JPH0238062A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH0238062A JPH0238062A JP19043788A JP19043788A JPH0238062A JP H0238062 A JPH0238062 A JP H0238062A JP 19043788 A JP19043788 A JP 19043788A JP 19043788 A JP19043788 A JP 19043788A JP H0238062 A JPH0238062 A JP H0238062A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- layer
- heating resistor
- conductor
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 35
- 239000004020 conductor Substances 0.000 claims abstract description 34
- 238000010438 heat treatment Methods 0.000 claims abstract description 25
- 230000001681 protective effect Effects 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 239000010407 anodic oxide Substances 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 abstract description 8
- 238000007254 oxidation reaction Methods 0.000 abstract description 8
- 238000005530 etching Methods 0.000 abstract description 5
- 238000004544 sputter deposition Methods 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 abstract description 3
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 8
- 238000007639 printing Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002048 anodisation reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005338 heat storage Methods 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- OTRAYOBSWCVTIN-UHFFFAOYSA-N OB(O)O.OB(O)O.OB(O)O.OB(O)O.OB(O)O.N.N.N.N.N.N.N.N.N.N.N.N.N.N.N Chemical compound OB(O)O.OB(O)O.OB(O)O.OB(O)O.OB(O)O.N.N.N.N.N.N.N.N.N.N.N.N.N.N.N OTRAYOBSWCVTIN-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は耐環境性の高いサーマルヘッドに関し、特に耐
湿特性の優れたアルミニウム導体配線を有スルサーマル
ヘッドに関スる。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal head with high environmental resistance, and particularly to a thermal head with aluminum conductor wiring having excellent moisture resistance.
サーマルヘッドを有する印字装置の普及に伴い、サーマ
ルヘッドの耐環境性の向上への要求もますます高まって
きた。With the spread of printing devices having thermal heads, there has been an increasing demand for improved environmental resistance of the thermal heads.
第４図は従来のサーマルヘッドの基本的層構成を示す断
面図である。一般約にサーマルヘッドは図のようにガラ
ス質の蓄熱層を付けたセラミック基板１上に抵抗体層２
よりなる発熱抵抗帯１０と発熱抵抗体の両端に接続され
た導体配線３が形成され、それらの上に絶縁保護膜５が
被着されている。ここで導体配線には安価で加工性に富
むアルミニウムが用いられ、絶縁保護膜には耐摩耗性に
優れたＳｉＣや５ｉｉＮ４などの硬質絶縁材料が用いら
れる。通常これらの成膜には量産性のあるスパッタ法が
用いられる。FIG. 4 is a sectional view showing the basic layer structure of a conventional thermal head. Generally speaking, a thermal head consists of a ceramic substrate 1 with a glass heat storage layer and a resistor layer 2 as shown in the figure.
Conductive wiring 3 connected to both ends of the heating resistor band 10 and the heating resistor are formed, and an insulating protective film 5 is deposited thereon. Here, aluminum, which is inexpensive and has good workability, is used for the conductor wiring, and a hard insulating material such as SiC or 5iiN4, which has excellent wear resistance, is used for the insulating protective film. Usually, a sputtering method that is suitable for mass production is used for forming these films.
上述した従来のサーマルヘッドにおいては導体配線とし
て用いるアルミニウムが腐食しやすい性質があるため、
配線パターンの断線をひきおこし、印字不良をおこすと
いう欠点を有する。このようなアルミニウム配線の腐食
は絶縁保護膜成膜で生じるピンホールなどの欠陥や印字
中に生じる絶縁保護膜の傷などを起点として進行する。In the conventional thermal head mentioned above, the aluminum used for the conductor wiring has a tendency to corrode.
This method has the drawback of causing disconnection of the wiring pattern and causing printing defects. Such corrosion of aluminum wiring progresses starting from defects such as pinholes that occur during the formation of an insulating protective film and scratches on the insulating protective film that occur during printing.
特に水滴が付いた状態や湿度の高い部屋で使用する場合
電解効果による腐食の発生率が著しく増大する。絶縁保
護膜を前述したような硬質材料とした場合印字中の傷な
どによる腐食の発生率を小さくできる。In particular, when used with water droplets or in a room with high humidity, the incidence of corrosion due to electrolytic effects increases significantly. When the insulating protective film is made of a hard material as described above, the incidence of corrosion due to scratches during printing can be reduced.
しかし成膜で生じるピンホールなどの欠陥を完全になく
すことは困難であった。However, it has been difficult to completely eliminate defects such as pinholes that occur during film formation.
本発明のサーマルヘッドは絶縁基板上に形成された発熱
抵抗帯及び発熱抵抗帯と電気的に接続されたアルミニウ
ムよりなる導体配線と発熱抵抗帯及び導体配線の上に被
着された絶縁保護膜とを有するサーマルヘッドにおいて
、導体配線の表面がアルミニウム陽極酸化層におおわれ
ていることを特徴としている。The thermal head of the present invention includes a heating resistance band formed on an insulating substrate, a conductor wiring made of aluminum electrically connected to the heating resistance band, and an insulating protective film deposited on the heating resistance band and the conductor wiring. The thermal head is characterized in that the surface of the conductor wiring is covered with an aluminum anodic oxide layer.
上述した従来のサーマルヘッドはアルミニウムよりなる
導体配線の上に直接スパッタ法などを用いて被着した絶
縁保護膜が形成されているのに対し、本発明のサーマル
ヘッドはアルミニウム配線の表面はアルミニウム陽極酸
化層でおおわれ、その上に絶縁保護膜が被着されている
という相違点を有する。The conventional thermal head described above has an insulating protective film deposited directly on the conductor wiring made of aluminum using a sputtering method, etc., whereas the thermal head of the present invention has an aluminum anode on the surface of the aluminum wiring. The difference is that it is covered with an oxide layer and an insulating protective film is deposited on top of it.
次に、本発明を図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の実施例１のサーマルヘッドの基本的層
構成を示す断面図である。■はガラス蓄熱層が付けられ
たセラミック基板であり、２は０．１μｍのＴａＳｉＯ
２抵抗体層、３は１μｍのアルミニウム導体層であり発
熱抵抗帯１０及び第３図の平面図の１１．１２に示すよ
うな導体配線が発熱抵抗帯端の壁面１３以外のアルミニ
ウム導体配線の表面は０．２μｍのアルミニウム陽極酸
化層４で被われている。絶縁保護５には５μｍのＳｉ３
Ｎ４をスパッタ法で被着した。発熱抵抗帯及び導体配線
の形成は抵抗体層とアルミニウム層を被着した後発熱抵
抗帯を含む配線パターンを両層を同時にエツチングして
形成し、その後、発熱抵抗帯部のアルミニウム層のみを
エツチング除去して行なうことができる。発熱抵抗帯端
部の壁面以外のアルミニウム表面の陽極酸化層の形成は
配線パターン形成後発熱抵抗帯部のアルミニウム層の除
去の前に陽極酸化を行なえばよい。この場合各個別導体
配線１１は共通導体配線１２を通して電気的に短絡して
いるので共通導体配線の一端に電圧を印加するだけでそ
の後エツチング除去される発熱抵抗帯両端部の壁面を除
いた全面が均一に陽極酸化できる。なお陽極酸化には電
解液として５％五ホウ酸アンモニウム水溶液を用い、電
解電圧は１５０■とした。五ホウ酸アンモニア水溶液を
用いた場合緻密で絶縁性の高い陽極酸化層を得ることが
できる。FIG. 1 is a sectional view showing the basic layer structure of a thermal head according to Example 1 of the present invention. ■ is a ceramic substrate with a glass heat storage layer attached, and 2 is a 0.1 μm TaSiO
2 is a resistor layer, 3 is a 1 μm aluminum conductor layer, and the heat generating resistor band 10 and the conductor wiring as shown in 11.12 in the plan view of FIG. is covered with a 0.2 μm aluminum anodized layer 4. 5μm Si3 for insulation protection 5
N4 was deposited by sputtering. The heating resistor band and conductor wiring are formed by depositing the resistor layer and aluminum layer, then etching both layers simultaneously to form a wiring pattern including the heating resistor band, and then etching only the aluminum layer in the heating resistor band. It can be done by removing it. The anodic oxidation layer on the aluminum surface other than the wall surface of the end portion of the heat generating resistor band may be formed by performing anodization after forming the wiring pattern and before removing the aluminum layer of the heat generating resistor band portion. In this case, each individual conductor wiring 11 is electrically short-circuited through the common conductor wiring 12, so that by simply applying a voltage to one end of the common conductor wiring, the entire surface of the heating resistor band except the wall surfaces at both ends of the heating resistor band is etched away. Can be anodized uniformly. In the anodization, a 5% aqueous ammonium pentaborate solution was used as the electrolyte, and the electrolytic voltage was 150 .mu.m. When an aqueous ammonia pentaborate solution is used, a dense and highly insulating anodic oxide layer can be obtained.
本実施例と従来のサーマルヘッド基板を放熱板に組み、
共通導体配線に放熱板に対して＋２４Ｖの電圧を印加し
た状態で温度６０℃、湿度９０％の槽内に入れ耐湿性の
比較をした。６００時間後に腐食の有無をチエツクした
ところ従来のサーマルヘッドは２０本中３本にアルミニ
ウム導体配線の腐食が発生していたが本実施例のサーマ
ルヘッドの場合腐食は認められなかった。以上のように
アルミニウム導体配線を化学的に安定な陽極酸化層でお
おうことにより絶縁保護膜の欠陥などによるアルミニウ
ム腐食を抑える効果がある。This embodiment and the conventional thermal head board are assembled into a heat sink,
A voltage of +24V was applied to the common conductor wiring with respect to the heat sink, and the test pieces were placed in a bath at a temperature of 60° C. and a humidity of 90% to compare their moisture resistance. When checking for corrosion after 600 hours, it was found that 3 out of 20 conventional thermal heads had corrosion in the aluminum conductor wiring, but no corrosion was observed in the thermal head of this example. As described above, covering the aluminum conductor wiring with a chemically stable anodic oxide layer has the effect of suppressing aluminum corrosion caused by defects in the insulating protective film.
第３図は本発明の実施例２の断面図である。本実施例も
実施例１と同じ層構成で作られたがアルミニウム陽極酸
化層は発熱抵抗帯両端側壁部も形成されている。発熱抵
抗帯部のアルミニウムを除去した後で陽極酸化する場合
共通導体配線の一端に電圧印加するだけでは個別導体配
線部分は電圧降下が生じるので陽極酸化が進行しない。FIG. 3 is a sectional view of Example 2 of the present invention. This example was also made with the same layer structure as Example 1, but the aluminum anodized layer was also formed on the side walls at both ends of the heating resistor band. When performing anodic oxidation after removing the aluminum from the heat-generating resistor band, simply applying a voltage to one end of the common conductor wiring will cause a voltage drop in the individual conductor wiring, so that the anodic oxidation will not proceed.
均一な膜厚の陽極酸化層は個別配線の一部が短絡するよ
うに第４図の破線部１４を残してパターン形成を行ない
１２．１４両方に電圧印加を行なって陽極酸化後斜線部
の短絡部分をエツチング除去して得ることができる。発
熱抵抗帯端部印字中に機械的な圧力を強く受ける上に膜
応力が強く働いているため絶縁保護膜の小さいクラック
が発生し、アルミニウム腐食の起点となりやすい。本実
施例のように発熱抵抗帯端部壁面も陽極酸化層を設けた
場合よりいっそうの耐湿特性の向上が可能である。The anodic oxidation layer with a uniform thickness is patterned leaving the broken line area 14 in Fig. 4 so that a part of the individual wiring is short-circuited. It can be obtained by removing the portion by etching. During printing, the edge of the heat-generating resistor band is subjected to strong mechanical pressure and strong film stress, which causes small cracks in the insulating protective film, which tend to become the starting point for aluminum corrosion. The moisture resistance can be further improved than in the case where an anodic oxide layer is also provided on the end wall surface of the heating resistor band as in this embodiment.
以上説明したように本発明のサーマルヘッドはアルミニ
ウム導体配線の表面が陽極酸化層でおおわれているため
耐湿特性が改善され、導体配線断線による故障率低減の
効果がある。As explained above, in the thermal head of the present invention, the surface of the aluminum conductor wiring is covered with an anodized layer, so that the moisture resistance is improved and the failure rate due to disconnection of the conductor wiring is reduced.
第１図は本発明の実施例１のサーマルヘッドの断面図、
第２図は本発明の実施例２のサーマルヘッドの断面図、
第３図は発熱抵抗帯及び導体配線を示すパターン図、
第４図は従来のサーマルヘッドの断面図である。
１・・・・・・基板、２・・・・・・抵抗体層、３・・
・・・・アルミニウム導体層、４・・・・・・アルミニ
ウム陽極酸化層、５・・・・・・絶縁保護膜、１０・・
・・・・発熱抵抗帯、１１・・・・・・個別導体配線、
１２・・・・・・共通導体配線。
代理人 弁理士 内 原 音1 is a cross-sectional view of a thermal head according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of a thermal head according to a second embodiment of the present invention, FIG. 3 is a pattern diagram showing a heating resistor band and conductor wiring, FIG. 4 is a sectional view of a conventional thermal head. 1...Substrate, 2...Resistor layer, 3...
... Aluminum conductor layer, 4 ... Aluminum anodic oxide layer, 5 ... Insulating protective film, 10 ...
...Heating resistance band, 11...Individual conductor wiring,
12... Common conductor wiring. Agent Patent Attorney Oto Uchihara
Claims (1)
と電気的に接続されたアルミニウムによりなる導体配線
と、前記発熱抵抗帯及び前記導体配線の上に被着された
絶縁保護膜とを有するサーマルヘッドにおいて、前記導
体配線の表面がアルミニウム陽極酸化層におおわれてい
ることを特徴とするサーマルヘッド。It has a heating resistance band formed on an insulating substrate, a conductor wiring made of aluminum electrically connected to the heating resistance band, and an insulating protective film deposited on the heating resistance band and the conductor wiring. A thermal head characterized in that the surface of the conductor wiring is covered with an aluminum anodic oxide layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19043788A JPH0238062A (en) | 1988-07-28 | 1988-07-28 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19043788A JPH0238062A (en) | 1988-07-28 | 1988-07-28 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238062A true JPH0238062A (en) | 1990-02-07 |
Family
ID=16258121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19043788A Pending JPH0238062A (en) | 1988-07-28 | 1988-07-28 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238062A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01130862A (en) * | 1987-11-17 | 1989-05-23 | Ube Ind Ltd | Degassing device for die |
| EP0737588A1 (en) * | 1994-10-31 | 1996-10-16 | Seiko Instruments Inc. | Thermal head and method of manufacturing same |
| JP2005313591A (en) * | 2003-10-17 | 2005-11-10 | Kyocera Corp | Thermal head and thermal printer using the same |
| JP2009202349A (en) * | 2008-02-26 | 2009-09-10 | Kyocera Corp | Recording head and recorder equipped with this head |
-
1988
- 1988-07-28 JP JP19043788A patent/JPH0238062A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01130862A (en) * | 1987-11-17 | 1989-05-23 | Ube Ind Ltd | Degassing device for die |
| EP0737588A1 (en) * | 1994-10-31 | 1996-10-16 | Seiko Instruments Inc. | Thermal head and method of manufacturing same |
| EP0737588A4 (en) * | 1994-10-31 | 1997-03-26 | Seiko Instr Inc | Thermal head and method of manufacturing same |
| JP2005313591A (en) * | 2003-10-17 | 2005-11-10 | Kyocera Corp | Thermal head and thermal printer using the same |
| JP4522183B2 (en) * | 2003-10-17 | 2010-08-11 | 京セラ株式会社 | Thermal head and thermal printer using the same |
| JP2009202349A (en) * | 2008-02-26 | 2009-09-10 | Kyocera Corp | Recording head and recorder equipped with this head |
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