JPH023484A - Adhesive for electroless plating and substrate - Google Patents
Adhesive for electroless plating and substrateInfo
- Publication number
- JPH023484A JPH023484A JP14591188A JP14591188A JPH023484A JP H023484 A JPH023484 A JP H023484A JP 14591188 A JP14591188 A JP 14591188A JP 14591188 A JP14591188 A JP 14591188A JP H023484 A JPH023484 A JP H023484A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- electroless plating
- epoxy resin
- substrate
- zeolite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 29
- 238000007772 electroless plating Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 title claims abstract description 10
- 239000003822 epoxy resin Substances 0.000 claims abstract description 23
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 23
- 229910021536 Zeolite Inorganic materials 0.000 claims abstract description 16
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000010457 zeolite Substances 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 abstract description 10
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 7
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 238000007788 roughening Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 abstract description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003365 glass fiber Substances 0.000 abstract description 2
- 229910052763 palladium Inorganic materials 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- -1 glycidyl ester Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、無電解めっき用の接着剤及び基材に係り、特
には、無電解めっきにより、印刷配線板或は装飾品等を
製造する際に用いるエポキシ樹脂系の無電解めっき用接
着剤及び基材に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to adhesives and base materials for electroless plating, and in particular to manufacturing printed wiring boards, decorative items, etc. by electroless plating. The present invention relates to an epoxy resin-based adhesive for electroless plating and a base material.
［従来の技術］
無電解めっきによる印刷配線板等の製造は、一般には、
接着剤を樹脂或いは金属等の基材上に塗布し、これを乾
燥・硬化させて接若剤付基材とした後、この接着剤の表
面を化学的または物理的手段等により粗化し、次いで無
電解めっき触媒を賦与し、回路を形成する部分以外の箇
所を無電解めっきレジストで被覆して無電解めっきを行
い、回路を形成する方法が採用されている。[Prior art] Manufacturing of printed wiring boards, etc. by electroless plating generally involves the following steps:
After applying the adhesive onto a base material such as a resin or metal, and drying and curing it to form a base material with an adhesive, the surface of this adhesive is roughened by chemical or physical means, and then A method has been adopted in which a circuit is formed by providing an electroless plating catalyst, coating parts other than the parts where the circuit is to be formed with an electroless plating resist, and performing electroless plating.
かかる方法においては、無電解めっき被膜が、上記接着
剤表面に強固に付着し、簡単には、剥がれない、すなわ
ち充分に高い剥離強度を有する必要がある。ゴム或いは
フェノール樹脂を含まないエポキシ樹脂系接着剤ではこ
のような性能を発揮できるものが得られず、フェノール
エポキシＮＢＲ系、酢酸ビニル共重合体系、フェノール
樹脂を用いた接着剤が使用されている。In such a method, the electroless plated film must firmly adhere to the adhesive surface and not be easily peeled off, that is, must have sufficiently high peel strength. Epoxy resin adhesives that do not contain rubber or phenol resin cannot exhibit such performance, and adhesives using phenol epoxy NBR, vinyl acetate copolymer, and phenol resins are used.
しかしながら、これらのフェノールエポキシＮＢＲ系、
酢酸ビニル共重合体系、フェノール樹脂等の接着剤は、
絶縁性能が低く、エポキシ樹脂等を樹脂材料として用い
ることが望まれている。このエポキシ樹脂を用いる方法
として、この樹脂と無機微粒子材料からなる基材の表面
をエツチングして基材表面を粗化する方法が提案されて
いる（特開昭６１−１６８２９１号公報）。However, these phenol epoxy NBR systems,
Adhesives such as vinyl acetate copolymer and phenolic resin are
Since the insulation performance is low, it is desired to use epoxy resin or the like as the resin material. As a method using this epoxy resin, a method has been proposed in which the surface of a base material made of this resin and an inorganic fine particle material is etched to roughen the surface of the base material (Japanese Unexamined Patent Publication No. 168291/1982).
［発明が解決しようとする問題点］
ところで、上記方法は、無機微粒子材料としてコロイダ
ルシリカ等を用いるものであるが。[Problems to be Solved by the Invention] Incidentally, the above method uses colloidal silica or the like as the inorganic fine particle material.
０．００２〜１μｍのように超微粉ならいざ知らず、数
μｍオーダーのシリカ等では、逆に、無電解めっき被膜
の剥離強度の低下、特に、無電解めっきの過程で、めっ
き被膜が膨れて、剥がれるという問題があり、実用化を
妨げていた。Ultra-fine powder such as 0.002 to 1 μm is difficult to deal with, but silica, etc. on the order of several μm, causes a decrease in the peel strength of the electroless plating film, especially when the plating film swells during the electroless plating process. There was a problem with peeling off, which prevented its practical use.
本発明者らは、上記問題を解決すべく鋭意検討した結果
、驚くべきことには、比較的安価なゼオライトを接着剤
に混合することにより、超微粉でなくても、上記めっき
被膜の膨れ現象を解消でき、剥離強度を著しく高めるこ
とができることを見い出した。As a result of intensive studies to solve the above problem, the present inventors surprisingly found that by mixing relatively inexpensive zeolite into the adhesive, the above-mentioned blistering phenomenon of the plating film could be achieved even without using ultrafine powder. It has been found that the peel strength can be significantly improved.
本発明は、かかる知見に基づいてなされたもので１本発
明の目的は、無電解めっき過程でめっき被膜の膨れが生
じないで、剥離強度を著しく高めることができる無電解
めっき用接着剤及び基材を提供することにある。The present invention has been made based on such knowledge. 1. An object of the present invention is to provide an adhesive and base material for electroless plating that can significantly increase peel strength without causing blistering of the plating film during the electroless plating process. The aim is to provide materials.
［問題点を解決するための手段］
上記問題点を解決するための手段としての本発明は、エ
ポキシ樹脂１００重量部に対しゼオライトを１〜１０重
量部加えたことから成る無電解めっき用接着剤及び前記
接着剤を基材上に塗布、硬化した後、粗化させたことか
ら成る無電解めっき用法材である。[Means for Solving the Problems] The present invention as a means for solving the above problems provides an adhesive for electroless plating comprising 1 to 10 parts by weight of zeolite added to 100 parts by weight of epoxy resin. and a material for electroless plating, which is obtained by coating the adhesive on a base material, curing it, and then roughening it.
本発明におけるエポキシ樹脂としては、ビスフェノール
Ａ型エポキシ樹脂、ノボラック型エポキシ樹脂、脂環式
エポキシ樹脂、臭素化エポキシ樹脂、脂肪族エポキシ樹
脂、多官能性エポキシ樹脂、グリシジルエステル型エポ
キシ樹脂等を用いることができるが、特には、ビスフェ
ノールＡ型エポキシ樹脂が好適である。As the epoxy resin in the present invention, bisphenol A type epoxy resin, novolac type epoxy resin, alicyclic epoxy resin, brominated epoxy resin, aliphatic epoxy resin, polyfunctional epoxy resin, glycidyl ester type epoxy resin, etc. can be used. However, bisphenol A type epoxy resin is particularly suitable.
一方、ゼオライトとしては、天然１合成のいずれのゼオ
ライトを用いても良いが、シリカ−アルミナ比が３〜７
のナトリウムＹ型ゼオライトを用いることが、剥離強度
を著しく高めることができ、好ましい。このゼオライト
は、粒径があまりに大きいと剥離強度が低下するため。On the other hand, as the zeolite, any natural 1 synthetic zeolite may be used, but the silica-alumina ratio is 3 to 7.
It is preferable to use a sodium Y-type zeolite, since the peel strength can be significantly increased. This is because if the particle size of this zeolite is too large, the peel strength will decrease.
小さいものほど良く、１μｍ〜２０μｍのものが好まし
い。またこの添加量は、多過ぎても、少な過ぎても剥離
強度が低下し、エポキシ樹脂１００重量部に対し１〜１
０重量部とする必要がある。The smaller the size, the better, and preferably 1 μm to 20 μm. In addition, if the amount added is too large or too small, the peel strength will decrease, and if the amount is 1 to 1% by weight per 100 parts by weight of the epoxy resin.
It needs to be 0 parts by weight.
尚、このゼオライトの添加は、硬化剤を混合する前でも
、混合後でも良いことは当然であるが、エポキシ樹脂が
硬化する前に添加すべきことはいうまでもない。It goes without saying that this zeolite may be added before or after mixing the curing agent, but it goes without saying that it should be added before the epoxy resin is cured.
また、この゛接着剤が塗布される基材としては、各種の
樹脂或は金属板等さらにはガラス、炭素等の繊維又は紙
、シート等と各種の樹脂との積層板等、一般に、印刷配
線板或は装飾品等の無電解めっきの基材として用いられ
る材料であれば、全て適用できる。In addition, the substrates to which this adhesive is applied include various resins or metal plates, as well as laminates of glass, carbon fibers, paper, sheets, etc., and various resins, and generally printed wiring. Any material that can be used as a base material for electroless plating such as plates or decorative items can be used.
以上エポキシ樹脂にゼオライト及び２−エチル−４−メ
チルイミダゾール、２−フェニルイミダゾール、２−ウ
ンデシルイミダゾール、２゜４−ジアミノ−６−〔２−
メチルイミダゾイル−（１））−エチル−８−トリアジ
ン等の硬化剤を混合した接着剤は、先ず、無電解めっき
の対象基材上にフローコート、浸漬、噴霧、印刷、ブレ
ード塗布等の方法により塗布される。次いで、この接着
剤を塗布した基材を室温〜５０℃の温度で風乾した後、
８０〜１００℃の温度で３０〜６０分間加熱して基材上
に接着、硬化させる、このようにして得られた基材は、
Ｎ−メチル−２−ピロリドン、ジメチルホルムアミド等
の有機溶媒に浸して、硬化した接着剤の表面を膨潤させ
て、次いで、無水クロム酸及び硫酸、或いはホウフッ化
水素酸及び重クロム酸塩等をベースとした粗化液で粗化
され、パラジウム及び錫を含有する液に浸漬して、その
表面に触媒を着け、無電解めっきに供される。無電解め
っき後は、１５０〜１７０℃の温度で、６０〜１２０分
間加熱し、めっき被膜粗面を修正する。Zeolite and 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2゜4-diamino-6-[2-
An adhesive mixed with a curing agent such as methylimidazoyl-(1)-ethyl-8-triazine is first applied onto the target substrate for electroless plating by methods such as flow coating, dipping, spraying, printing, and blade coating. applied by. Next, after air-drying the base material coated with this adhesive at a temperature of room temperature to 50°C,
The substrate thus obtained is heated at a temperature of 80 to 100°C for 30 to 60 minutes to adhere and cure the substrate.
The surface of the cured adhesive is swollen by soaking in an organic solvent such as N-methyl-2-pyrrolidone or dimethylformamide, and then an adhesive based on chromic anhydride and sulfuric acid, or fluoroboric acid and dichromate, etc. The surface is roughened with a roughening solution containing 100% acetate, and then immersed in a solution containing palladium and tin to coat the surface with a catalyst and subjected to electroless plating. After electroless plating, the plated film is heated at a temperature of 150 to 170° C. for 60 to 120 minutes to correct the rough surface of the plating film.
［実施例］
例１〜４、比較 １
エポキシ樹脂（エピコート８２８．油化セルエポキシ社
製）１００重量部、２−エチル−４−メチルイミダゾー
ル５重量部、アエロジル２００（日本アエロジル社製）
１重量部にそれぞれ、平均粒子径が７〜８μｍのナトリ
ウムＹ型ゼオライト及びこれを６３５メツシユ（目開き
２０μｍ）の篩でふるって通過したゼオライトを第１表
に示した量（エポキシ樹脂１００重量部に対する重量部
量）添加した接着剤を作成した。[Examples] Examples 1 to 4, Comparison 1 100 parts by weight of epoxy resin (Epicoat 828, manufactured by Yuka Cell Epoxy Co., Ltd.), 5 parts by weight of 2-ethyl-4-methylimidazole, Aerosil 200 (manufactured by Nippon Aerosil Co., Ltd.)
1 part by weight of sodium Y-type zeolite with an average particle size of 7 to 8 μm and zeolite passed through a 635-mesh sieve (openings of 20 μm) as shown in Table 1 (per 100 parts by weight of epoxy resin). (parts by weight) was added to prepare an adhesive.
次に、この接着剤をガラス繊維エポキシ樹脂積層板（住
人ベークライト社製、ＦＲ４，１，６１１１ｍ厚）にド
クターブレード（隙間０ 、３ ｉｎ）で塗布し、十分
風乾した後、８０℃の温度で６０分間加熱して接着剤を
硬化し接着剤付基材とした。Next, this adhesive was applied to a glass fiber epoxy resin laminate (manufactured by Juju Bakelite Co., Ltd., FR4, 1,6111 m thick) using a doctor blade (gap 0, 3 inches), thoroughly air-dried, and then heated at a temperature of 80°C. The adhesive was cured by heating for 60 minutes to form an adhesive-attached base material.
この接着剤付基材をＮ−メチル−２−ピロリドンに６０
分浸漬し、次いで、クロム酸混液（Ｃｒｙ、６５ｇ、濃
硫酸２３０ｍ１を水で稀釈して全体をＩＱとする）に４
７℃の温度で３０分間浸漬して粗化処理を行なった後、
水洗した。This adhesive-attached base material was dissolved in N-methyl-2-pyrrolidone for 60 minutes.
immersed in chromic acid mixture (Cry, 65 g, concentrated sulfuric acid 230 ml diluted with water to make the total IQ) for 4 minutes.
After roughening treatment by soaking at a temperature of 7°C for 30 minutes,
Washed with water.
引き続き、これを１８％濃度のＨＣｌ中に１分間浸漬し
た後、ＰｄＣ１，，５ｎＣ１２を含む塩酸酸性水溶液か
ら成る化学めっき用触媒液（日本鉱業（株）製、商品名
ＮＣ−３）に５分間浸漬した後、水洗した。次いで、こ
れをシュウ酸を含む塩酸酸性水溶液に５分間浸漬し、水
洗した。Subsequently, this was immersed in HCl at a concentration of 18% for 1 minute, and then immersed in a chemical plating catalyst solution (manufactured by Nippon Mining Co., Ltd., trade name NC-3) consisting of an acidic hydrochloric acid aqueous solution containing PdCl, 5nC12 for 5 minutes. After soaking, it was washed with water. Next, this was immersed in a hydrochloric acid aqueous solution containing oxalic acid for 5 minutes and washed with water.
これを、室温で風乾した後、１２０℃の温度で２０分間
の乾燥を行なった。This was air-dried at room temperature and then dried at a temperature of 120° C. for 20 minutes.
この後、７２℃の温度に保った無電解銅めっき液（日本
鉱業（株）製、商品名ＫＣ−１０）に浸漬し、約３０μ
ｍの厚さの銅膜を得た。このめっき後の基材を十分に水
洗し、１６０℃の温度で４０分間乾燥した。このめっき
後のビール強度を測定した結果、第１表に示すとおりで
あった・
ル漱ｊしレユ炙
実施例において、ゼオライトに代えて、第１表に示した
無機材料をそれぞれ添加し、実施例と同様の操作を行な
った結果を、第１表に併せて記載した。また比較のため
無機材料を添加しないものについても同様に行ない、こ
の結果も併記した。After that, it was immersed in an electroless copper plating solution (manufactured by Nippon Mining Co., Ltd., trade name KC-10) kept at a temperature of 72°C, and
A copper film with a thickness of m was obtained. After this plating, the base material was thoroughly washed with water and dried at a temperature of 160° C. for 40 minutes. The beer strength after this plating was measured and the results were as shown in Table 1. The results of the same operations as in the example are also listed in Table 1. In addition, for comparison, the same test was carried out without adding any inorganic material, and the results are also shown.
第１表
［発明の効果］
以上のような本発明は、エポキシ樹脂１００重量部に対
しゼオライトを１〜１０重量部加えたため、めっき被膜
の膨れ現象を解消でき、剥離強度を著しく高めることが
できる等の格別の効果を奏する。Table 1 [Effects of the Invention] In the present invention as described above, since 1 to 10 parts by weight of zeolite is added to 100 parts by weight of epoxy resin, the blistering phenomenon of the plating film can be eliminated and the peel strength can be significantly increased. It produces exceptional effects such as
Claims (2)
〜１０重量部加えたことを特徴とする無電解めっき用接
着剤。(1) 1 zeolite per 100 parts by weight of epoxy resin
An adhesive for electroless plating characterized by adding ~10 parts by weight.
〜１０重量部加えた接着剤を基材上に塗布、硬化した後
、次いで粗化させたことを特徴とする無電解めっき用基
材。(2) 1 zeolite per 100 parts by weight of epoxy resin
A substrate for electroless plating, characterized in that an adhesive containing ~10 parts by weight is applied onto the substrate, cured, and then roughened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14591188A JPH023484A (en) | 1988-06-15 | 1988-06-15 | Adhesive for electroless plating and substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14591188A JPH023484A (en) | 1988-06-15 | 1988-06-15 | Adhesive for electroless plating and substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH023484A true JPH023484A (en) | 1990-01-09 |
Family
ID=15395923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14591188A Pending JPH023484A (en) | 1988-06-15 | 1988-06-15 | Adhesive for electroless plating and substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH023484A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4963942A (en) * | 1987-08-20 | 1990-10-16 | Canon Kabushiki Kaisha | Fixing device having blower for supplying a blast of air |
| GB2245892A (en) * | 1990-06-27 | 1992-01-15 | Secr Defence | Improved hydrolytic stability in adhesive joints |
| JP2002338932A (en) * | 2001-05-14 | 2002-11-27 | Sony Chem Corp | Adhesive |
-
1988
- 1988-06-15 JP JP14591188A patent/JPH023484A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4963942A (en) * | 1987-08-20 | 1990-10-16 | Canon Kabushiki Kaisha | Fixing device having blower for supplying a blast of air |
| GB2245892A (en) * | 1990-06-27 | 1992-01-15 | Secr Defence | Improved hydrolytic stability in adhesive joints |
| JP2002338932A (en) * | 2001-05-14 | 2002-11-27 | Sony Chem Corp | Adhesive |
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