JPH0238932Y2 - - Google Patents

Info

Publication number
JPH0238932Y2
JPH0238932Y2 JP7760981U JP7760981U JPH0238932Y2 JP H0238932 Y2 JPH0238932 Y2 JP H0238932Y2 JP 7760981 U JP7760981 U JP 7760981U JP 7760981 U JP7760981 U JP 7760981U JP H0238932 Y2 JPH0238932 Y2 JP H0238932Y2
Authority
JP
Japan
Prior art keywords
plating
tank
plating liquid
master
holder frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7760981U
Other languages
Japanese (ja)
Other versions
JPS57192954U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7760981U priority Critical patent/JPH0238932Y2/ja
Publication of JPS57192954U publication Critical patent/JPS57192954U/ja
Application granted granted Critical
Publication of JPH0238932Y2 publication Critical patent/JPH0238932Y2/ja
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案は、情報記録媒体用原盤からスタンパを
作るに際して使用する無電解メツキ用治具装置に
関する。
[Detailed Description of the Invention] The present invention relates to an electroless plating jig device used when making a stamper from a master disc for an information recording medium.

例えばビデオデイスク用原盤は、ガラス盤の上
にレジストを塗布して、そのレジストに記録信号
としてのレーザビームを照射してピツトを形成し
たもので、このビデオデイスク原盤からスタンパ
を製造するには、スパツタリングによる方法と銀
鏡反応による方法が確立されている。
For example, a video disc master is made by coating a glass disc with a resist and irradiating the resist with a laser beam as a recording signal to form pits. To manufacture a stamper from this video disc master, A method using sputtering and a method using silver mirror reaction have been established.

しかしながら、これらの方法ではスタンパの寿
命や品質の点について限界があつた。またNi等
を用いる無電解メツキによる場合は、寿命・品質
共に向上するが、メツキ時に泡が生じたり、外部
からのゴミの混入があると、メツキ膜にムラがで
きてしまうなどの問題があつた。
However, these methods have limitations in terms of stamper life and quality. In addition, electroless plating using Ni etc. improves both lifespan and quality, but there are problems such as bubbles occurring during plating and unevenness in the plating film if dirt is mixed in from the outside. Ta.

本考案の目的は、無電解メツキを行なうに当つ
て、上記したような泡やゴミによるメツキ膜のム
ラができないようにすることができる無電解メツ
キ用治具装置を提供することである。
An object of the present invention is to provide a jig device for electroless plating that can prevent unevenness of the plating film caused by bubbles and dust as described above when performing electroless plating.

以下、本考案を実施例によつて説明する。第1
図および第2図において、1は円筒状のメツキ槽
本体であり、内部が隔壁2によつて外槽Aと内槽
Bとに分離されており、内槽Bの流入口3から流
入したメツキ液4は、隔壁2を越えて外槽Aにあ
ふれ出ると、その外槽Aの排出口5から出てフイ
ルタ6を通つて流入口3に循環するようになつて
いる。
The present invention will be explained below with reference to examples. 1st
In the figures and FIG. 2, 1 is a cylindrical plating tank main body, the inside of which is separated into an outer tank A and an inner tank B by a partition wall 2. When the liquid 4 overflows over the partition wall 2 into the outer tank A, it exits from the outlet 5 of the outer tank A, passes through the filter 6, and circulates to the inlet 3.

メツキ槽本体1の外槽Aの外壁にはナイロンボ
ール7から成る軸受を介してリング状のホルダ枠
8が回転自在に取り付けられており、このホルダ
枠8に90度の角度間隔でホルダ9が取付けられて
いる。
A ring-shaped holder frame 8 is rotatably attached to the outer wall of the outer tank A of the plating tank body 1 via a bearing made of nylon balls 7, and holders 9 are mounted on this holder frame 8 at angular intervals of 90 degrees. installed.

なお、10はガラス原盤である。 Note that 10 is a glass master disk.

本実施例においては、上記ホルダ9に、信号カ
ツテイング面が下面となるようにビデオデイスク
用のガラス原盤10を載せ、メツキ液4に浸す。
そして、Niメツキ反応が起ると泡が生じてくる
が、この時ホルダ枠8を回転させることにより、
その泡をガラス原盤10の外側に逃がすことがで
きる。また、このメツキ時においては、信号カツ
テイング面が下面となるので、上部からのゴミな
どがその信号カツテイング面に付着するおそれは
全くない。
In this embodiment, a glass master disc 10 for a video disk is placed on the holder 9 with the signal cutting surface facing downward, and immersed in the plating liquid 4.
Then, when the Ni plating reaction occurs, bubbles are generated, but at this time, by rotating the holder frame 8,
The bubbles can be released to the outside of the glass master disk 10. Further, during this plating, since the signal cutting surface is the lower surface, there is no possibility that dust or the like from above will adhere to the signal cutting surface.

以上のように、本考案による装置を使用すれ
ば、無電解メツキ時における泡やゴミによりメツ
キ膜にむらが生じるようなことは防止され、原盤
から無電解メツキによるスパツタを作る際に適し
ている。
As described above, by using the device according to the present invention, it is possible to prevent unevenness in the plating film caused by bubbles and dust during electroless plating, and it is suitable for making spatters by electroless plating from a master plate. .

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の無電解メツキ用治
具装置の平面図、第2図は第1図の−線に沿
つた断面図である。 1……メツキ槽本体、2……隔壁、3……流入
口、4……メツキ液、5……排出口、6……フイ
ルタ、7……ナイロンボール、8……ホルダ枠、
9……ホルダ、10……ガラス原盤。
FIG. 1 is a plan view of an electroless plating jig device according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along the - line in FIG. 1. 1... Plating tank body, 2... Partition wall, 3... Inlet, 4... Plating liquid, 5... Outlet, 6... Filter, 7... Nylon ball, 8... Holder frame,
9...Holder, 10...Glass master.

Claims (1)

【実用新案登録請求の範囲】 メツキ液流入口を底部に有し、上縁からメツキ
液を溢れさせる筒状の内槽、メツキ液排出口を底
部に有し、前記内槽から溢れた前記メツキを受け
るように前記内槽の外側に隣接して配された円環
状の外槽からなるメツキ槽と、 前記円環状の外槽に軸受を介して回転自在に取
り付けられたリング状のホルダ枠、このホルダ枠
に取り付けられ、原盤を信号カツテイング面が下
面となるように保持するホルダからなる原盤保持
手段と、 を備えた無電解メツキ用治具装置。
[Claims for Utility Model Registration] A cylindrical inner tank having a plating liquid inlet at the bottom and allowing the plating liquid to overflow from the upper edge, a plating liquid outlet at the bottom, and the plating liquid overflowing from the inner tank. a plating tank consisting of an annular outer tank arranged adjacent to the outside of the inner tank so as to receive the plating tank; a ring-shaped holder frame rotatably attached to the annular outer tank via a bearing; A jig device for electroless plating, comprising: master holding means comprising a holder attached to the holder frame and holding the master with the signal cutting surface facing downward;
JP7760981U 1981-05-29 1981-05-29 Expired JPH0238932Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7760981U JPH0238932Y2 (en) 1981-05-29 1981-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7760981U JPH0238932Y2 (en) 1981-05-29 1981-05-29

Publications (2)

Publication Number Publication Date
JPS57192954U JPS57192954U (en) 1982-12-07
JPH0238932Y2 true JPH0238932Y2 (en) 1990-10-19

Family

ID=29873260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7760981U Expired JPH0238932Y2 (en) 1981-05-29 1981-05-29

Country Status (1)

Country Link
JP (1) JPH0238932Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005048209A (en) * 2003-07-30 2005-02-24 Hitachi Ltd Electroless plating method, electroless plating device, method of fabricating semiconductor device, and fabrication device therefor

Also Published As

Publication number Publication date
JPS57192954U (en) 1982-12-07

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