JPH0238217A - Mechanism for determining separating position of semiconductor device - Google Patents
Mechanism for determining separating position of semiconductor deviceInfo
- Publication number
- JPH0238217A JPH0238217A JP63186117A JP18611788A JPH0238217A JP H0238217 A JPH0238217 A JP H0238217A JP 63186117 A JP63186117 A JP 63186117A JP 18611788 A JP18611788 A JP 18611788A JP H0238217 A JPH0238217 A JP H0238217A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- slide rail
- rail
- cylinder
- claw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 50
- 210000000078 claw Anatomy 0.000 abstract description 23
- 238000000926 separation method Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
Landscapes
- Special Conveying (AREA)
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用公費〕
この発明は、例えば半導体製造装置における半導体装置
等の分離切出位置決め機構に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Public Expenses for Industrial Use] The present invention relates to a separation/cutting and positioning mechanism for semiconductor devices, etc. in, for example, semiconductor manufacturing equipment.
第８図は従来の半導体装置の分離切出位置決め機構を示
しており、図において、１、ｌａ、ｌｂは半導体装置、
２は半導体装置１を水平１列にガイドするレール、３は
レール１の延長線上にあり、任意の駆動手段により水平
往復移動可能で、真空吸着機能を備え、供給されてきた
半導体装置１を停止させるための壁３ａを持ったスライ
ドレールである。FIG. 8 shows a conventional separation/cutting and positioning mechanism for semiconductor devices, and in the figure, 1, la, and lb are semiconductor devices;
2 is a rail that guides the semiconductor devices 1 in a horizontal row; 3 is an extension of the rail 1; it can be horizontally reciprocated by any driving means, has a vacuum suction function, and stops the semiconductor devices 1 that have been supplied. It is a slide rail with a wall 3a for moving the vehicle.
次に動作について説明する。第８図において、レール２
の延長線上で点線で示す位置で待機しているスライドレ
ール３に、矢印Ｂの方向から供給されてきた半導体装置
１ａがスライドレール３の壁３ａに当ると、供給を停止
し、スライドレール３上に１個の半導体装置を載せる。Next, the operation will be explained. In Figure 8, rail 2
When the semiconductor device 1a supplied from the direction of arrow B hits the wall 3a of the slide rail 3 on the slide rail 3, which is waiting at the position indicated by the dotted line on the extension line of One semiconductor device is placed on the board.
次いで、スライドレール３は半導体装置１ａを吸着保持
すると、矢印０の方向に水平移動し、半導体装ｔｌ−分
離切出しを行う。Next, the slide rail 3 sucks and holds the semiconductor device 1a, moves horizontally in the direction of arrow 0, and separates and cuts out the semiconductor device tl.
従来の半導体装置の分離切出位置決め機構は以上のよう
に構成されているので、第６図において、半導体装１を
分離切出す際の撮動や、切出直後の停止時のｍｓのため
に、半導体装置が１ｂのように斜線で示すようにはみ出
し、次工程へ半導体装置を搬送できないばかりか、スラ
イドレール上の半導体装置が受傷または破損する等の問
題点があった。Since the conventional separation and cutting positioning mechanism for semiconductor devices is configured as described above, in FIG. , the semiconductor device protrudes as indicated by diagonal lines 1b, which not only makes it impossible to transport the semiconductor device to the next process, but also causes problems such as damage or damage to the semiconductor device on the slide rail.
この発明は上記のような問題点を解消するためになされ
たもので、半導体装置の分離切出し位置決めを確実に行
うことによって、半導体製造装置の信頼性を向上させる
と共に、半導体装置の不良を解消できる分離切出位置決
め機構を得ることを目的とする。This invention was made to solve the above-mentioned problems, and by reliably positioning the separation and cutting of semiconductor devices, it is possible to improve the reliability of semiconductor manufacturing equipment and eliminate defects in semiconductor devices. The purpose is to obtain a separation cutout positioning mechanism.
〔課題を解決するための手段〕
この発明に係る半導体装置の分離切出位置決め機構は１
半導体装置を分離切出した後、切出搬送方向の後方から
半導体装置を押圧する後押爪を備えたものである。[Means for Solving the Problem] A semiconductor device separation/cutting and positioning mechanism according to the present invention includes 1
After the semiconductor device is separated and cut out, it is provided with a rear pushing claw that presses the semiconductor device from the rear in the cutting and conveying direction.
この発明における半導体装置の分離切出装置は、半導体
装置を載せ真空吸着し、切出搬送方向へ水平移動したス
ライドレ−ルにより分離切出され、更に後方より水平運
動する後押爪により、スライドレール上の半導体装置を
押圧し、位置決めする。The separating and cutting device for semiconductor devices according to the present invention mounts the semiconductor device and vacuum-chucks it, separates and cuts it by a slide rail that moves horizontally in the cutting and conveying direction, and then slides it by a rear pusher claw that moves horizontally from the rear. Press and position the semiconductor device on the rail.
以下この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図〜第５図において、Ｉ Ｓｌ＆ ｌｌｂはそれぞ
れ半導体装置、２は半導体装＠ｌを水平１列に案内する
レール、３はレール１の延長上にあって、供給された半
導体装置１を停止させる壁３ａがあり、先頭の半導体装
置１ａを吸着する機能を備えた水平移動可能なスライド
レール、４はスライドレール３を水平移動させるエアシ
リンダ、５は切出分離待機中のスライドレール３、及び
その上の半導体装置ｌａの上で待機し、Ｌ字形で、２つ
の互いに平行な摺動面をその側面に備えた後押爪、６は
後押爪５の側面を案内し上下動作を案内する垂直ガイド
、７は後押爪５に垂直ガイド６の案内面に対し、垂直に
取付は固定された軸、８は後押爪５を駆動させるエアシ
リンダ、９は垂直ガイド６企取付けて後押爪５を保持す
ると共に、ｆｉＩｌＩ７の上下動でガイドする長穴９ａ
（第４図破線で示す）を備え、エアシリンダ８と直結
されたブロック、ｌｏは後押爪５をレール２に対し平行
に移動させるため、ブロック９を貫通し、互いに平行な
２本のガイドバー１１はエアシリンダー８、ガイドバー
１０が取付けられ、後押爪５が上下するための上下に段
差がある溝が備えられているプレート、認は軸７に貫か
れ、ブロック９の背面に位置し、プレート１１の溝に沿
ってころがり、後押爪５を上下動させるカムフォロアで
ある。In FIGS. 1 to 5, I Sl & Ilb are semiconductor devices, 2 is a rail that guides the semiconductor devices @l in one horizontal row, and 3 is an extension of the rail 1 to guide the supplied semiconductor devices 1. A horizontally movable slide rail that has a wall 3a for stopping and has a function of adsorbing the leading semiconductor device 1a; 4 is an air cylinder that horizontally moves the slide rail 3; 5 is a slide rail 3 waiting for cutting and separation; and a rear pusher claw 6 that waits on top of the semiconductor device la thereon, is L-shaped and has two mutually parallel sliding surfaces on its side surfaces, and 6 guides the side surface of the rear pusher claw 5 to guide the vertical movement. 7 is a fixed shaft installed perpendicularly to the guide surface of the vertical guide 6 on the rear push claw 5; 8 is an air cylinder that drives the rear push claw 5; 9 is a shaft that is fixed after the vertical guide 6 is installed. Elongated hole 9a that holds the pusher claw 5 and guides it by vertical movement of fiIlI7
(shown by the broken line in Figure 4), a block directly connected to the air cylinder 8, lo is two guides that pass through the block 9 and are parallel to each other in order to move the rear push claw 5 parallel to the rail 2. The bar 11 is a plate to which an air cylinder 8 and a guide bar 10 are attached, and is provided with a groove with a step at the top and bottom for the rear push claw 5 to move up and down. This is a cam follower that rolls along the groove of the plate 11 and moves the rear push claw 5 up and down.
次に動作について説明する。第１図、第２図のように、
スライドレール３はエアシリンダ４が、また、後押爪５
はエアシリンダ８がそれぞれ引込状態で待機しており、
レール２上を矢印Ｂの方向から半導体装＠１が連続供給
される。Next, the operation will be explained. As shown in Figures 1 and 2,
The slide rail 3 is equipped with an air cylinder 4 and a rear push claw 5.
The air cylinders 8 are waiting in the retracted state,
Semiconductor devices @1 are continuously supplied on the rail 2 from the direction of arrow B.
次に先頭の半導体装置１ａがスライドレール３の壁３ａ
に当たると、供給が停止する。次にスライドレール３上
の半導体装置１＆を真空吸着し、吸着保持のままエアシ
リンダ４が動作して、第８図矢印０方向に移動して、半
導体装Ｉｌｌ ｌａが１個分離切出される。Next, the first semiconductor device 1a is placed on the wall 3a of the slide rail 3.
If it hits, the supply will stop. Next, the semiconductor device 1& on the slide rail 3 is vacuum-suctioned, and while the semiconductor device 1& is being held, the air cylinder 4 is operated to move in the direction of arrow 0 in FIG. 8, and one semiconductor device Illa is separated and cut out.
次に、エアシリンダ８が動作すると、そのロンド先端に
取付けられているブロック９、さらにブロック９に具備
されている後押爪５、垂直ガイド６、軸７、カムフォロ
ア庄が第８図の矢印０の方向に水平に動きだす。まもな
く、カムフォロア１２がプレート１１の溝の斜面にさし
かかると、斜面に沿ってカムフォロアしが、軸７により
連動して、後押爪５が垂直ガイド６の内側を摺動しなが
ら下降しつつ、水平移動する。りがて、プレート１１ノ
溝の斜面が終ったところから、溝は水平になるため、そ
れに従って刀ムフォロアセ、さらに後押爪５が水平移動
し、スライドレール３上の半導体装置１ａｔ−壁３ａに
押付ける。第８図破線矢印の軌跡を後押爪５はたどる。Next, when the air cylinder 8 operates, the block 9 attached to the tip of the cylinder, the rear push claw 5, the vertical guide 6, the shaft 7, and the cam follower provided on the block 9 are moved to the arrow 0 in FIG. It begins to move horizontally in the direction of. Soon, when the cam follower 12 reaches the slope of the groove of the plate 11, the cam follower moves along the slope, and is moved horizontally while the rear push pawl 5 slides inside the vertical guide 6 and descends in conjunction with the shaft 7. Moving. Since the groove becomes horizontal from the point where the slope of the groove of the plate 11 ends, the blade follower and the rear pusher claw 5 move horizontally accordingly, and the semiconductor device 1at on the slide rail 3 is moved to the wall 3a. press The pusher claw 5 follows the trajectory of the broken line arrow in FIG.
次にエアシリンダ８が引込動作に入ると、第８図の破線
矢印を逆にたどって、後押爪５は第１図、第２図の待機
位置に戻り、スライドレール３の吸着を停止し、次工程
の搬送機Ｗにより、スライドレール３上の半導体装置１
ａは次工程へ搬送される。次にスライドレール３はエア
シリンダ４が引込動作を始め、第８図矢印Ｏの逆方向に
水平移動し、第１図、第２図の待機状態に戻り、次の半
導体装＠１の分離動作を上記一連の動作により行う。Next, when the air cylinder 8 enters the retracting operation, the rear push claw 5 returns to the standby position shown in FIGS. 1 and 2 by following the broken line arrow in FIG. 8 in the opposite direction, and stops adsorbing the slide rail 3. , the semiconductor device 1 on the slide rail 3 is transported by the next process transport machine W.
a is transported to the next process. Next, the air cylinder 4 starts retracting the slide rail 3, and the slide rail 3 moves horizontally in the opposite direction of the arrow O in FIG. 8, returns to the standby state shown in FIGS. is performed by the above series of operations.
なお上記実施例では、スライドレール３、後押爪５の駆
動にエアシリンダを用いたが、他ノ駆動装置、例えばン
レノイド等でもよい。また、上記実施例では後押爪５が
スライドレール３上の半導体装置１ａの上方に待機し、
そこから下降水平移動するように、機構を構成したが、
第６図のように後押爪５をレールｌの下部に待機させた
り、第７図のように後押爪５をレール１の左右いずれか
に待機させ、各々破線矢印の軌跡をたどるようにプレー
） １１の取付方向や溝の方向を変えた機構の構成にし
ても同様の効果を奏する。In the above embodiment, an air cylinder is used to drive the slide rail 3 and the rear pusher claw 5, but other drive devices such as an lenoid may also be used. Further, in the above embodiment, the rear push claw 5 waits above the semiconductor device 1a on the slide rail 3,
The mechanism was configured to move downward horizontally from there, but
As shown in Fig. 6, the rear pusher claw 5 is placed on standby at the bottom of the rail l, or as shown in Figure 7, the rear pusher claw 5 is placed on standby on either the left or right side of the rail 1, and each follows the locus of the dashed arrow. A similar effect can be obtained even if the mechanism is configured by changing the mounting direction of 11 or the direction of the groove.
以上のようにこの発明によれば、後押爪を備えることで
、半導体装置の分ＩＩＩすＪ出を確実なものにし、さら
に位置の矯正ができるので、次工程への搬送が確実とな
り、信頼性の高い装置が得られる効果がある。また、分
離切出直後のスライドレール上の半導体装置を位置決め
することにより、半導体装置の傷？破損等の不良発生を
防ぐ効果がある。As described above, according to the present invention, by providing the rear pusher claw, it is possible to ensure that the semiconductor device is fully exposed, and also to correct the position, so that transportation to the next process is ensured and reliable. This has the effect of providing a device with high performance. Also, by positioning the semiconductor device on the slide rail immediately after separation and cutting, it is possible to prevent damage to the semiconductor device. This has the effect of preventing defects such as damage.
第１図はこの発明の一実施例による分離切出位置決め機
構の平面図、第２図は待機状態の正面図、第８図は動作
後の正面図、第４図は背面図、第５図は断面図、第６図
、第７図はそれぞれこの発明の他の実施例を示す正面図
と平面図、第８図は従来の分離切出直後を示す正面図で
ある。
因において、１は半導体装置、２はレール、３はスライ
ドレール、４はエアシリンダ、５は後押爪、６は垂直ガ
イド、７は軸、８はエアシリンダ、９はブロック、気は
長穴、ｌＯはガイドバー １１はプレート、臣はカム７
オロ了である。Fig. 1 is a plan view of a separation cutout positioning mechanism according to an embodiment of the present invention, Fig. 2 is a front view in a standby state, Fig. 8 is a front view after operation, Fig. 4 is a rear view, and Fig. 5. 6 is a sectional view, FIG. 6 is a front view and a plan view showing other embodiments of the present invention, and FIG. 8 is a front view showing the conventional structure immediately after separation and cutting. In the figures, 1 is a semiconductor device, 2 is a rail, 3 is a slide rail, 4 is an air cylinder, 5 is a rear pusher claw, 6 is a vertical guide, 7 is a shaft, 8 is an air cylinder, 9 is a block, and qi is a long hole. , lO is the guide bar, 11 is the plate, and 10 is the cam 7.
It's completely obvious.
Claims (1)
ルと、その搬送方向の延長上の先端に配置され、上記半
導体装置のモールド部を真空吸着するための貫通穴を上
方に備えた水平往復連動可能なスライドレールと、それ
を駆動せしめるシリンダーと、上記スライドレールの上
方に配置され、溝カムを有するプレートと、このプレー
トに取付けられた平行２列の直線ガイドバーと、このガ
イドバーに係合され水平運動可能であり、中央部分に上
下方向の長穴を有したブロックと、上記プレートの溝カ
ムに沿つて案内されるカムフォロワを一端に有し、上記
ブロックの長穴を貫通し、他端に垂直ガイドによつて上
下方向に摺動案内される後押爪とを有する軸と、上記垂
直ガイドを水平方向に駆動せしめるシリンダーとを備え
たことを特徴とする半導体装置の分離切出位置決め機構
。A rail that guides a semiconductor device that is fixedly placed in the horizontal direction, and a rail that is placed at the end of the extension in the transport direction and has a through hole above for vacuum suction of the mold part of the semiconductor device, and can be moved horizontally back and forth. a slide rail, a cylinder for driving the slide rail, a plate disposed above the slide rail and having a grooved cam, two parallel rows of linear guide bars attached to this plate, and a cylinder that is engaged with the guide bar. A block that is movable horizontally and has a vertically elongated hole in the central part, and a cam follower at one end that is guided along the grooved cam of the plate, passes through the elongated hole of the block, and has a cam follower at the other end. 1. A positioning mechanism for separating and cutting out semiconductor devices, comprising: a shaft having a rear push pawl that is slidably guided in the vertical direction by a vertical guide; and a cylinder that drives the vertical guide in the horizontal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63186117A JPH0238217A (en) | 1988-07-25 | 1988-07-25 | Mechanism for determining separating position of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63186117A JPH0238217A (en) | 1988-07-25 | 1988-07-25 | Mechanism for determining separating position of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238217A true JPH0238217A (en) | 1990-02-07 |
Family
ID=16182659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63186117A Pending JPH0238217A (en) | 1988-07-25 | 1988-07-25 | Mechanism for determining separating position of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238217A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006021928A (en) * | 2004-06-08 | 2006-01-26 | Ueno Seiki Kk | Parts feeder |
| CN107680920A (en) * | 2017-10-10 | 2018-02-09 | 覃其伦 | A kind of solar battery sheet breaks piece equipment |
| CN112830220A (en) * | 2021-01-27 | 2021-05-25 | 王龙龙 | Intermittent type formula unloading material feeding unit |
-
1988
- 1988-07-25 JP JP63186117A patent/JPH0238217A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006021928A (en) * | 2004-06-08 | 2006-01-26 | Ueno Seiki Kk | Parts feeder |
| CN107680920A (en) * | 2017-10-10 | 2018-02-09 | 覃其伦 | A kind of solar battery sheet breaks piece equipment |
| CN107680920B (en) * | 2017-10-10 | 2019-11-01 | 安徽天念材料科技有限公司 | A kind of solar battery sheet breaks piece equipment |
| CN112830220A (en) * | 2021-01-27 | 2021-05-25 | 王龙龙 | Intermittent type formula unloading material feeding unit |
| CN112830220B (en) * | 2021-01-27 | 2022-07-19 | 湖北雪飞化工有限公司 | Intermittent type formula unloading material feeding unit |
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