JPH0231407A - Chip part - Google Patents
Chip partInfo
- Publication number
- JPH0231407A JPH0231407A JP18219088A JP18219088A JPH0231407A JP H0231407 A JPH0231407 A JP H0231407A JP 18219088 A JP18219088 A JP 18219088A JP 18219088 A JP18219088 A JP 18219088A JP H0231407 A JPH0231407 A JP H0231407A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electrode
- electrodes
- pattern
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 31
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 239000003990 capacitor Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Details Of Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はプリント基板に実装するチップ部品の改良に関
する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to improvements in chip components mounted on printed circuit boards.
（従来の技術）
各種通信機器、電子機器等において使用されるハイブリ
ッドＩＣ等に実装されるコンデンサ、抵抗器等のＩＣ部
品として、最近ではチップ部品と舟称されるものが多用
されるに至っている。(Prior Art) Recently, what are commonly referred to as chip components have come into widespread use as IC components such as capacitors and resistors that are mounted in hybrid ICs used in various communication devices, electronic devices, etc. .
第４図（ａｌ ［ｂｌ及び（ｃｌ はチップ部品とし
ての従来のチップコンデンサ、その接続状態を示す平面
図及びＢ−８断面図であり、このチップコンデンサは薄
型の直方体状の本体１と、本体１の両端部に一体化接続
された電極部２とから成り１本体１と電極部２との全体
形状が一つの薄型の直方体を成している。Figure 4 (al [bl and (cl) is a conventional chip capacitor as a chip component, a plan view and a cross-sectional view taken along the line B-8 showing its connection state, and this chip capacitor has a thin rectangular parallelepiped main body 1 and a main body. The electrode part 2 is integrally connected to both ends of the main body 1, and the overall shape of the main body 1 and the electrode part 2 forms one thin rectangular parallelepiped.
このようなチップ部品をプリント基板上に実装する場合
には、同図（ｂ）に示すように接続対象となる配線パタ
ーン３の所定部位にハンダ粒を介して電極部２を載置し
てからりフロ一方式のハンダ接続方法かまたは所定位置
に接着剤を介して付着した後ハンダデイツプ方法によっ
て接続を行う。When mounting such a chip component on a printed circuit board, as shown in the same figure (b), after placing the electrode part 2 on a predetermined part of the wiring pattern 3 to be connected via solder particles. The connection is made by a reflow soldering method or by a solder dip method after being attached to a predetermined position with an adhesive.
ここで示したチップ部品の電極部２の角部形状は直角で
あるため、特にリフロ一方式のハンダ接続を行った場合
に溶融したハンダ４は１帰部底面の形状に沿って展開し
てから四角形状に冷却固化する。角部にあっては熱が逃
げ易く早く固化するため、ここに形成されるハンダの形
状は理想的な形状とされるフィレット形状を形造ること
が難しい。種々の実験によれば、角部底面のハンダの量
が少ないときに理想的なフィレット形状を形成する確立
が高いことが解った。即ち、チップ部品の電極部周辺の
ハンダがほぼ均一な熱拡散係数をもつ方が理想的なフィ
レット形状を形成し易いと言い得よう。Since the corner shape of the electrode part 2 of the chip component shown here is a right angle, the melted solder 4 expands along the shape of the bottom surface of the part 1, especially when reflow soldering is performed. Cool and solidify into a rectangular shape. Since heat easily escapes at the corners and solidifies quickly, it is difficult to form the ideal fillet shape for the solder formed there. According to various experiments, it has been found that the probability of forming an ideal fillet shape is high when the amount of solder on the bottom of the corner is small. That is, it can be said that it is easier to form an ideal fillet shape if the solder around the electrode portion of the chip component has a substantially uniform thermal diffusion coefficient.
更に、上記従来のものでは角部の分だけハンダの量が余
計に必要となるため、溶融のための熱もその分だけ高温
化する必要が生じ、高温によって部品の性能が低下する
。Furthermore, in the above-mentioned conventional product, an extra amount of solder is required for the corners, so the heat for melting must be increased accordingly, and the performance of the component deteriorates due to the high temperature.
このようなハンダ接続状態は、電極と配線パターンとの
接続強度の低下という問題に加えて、電極の面積が角部
がある分だけ広くなるため、パターン作成上及び部品装
着上から見て実装密度の高度化に対する大きな障害とな
っている。In addition to the problem of a decrease in the connection strength between the electrode and the wiring pattern, this solder connection condition also increases the area of the electrode due to the corners, which reduces the mounting density from the point of view of pattern creation and component mounting. This is a major obstacle to the advancement of technology.
同様の問題は、第５図（ａｌ及び（ｂ）に示した如く脚
状のリードを有したチップ部品としてのチップトランジ
スタにおいても考えられる。同図（ａ）及び（ｂ）は夫
々正面図及び平面図を示し、このチップトランジスタは
パッケージ５と、パッケージ５の側壁から伸びた脚状リ
ード６とを有している、リード６の先端部６ａの平面形
状は図示のように矩形をなしている。このチップトラン
ジスタを基板上の配線パターン上に接続する場合には所
定量のハンダを介してリード先端６ａをパターン上のａ
置した状態でリフローを行う。こうして溶融したハンダ
４は矩形のリード先端６ａの底面に沿って展開し、略矩
形の形状で冷却固化する。この場合も、リード先端６ａ
の角部の存在に起因してハンダの展開する範囲が大きく
拡大され、高密度実装に対する障害となっている。A similar problem can also be considered in a chip transistor as a chip component having leg-shaped leads as shown in FIGS. 5(a) and 5(b). FIGS. This chip transistor has a package 5 and leg-like leads 6 extending from the side wall of the package 5.The top end 6a of the lead 6 has a rectangular planar shape as shown in the figure. When connecting this chip transistor to a wiring pattern on a substrate, connect the lead tip 6a to a on the pattern using a predetermined amount of solder.
Perform reflow in the same state. The thus melted solder 4 spreads along the bottom surface of the rectangular lead tip 6a, and cools and solidifies in a substantially rectangular shape. In this case as well, the lead tip 6a
Due to the presence of the corners, the range in which the solder spreads is greatly expanded, which is an obstacle to high-density mounting.
また、同図［ａ）に示すようにリード６の先端６ａが水
平でなく１点線で示すように下方へ向けて変形し且つ捻
った状態にある場合には、先端６ａの一つの角部だけが
パターン上に点接触し、水平部底面が浮いた状態となり
、接続状態が悪化する。In addition, if the tip 6a of the lead 6 is not horizontal as shown in FIG. makes point contact on the pattern, causing the bottom surface of the horizontal portion to float, deteriorating the connection condition.
（発明の目的）
本発明は上記に鑑みてなされたものであり、チップ部品
の電極部が角部を有することによって発生する溶融ハン
ダの展開領域の過剰拡大を防止して高密度実装を実現す
るとともに、接続強度を向上したチップ部品を提供する
ことを目的としている。(Objective of the Invention) The present invention has been made in view of the above, and has an object to realize high-density mounting by preventing excessive expansion of the spread area of molten solder caused by the electrode portions of chip components having corners. At the same time, the aim is to provide chip components with improved connection strength.
（発明の概要）
上記目的を達成するため本発明は、本体に接続された電
極部を有したチップ部品において、該電極部の少なくと
も周縁部の平面形状を曲線状に構成したことを特徴とし
ている。(Summary of the Invention) To achieve the above object, the present invention provides a chip component having an electrode portion connected to a main body, characterized in that at least the peripheral edge of the electrode portion has a curved planar shape. .
また、本考案は前記電極部は脚状のリードであり、該リ
ード先端の周縁部の平面形状が曲線状であることを特徴
としている。Further, the present invention is characterized in that the electrode portion is a leg-shaped lead, and the planar shape of the peripheral edge of the lead tip is curved.
（実施例）
以下、本発明のチップ部品を添付図面に示した実施例に
基いて詳細に説明する。(Example) Hereinafter, a chip component of the present invention will be described in detail based on an example shown in the accompanying drawings.
第１図（ａ） （ｂｌ及び（ｃ）は本発明の第１の実
施例のチップ部品の全体構成を示す斜視図、接続状態を
示すＡ−Ａ断面図及び平面図であり、このチップ部品は
薄型直方体の本体ＩＱと、本体１０の両端面に接続一体
化された円弧状の平面形状を有する電極１２．１２とを
有する。電極１２は薄型円弧状の柱状体である。この電
極Ｉ２を有したチップ部品をプリント基板１３上の配線
パターン１４上にリフロー式にハンダ接続する場合には
、各電極１２をハンダ１５を介してパターンＩ４上に載
置してリフローを行うことによって電１！１２とパター
ン１４とを接続一体化することができる。FIGS. 1(a), 1(b) and 1(c) are a perspective view showing the overall configuration of a chip component according to a first embodiment of the present invention, a sectional view taken along line A-A showing a connection state, and a plan view of this chip component. has a thin rectangular parallelepiped main body IQ, and electrodes 12.12 having an arcuate planar shape connected and integrated to both end surfaces of the main body 10.The electrode 12 is a thin arcuate columnar body.This electrode I2 When reflow-soldering the chip components with the solder onto the wiring pattern 14 on the printed circuit board 13, each electrode 12 is placed on the pattern I4 via the solder 15 and reflowed. 12 and pattern 14 can be connected and integrated.
なお、このときのパターン１４の形状は電極１２とほぼ
相似形の円弧状に構成する。この際、ハンダ＋５は全体
として均一な速度で放熱を行いながら電極１２の円弧状
の周辺形状に沿って展開するため、円弧状に冷却固化す
ることができる。このとき、第１図（ｂ）に示すように
ハンダ１５は電極の全周側面に亙って理想的なフィレッ
ト形状を構成することができる。このため、ハンダ付は
接続強度を向上することができる。Note that the shape of the pattern 14 at this time is formed into an arc shape that is substantially similar to the electrode 12. At this time, since the solder +5 spreads along the arc-shaped peripheral shape of the electrode 12 while dissipating heat at a uniform rate as a whole, it can be cooled and solidified in an arc-shape. At this time, as shown in FIG. 1(b), the solder 15 can form an ideal fillet shape over the entire circumference of the electrode. Therefore, soldering can improve the connection strength.
また、使用するハンダの量を低減することができるため
、リフロー時における熱量を減少し、部品性能の劣化を
防止することができる。Furthermore, since the amount of solder used can be reduced, the amount of heat during reflow can be reduced and deterioration of component performance can be prevented.
なお、第１図の実施例の電極の平面形状は図示のような
円弧状の他に半円形状、その他の曲面形状のものを含む
。Note that the planar shape of the electrode in the embodiment shown in FIG. 1 includes not only the circular arc shape shown, but also semicircular shapes and other curved shapes.
第２図は本発明の第２の実施例であり、電極１２の本体
側部分１２ａを本体１０の両端部を延長した直方体形状
とするとともに、外側部分！２ｂの平面形状を円弧状に
構成した点において前記第１の実施例と相違しているが
、接続した場合の効果等の点においては変わるところが
ない。FIG. 2 shows a second embodiment of the present invention, in which the main body side portion 12a of the electrode 12 has a rectangular parallelepiped shape with both ends of the main body 10 extended, and the outer portion! Although this embodiment differs from the first embodiment in that the planar shape of 2b is arcuate, there is no difference in terms of effects when connected.
第３図（ａｌ及び（ｂ）は脚状のリードを有したチップ
部品に本発明を適用した実施例であり、本体２０から伸
びたリード２１の先端２１ａの先端形状を円弧状にした
（角を取った）構成に特徴を有する。FIGS. 3(al) and (b) show an embodiment in which the present invention is applied to a chip component having leg-shaped leads, in which the tip end 21a of the lead 21 extending from the main body 20 is shaped like an arc (corner). ) has characteristics in its composition.
この場合も、上記各実施例と同様にリード先端２１ａ下
面の溶融ハンダ１５は、先端２１ａの周縁形状に沿って
展開するため、フィレット形状を形成しながら円弧状に
形作られる。In this case, as in the above-described embodiments, the molten solder 15 on the lower surface of the lead tip 21a expands along the peripheral edge shape of the tip 21a, so that it is shaped into an arc while forming a fillet shape.
このため、溶融ハンダが必要以上に展開することによる
実装密度の低下等の不都合をもたらすことかない。また
、リード先端が変形した場合においても先端２１ａに角
部が存しないため、パターンとの間は常に線接触となり
、接続強度が低下することがない。Therefore, there is no problem such as a reduction in packaging density due to unnecessarily expanding molten solder. Further, even if the lead tip is deformed, since there is no corner at the tip 21a, there is always a line contact with the pattern, and the connection strength does not decrease.
このように本発明にあっては、チップ部品の電極の周縁
部の平面形状を曲線状に構成したため、リフロー式のハ
ンダ接続を行う場合に溶融ハンダが曲線状の周縁部形状
に沿って展開し５曲線形状に冷却固化する。このため、
電極の平面形状を矩形にした場合に比して電極を越えて
ハンダが展開する領域が狭くなり、フィレット形状を得
易くなる。この結果、実装の高密度化を実現することを
容易とし、ハンダの使用量を低減して熱による部品の性
能低下を防止し、更に接続強度を向上することができる
。In this way, in the present invention, since the planar shape of the peripheral edge of the electrode of the chip component is configured in a curved shape, molten solder expands along the curved peripheral edge shape when performing reflow solder connection. 5. Cool and solidify into a curved shape. For this reason,
Compared to the case where the planar shape of the electrode is rectangular, the area in which the solder spreads beyond the electrode becomes narrower, making it easier to obtain a fillet shape. As a result, it is possible to easily realize high-density mounting, reduce the amount of solder used, prevent performance deterioration of components due to heat, and further improve connection strength.
（発明の効果）
以上のように本発明によれば、チップ部品の電極部が角
部な有することによって発生する溶融ハンダの展開領域
の過剰拡大を防止して高密度実装を実現するとともに、
接続強度を向上することができる。(Effects of the Invention) As described above, according to the present invention, it is possible to prevent excessive expansion of the molten solder deployment area caused by the corner electrode portion of a chip component, and to realize high-density mounting.
Connection strength can be improved.
第１図（ａ） ｆｂｌ及び［ｃｌ は本発明の第１の
実施ＣＧ）
第１図
明の第２の実施例の構成を示す斜視図及び平面図、第３
図（ａｌ及び（ｂｌ は本考案の第３の実施例の平面図
及び正面図、第４図（ａｌ （ｂ）及び（ｃ）はチッ
プ部品としての従来のチップコンデンサ、その接続状態
を示す平面図及びＢ−Ｂ断面図、第５図（ａｌ及びｆｂ
）は脚状のリードを有したチップ部品としてのチップト
ランジスタの正面図及び平面図である。
Ｉ・・・チップ部品本体 ２・・・電極部３・・・配線
パターン ４・・・ハンダ５・・・パッケージ ６・・
・脚状リード１０・・・本体 １２・・・電極 １４・
・・配線パターン １５・・・ハンダ ２ｏ・・・本体
２１・・・リード ２Ｊａ・・・先端
第３図FIG. 1(a) fbl and [cl are CGs of the first embodiment of the present invention) A perspective view and a plan view showing the configuration of the second embodiment of FIG.
Figures (al and (bl) are a plan view and front view of the third embodiment of the present invention, and Figures (al) (b) and (c) are plane views showing a conventional chip capacitor as a chip component and its connection state. Figure and BB sectional view, Figure 5 (al and fb
) are a front view and a plan view of a chip transistor as a chip component having leg-shaped leads. I...Chip component body 2...Electrode section 3...Wiring pattern 4...Solder 5...Package 6...
・Legged lead 10...Main body 12...Electrode 14・
...Wiring pattern 15...Solder 2o...Body 21...Lead 2Ja...Tip Fig. 3
Claims (2)
いて、 該電極部の少なくとも周縁部の平面形状を曲線状に構成
したことを特徴とするチップ部品。(1) A chip component having an electrode portion connected to a main body, characterized in that at least the peripheral edge of the electrode portion has a curved planar shape.
の周縁部の平面形状が曲線状であることを特徴とする請
求項第１項のチップ部品。(2) The chip component according to claim 1, wherein the electrode portion is a leg-shaped lead, and the planar shape of the peripheral edge of the lead tip is curved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18219088A JPH0231407A (en) | 1988-07-21 | 1988-07-21 | Chip part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18219088A JPH0231407A (en) | 1988-07-21 | 1988-07-21 | Chip part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231407A true JPH0231407A (en) | 1990-02-01 |
Family
ID=16113911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18219088A Pending JPH0231407A (en) | 1988-07-21 | 1988-07-21 | Chip part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231407A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998045856A1 (en) * | 1997-04-07 | 1998-10-15 | Ford Global Technologies, Inc. | Meniscus-shaped terminations for leadless electronic components |
-
1988
- 1988-07-21 JP JP18219088A patent/JPH0231407A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998045856A1 (en) * | 1997-04-07 | 1998-10-15 | Ford Global Technologies, Inc. | Meniscus-shaped terminations for leadless electronic components |
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