolet curable resins are mixed with the binder resin for conductive wave films, the coating properties of the coating material for forming conductive films can be improved or obtained. The adhesion between the resistive film and the film can be improved.
導電性被膜用バインダー樹脂と、熱可塑性樹脂、熱硬化
性樹脂、紫外線硬化性樹脂との混合割合は、混合された
バインダー樹脂でのキャリアー移動速度が１Ｏ−８Ｃ−
／ｖ−５ｅＣ以上に保持すれば良い。The mixing ratio of the binder resin for conductive film, thermoplastic resin, thermosetting resin, and ultraviolet curable resin is such that the carrier movement speed in the mixed binder resin is 1O-8C-
/v-5eC or higher.
（Ｃ）導電粒子と（ｅ）導電性被膜用バインダー樹脂と
はそれぞれの容積において、０．１≦（Ｃ）／（（ｃ）
＋ （ｅ））≦５０ｖｏ１％、好ましくは０．５≦（ｃ
） ／ （（ｃ）＋ （ｅ））≦３Ｑｖｏ１％である。(C) Conductive particles and (e) binder resin for conductive coating have respective volumes of 0.1≦(C)/((c)
+ (e))≦50vo1%, preferably 0.5≦(c
)/((c)+(e))≦3Qvo1%.
０．１ｖｏ１％未満であると、抵抗膜分解能が悪くなる
。If it is less than 0.1vo1%, the resolution of the resistive film will be poor.
また５０ｖｏ１％を超えると、透明性が悪くなる。Moreover, when it exceeds 50vo1%, transparency deteriorates.
（ｄ）絶縁粒子と＜ｅ＞導電性被膜用バインダー樹脂と
は、それぞれの容積において、０．１≦（ｄ）／ （（
ｄ） ＋ （ｅ））≦５０ｖｏ１％、好ましくは０．５
≦（ｄ） ／ （（ｄ）＋ （ｅ））≦２０ＶＯ１％で
ある。０．１ｖｏ１％未満であると、抵抗膜同士が被膜
を介して常に接触してしまう。また５０ｖｏ１％を超え
ると、透明性が悪くなる。(d) The insulating particles and <e> the binder resin for conductive coating have a volume of 0.1≦(d)/((
d) + (e))≦50vo1%, preferably 0.5
≦(d)/((d)+(e))≦20VO1%. If it is less than 0.1vo1%, the resistive films will always come into contact with each other through the coating. Moreover, when it exceeds 50vo1%, transparency deteriorates.
また、被膜自体に導電性をもたせない場合には、導電性
被膜形成用塗料で用いた（ｅ）導電性被膜用バインダー
樹脂の代わりに、（ｅｏ）非導電性被膜用バインダー樹
脂を用いた非導電性被膜形成用塗料で、塗布形成すれば
よい。非導電性被膜用ノくインダー樹脂とは、前記熱可
塑性樹脂、熱硬化性樹脂、紫外線硬化性樹脂と同じもの
である。In addition, if the film itself does not have conductivity, a non-conductive film using (eo) binder resin for non-conductive film can be used instead of (e) binder resin for conductive film used in the paint for forming conductive film. It can be formed by coating with a paint for forming a conductive film. The inder resin for the non-conductive film is the same as the thermoplastic resin, thermosetting resin, and ultraviolet curable resin.
被膜が積層された抵抗膜は、積層された状態における被
膜面で、１００Ω／口≦表面抵抗≦５０００Ω／口を有
するものがよい。透明性を要求される用途では、前記表
面抵抗を有し、かつ被膜を積層した抵抗膜が形成された
絶縁基材（基材■および基材■）の全光線透過率が７０
％以上、ヘーズが２０％未満であるのが好ましい。被膜
の膜厚は、０．５〜５０μｍにする。５０μｍを超える
と分解能が悪くなるからである。また０、５μｍ未満で
は、入力時に被膜が剥げたり、アークが発生したりして
タッチパネルを長期間使用できなくなるからである。The resistive film on which the coatings are laminated preferably has a relationship of 100Ω/hole≦surface resistance≦5000Ω/hole on the coating surface in the laminated state. For applications that require transparency, the total light transmittance of the insulating base material (base material ■ and base material ■) having the above-mentioned surface resistance and on which a resistive film with a laminated film is formed is 70.
% or more and the haze is preferably less than 20%. The film thickness of the film is 0.5 to 50 μm. This is because if it exceeds 50 μm, the resolution will deteriorate. If the thickness is less than 0.5 μm, the film may peel off or arcs may occur during input, making it impossible to use the touch panel for a long period of time.
導電粒子分散膜は、導電粒子が分散された導電粒子分散
膜形成用塗料を用いて、基材Ｉの抵抗膜の上に塗布形成
される。また絶縁粒子分散膜は、絶縁粒子が分散された
絶縁粒子分散膜形成用塗料を用いて、導電粒子分散膜上
に塗布形成される。The conductive particle dispersed film is formed by coating on the resistive film of the base material I using a paint for forming a conductive particle dispersed film in which conductive particles are dispersed. Further, the insulating particle dispersed film is formed by coating on the conductive particle dispersed film using a coating material for forming an insulating particle dispersed film in which insulating particles are dispersed.
導電粒子分散膜または絶縁粒子分散膜自体は、導電性を
有していても、有していなくてもよい。導電性を有さな
い絶縁粒子分散膜では、導電粒子の一部が露出するよう
に絶縁粒子分散膜の膜厚を調製しなければならない。導
電粒子を介して抵抗膜相互を導通させることができるか
らある。なお、導電粒子分散膜または絶縁粒子分散膜自
体が導電性を有した場合には、タッチパネルの分解能を
さらに向上させることができる。The conductive particle dispersed film or the insulating particle dispersed film itself may or may not have conductivity. In an insulating particle dispersed film that does not have conductivity, the thickness of the insulating particle dispersed film must be adjusted so that a portion of the conductive particles are exposed. This is because the resistive films can be electrically connected to each other via the conductive particles. Note that when the conductive particle dispersed film or the insulating particle dispersed film itself has conductivity, the resolution of the touch panel can be further improved.
導電粒子分散膜または絶縁粒子分散膜自体に導電性をも
たせるには、（ｆ）キャリアー移動速度が１０−８ｃｄ
／ Ｖ −ｓｅｅ以上のバインダー樹脂（以下導電性
分散膜用バインダー樹脂という）中に、（ｅ）導電粒子
または（ｄ）絶縁粒子が分散された導電性分散膜形成用
塗料を用いて、基材■あるいは基材■の導電粒子分散膜
上に塗布形成すればよい。In order to impart conductivity to the conductive particle dispersed film or the insulating particle dispersed film itself, (f) the carrier movement speed is 10-8 cd.
/V-see or higher binder resin (hereinafter referred to as binder resin for conductive dispersed film), using a paint for forming a conductive dispersed film in which (e) conductive particles or (d) insulating particles are dispersed, (2) Alternatively, it may be formed by coating on the conductive particle dispersed film of the base material (2).
導電性分散膜用バインダー樹脂とは、前記抵抗膜用バイ
ンダー樹脂でキャリアー移動速度が１０−８０−／ｖ−
８ｅＣ以上のバインダー樹脂と同じものである。さらに
前記熱可塑性樹脂、熱硬化性樹脂、紫外線硬化性樹脂の
うちから、一種以上を導電性分散膜用バインダー樹脂と
混合すると、導電性分散膜塗料の塗工性を向上させたり
、得られる抵抗膜と導電粒子分散膜あるいは導電粒子分
散膜と絶縁粒子分散膜との密着性を向上させたりするこ
とができる。The binder resin for conductive dispersion film is the binder resin for resistive film and has a carrier movement speed of 10-80-/v-.
It is the same as the binder resin of 8eC or higher. Furthermore, when one or more of the above-mentioned thermoplastic resins, thermosetting resins, and ultraviolet curable resins are mixed with the binder resin for the conductive dispersion film, the coating properties of the conductive dispersion film coating material can be improved, and the resulting resistance can be improved. It is possible to improve the adhesion between the film and the conductive particle dispersed film or between the conductive particle dispersed film and the insulating particle dispersed film.
導電性分散用バインダー樹脂と、熱可塑性樹脂、熱硬化
性樹脂、紫外線硬化性樹脂との混合割合は、混合された
バインダー樹脂でのキャリアー移動速度が１Ｏ−８Ｃ−
／ｖ−８ｅＣ以上に保持すれば良い。The mixing ratio of the conductive dispersion binder resin, thermoplastic resin, thermosetting resin, and ultraviolet curable resin is such that the carrier movement speed in the mixed binder resin is 1O-8C-
/v-8eC or higher.
（ｃ）導電粒子または（ｄ）絶縁粒子と導電性分散膜用
バインダー樹脂との混合割合は、それぞれ前記（Ｃ）導
電粒子および／または（ｄ）絶縁粒子と（ｂ）抵抗膜用
バインダー樹脂および（ｄ）絶縁粒子あるいは（ｅ）導
電粒子と（ｄ）絶縁粒子と、（８）導電性被膜用バイン
ダー樹脂との混合割合と同一である。The mixing ratio of (c) conductive particles or (d) insulating particles and binder resin for conductive dispersion film is the same as that of (C) conductive particles and/or (d) insulating particles and (b) binder resin for resistive film, respectively. The mixing ratio of (d) insulating particles or (e) conductive particles, (d) insulating particles, and (8) binder resin for conductive coating is the same.
また、導電粒子分散膜または絶縁粒子分散膜自体に導電
性をもたせない場合には、導電性分散膜形成用塗料で用
いた（ｅ）導電性分散膜用バインダー樹脂の代わりに、
（ｅｏ）非導電性分散膜用バインダー樹脂を用いた非導
電性分散膜形成用塗料で、塗布形成すればよい。非導電
性分散膜用バインダー樹脂とは、前記熱可塑性樹脂、熱
硬化性樹脂、紫外線硬化性樹脂と同じものである。In addition, if the conductive particle dispersed film or insulating particle dispersed film itself does not have conductivity, instead of (e) binder resin for conductive dispersed film used in the coating for forming conductive dispersed film,
(eo) It may be formed by coating with a paint for forming a non-conductive dispersed film using a binder resin for a non-conductive dispersed film. The binder resin for the non-conductive dispersion film is the same as the thermoplastic resin, thermosetting resin, and ultraviolet curable resin.
導電粒子分散膜が積層された抵抗膜（基材■）あるいは
さらに絶縁粒子分散膜が積層された抵抗膜（基材Ｖ）は
、積層された状態における膜面で、１００Ω／口≦表面
抵抗≦５０００Ω／口を有するものがよい。透明性を要
求される用途では、前記表面抵抗を有し、かつ基材■お
よび基材Ｖの全光線透過率が７０％以上、ヘーズが２０
％未満であるのが好ましい。導電粒子分散膜または絶縁
粒子分散膜の膜厚は、０．５〜５０μｍにする。A resistive film (base material ■) on which a conductive particle dispersed film is laminated or a resistive film (base material V) on which an insulating particle dispersed film is further laminated has a resistance of 100 Ω/hole ≦ surface resistance ≦ on the film surface in the laminated state. It is preferable to have 5000Ω/mouth. For applications that require transparency, materials that have the above-mentioned surface resistance, have a total light transmittance of 70% or more, and have a haze of 20% or more
Preferably, it is less than %. The thickness of the conductive particle dispersed film or the insulating particle dispersed film is 0.5 to 50 μm.
５０μｍを超えると分解能が悪くなるからである。This is because if it exceeds 50 μm, the resolution will deteriorate.
また０、５μｍ未満では、入力時に被膜が剥げたり、ア
ークが発生したりしてタッチパネルを長期間使用できな
くなるからである。If the thickness is less than 0.5 μm, the film may peel off or arcs may occur during input, making it impossible to use the touch panel for a long period of time.
本発明で用いられる抵抗膜形成用塗料、被膜形成用塗料
、導電粒子分散膜形成用塗料、絶縁粒子分散膜形成用塗
料は、前記各成分が溶剤中に、溶解あるいは分散されて
いる。この溶剤としては、各樹脂を、溶解または希釈し
うるものを使用する。In the resistive film-forming paint, film-forming paint, conductive particle-dispersed film-forming paint, and insulating particle-dispersed film-forming paint used in the present invention, each of the above-mentioned components is dissolved or dispersed in a solvent. As this solvent, one that can dissolve or dilute each resin is used.
たとえば、メタノール、エタノール、プロパツール、ブ
タノール、ジアセトンアルコール、シクロヘキサノール
等のアルコール類、アセトン、シクロヘキサノン、メチ
ルエチルケトン、メチルイソブチルケトン、ホロン、イ
ソホロン等のケトン類、エチレングリコールモノメチル
エーテル、エチレングリモノエチルエーテル、カルピト
ール、メチルカルピトール、ジオキサン等のエーテル類
、酢酸ｎ−ブチル等のエステル類、ヘキサン、シクロヘ
キサン等の石油ナフサ類、トルエン、キシレン、メシチ
レン、ソルベントナフサ等のペンゾール類、Ｎ−メチル
−２−ピロリドンおよびその誘導体などが一種または二
種以上組み合わせて使用する。このような溶剤は、所望
の膜厚および塗料を塗布しうる粘度となるような量で用
いられる。また水溶性バインダー樹脂を用いた場合には
、溶剤として水を用いることもできる。For example, alcohols such as methanol, ethanol, propatool, butanol, diacetone alcohol, cyclohexanol, ketones such as acetone, cyclohexanone, methyl ethyl ketone, methyl isobutyl ketone, holon, isophorone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, etc. , ethers such as carpitol, methylcarpitol, and dioxane, esters such as n-butyl acetate, petroleum naphthas such as hexane and cyclohexane, pensoles such as toluene, xylene, mesitylene, and solvent naphtha, N-methyl-2- Pyrrolidone and its derivatives are used singly or in combination. Such a solvent is used in an amount that provides the desired film thickness and viscosity for coating the paint. Moreover, when a water-soluble binder resin is used, water can also be used as a solvent.
抵抗膜形成用塗料、被膜形成用塗料、導電粒子分散膜形
成用塗料、絶縁粒子分散膜形成用塗料を、製造する際に
は、（ａ）絶縁粒子、（ｂ）導電粒子または（ｄ）導電
性酸化インジウム粉末の分散性を向上させて、粒子同士
の再凝集を防止するため、界面活性剤あるいはカップリ
ング材を前記塗料に添加すると良い。When producing a coating for forming a resistive film, a coating for forming a film, a coating for forming a conductive particle dispersed film, and a coating for forming an insulating particle dispersed film, (a) insulating particles, (b) conductive particles, or (d) conductive particles are used. In order to improve the dispersibility of the indium oxide powder and prevent particles from re-agglomerating, a surfactant or a coupling agent may be added to the paint.
界面活性剤としては、アニオン系、ノニオン系、カチオ
ン系などのものを広く用いることもできる。As the surfactant, a wide variety of surfactants such as anionic, nonionic, and cationic surfactants can be used.
またカップリング剤としては、シラン系、チタン系、ア
ルミニウム系、ジルコニウム系、マグネシウム系のもの
が使用できる。Further, as the coupling agent, silane-based, titanium-based, aluminum-based, zirconium-based, and magnesium-based ones can be used.
このようにして得られる塗料を用い、従来公知の塗工法
、たとえば、スピンナー法、バーコード法、デイツプ法
、メイヤバー法、エアーナイフ法あるいはグラビア、ス
クリーン、ロールコータ−等の印刷法によって塗布し、
ついで硬化させることによって基材Ｉ〜■が得られる。Using the paint obtained in this way, it is applied by a conventionally known coating method, such as a spinner method, a barcode method, a dip method, a Meyer bar method, an air knife method, or a printing method such as gravure, screen, or roll coater,
By then curing, substrates I to (2) are obtained.
本発明では、これらの方法によって得られた基材■〜■
を、各抵抗膜が対向するように重ねてタッチパネルを構
成している。In the present invention, the base materials ■～■ obtained by these methods
A touch panel is constructed by stacking the resistive films so that the resistive films face each other.
第１０図は、本第１タツチパネルの要部断面図である。FIG. 10 is a sectional view of essential parts of the first touch panel.
第１１図は、本第１〜第６タツチパネルの座標読み取り
原理図の一例である。また第１２図は、本タッチパネル
の概略斜視図である。ここでは第１０図と第１２図を用
いて、本第１タツチパネルの座標読み取り原理図の一例
を示す（基材■と基材■との組合せ）。この例では、可
動パネル（上側）２により抑圧位置Ａ点のＹ座標を、固
定パネル（下側）３によりＸ座標を読み取る。押圧位置
Ａ点で、抵抗膜７と被膜１２を介して抵抗膜６とが接触
すると、定電流電源装置２１により供給された電流■は
、Ｉ と１２とに分配されて可動パネル（上側）２を流
れ、Ａ点で下側のＡ。FIG. 11 is an example of a coordinate reading principle diagram of the first to sixth touch panels. Moreover, FIG. 12 is a schematic perspective view of this touch panel. Here, an example of a coordinate reading principle diagram of the first touch panel is shown using FIG. 10 and FIG. 12 (combination of base material (2) and base material (2)). In this example, the movable panel (upper side) 2 reads the Y coordinate of the suppression position A point, and the fixed panel (lower side) 3 reads the X coordinate. When the resistive film 7 and the resistive film 6 come into contact with each other via the coating 12 at the pressing position A, the current supplied by the constant current power supply 21 is distributed between the movable panel (upper side) 2 and 12. , and lower A at point A.
点に移る。さらにＡ゛点で電流Ｉは、１３と１４に分配
された後、固定パネル（下側）３を流れて回路を形成す
る。ここでＩ と１２を検出すれば、Ａ点のＹ座標が算
出され、同じく１３と工、を検出すれば、Ａ点のＸ座標
が算出されて、Ａ点の座標が決定される。Move to point. Further, at point A', the current I is distributed to 13 and 14, and then flows through the fixed panel (lower side) 3 to form a circuit. Here, if I and 12 are detected, the Y coordinate of point A is calculated, and if 13 and I are detected, the X coordinate of point A is calculated and the coordinates of point A are determined.
さらに可動パネル（上側）２あるいは固定バネル（下側
）３のうちいずれか一方の抵抗膜の抵抗値を他方の抵抗
膜の抵抗値より高くし、抵抗値の高い方のパネルを定電
流電源装置の＋側に接続すると、文字・図形の入力時に
発生するアークを有効に防止することができる。Furthermore, the resistance value of the resistance film of either the movable panel (upper side) 2 or the fixed panel (lower side) 3 is made higher than the resistance value of the other resistance film, and the panel with the higher resistance value is used as a constant current power supply. When connected to the + side of , it is possible to effectively prevent arcs that occur when inputting characters and figures.
なお、本発明は図示するような実施例に限らず、本発明
の範囲内で種々に改変することができる。Note that the present invention is not limited to the embodiments shown in the drawings, and can be variously modified within the scope of the present invention.
たとえば、本タッチパネルは、上述したような第１２図
に示すＸ、Ｙ座標読み取り用電気回路に接続されるだけ
でなく、その他の公知の電気回路に接続されることも可
能である。その際に、本タッチパネルを二層以上積層さ
せて使用するようにしても良い。For example, the present touch panel can be connected not only to the electric circuit for reading X and Y coordinates shown in FIG. 12 as described above, but also to other known electric circuits. In this case, the present touch panel may be used by laminating two or more layers.
発明の詳細
な説明してきたように、本タッチパネルは、絶縁基材の
一方の表面に主として抵抗膜からなる導電層が形成され
た２枚の基材を用い、それぞれの導電層を対向させ、略
平行で所定の間隔に配置し、いずれか一方の前記基材の
一部を押圧することにより、該導電層同士の一部を接触
して、電気的に導電させ、高精細な文字・図形を入力す
るものであって、本第１タツチパネルは、一方の基材と
して基材■を用い、他方の基材として基材Ｉ〜基材■の
うちから選ばれる一種を組み合わせた構造からなる。本
第２タツチパネルは、一方の基材として基材Ｖを用い、
他方の基材として基材１１■、■、ｖ〜■のうちから選
ばれる一種を組み合わせた構造からなる。本第３タツチ
パネルは、−方の基材として基材■を用い、他方の基材
として基材１１■、■、■〜■のうちから選ばれる一種
を組み合わせた構造からなる。本第４タツチパネルは、
一方の基材として基材■を用い、他方の基材として基材
１１■、■、■〜■のうちから選ばれる一種を組み合わ
せた構造からなる。本第５タツチパネルは、一方の基材
として基材■を用い、他方の基材として基材■、■、■
、■〜■のうちから選ばれる一種を組み合わせた構造か
らなる。As described in detail of the invention, this touch panel uses two base materials each having a conductive layer mainly made of a resistive film formed on one surface of an insulating base material, with the conductive layers facing each other. By arranging the conductive layers in parallel at a predetermined interval and pressing a portion of one of the base materials, a portion of the conductive layers are brought into contact with each other and electrically conductive, thereby forming high-definition characters and figures. The first touch panel, which is used for input, has a structure in which a base material (2) is used as one base material, and one selected from base materials I to (2) is used as the other base material. This second touch panel uses base material V as one base material,
The other base material is a combination of base materials 11 (11), (2), and (v) to (2). The third touch panel has a structure in which base material (11) is used as one base material, and one type selected from base materials (11), (2), and (2) to (11) is used as the other base material. This fourth touch panel is
It has a structure in which base material (1) is used as one base material, and base material (11) selected from among base materials (11), (2), and (2) to (11) is used as the other base material. This fifth touch panel uses base material ■ as one base material, and base materials ■, ■, ■ as the other base material.
, consisting of a structure that combines one type selected from ■ to ■.
本第６タツチパネルは、一方の基材として基材■を用い
、他方の基材として基材Ｉ、■、■、■のうちから選ば
れる一種を組み合わせた構造からなる。そのため、高精
細な文字・図形などの入力が可能となるにもかかわらず
、誤入力が少なく、タッチパネルの耐久性が向上すると
いう優れた効果を有する。This sixth touch panel has a structure in which the base material (2) is used as one base material, and one type selected from the base materials I, (2), (2), and (2) is used as the other base material. Therefore, even though it is possible to input high-definition characters and figures, it has the excellent effect of reducing erroneous input and improving the durability of the touch panel.
本タッチパネルの用途としては、コンピューターの人力
装置として使用できるのはもちろんのこと、さらにコピ
ー機では、複写位置を指定する際にも使用できる。また
透明性の要求されない用途での使用も可能であり、その
際には、絶縁基材、抵抗膜、被膜、導電粒子分散膜、絶
縁粒子分散膜が透明でなくても構わない。This touch panel can be used not only as a manual device for computers, but also for copying machines to specify the copying position. It is also possible to use it in applications where transparency is not required, and in that case, the insulating base material, the resistive film, the coating, the conductive particle dispersed film, and the insulating particle dispersed film do not need to be transparent.
以下本タッチパネルを、より具体的な実施例によって説
明するが、本タッチパネルは、これら実施例に限定され
るものではない。The present touch panel will be described below using more specific examples, but the present touch panel is not limited to these examples.
実施例
タッチパネルを形成するために、以下に示す基材■〜■
を作成した。In order to form the example touch panel, the following base materials ■～■
It was created.
「基材■−１」
錫をドープした酸化インジウム粉末（商品名ＥＬＣＯＭ
ＴＬ−１２０触媒化成工業■製）１３０ｇとポリエス
テル樹脂（商品名 バイロン 東洋紡績■製）７０ｇと
シクロへキサノン２００ｇとを混合し１サンドミルで３
０分間粉砕して抵抗膜形成用塗料を得た。この塗料を、
ポリカーボネート板（ＣＲ−３９）にバーコーターで塗
布し、乾燥して基材を得た。"Base material ■-1" Tin-doped indium oxide powder (product name: ELCOM
Mix 130 g of TL-120 (manufactured by Catalysts & Chemicals Industry), 70 g of polyester resin (trade name: Byron, manufactured by Toyobo ■), and 200 g of cyclohexanone, and mix with 1 sand mill.
The powder was pulverized for 0 minutes to obtain a coating material for forming a resistive film. This paint,
It was applied onto a polycarbonate plate (CR-39) using a bar coater and dried to obtain a base material.
「基材Ｉ−２」
ＰＥＴフィルム（厚み１２５μｍ）を用いた以外は、基
材Ｉ−１と同様にして基材を得た。"Base material I-2" A base material was obtained in the same manner as base material I-1 except that a PET film (thickness: 125 μm) was used.
「基材Ｉ−３」
錫をドープした酸化インジウム粉末（商品名ＥＬＣＯＭ
ＴＬ−１３０触媒化成工業■製）１５０ｇとポリビニ
ルカルバゾール樹脂（商品名 ツビコール亜南香料製
キャリアー移動速度が１０−６ｃｄ ／ Ｖ・５ｅｅ）
２５．０ｓｒと紫外線硬化樹脂（商品名Ｄ１１−７０５
■大八化学工業所製）１２．５ｇとシクロへキサノン２
００ｇとを混合し、サンドミルで２時間粉砕して抵抗膜
形成用塗料を得た。この塗料を、ポリカーボネート板（
ＣＲ−３９）にバーコーターで塗布し、乾燥した後紫外
線で硬化させて基材を得た。"Substrate I-3" Tin-doped indium oxide powder (product name: ELCOM
TL-130 Catalysts & Chemicals Co., Ltd.) 150g and polyvinylcarbazole resin (trade name: Tubicol Anan Fragrance Co., Ltd.)
Carrier movement speed is 10-6cd/V・5ee)
25.0sr and ultraviolet curing resin (product name D11-705
■Daihachi Chemical Industry Co., Ltd.) 12.5g and cyclohexanone 2
00g and ground in a sand mill for 2 hours to obtain a coating material for forming a resistive film. Apply this paint to a polycarbonate board (
CR-39) was coated with a bar coater, dried, and then cured with ultraviolet rays to obtain a base material.
「基材Ｉ−４」
ＰＥＴフィルム（厚み１２５μｍ）を用いた以外は、基
材Ｉ−３と同様にして基材を得た。"Substrate I-4" A substrate was obtained in the same manner as Substrate I-3 except that a PET film (thickness: 125 μm) was used.
「基材Ｉ−５」
５重量％の酸化錫を含む酸化インジウム粉末を、タブレ
ット状に成型した後、２ｋＷの電子銃を用い、ガラス板
上に板温度４００℃、酸素分圧３×１０ ”−’ｔｏｒ
ｒ、蒸着速度３／ＳｅＣテ基材を得た。"Substrate I-5" After molding indium oxide powder containing 5% by weight of tin oxide into a tablet shape, it was placed on a glass plate using a 2kW electron gun at a plate temperature of 400°C and an oxygen partial pressure of 3 x 10''. -'tor
r, vapor deposition rate 3/SeC substrate was obtained.
「基材■−６」
ＰＥＴフィルム（厚み１２５μｍ）を用い、板温度を１
００℃とした以外は、基材１−５と同様にして基材を得
た。"Substrate ■-6" PET film (thickness 125 μm) was used, and the plate temperature was set to 1.
A base material was obtained in the same manner as base material 1-5 except that the temperature was 00°C.
「基材Ｉ−７」
カーボンペースト（商品名ＪＥＦＯ２４−Ｒ１３２日本
アチソン■製）を、ポリカーボネート板（ＣＲ−３９）
に、１５０メツシユのスクリーンを使用してスクリーン
印刷し、１５０℃、３０分間乾燥して基材を得た。"Substrate I-7" Carbon paste (product name JEFO24-R132 manufactured by Acheson Japan) was applied to a polycarbonate plate (CR-39).
Then, screen printing was performed using a 150-mesh screen and drying was performed at 150° C. for 30 minutes to obtain a base material.
「基材■−８」
ＰＥＴフィルム（厚み１２５μｍ）を用いた以外は、基
材１−７と同様にして基材を得た。"Substrate ■-8" A substrate was obtained in the same manner as Substrate 1-7 except that a PET film (thickness: 125 μm) was used.
「基材■−９」
弗素をドープした酸化インジウム粉末（商品名ＥＬＣＯ
Ｍ ＴＬ−１３０） １５０ ｇとポリエステル樹脂（
商品名 バイロン）３７．５ｇとシクロへキサノン２０
０ｇとを混合し、サンドミルで２時間粉砕して抵抗膜形
成用塗料を得た。この塗料を、ＰＥＴフィルム（厚み１
００μｍ）にバーコーターで塗布し、乾燥して基材を得
た。“Base material ■-9” Fluorine-doped indium oxide powder (product name: ELCO
M TL-130) 150 g and polyester resin (
Product name Byron) 37.5g and cyclohexanone 20
0 g and pulverized in a sand mill for 2 hours to obtain a coating material for forming a resistive film. Apply this paint to PET film (thickness 1
00 μm) using a bar coater and dried to obtain a base material.
「基材■−１」
錫をドープした酸化インジウム粉末（商品名ＥＬＣＯＭ
ＴＬ−１２０） １３０ ｇとポリエステル樹脂（商
品名 バイロン）７０ｇと７クロへキサノン２００ｇと
を混合し、サンドミルで３０分間粉砕し、さらに酸化珪
素粒子（商品名 真綿球 粒径８μｍ 比重２．２ 触
媒化成工業■製）の表面に厚み０．０５μｍの銀鍍金を
した粒子４，２ｇ（比重２．５）とを混合し、抵抗膜形
成用塗料を得た。この塗料を、ポリカーボネート板（Ｃ
Ｒ−３９）にバーコーターで塗布し、乾燥して基材を得
た。"Base material ■-1" Tin-doped indium oxide powder (product name: ELCOM
TL-120) 130 g, polyester resin (trade name: Vylon), 70 g, and 7-chlorohexanone (200 g) were mixed, ground in a sand mill for 30 minutes, and then silicon oxide particles (trade name: cotton balls, particle size: 8 μm, specific gravity: 2.2) were mixed. A paint for forming a resistive film was obtained by mixing 4.2 g of particles (specific gravity: 2.5) whose surface was plated with silver to a thickness of 0.05 μm (manufactured by Kasei Kogyo ■). Apply this paint to a polycarbonate board (C
R-39) using a bar coater and dried to obtain a base material.
（導電粒子である真綿球に銀鍍金をした粒子は、２、
２ ｖｏ１％含有。）
「基材■−２」
ＰＥＴフィルム（厚み１２５μｍ）を用いた以外は、基
材１１−１と同様にして基材■を得た。(Particles made of conductive cotton balls plated with silver are 2,
Contains 2 vol1%. ) "Substrate ■-2" Substrate ■ was obtained in the same manner as Substrate 11-1 except that a PET film (thickness: 125 μm) was used.
「基材■−３」
錫をドープした酸化インジウム粉末（商品名ＥＬＣＯＭ
ＴＬ−１３０） １５０ Ｋとポリビニルカルバゾー
ル樹脂（商品名 ツビコール）２５．０ｇと紫外線硬化
樹脂（商品名 ＤＩ！−７０５） １２． ５ ｇとシ
クロへキサノン２００ｇとを混合し、サンドミルで２時
間粉砕し、さらに酸化珪素粒子（商品名 真綿球 粒径
５μｍ 比重２．２）の表面に厚み０・、０５μｍのニ
ッケル鍍金、その上に０．０５μｍの全鍍金をした粒子
０．４６ｇ （比重３．５）とを混合し、抵抗膜形成用
塗料を得た。"Base material ■-3" Tin-doped indium oxide powder (product name: ELCOM
TL-130) 150 K, 25.0 g of polyvinyl carbazole resin (trade name: Tubicol), and ultraviolet curing resin (trade name: DI!-705) 12. 5 g and 200 g of cyclohexanone were mixed and ground in a sand mill for 2 hours, and the surface of silicon oxide particles (trade name: cotton balls, particle size 5 μm, specific gravity 2.2) was plated with nickel to a thickness of 0.05 μm, and then and 0.46 g of fully plated particles (specific gravity 3.5) of 0.05 μm were mixed to obtain a coating material for forming a resistive film.
この塗料を、ポリカーボネート板（ＣＩ？−３９）にバ
ーコーターで塗布し、乾燥した後、紫外線で硬化させて
基材を得た。（導電粒子である真綿球にニッケルー金鍍
金をした粒子は、０．２５ｖｏ１％含有。）
「基材■−４」
ＰＥＴフィルム（厚み１２５μｍ）を用いた以外は、基
材１１−３と同様にして基材を得た。This paint was applied to a polycarbonate plate (CI?-39) using a bar coater, dried, and then cured with ultraviolet light to obtain a base material. (Particles made by plating cotton balls with nickel and gold, which are conductive particles, contain 0.25 vol. A base material was obtained.
「基材■−１」
ポリビニルカルバゾール樹脂（商品名 ツビコール）１
５ｇとイソホロン８５ｇと酸化珪素粒子（商品名 上粒
子 粒径１６μｍ比重２．２触媒化成工業■製）１．５
ｇとを混合し、充分分散して被膜形成用塗料を得た。こ
の塗料を基材Ｉ−２にバーコーターで塗布し、乾燥して
基材を形成した。（絶縁粒子である上粒子は、５． １
ｖ。"Base material ■-1" Polyvinyl carbazole resin (product name Tubicol) 1
5g, 85g of isophorone, and silicon oxide particles (product name: Upper particle, particle size: 16μm, specific gravity: 2.2, manufactured by Catalysts & Chemicals Industry ■) 1.5
g and were sufficiently dispersed to obtain a film-forming paint. This paint was applied to base material I-2 using a bar coater and dried to form a base material. (The upper particle, which is an insulating particle, is 5.1
v.
％含有。）
「基材■−２」
酸化珪素粒子（商品名 上粒子）を０．７５ｇにした以
外は、基材ＤＩ−１と同様にして基材を形成した。（絶
縁粒子である上粒子は、２． ６ ｖｏ１％含有。）
「基材■−３」
酸化珪素粒子（商品名 毛粒子）を０．１５ｇにした以
外は、基材ｍ−１と同様にして基材を形成した。（絶縁
粒子である毛粒子は、０． ５ ｖｏ１％含有。）
「基材■−４」
ポリビニルカルバゾール樹脂（商品名 ツビコール）１
０ｇと紫外線硬化樹脂（商品名Ｄ１１−７０５）５ｇと
シクロへキサノン８５ｇとジビニルベンゼン樹脂粒子（
商品名 ミクロバールＳＰ 粒径１２μｍ 比重１．
２）０．１５ｇとを混合し、充分分散して被膜形成用塗
料を得た。この塗料を基材ｎ−４にバーコーターで塗布
し１．乾燥した後、紫外線で硬化させて基材を形成した
。（絶縁粒子であるミクロバールＳＰは、１． Ｏｖ
ｏ１％含有。）「基材■−１」
錫をドープした酸化インジウム粉末（商品名［ＥＬＣＯ
Ｍ ＴＬ−１３０） １５０ ｇとアクリル樹脂（大日
本インキ■製 商品名 アクリディック Ａ−４０５）
６０ｇとメラミン樹脂（大日本インキ■製 商品名 ス
パーベッカミンＪ−８２０−８０） ３３．３ ｇとブ
チルカルピトールアセテート２００ｇとを混合し、サン
ドミルで２時間粉砕し、さらに酸化珪素粒子（商品名
真綿球 粒径５μｍ 比重２．２）の表面に厚み０．０
５μｍの銀鍍金をした粒子０．７ｇ（比重２．７）とを
混合し、導電粒子分散膜形成用塗料を得た。この塗料を
、基材１−５にバーコーターで塗布し、乾燥して基材を
得た。Contains %. ) "Base material ■-2" A base material was formed in the same manner as base material DI-1 except that the amount of silicon oxide particles (trade name: upper particles) was changed to 0.75 g. (The upper particles, which are insulating particles, contain 2.6 vol. A base material was formed. (Hair particles, which are insulating particles, contain 0.5 vol%.) "Base material ■-4" Polyvinyl carbazole resin (trade name Tubicol) 1
0g, 5g of ultraviolet curing resin (product name D11-705), 85g of cyclohexanone, and divinylbenzene resin particles (
Product name Microvar SP Particle size 12μm Specific gravity 1.
2) and 0.15 g and sufficiently dispersed to obtain a film-forming paint. Apply this paint to base material n-4 using a bar coater.1. After drying, it was cured with ultraviolet light to form a base material. (Microvar SP, which is an insulating particle, is 1. Ov
Contains 1% o. ) "Substrate ■-1" Tin-doped indium oxide powder (product name [ELCO
M TL-130) 150 g and acrylic resin (manufactured by Dainippon Ink, product name Acridic A-405)
60 g of melamine resin (manufactured by Dainippon Ink ■, trade name: Super Beckamine J-820-80) and 200 g of butylcarpitol acetate were mixed together, ground in a sand mill for 2 hours, and further mixed with silicon oxide particles (trade name:
Cotton ball Particle size 5 μm Specific gravity 2.2) Thickness 0.0 on the surface
0.7 g of 5 μm silver-plated particles (specific gravity 2.7) were mixed to obtain a paint for forming a conductive particle dispersed film. This paint was applied to base material 1-5 using a bar coater and dried to obtain a base material.
（導電粒子である真綿球に銀鍍金をした粒子は、０、４
ｖｏ１％含有。）
「基材■−２」
基材１−６を用いた以外は、基材ＩＶ−１と同様にして
基材を得た。(Particles made of conductive particles such as cotton balls plated with silver are 0, 4
Contains vol1%. ) "Base material ■-2" A base material was obtained in the same manner as base material IV-1 except that base material 1-6 was used.
「基材■−３」
錫をドープした酸化インジウム粉末（商品名ＥＬＣＯＭ
ＴＬ−１２０） １２０ ｇとポリエステル樹脂（商
品名 バイロン）８０ｇとシクロへキサノン２００ｇと
を混合し、サンドミルで３０分間粉砕し、さらに酸化珪
素粒子（商品名 真綿球 粒径８μｍ 比重２．２）の
表面に厚み０．０５μｍの銀鍍金をした粒子１８．２ｇ
（比重２．５）とを混合し、導電粒子分散膜形成用塗
料を得た。この塗料を、基材Ｉ−８にバーコーターで塗
布し、乾燥して基材を得た。（導電粒子である真綿球に
銀鍍金をした粒子は、８． ２ ｖｏ１％含有。）「基
材ｖ−１」
ポリエステル樹脂（商品名 バイロン）２７ｇとシクロ
へキサノン１３０ｇとジビニルベンゼン樹脂粒子（商品
名 ミクロバールＳＰ 粒径１２μｍ 比重１．２）
１．５ｇとを混合し、充分分散して絶縁粒子分散膜形成
用塗料を得た。−この塗料を基材■−１にバーコーター
で塗布し、乾燥して基材を形成した。（絶縁粒子である
ミクロバールｓｐは、５． ５ ｖｏ１％含有。）「
基材ｖ−２」
基材ＩＶ−２を用いた以外は、基材Ｖ−１と同様にして
基材を得た。"Base material ■-3" Tin-doped indium oxide powder (product name: ELCOM
TL-120) 120 g, polyester resin (trade name: Vylon), 80 g, and cyclohexanone (200 g) were mixed, ground in a sand mill for 30 minutes, and then silicon oxide particles (trade name: cotton balls, particle size: 8 μm, specific gravity: 2.2) were mixed. 18.2g of particles with silver plating with a thickness of 0.05μm on the surface
(specific gravity 2.5) to obtain a paint for forming a conductive particle dispersed film. This paint was applied to base material I-8 using a bar coater and dried to obtain a base material. (Particles made by silver-plating cotton balls, which are conductive particles, contain 8.2 vol. Name Microbar SP Particle size 12μm Specific gravity 1.2)
1.5 g and sufficiently dispersed to obtain a paint for forming an insulating particle dispersed film. - This paint was applied to the base material ①-1 using a bar coater and dried to form a base material. (Microbar SP, which is an insulating particle, contains 5.5 vol. 1%.)
Base material v-2" A base material was obtained in the same manner as base material V-1 except that base material IV-2 was used.
「基材■−３」
ポリエステル樹脂（商品名 バイロン）２０ｇとシクロ
へキサノン１００ｇと酸化珪素粒子（商品名 毛粒子
粒径１６μｍ 比重２．２）１．９ｇとを混合し、充分
分散して絶縁粒子分散膜形成用塗料を得た。この塗料を
基材ＩＶ−３にバーコーターで塗布し、乾燥して基材を
形成した。"Base material ■-3" 20 g of polyester resin (product name: Vylon), 100 g of cyclohexanone, and silicon oxide particles (product name: hair particles)
A particle size of 16 μm and a specific gravity of 2.2) (1.9 g) were mixed and sufficiently dispersed to obtain a paint for forming an insulating particle dispersed film. This paint was applied to base material IV-3 using a bar coater and dried to form a base material.
（絶縁粒子である毛粒子は、５． １ ｖｏ１％含有
。）「基材■−１」
錫をドープした酸化インジウム粉末（商品名ＥＬＣＯＭ
ＴＬ−１３０） １５０ ｇとポリエステル樹脂（商
品名 バイロン）３７．５ｇとシクロへキサノン２００
ｇとを混合し、サンドミルで２時間粉砕した。その後ジ
ビニルベンゼン樹脂粒子（商品名 ミクロバールＳＰ
粒径１２μｍ 比重１．２）１０ｇとを混合し、充分
分散して抵抗膜形成用塗料を得た。この塗料を、ポリカ
ーボネート板（ＣＲ−３９）にバーコーターで塗布し、
乾燥して基材を得た。（絶縁粒子であるミクロバールｓ
Ｐは、１．６ｖｏ１％含有。）
「基材■−２」
ＰＥＴフィルム（厚み１２５μｍ）を用いた以外は、基
材Ｖｌ−１と同様にして基材を得た。(The hair particles, which are insulating particles, contain 5.1 vol%.) "Base material ■-1" Indium oxide powder doped with tin (trade name ELCOM
TL-130) 150 g, polyester resin (trade name: Vylon) 37.5 g, and cyclohexanone 200 g
g and ground in a sand mill for 2 hours. After that, divinylbenzene resin particles (product name Microbal SP)
Particle size: 12 μm, specific gravity: 1.2) (10 g) were mixed and sufficiently dispersed to obtain a coating material for forming a resistive film. Apply this paint to a polycarbonate board (CR-39) with a bar coater,
A base material was obtained by drying. (Microbar s which is an insulating particle
P contains 1.6vol%. ) "Base material ■-2" A base material was obtained in the same manner as base material Vl-1 except that a PET film (thickness: 125 μm) was used.
「基材■−１」
ポリビニルカルバゾール樹脂（商品名 ツビコール）１
５ｇとイソホロン８５ｇと酸化珪素粒子（商品名 上粒
子 粒径１６μｍ 比重２．２）１．５ｇとを混合し、
充分分散して絶縁粒子分散膜形成用塗料を得た。この塗
料を基材１−２にバーコーターで塗布し、乾燥して基材
を形成した。"Base material ■-1" Polyvinyl carbazole resin (product name Tubicol) 1
5 g of isophorone, 85 g of isophorone, and 1.5 g of silicon oxide particles (trade name: Upper particles, particle size: 16 μm, specific gravity: 2.2),
After sufficient dispersion, a paint for forming an insulating particle dispersed film was obtained. This paint was applied to base material 1-2 using a bar coater and dried to form a base material.
（絶縁粒子である上粒子は、５． １ ｖｏ１％含有
。）「基材■−２」
酸化珪素粒子（商品名 上粒子）を０．７５ｇにした以
外は、基材■−１と同様にして基材を形成した。（絶縁
粒子である上粒子は、２． ６ ｖｏ１％含有。）
「基材■−３」
酸化珪素粒子（商品名 上粒子）を０．１５ｇにした以
外は、基材■−２と同様にして基材を形成した。（絶縁
粒子である上粒子は、０． ５ ｖｏ１％含有。）
「基材■−４」
ポリビニルカルバゾール樹脂（商品名 ツビコール）１
０ｇと紫外線硬化樹脂（商品名ＤＨ−７０５） ５ ｇ
とシクロへキサノン８５ｇとジビニルベンゼン樹脂粒子
（商品名 ミクロパールＳＰ 粒径１２μｍ 比重１
．２）０．１５ｇとを混合し、充分分散して絶縁粒子分
散膜形成用塗料を得た。(The upper particles, which are insulating particles, contain 5.1 vol. A base material was formed. (The upper particles, which are insulating particles, contain 2.6 vol. A base material was formed. (The upper particle, which is an insulating particle, contains 0.5 vol%.) "Base material ■-4" Polyvinyl carbazole resin (trade name Tubicol) 1
0g and UV curing resin (product name DH-705) 5g
and cyclohexanone 85g and divinylbenzene resin particles (product name Micropearl SP particle size 12μm specific gravity 1
．． 2) was mixed with 0.15 g and sufficiently dispersed to obtain a paint for forming an insulating particle dispersed film.
この塗料を基材１−３にバーコーターで塗布し、乾燥し
た後、紫外線で硬化させて基材を形成した。This paint was applied to base material 1-3 using a bar coater, dried, and then cured with ultraviolet rays to form a base material.
（絶縁粒子であるミクロパールＳＰは、１． Ｏｖｏ
１％含有。）
「基材■−５」
基材Ｉ−４を用いた以外は、基材■−４と同様にして基
材を形成した。(Micropearl SP, which is an insulating particle, is 1. Ovo
Contains 1%. ) "Base material ■-5" A base material was formed in the same manner as base material ■-4 except that base material I-4 was used.
「基材■−６」
ポリビニルカルバゾール樹脂（商品名 ツビコール）１
０ｇとポリエステル樹脂（商品名 バイロン）１ｇとシ
クロへキサノン８９にとジビニルベンゼン樹脂粒子（商
品名 ミクロパール８１粒径１２μｍ 比重１．２）０
．５ｇとを混合し、充分分散して絶縁粒子分散膜形成用
塗料を得た。"Base material ■-6" Polyvinyl carbazole resin (product name Tubicol) 1
0g, polyester resin (trade name: Vylon), 1g of cyclohexanone 89, and divinylbenzene resin particles (trade name: Micropearl 81, particle size: 12μm, specific gravity: 1.2) 0
．． 5 g and sufficiently dispersed to obtain a paint for forming an insulating particle dispersed film.
この塗料を基材１−５にバーコーターで塗布し、乾燥し
て基材を形成した。（絶縁粒子であるミクロバールＳＰ
は、４． ３ ｖｏ１％含有。）ｒ基材■−７」
基材１−６を用いた以外は、基材■−６と同様にして基
材を形成した。This paint was applied to base material 1-5 using a bar coater and dried to form a base material. (Microvar SP which is an insulating particle
4. Contains 3 vo1%. ) r Base material ■-7'' A base material was formed in the same manner as base material ■-6 except that base material 1-6 was used.
「基材■−８」
ポリビニルカルバゾール樹脂（商品名 ツビコール）１
５００ｇとイソホロン８５００＋ｒと酸化珪素粒子（商
品名 上粒子 粒径１６μｍ 比重２．２）１５０ｇと
酸化珪素粒子（商品名 真綿球 粒径１μｍ 比重２．
２）０．０４ｇとを混合し、充分分散して絶縁粒子分散
膜形成用塗料を得た。この塗料を基材１−２にバーコー
ターで塗布し、乾燥して基材を形成した。（絶縁粒子で
ある上粒子および真綿球は、両者の合計で５．１ｖｏ１
％含有。）
「基材■−９」
基材１−８を用いた以外は、基材■−８と同様にして基
材を形成した。"Base material ■-8" Polyvinyl carbazole resin (product name Tubicol) 1
500 g, isophorone 8500+r, silicon oxide particles (trade name: upper particles, particle size 16 μm, specific gravity 2.2) and 150 g of silicon oxide particles (trade name: cotton balls, particle size 1 μm, specific gravity 2.2).
2) and 0.04 g and sufficiently dispersed to obtain a paint for forming an insulating particle dispersed film. This paint was applied to base material 1-2 using a bar coater and dried to form a base material. (The upper particles and cotton balls, which are insulating particles, have a total of 5.1 vol.
Contains %. ) "Base material ■-9" A base material was formed in the same manner as base material ■-8 except that base material 1-8 was used.
「基材■−１」
錫をドープした酸化インジウム粉末（商品名ＥＬＣＯＭ
ＴＬ−１３０） １５０ ｇとポリビニルカルバゾー
ル樹脂（商品名 ツビコール）２５．０ｇと紫外線硬化
樹脂（商品名 ＤＨ−７０５） １２． ５ Ｋとシク
ロへキサノン２００ｇとを混合し、サンドミルで２時間
粉砕し、さらにジビニルベンゼン樹脂粒子（商品名ミク
ロパールＳＰ 粒径１２μｍ比重１．２）０．３ｇと
酸化珪素粒子（商品名真綿球 粒径５μｍ 比重２．２
）の表面に厚み０．０５μｍのニッケル鍍金、その上に
０．０５μｍの全鍍金をした粒子０．４６ｇ （比重３
．５）とを混合し、抵抗膜形成用塗料を得た。この塗料
を、ポリカーボネート板（ＣＲ−３９）にバーコーター
で塗布し、乾燥した後、紫外線で硬化させて基材を得た
。（絶縁粒子であるミクロパールＳＰは、０、 ５ Ｖ
Ｏ！％含有。導電粒子である真綿球にニッケルー金鍍金
をした粒子は、０． ３ ｖｏ１％含有。）「基材■−
２」
ＰＥＴフィルム（厚み１２５μｍ）を用いた以外は、基
材■−１と同様にして基材を得た。"Base material ■-1" Tin-doped indium oxide powder (product name: ELCOM
TL-130) 150 g, polyvinyl carbazole resin (trade name: Tubicol) 25.0 g, and ultraviolet curing resin (trade name: DH-705) 12. 5 K and 200 g of cyclohexanone were mixed, ground for 2 hours in a sand mill, and further mixed with 0.3 g of divinylbenzene resin particles (trade name Micropearl SP, particle size 12 μm, specific gravity 1.2) and silicon oxide particles (trade name Cotton balls). Particle size 5μm Specific gravity 2.2
) with nickel plating with a thickness of 0.05 μm on the surface, and 0.46 g of particles with a total plating of 0.05 μm on top (specific gravity 3
．． 5) was mixed to obtain a coating material for forming a resistive film. This paint was applied to a polycarbonate plate (CR-39) using a bar coater, dried, and then cured with ultraviolet light to obtain a base material. (Micropearl SP, which is an insulating particle, has a voltage of 0.5 V.
O! Contains %. Particles made by plating cotton balls, which are conductive particles, with nickel and gold are 0. Contains 3 vo1%. ) "Base material■-
2'' A substrate was obtained in the same manner as Substrate ①-1 except that a PET film (thickness: 125 μm) was used.
「基材■−３」
錫をドープした酸化インジウム粉末（商品名１シＬＣＯ
Ｍ ＴＬ−１３０） ９６００ ｇとポリビニルカルバ
ゾール樹脂（商品名 ツビコール）１６００ｇと紫外線
硬化樹脂（商品名ＤＩ（−７０５） ８００ ｇとイソ
ホロン１３６００にと酸化珪素粒子（商品名真綿球 粒
径１６μｍ 比重２．２）２４０ｇと酸化珪素粒子（商
品名 真綿球 粒径３．５μｍ比重２．２）０．７ｇと
酸化珪素粒子（商品名真綿球 粒径２．４μｍ 比重２
．２）の表面に厚み０．０５μｍの銀鍍金をした粒子１
０ｇ（比重３．２）とを混合し、充分分散して抵抗膜形
成用塗料を得た。この塗料を、ポリカーボネート板（Ｃ
Ｉ？−３９）にバーコーターで、塗布し、乾燥した後、
紫外線で硬化させて基材を得た。（絶縁粒子である上粒
子および真綿球は、両者の合計で５．４ｖｏ１％含有。"Base material ■-3" Tin-doped indium oxide powder (product name 1SILCO)
M TL-130) 9600 g, polyvinyl carbazole resin (trade name Tubicol) 1600 g, ultraviolet curable resin (trade name DI (-705) 800 g, isophorone 13600, silicon oxide particles (trade name Cotton Ball, particle size 16 μm, specific gravity 2. 2) 240 g and silicon oxide particles (trade name: cotton balls, particle size 3.5 μm, specific gravity 2.2) and 0.7 g of silicon oxide particles (trade name: cotton balls, particle size 2.4 μm, specific gravity 2)
．． 2) Particle 1 whose surface was plated with silver to a thickness of 0.05 μm
0 g (specific gravity: 3.2) and sufficiently dispersed to obtain a coating material for forming a resistive film. Apply this paint to a polycarbonate board (C
I? -39) with a bar coater and after drying,
A base material was obtained by curing with ultraviolet light. (The upper particles, which are insulating particles, and cotton balls contain a total of 5.4 vol%.
導電粒子である真綿球に銀鍍金をした粒子は、０． ２
ｖｏ１％含有。）「基材■−４」
ＰＥＴフィルム（厚み１２５μｍ）を用いた以外は、基
材■−３と同様にして基材を得た。Particles made of cotton balls, which are conductive particles, and plated with silver have a particle size of 0. 2
Contains vol1%. ) "Substrate ■-4" A base material was obtained in the same manner as Substrate ■-3 except that a PET film (thickness: 125 μm) was used.
「基材■−１」
ポリビニルカルバゾール樹脂（商品名 ツビコール）１
５ｇとイソホロン８５ｇと酸化珪素粒子（商品名 上粒
子 粒径１６μｍ比重２．２）１６５ｇと酸化珪素粒子
（商品名 真綿球 粒径２μｍ 比重２．２）の表面に
厚み０．０５μｍの銀鍍金をした粒子０．４５ｇ （比
重３．３）とを混合し、充分分散して抵抗膜形成用塗料
を得た。"Base material ■-1" Polyvinyl carbazole resin (product name Tubicol) 1
5g of isophorone, 85g of isophorone, 165g of silicon oxide particles (product name: Upper Particles, particle size 16μm, specific gravity 2.2), and 165g of silicon oxide particles (product name: cotton balls, particle size 2μm, specific gravity 2.2), with silver plating to a thickness of 0.05μm. 0.45 g of the particles (specific gravity: 3.3) were mixed and sufficiently dispersed to obtain a coating material for forming a resistive film.
この塗料を、基材１−２にバーコーターで塗布し、乾燥
して基材を形成した。（絶縁粒子である上粒子は、５．
１ ｖｏ１％含有。導電粒子である真綿球に銀鍍金
をした粒子は、１． Ｏｖｏ１％含有。）「基材■〜
２」
酸化珪素粒子（商品名 上粒子）を０．７５ｇにした以
外は、基材ｌＸ−１と同様にして基材を形成した。（絶
縁粒子である上粒子は、２．６ ｖｏ１％含有。導電
粒子である真綿球に銀鍍金をした粒子は、１． Ｏｖ
ｏ１％含有。）
「基材■−３」
酸化珪素粒子（商品名 上粒子）をＯ’、１５ｇにした
以外は、基材ｌＸ−１と同様にして基材を形成した。（
絶縁粒子である上粒子は、０． ５ ｖｏ１％含有。導
電粒子である真綿球に銀鍍金をした粒子は、１． Ｏ
ｖｏ！％含有。）
ｒ基材■−４」
ポリビニルカルバゾール樹脂（商品名 ツビコール）１
０ｇと紫外線硬化樹脂（商品名Ｄ１１−７０５ ） ５
ｇとシクロへキサノン８５ｇとジビニルベンゼン樹脂
粒子（商品名 ミクロバールＳＰ 粒径１２μｍ 比
重１．２）０．１５ｇと酸化珪素粒子（商品名 真綿球
粒径３μｍ 比重２．２）の表面に厚み０．０５μｍ
のニッケルー金鍍金をした粒子０．４３ｇ （比重４，
３）とを混合し、充分分散して被膜形成用塗料を得た。This paint was applied to base material 1-2 using a bar coater and dried to form a base material. (The upper particles, which are insulating particles, are 5.
Contains 1 vol 1%. Particles made of conductive cotton balls plated with silver are: 1. Contains 1% Ovo. ) “Base material ■～
2'' A base material was formed in the same manner as base material 1X-1 except that the amount of silicon oxide particles (trade name: upper particles) was changed to 0.75 g. (The upper particle, which is an insulating particle, contains 2.6 vol.
Contains 1% o. ) "Substrate ■-3" A base material was formed in the same manner as base material 1X-1, except that the silicon oxide particles (trade name: upper particles) were O' and 15 g. (
The upper particle, which is an insulating particle, has a particle size of 0. Contains 5 vol1%. Particles made of conductive cotton balls plated with silver are: 1. O
vo! Contains %. ) r base material ■-4” Polyvinylcarbazole resin (trade name Tubicol) 1
0g and ultraviolet curing resin (product name D11-705) 5
g, 85 g of cyclohexanone, 0.15 g of divinylbenzene resin particles (product name: Microbal SP, particle size: 12 μm, specific gravity: 1.2), and 0.15 g of silicon oxide particles (product name: cotton balls, particle size: 3 μm, specific gravity: 2.2) with a thickness of 0. .05μm
0.43g of nickel-gold plated particles (specific gravity 4,
3) and were sufficiently dispersed to obtain a film-forming paint.
この塗料を、基材Ｉ−３にバーコーターで塗布し、乾燥
した後、紫外線で硬化させて基材を形成した。（絶縁粒
子である上粒子は、１． Ｏｖｏ１％含有。導電粒子で
ある真綿球にニッケルー金鍍金をした粒子は、０、 ８
ｙｏ１％含有。）
「基材■−５」
基材！−４を用い、紫外線硬化樹脂の代わりにポリエス
テル樹脂（商品名 バイロン）１ｇに、シクロへキサノ
ン８９ｇに、真綿球にニッケルー金鍍金をした粒子０．
１５ｇにした以外は、基材ｌＸ−４と同様にして基材を
形成した。（絶縁粒子である上粒子は、１． ３ ｖｏ
１％含有。導電粒子である真綿球にニッケルー金鍍金を
した粒子は、０、 ４ ｖｏ１％含有。）
「基材■−６」
ポリエステル樹脂（商品名 バイロン）２４ｇとシクロ
へキサノン８９ｇとジビニルベンゼン樹脂粒子（商品名
ミクロバールＳＰ 粒径１２μｍ比重１．２）１．
５ｇと酸化珪素粒子（商品名真綿球 粒径２，２μｍ
比重２．２）の表面に厚み０．０５μｍの銀鍍金をした
粒子０．３５ｇ（比ｆｆ１３．２）とを混合し、充分分
散して被膜形成用塗料を得た。この塗料を、基材Ｉ−６
に３８０メツシユのスクリーンを使用してスクリーン印
刷し、乾燥して基材を形成した。（絶縁粒子であるミク
ロバールＳＰは、６． １ ｖｏ１％含有。導電粒子
である真綿球に銀鍍金をした粒子は、０，５ｖｏ１％含
有。）
ｒ基材■−７」
ポリエステル樹脂（商品名 バイロン）２４００ｇとイ
ソホロン１３６００ｇと酸化珪素粒子（商品名 上粒子
粒径１６μｍ 比重２．２）２４０ｇと酸化珪素粒子
（商品名 真綿球 粒径３．５μｍ 比重２．２）０．
７ｇと酸化珪素粒子（商品名 真綿球 粒径２，４μｍ
比重２．２）の表面に厚み０．０５μｍの銀鍍金をした
粒子１０ｇ（比重３．２）とを混合し、充分分散して被
膜形成用塗料を得た。この塗料を、基材１−７に３８０
メツシユのスクリーンを使用してスクリーン印刷し、乾
燥して導電膜を形成した。（絶縁粒子である上粒子およ
び真綿球は両者の合計で５．４ ｖｏ１９６含有。導
電粒子である真綿球に銀鍍金をした粒子は、０． ２
ｖａｔ％含有。）以上のようにして得られた基材の、透
明性（全光線透過率： Ｔｔ 、ヘーズ：Ｈ）をヘーズ
コンピューター（スガ試験機製）で、表面抵抗（Ｒｓ
）を電極セル（ＹＨＰ製）で、および膜厚を測定し、表
１に結果を示した。This paint was applied to base material I-3 using a bar coater, dried, and then cured with ultraviolet rays to form a base material. (The upper particles, which are insulating particles, contain 1. Ovo1%. The particles, which are conductive particles made of cotton balls plated with nickel and gold, have a content of 0.8%.
Contains 1% yo. ) “Base material ■-5” Base material! -4, 1 g of polyester resin (trade name: Vylon) instead of ultraviolet curable resin, 89 g of cyclohexanone, and 0.0 g of nickel-gold plated cotton balls.
A base material was formed in the same manner as base material 1X-4 except that the weight was changed to 15 g. (The upper particle, which is an insulating particle, has 1.3 vo
Contains 1%. The conductive particles, which are cotton balls plated with nickel and gold, contain 0.4 vol. ) "Base material ■-6" 24 g of polyester resin (trade name: Vylon), 89 g of cyclohexanone, and divinylbenzene resin particles (trade name: Microbal SP, particle size: 12 μm, specific gravity: 1.2) 1.
5g and silicon oxide particles (trade name: cotton balls, particle size: 2.2μm)
0.35 g of particles (specific gravity: 2.2) whose surface was plated with silver to a thickness of 0.05 μm (ratio: ff: 13.2) were mixed and sufficiently dispersed to obtain a film-forming paint. Apply this paint to the base material I-6.
The substrate was screen printed using a 380 mesh screen and dried to form a substrate. (Microvar SP, which is an insulating particle, contains 6.1 vol. 1%. Particles made of silver-plated cotton balls, which are conductive particles, contain 0.5 vol. 1%.) r Base material ■-7" Polyester resin (product name Vylon) 2400 g, isophorone 13600 g, silicon oxide particles (trade name: upper particles, particle size 16 μm, specific gravity 2.2) 240 g, and silicon oxide particles (trade name: cotton balls, particle size 3.5 μm, specific gravity 2.2) 0.
7g and silicon oxide particles (product name cotton balls, particle size 2.4 μm)
10 g of particles (specific gravity 3.2) having a surface with a specific gravity of 2.2) plated with silver to a thickness of 0.05 μm were mixed and sufficiently dispersed to obtain a paint for film formation. Apply this paint to base material 1-7 at 380 ml.
A conductive film was formed by screen printing using a mesh screen and drying. (The upper particles and the cotton balls, which are insulating particles, contain a total of 5.4 vo196. The particles made by silver-plating the cotton balls, which are conductive particles, contain 0.2 vo196.
Contains VAT%. ) The surface resistance (Rs
) was measured using an electrode cell (manufactured by YHP) and its film thickness, and the results are shown in Table 1.
次にこれらの基材を表２〜７のように組合せ、タッチパ
ネルを作成した。得られたタッチパネルについて、下記
の評価を行なった。Next, these base materials were combined as shown in Tables 2 to 7 to create touch panels. The obtained touch panel was evaluated as follows.
人力状態：文字・図形を、タッチパネルに書き込み、表
示部の入力状態を評価し
た。Manual state: Characters and figures were written on the touch panel and the input state of the display section was evaluated.
摺動テスト： ３００ｇ荷重をかけたボールペンを、５
ｃｍの幅で摺動させ、線切れな
どの入力不能になるまでの往復回数
を評価した。Sliding test: A ballpoint pen with a load of 300g was
The device was slid with a width of cm, and the number of reciprocations until input became impossible due to line breakage was evaluated.
透 明 性：Ｔｔ、Ｈを測定した。Transparency: Tt and H were measured.
入力荷重：タッチペンに、定電流電源装置２１からＤＣ
１２Ｖ、１ｍＡを供給
し、ボールペンにかかる荷重を増加
させたとき、電圧計２３で電圧が３
Ｖ以下になった時点での荷重をｎ１定
した。Input load: DC from constant current power supply 21 to touch pen
When 12 V and 1 mA were supplied and the load applied to the ballpoint pen was increased, the load at the time when the voltage became 3 V or less with the voltmeter 23 was determined as n1.
表１ 第１タツチパネル 表２ 注：Ａ＝４電粒子粒子分散膜＝絶縁粒子分散膜。Table 1 1st touch panel Table 2 Note: A = 4 electric particles dispersed film = insulating particle dispersed film.
ｔＪ２タッチパネル 第３タツチパネル 第６タツチパネル 第４タツチパネル 表 第５タツチパネル 表tJ2 touch panel 3rd touch panel 6th touch panel 4th touch panel table 5th touch panel table
第１図〜第９図は基材ｌ〜基材■の要部断面図、第１０
図は本タッチパネルの要部断面図、第１１図は本第１〜
第６タツチパネルの座標読み取り原理の一例を示す概略
図、第１２図は本タッチパネルの一例を示す概略斜視図
である。
１・・・タッチパネル ２・・・可動パネル（上側）３
・・・固定パネル（下側） ４．５・・・絶縁基材６．
７・・・抵抗膜 ８・・・導電粒子分散膜９・・・
絶縁粒子分散膜 １２・・・被膜１４・・・絶縁粒子
１５・・・導電粒子第７．１８，１９．２０
・・・端子
２１・・・定電流装置 ２２・・・電流計２３・
・・電圧計 ２４・・・入力ペン代理人
弁理士 鈴 木 俊一部
第
図
第
図
←Ｉ
Ｉ→Figures 1 to 9 are sectional views of main parts of base materials 1 to 2, and 10
The figure is a sectional view of the main part of this touch panel, and Figure 11 is a sectional view of the main part of this touch panel.
A schematic diagram showing an example of the coordinate reading principle of the sixth touch panel, and FIG. 12 is a schematic perspective view showing an example of the present touch panel. 1...Touch panel 2...Movable panel (upper side) 3
... Fixed panel (lower side) 4.5 ... Insulating base material 6.
7... Resistive film 8... Conductive particle dispersed film 9...
Insulating particle dispersed film 12... Coating 14... Insulating particles 15... Conductive particles No. 7.18, 19.20
...Terminal 21... Constant current device 22... Ammeter 23.
...Voltmeter 24...Input pen agent
Patent Attorney Shunichi Suzuki Figure ←I I→
Claims (15)
導電層が形成された２枚の基材を用い、それぞれの導電
層を対向させ、略平行で所定の間隔に配置し、いずれか
一方の前記基材の一部を押圧することにより、該導電層
同士の一部を接触させて電気的に導通させるタッチパネ
ルにおいて、前記基材として下記の基材（III）と、基
材（ I ）、（II）、（III）、（IV）、（Ｖ）、（VI）
、（VII）、（VIII）、（IX）のうちのいずれか１枚と
を組み合わせたことを特徴とするタッチパネル。 基材（ I ）：所定膜厚の抵抗膜が表面に形成された基
材 基材（II）：導電粒子が分散し、導電粒子の一部が露出
する膜厚を有する抵抗膜が表面に形成された基材 基材（III）：［１］導電粒子が分散し、導電粒子の一
部が露出する膜厚を有する抵抗膜が基材表面に形成され
、［２］絶縁粒子が分散し、絶縁粒子の一部が露出する
か、あるいは絶縁粒子と導電粒子の一部が共に露出する
膜厚を有する被膜が前記抵抗膜に積層された基材 基材（IV）：［１］所定膜厚の抵抗膜が基材表面に形成
され、［２］導電粒子が分散し、導電粒子の一部が露出
する膜厚を有する導電粒子分散膜が前記抵抗膜に積層さ
れた基材 基材（Ｖ）：［１］所定膜厚の抵抗膜が基材表面に形成
され、［２］導電粒子が分散し、導電粒子の一部が露出
する膜厚を有する導電粒子分散膜が前記抵抗膜に積層さ
れ、［３］さらに絶縁粒子が分散し、絶縁粒子の一部が
露出するか、あるいは絶縁粒子と導電粒子の一部が共に
露出する膜厚を有する絶縁粒子分散膜が前記導電粒子分
散膜に積層された基材 基材（VI）：絶縁粒子が分散し、絶縁粒子の一部が露出
する膜厚を有する抵抗膜が形成された基材 基材（VII）：［１］所定膜厚の抵抗膜が基材表面に形
成され、［２］絶縁粒子が分散し、絶縁粒子の一部が露
出する膜厚を有する導電性の絶縁粒子分散膜が前記抵抗
膜に積層された基材 基材（VIII）：導電粒子および絶縁粒子が分散し、絶縁
粒子の一部が露出する膜厚を有する抵抗膜が表面に形成
された基材 基材（IX）：［１］所定膜厚の抵抗膜が形成され、［３
］導電粒子と絶縁粒子とが分散し、導電粒子と絶縁粒子
の一部が露出する膜厚を有する被膜が前記抵抗膜に積層
された基材(1) Using two base materials in which a conductive layer consisting mainly of a resistive film is formed on one surface of the insulating base material, each conductive layer is placed facing each other, approximately parallel to each other, and at a predetermined interval, and either In a touch panel in which parts of the conductive layers are brought into contact with each other and electrically conductive by pressing a part of one of the base materials, the following base material (III) and a base material (I ), (II), (III), (IV), (V), (VI)
, (VII), (VIII), and (IX). Base material (I): A base material with a resistive film of a predetermined thickness formed on the surface. Base material (II): A resistive film with a thickness such that conductive particles are dispersed and a portion of the conductive particles are exposed is formed on the surface. Base material (III): [1] Conductive particles are dispersed, and a resistive film having a thickness such that a part of the conductive particles is exposed is formed on the surface of the base material, [2] Insulating particles are dispersed, Base material (IV) in which a film having a thickness such that a part of the insulating particles or both the insulating particles and the conductive particles are exposed is laminated on the resistive film: [1] Predetermined film thickness [2] A base material (V ): [1] A resistive film with a predetermined thickness is formed on the surface of the base material, [2] A conductive particle dispersed film having a thickness such that conductive particles are dispersed and a part of the conductive particles are exposed is laminated on the resistive film. [3] Further, an insulating particle dispersed film having a thickness such that the insulating particles are dispersed and a part of the insulating particles are exposed, or a part of the insulating particles and a part of the conductive particles are exposed together is formed on the conductive particle dispersed film. Laminated base material Base material (VI): A base material on which insulating particles are dispersed and a resistive film having a thickness such that a part of the insulating particles is exposed. Base material (VII): [1] A layer of a predetermined film thickness. A resistive film is formed on the surface of the base material, and [2] a conductive insulating particle dispersed film having a thickness such that insulating particles are dispersed and a part of the insulating particles are exposed is laminated on the resistive film. (VIII): Base material on which conductive particles and insulating particles are dispersed, and a resistive film having a thickness that exposes a portion of the insulating particles is formed on the surface (IX): [1] Resistive film with a predetermined thickness is formed, [3
] A base material in which conductive particles and insulating particles are dispersed and a coating layered on the resistive film has a thickness such that a portion of the conductive particles and insulating particles are exposed.
導電層が形成された２枚の基材を用い、それぞれの導電
層を対向させ、略平行で所定の間隔に配置し、いずれか
一方の前記基材の一部を押圧することにより、該導電層
同士の一部を接触させて電気的に導通させるタッチパネ
ルにおいて、請求項第１項に記載の基材（Ｖ）と、基材
（ I ）、（II）、（IV）、（Ｖ）、（VI）、（VII）、
（VIII）、（IX）のうちのいずれか１枚とを組み合わせ
たことを特徴とするタッチパネル。(2) Using two base materials in which a conductive layer consisting mainly of a resistive film is formed on one surface of an insulating base material, each conductive layer is placed facing each other, approximately parallel to each other and at a predetermined interval, and either A touch panel in which a portion of the conductive layers are brought into contact with each other and electrically conductive by pressing a portion of one of the base materials, the base material (V) according to claim 1; (I), (II), (IV), (V), (VI), (VII),
A touch panel characterized by combining any one of (VIII) and (IX).
導電層が形成された２枚の基材を用い、それぞれの導電
層を対向させ、略平行で所定の間隔に配置し、いずれか
一方の前記基材の一部を押圧することにより、該導電層
同士の一部を接触させて電気的に導通させるタッチパネ
ルにおいて、請求項第１項に記載の基材（VI）と、基材
（ I ）、（II）、（IV）、（VI）、（VII）、（VIII）
、（IX）のうちのいずれか１枚とを組み合わせたことを
特徴とするタッチパネル。(3) Using two base materials in which a conductive layer consisting mainly of a resistive film is formed on one surface of an insulating base material, each conductive layer is placed facing each other, approximately parallel to each other, and at a predetermined interval, and either A touch panel in which a portion of the conductive layers are brought into contact with each other and electrically conductive by pressing a portion of one of the base materials, the base material (VI) according to claim 1; (I), (II), (IV), (VI), (VII), (VIII)
, (IX).
導電層が形成された２枚の基材を用い、それぞれの導電
層を対向させ、略平行で所定の間隔に配置し、いずれか
一方の前記基材の一部を押圧することにより、該導電層
同士の一部を接触させて電気的に導通させるタッチパネ
ルにおいて、請求項第１項に記載の基材（VII）と、基
材（ I ）、（II）、（IV）、（VII）、（VIII）、（I
X）のうちのいずれか１枚とを組み合わせたことを特徴
とするタッチパネル。(4) Using two base materials in which a conductive layer consisting mainly of a resistive film is formed on one surface of the insulating base material, each conductive layer is placed facing each other, approximately parallel to each other and at a predetermined interval, and either A touch panel in which a part of the conductive layers are brought into contact with each other and electrically conductive by pressing a part of one of the base materials, the base material (VII) according to claim 1; (I), (II), (IV), (VII), (VIII), (I
A touch panel characterized by combining any one of X).
導電層が形成された２枚の基材を用い、それぞれの導電
層を対向させ、略平行で所定の間隔に配置し、いずれか
一方の前記基材の一部を押圧することにより、該導電層
同士の一部を接触させて電気的に導通させるタッチパネ
ルにおいて、請求項第１項に記載の基材（VIII）と、基
材（ I ）、（II）、（IV）、（VIII）、（IX）のうち
のいずれか１枚とを組み合わせたことを特徴とするタッ
チパネル。(5) Using two base materials in which a conductive layer consisting mainly of a resistive film is formed on one surface of the insulating base material, the conductive layers are arranged facing each other, approximately parallel to each other, and at a predetermined interval, and either A touch panel in which a portion of the conductive layers are brought into contact with each other and electrically conductive by pressing a portion of one of the base materials, the base material (VIII) according to claim 1; A touch panel characterized by combining any one of (I), (II), (IV), (VIII), and (IX).
導電層が形成された２枚の基材を用い、それぞれの導電
層を対向させ、略平行で所定の間隔に配置し、いずれか
一方の前記基材の一部を押圧することにより、該導電層
同士の一部を接触させて電気的に導通させるタッチパネ
ルにおいて、請求項第１項に記載の基材（IX）と、基材
（ I ）、（II）、（IV）、（IX）のうちのいずれか１
枚とを組み合わせたことを特徴とするタッチパネル。(6) Using two base materials in which a conductive layer consisting mainly of a resistive film is formed on one surface of an insulating base material, each conductive layer is placed facing each other, approximately parallel to each other, and at a predetermined interval, and either A touch panel in which a part of the conductive layers are brought into contact with each other and electrically conductive by pressing a part of one of the base materials, the base material (IX) according to claim 1; Any one of (I), (II), (IV), (IX)
A touch panel characterized by a combination of two panels.
形成するに際して、抵抗膜形成用塗料中に均一分散して
あることを特徴とする請求項第１項から第６項に記載の
タッチパネル。(7) The conductive particles are uniformly dispersed in a coating material for forming a resistive film when the resistive film is coated on the insulating base material. Touch panel as described.
に塗布形成するに際して、導電粒子分散膜形成用塗料中
に均一分散してあることを特徴とする請求項第１項から
第７項に記載のタッチパネル。(8) The conductive particles are uniformly dispersed in a coating material for forming a conductive particle dispersed film when the conductive particle dispersed film is coated on the resistive film. The touch panel according to item 7.
するに際して、被膜形成用塗料中に均一分散してあるこ
とを特徴とする請求項第１項から第８項に記載のタッチ
パネル。(9) The touch panel according to any one of claims 1 to 8, wherein the conductive particles are uniformly dispersed in a film-forming paint when the film is coated on the resistive film. .
布形成するに際して、抵抗膜形成用塗料中に均一分散し
てあることを特徴とする請求項第１項から第９項に記載
のタッチパネル。(10) The insulating particles are uniformly dispersed in a coating material for forming a resistive film when the resistive film is coated on the insulating base material. Touch panel as described.
子分散膜上に塗布形成するに際して、絶縁粒子分散膜形
成用塗料中に均一分散してあることを特徴とする請求項
第１項から第１０項に記載のタッチパネル。(11) The insulating particles are uniformly dispersed in a paint for forming an insulating particle dispersed film when forming the insulating particle dispersed film on the conductive particle dispersed film. The touch panel according to item 10.
成するに際して、被膜形成用塗料中に均一分散してある
ことを特徴とする請求項第１項から第１１項に記載のタ
ッチパネル。(12) The touch panel according to any one of claims 1 to 11, wherein the insulating particles are uniformly dispersed in a film-forming paint when the film is coated on the resistive film. .
縁粒子であることを特徴とする請求項第１項から第１２
項のいずれかに記載のタッチパネル。(13) Claims 1 to 12, wherein the insulating particles are insulating particles having two or more types of particle sizes.
The touch panel described in any of the paragraphs.
された側の表面抵抗値を、他方の絶縁基材で膜が形成さ
れた側の表面抵抗値以上に設定し、高い表面抵抗値を有
する抵抗膜に電源の＋側を接続したことを特徴とする請
求項第１項から第１３項に記載のタッチパネル。(14) The surface resistance value of the side on which the conductive layer is formed on one of the opposing insulating base materials is set to be higher than the surface resistance value on the side on which the film is formed on the other insulating base material, and the surface resistance is high. 14. The touch panel according to claim 1, wherein the + side of a power source is connected to the resistive film having a value.
表面抵抗値が、積層前の抵抗膜の表面抵抗値より高くし
たことを特徴とする請求項第１項から第１４項に記載の
タッチパネル。(15) The touch panel according to any one of claims 1 to 14, wherein the surface resistance value of the conductive layer having the film or the insulating particle dispersed film is higher than the surface resistance value of the resistive film before lamination.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22359287 | 1987-09-07 | ||
| JP63-125429 | 1988-05-23 | ||
| JP63-125430 | 1988-05-23 | ||
| JP12542988 | 1988-05-23 | ||
| JP12543088 | 1988-05-23 | ||
| JP62-223592 | 1988-05-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0250214A true JPH0250214A (en) | 1990-02-20 |
| JPH0642189B2 JPH0642189B2 (en) | 1994-06-01 |
Family
ID=27315130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22377888A Expired - Fee Related JPH0642189B2 (en) | 1987-09-07 | 1988-09-07 | Touch panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642189B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03172913A (en) * | 1989-12-01 | 1991-07-26 | Omron Corp | Coordinate input device and manufacture thereof |
| WO1993015519A1 (en) * | 1992-01-30 | 1993-08-05 | Catalysts & Chemicals Industries Co., Ltd. | Writing pad and production thereof |
| JP5620678B2 (en) * | 2007-10-23 | 2014-11-05 | 宇部エクシモ株式会社 | Metal film forming method and conductive particles |
| JP2015130061A (en) * | 2014-01-07 | 2015-07-16 | 日本写真印刷株式会社 | touch panel |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61206116A (en) * | 1985-03-08 | 1986-09-12 | サンアロ−株式会社 | Conductive sheet |
| JPS61282909A (en) * | 1985-06-07 | 1986-12-13 | Seiko Epson Corp | Input device |
| JPS6292301A (en) * | 1985-10-17 | 1987-04-27 | 東レ株式会社 | Transparent resistive sheet with anisotropic conductive layer |
-
1988
- 1988-09-07 JP JP22377888A patent/JPH0642189B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61206116A (en) * | 1985-03-08 | 1986-09-12 | サンアロ−株式会社 | Conductive sheet |
| JPS61282909A (en) * | 1985-06-07 | 1986-12-13 | Seiko Epson Corp | Input device |
| JPS6292301A (en) * | 1985-10-17 | 1987-04-27 | 東レ株式会社 | Transparent resistive sheet with anisotropic conductive layer |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03172913A (en) * | 1989-12-01 | 1991-07-26 | Omron Corp | Coordinate input device and manufacture thereof |
| WO1993015519A1 (en) * | 1992-01-30 | 1993-08-05 | Catalysts & Chemicals Industries Co., Ltd. | Writing pad and production thereof |
| US5541370A (en) * | 1992-01-30 | 1996-07-30 | Catalysts & Chemicals Industries Co., Ltd. | Pressure-sensitive pad and production thereof |
| JP5620678B2 (en) * | 2007-10-23 | 2014-11-05 | 宇部エクシモ株式会社 | Metal film forming method and conductive particles |
| JP2015130061A (en) * | 2014-01-07 | 2015-07-16 | 日本写真印刷株式会社 | touch panel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642189B2 (en) | 1994-06-01 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| LAPS | Cancellation because of no payment of annual fees |