JPH0244046U - - Google Patents
Info
- Publication number
- JPH0244046U JPH0244046U JP11711788U JP11711788U JPH0244046U JP H0244046 U JPH0244046 U JP H0244046U JP 11711788 U JP11711788 U JP 11711788U JP 11711788 U JP11711788 U JP 11711788U JP H0244046 U JPH0244046 U JP H0244046U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- common electrode
- thermal head
- individual electrodes
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案のサーマルヘツドの一実施例の
全体説明図、第２図は同実施例の要部の斜視図、
第３図は第２図の矢視部分の拡大図、第４図は
同実施例の要部の分解斜視図、第５図は第４図の
−線断面図、第６，７図は従来のサーマルヘ
ツドの要部の説明図である。
１……支持体、１ｂ……絶縁基板支持表面（支
持体表面）、１ｃ……接着剤配設用凹部、２……
絶縁基板、３……接着剤、４……発熱抵抗体、５
……共通電極、５ａ……共通電極本体部、５ｂ…
…共通電極接続部、６……個別電極。
FIG. 1 is an overall explanatory diagram of an embodiment of the thermal head of the present invention, and FIG. 2 is a perspective view of the main parts of the embodiment.
FIG. 3 is an enlarged view of the part in the direction of the arrow in FIG. 2, FIG. 4 is an exploded perspective view of the main parts of the same embodiment, FIG. FIG. 3 is an explanatory diagram of the main parts of the thermal head of FIG. 1...Support body, 1b...Insulating substrate support surface (support surface), 1c...Recessed portion for adhesive placement, 2...
Insulating substrate, 3...Adhesive, 4...Heating resistor, 5
...Common electrode, 5a...Common electrode main body, 5b...
...Common electrode connection part, 6...Individual electrode.
Claims (1)
された多数の個別電極６と、これらの共通電極５
および個別電極６を接続する発熱抵抗体４とが表
面に形成された絶縁基板２の裏面が接着剤３によ
り支持体１の表面１ｂに固着されたサーマルヘツ
ドにおいて、前記絶縁基板２の裏面および支持体
１の表面１ｂの一方または両方に接着剤配設用凹
部１ｃが局所的に形成され、前記接着剤３はこの
接着剤配設用凹部１ｃに配設されたことを特徴と
するサーマルヘツド。 A common electrode 5, a large number of individual electrodes 6 arranged opposite to the common electrode 5, and these common electrodes 5.
In a thermal head, the back surface of an insulating substrate 2, on which a heating resistor 4 connecting the individual electrodes 6 is formed, is fixed to the surface 1b of a support 1 with an adhesive 3. A thermal head characterized in that an adhesive disposing recess 1c is locally formed on one or both surfaces 1b of the body 1, and the adhesive 3 is disposed in the adhesive disposing recess 1c.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11711788U JPH0244046U (en) | 1988-09-06 | 1988-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11711788U JPH0244046U (en) | 1988-09-06 | 1988-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0244046U true JPH0244046U (en) | 1990-03-27 |
Family
ID=31360277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11711788U Pending JPH0244046U (en) | 1988-09-06 | 1988-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244046U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0584952A (en) * | 1991-09-30 | 1993-04-06 | Rohm Co Ltd | Printing head substrate, printing head equipped therewith and printer using them |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5863473A (en) * | 1981-10-13 | 1983-04-15 | Oki Electric Ind Co Ltd | Thermal head |
| JPS6024211A (en) * | 1983-07-20 | 1985-02-06 | Kawasaki Steel Corp | Method for correcting camber of material to be rolled in thick-sheet rolling |
| JPS6185944A (en) * | 1984-08-17 | 1986-05-01 | パ−ソナル・プロダクツ・カンパニ− | Embossed absorbing structure |
| JPH01190467A (en) * | 1988-01-25 | 1989-07-31 | Tdk Corp | Thermal head |
-
1988
- 1988-09-06 JP JP11711788U patent/JPH0244046U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5863473A (en) * | 1981-10-13 | 1983-04-15 | Oki Electric Ind Co Ltd | Thermal head |
| JPS6024211A (en) * | 1983-07-20 | 1985-02-06 | Kawasaki Steel Corp | Method for correcting camber of material to be rolled in thick-sheet rolling |
| JPS6185944A (en) * | 1984-08-17 | 1986-05-01 | パ−ソナル・プロダクツ・カンパニ− | Embossed absorbing structure |
| JPH01190467A (en) * | 1988-01-25 | 1989-07-31 | Tdk Corp | Thermal head |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0584952A (en) * | 1991-09-30 | 1993-04-06 | Rohm Co Ltd | Printing head substrate, printing head equipped therewith and printer using them |