JPH0245693U - - Google Patents
Info
- Publication number
- JPH0245693U JPH0245693U JP12527388U JP12527388U JPH0245693U JP H0245693 U JPH0245693 U JP H0245693U JP 12527388 U JP12527388 U JP 12527388U JP 12527388 U JP12527388 U JP 12527388U JP H0245693 U JPH0245693 U JP H0245693U
- Authority
- JP
- Japan
- Prior art keywords
- board
- motherboard
- connector
- electronic device
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 claims 2
- 239000000428 dust Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第1図及び第2図は本考案ダミー基板の構造の
一実施例の実装状態を示す側面図及び正面図、第
3図及び第4図は従来技術の実装状態を示す側面
図及び正面図である。
1:案内レール、1a:レール凸部、2:ガイ
ド片、3:ダミー基板、4:リブ、5:マザーボ
ード、6:コネクタ、7:閉鎖部。
1 and 2 are side and front views showing the mounting state of one embodiment of the structure of the dummy board of the present invention, and FIGS. 3 and 4 are side and front views showing the mounting state of the conventional technology. be. 1: Guide rail, 1a: Rail protrusion, 2: Guide piece, 3: Dummy board, 4: Rib, 5: Motherboard, 6: Connector, 7: Closing part.
Claims (1)
持され、マザーボードのコネクタに接続されるプ
リント基板の非実装時に、プリント基板の代わり
に上記案内レールに支持してマザーボードのコネ
クタ内への粉塵の侵入を防止するダミー基板の構
造であつて、 上記ダミー基板の対向する両側辺の数ケ所に切
溝を入れて交互に折り曲げ形成され、上記電子機
器内の案内レールにガイドされるガイド片と、上
記ダミー基板の他の一辺を折り曲げて形成され電
子機器内に実装された状態で上記マザーボードの
コネクタの接続面を覆う閉鎖部とを一体成型によ
つて備え、上記ガイド片は、その内側側壁に上記
案内レールに圧接される突出状のリブを形成して
なることを特徴とするダミー基板の構造。[Claim for Utility Model Registration] When a printed circuit board is supported between a pair of opposing guide rails in an electronic device and is connected to a connector on a motherboard, when the printed circuit board is not mounted, the motherboard is supported on the guide rails in place of the printed circuit board. The structure of the dummy board is to prevent dust from entering into the connector, and the dummy board is formed by cutting grooves at several places on opposite sides of the board and bending them alternately, so that the guide rails inside the electronic device are The guide piece is integrally molded with a guide piece to be guided and a closing part formed by bending the other side of the dummy board and covering a connection surface of the connector of the motherboard when mounted in an electronic device. A structure of a dummy board, characterized in that each piece has a protruding rib formed on its inner side wall to be pressed against the guide rail.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988125273U JPH0729676Y2 (en) | 1988-09-26 | 1988-09-26 | Dummy board structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988125273U JPH0729676Y2 (en) | 1988-09-26 | 1988-09-26 | Dummy board structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0245693U true JPH0245693U (en) | 1990-03-29 |
JPH0729676Y2 JPH0729676Y2 (en) | 1995-07-05 |
Family
ID=31375734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988125273U Expired - Lifetime JPH0729676Y2 (en) | 1988-09-26 | 1988-09-26 | Dummy board structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0729676Y2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58175695U (en) * | 1982-05-17 | 1983-11-24 | 富士通株式会社 | Blank plate fixing mechanism |
JPS62128697U (en) * | 1986-02-07 | 1987-08-14 |
-
1988
- 1988-09-26 JP JP1988125273U patent/JPH0729676Y2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58175695U (en) * | 1982-05-17 | 1983-11-24 | 富士通株式会社 | Blank plate fixing mechanism |
JPS62128697U (en) * | 1986-02-07 | 1987-08-14 |
Also Published As
Publication number | Publication date |
---|---|
JPH0729676Y2 (en) | 1995-07-05 |
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