JPH02301493A - Thin electronic machinery - Google Patents
Thin electronic machineryInfo
- Publication number
- JPH02301493A JPH02301493A JP1122268A JP12226889A JPH02301493A JP H02301493 A JPH02301493 A JP H02301493A JP 1122268 A JP1122268 A JP 1122268A JP 12226889 A JP12226889 A JP 12226889A JP H02301493 A JPH02301493 A JP H02301493A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- frame
- quartz vibrator
- outer panels
- external force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract 3
- 239000002184 metal Substances 0.000 abstract description 4
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 2
- 230000007774 longterm Effects 0.000 abstract description 2
- 239000010453 quartz Substances 0.000 abstract 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 239000013078 crystal Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 2
- 230000012447 hatching Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Calculators And Similar Devices (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
この発明は、たとえば多機能ICカードなどの薄形電子
機器に係わり、詳しくは、2枚の外板および枠部材から
なる板状筺体内に電子部品を収容してなる薄形電子機器
に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a thin electronic device such as a multi-functional IC card, and more specifically, it relates to a thin electronic device such as a multi-function IC card, and more specifically, a device consisting of two outer panels and a frame member. The present invention relates to a thin electronic device in which electronic components are housed in a plate-like housing.
(従来の技術)
近年、情報処理媒体としての多機能ICカードが多用さ
れつつある。(Prior Art) In recent years, multifunctional IC cards have been increasingly used as information processing media.
この多機能ICカードは、第6図に示すように、2枚の
外板であるところのフロントパネルa1バックパネルb
1および矩形状の枠部材としてのガードフレームCから
なる板状筐体d内に、プリント基板eや水晶振動子をは
じめとする幾つかの電子部品f・・・(1つのみ図示)
を収納した構成となっている。As shown in Fig. 6, this multifunctional IC card consists of two outer panels: a front panel a and a back panel b.
1 and a guard frame C as a rectangular frame member, several electronic components f including a printed circuit board e and a crystal resonator f... (only one is shown)
It is configured to house.
しかしながら、従来のこの種の薄形電子機器にあっては
、外力の影響を考慮した電子部品f・・・の配置構成と
なっておらず、周圧力に対して比較的弱い水晶振動子な
どの電子部品fも板状筺体dのほぼ中央部などに配置し
ていた。このため、第6図に示すように何等かの原因で
板状筺体dに外力が加わり、外板であるフロントパネル
aやバックパネルbが曲がったり凹んだりした場合、電
子部品f・・・に直接圧力が加わり、周圧力に対して比
較的弱い水晶振動子などの電子部品fが破損することが
あった。However, in conventional thin electronic devices of this type, the electronic components f... are not arranged in consideration of the influence of external forces, and the components such as crystal oscillators, which are relatively weak against circumferential pressure, The electronic component f was also placed approximately in the center of the plate-like housing d. Therefore, as shown in Fig. 6, if an external force is applied to the plate-shaped housing d for some reason and the outer panels, such as the front panel a and the back panel b, are bent or dented, the electronic components f... Direct pressure is applied, and electronic components f such as crystal oscillators, which are relatively weak against circumferential pressure, may be damaged.
(発明が解決しようとする課題)
上記したように、従来においては、何等かの原因で板状
筐体の外板であるフロントパネルやバックパネルが曲が
ったり凹んだりすると、板状筺体内に収容されている電
子部品に直接圧力が加わって電子部品が破損し、電子機
器としての性能を維持できなくなることがあった。(Problems to be Solved by the Invention) As described above, in the past, if the front panel or back panel, which is the outer panel of a plate-shaped housing, is bent or dented for some reason, it is difficult to accommodate the front panel or back panel in the plate-shaped housing. In some cases, direct pressure was applied to the electronic components being used, causing damage to the electronic components and making it impossible to maintain the performance of the electronic device.
この発明は、上記事情に基づきなされたもので、その目
的とするところは、簡単な構成でありながら、板状筺体
内に収容した電子部品の外力による破損を確実に防止で
き、長期に亙って使用できるようにした薄形電子機器を
提供しようとするものである。This invention was made based on the above circumstances, and its purpose is to have a simple structure, yet to reliably prevent damage to electronic components housed in a plate-like housing due to external forces, and to provide long-term use. The aim is to provide a thin electronic device that can be used with ease.
[発明の構成]
(課mを解決するための手段)
本発明は、上記課題を解決するために、第1の手段とし
て、2枚の外板と、この2枚の外板の間でかつ外板の外
周縁に設けられた枠部材とからなる板状筺体内に電子部
品を収容してなる薄形電子機器において、前記枠部材の
内側周部近傍に前記電子部品を配置したものである。[Structure of the Invention] (Means for Solving Issue M) In order to solve the above problem, the present invention provides, as a first means, two outer panels, and a space between the two outer panels and the outer panel. In this thin electronic device, an electronic component is housed in a plate-shaped casing consisting of a frame member provided on the outer periphery of the electronic component, and the electronic component is arranged near the inner periphery of the frame member.
また、第2の手段として、2枚の外板および枠部材から
なる板状筺体内に電子部品を収容してなる薄形電子機器
において、前記電子部品の周囲近傍に支持部材を設けた
ものである。Further, as a second means, in a thin electronic device having an electronic component housed in a plate-like housing made of two outer panels and a frame member, a support member is provided near the periphery of the electronic component. be.
(作用)
この発明は、第1の手段によれば、棒部材部分は剛性が
強く、しかも、外板にたとえ外力が加わっても棒部材近
傍の変形量が少ないため、板状筺体内のコーナ部や縁な
どの棒部材近傍に配置された電子部品には圧力が加わら
ない。このため、板状筺体内に収容した電子部品の破損
が防止され、長期に亙って性能の維持が可能となる。(Function) According to the first means, the rod member portion has high rigidity, and even if an external force is applied to the outer panel, the amount of deformation near the rod member is small, so that the corner inside the plate-shaped housing No pressure is applied to electronic components placed near the rod members, such as the parts and edges. Therefore, damage to the electronic components housed within the plate-shaped housing is prevented, and performance can be maintained over a long period of time.
また、第2の手段によれば、電子部品の近傍が支持部材
により支持され、外板にたとえ外力が加わってもこの部
分の変形が阻止され、電子部品には圧力が加わらない。Further, according to the second means, the vicinity of the electronic component is supported by the support member, and even if an external force is applied to the outer plate, deformation of this portion is prevented, and no pressure is applied to the electronic component.
このため、板状筺体内に収容した電子部品の破損が防止
され、長期に亙って性能の維持が可能となる。Therefore, damage to the electronic components housed within the plate-shaped housing is prevented, and performance can be maintained over a long period of time.
(実施例)
以下、この発明の一実施例ついて第1図ないし第3図を
参照して説明する。(Embodiment) An embodiment of the present invention will be described below with reference to FIGS. 1 to 3.
第1図および第2図において、1は薄形電子機器である
ところの多機能ICカードであり、この多機能ICカー
ド1は、2枚の外板であるところのフロントパネル2、
バックパネル3、および矩形状の枠部材としてのガード
フレーム4からなる板状筐体5内に、プリント基板6、
液晶表示装置7、電池8、および電子部品としての水晶
振動子9等を収納した構成となっている。また、フロン
トパネル2、バックパネル3、およびガードフレーム4
は、例えばS U S 304等の金属材料で構成され
、それぞれ溶接されている。In FIGS. 1 and 2, 1 is a multifunctional IC card which is a thin electronic device, and this multifunctional IC card 1 has two outer panels, a front panel 2,
A printed circuit board 6,
It has a configuration in which a liquid crystal display device 7, a battery 8, a crystal resonator 9 as an electronic component, and the like are housed. In addition, the front panel 2, back panel 3, and guard frame 4
are made of a metal material such as SUS 304, and are welded together.
また、水晶振動子9は、板状筺体5内のコーナ部、すな
わち、ガードフレーム4のコーナ部に配置され外力によ
り容易に破損しないようになっている。Further, the crystal resonator 9 is arranged at a corner within the plate-shaped housing 5, that is, at a corner of the guard frame 4, so that it is not easily damaged by external force.
すなわち、上記のような構成にあっては、ガードフレー
ム4の近傍部分、特にコーナ部分は剛性が強く、フロン
トパネル2およびバックパネル3にたとえ外力Fが加わ
っても変形がほとんどなく、第3図に示すようにコーナ
部に配置されたガードフレーム4より厚みが薄い水晶振
動子9には圧力が加わらず破損することがない。したが
って、多機能ICカード1の長期に亙っての性能の維持
が可能となる。That is, in the above configuration, the parts near the guard frame 4, especially the corner parts, have high rigidity, and even if an external force F is applied to the front panel 2 and the back panel 3, there is almost no deformation, and as shown in FIG. As shown in the figure, pressure is not applied to the crystal resonator 9 which is thinner than the guard frame 4 disposed at the corner and is not damaged. Therefore, it is possible to maintain the performance of the multifunction IC card 1 over a long period of time.
なお、水晶振動子9の配置位置は、コーナ部のみに限ら
ず、第4図中にハツチングで示すガードフレーム4の内
周部に沿った近傍領域Eであれば同様の効果が得られる
。Note that the same effect can be obtained if the crystal resonator 9 is disposed not only in the corner portion but also in a nearby region E along the inner circumferential portion of the guard frame 4 shown by hatching in FIG.
さらには、水晶振動子9の搬送を防止する他の例として
、第5図に示すようにしてもよい。すなわち、水晶振動
子9の周囲を水晶振動子9より厚みが厚い金属製の矩形
枠状の支持部材10で囲む構成とし、フロントパネル2
およびバックパネル3にたとえ外力Fが加わっても支持
部材10で支持するようにして、水晶振動子9には圧力
が加わらないようにしてもよい。Furthermore, as another example of preventing the transport of the crystal resonator 9, the arrangement shown in FIG. 5 may be used. That is, the crystal resonator 9 is surrounded by a metal rectangular frame-shaped support member 10 that is thicker than the crystal resonator 9, and the front panel 2
Further, even if an external force F is applied to the back panel 3, it may be supported by the support member 10 so that no pressure is applied to the crystal resonator 9.
なお、本発明は、薄形電子機器として多機能ICカード
を、また、電子部品として水晶振動子を適用したものに
ついて説明したが、これに限るものでない。また、支持
部材を金属製かつ矩形枠状としたが、金属製に限らず、
また、矩形枠状でなくともよい。Although the present invention has been described using a multifunctional IC card as a thin electronic device and a crystal resonator as an electronic component, the present invention is not limited to this. In addition, although the support member is made of metal and has a rectangular frame shape, it is not limited to metal.
Moreover, it does not have to be a rectangular frame shape.
その他、本発明は要旨を変えない範囲で種々変形実施可
能なことは勿論である。In addition, it goes without saying that the present invention can be modified in various ways without departing from the gist thereof.
[発明の効果]
以上詳述したように、この発明によれば、簡単な構成で
ありながら、板状筺体内に収容した電子部品の破損が防
止され、長期に亙って性能の維持が可能な薄形電子機器
を提供できるといった効果を奏する。[Effects of the Invention] As detailed above, according to the present invention, although the structure is simple, damage to the electronic components housed in the plate-like housing is prevented, and performance can be maintained over a long period of time. This has the advantage that it is possible to provide thin electronic equipment.
第1図ないし第3図はこの発明の一実施例を説明するた
めのもので、第1図はフロントパネルの一部を切除して
示す他機能ICカードの概略的平面図、第2図は第1図
■−■線に沿う概略的断面図、第3図は外力が加わった
状態を示す概略的断面図、第4図は電子部品に圧力が加
わらない範囲を示す説明図、第5図は他の実施例を一部
切除して示す概略的平面図、第7図は従来例の外力が加
わった状態を示す概略的断面図である。
1・・・薄形電子機器(多機能ICカード)、2・・・
外板(フロントパネル)、3・・・外板(バックパネル
)、4・・・枠部材(ガードフレーム)、9・・・電子
部品(水晶振動子)、10・・・支持部材。
出願人代理人 弁理士 鈴江武彦
第1図
第2図
第3図
第4図
第5図1 to 3 are for explaining one embodiment of the present invention, FIG. 1 is a schematic plan view of a multifunctional IC card with a part of the front panel cut away, and FIG. Fig. 1 is a schematic sectional view along the line ■-■, Fig. 3 is a schematic sectional view showing the state where external force is applied, Fig. 4 is an explanatory view showing the range where no pressure is applied to electronic components, Fig. 5 7 is a schematic plan view showing another embodiment with a portion thereof cut away, and FIG. 7 is a schematic cross-sectional view showing a state in which an external force is applied to the conventional example. 1... Thin electronic device (multifunctional IC card), 2...
Outer plate (front panel), 3... Outer plate (back panel), 4... Frame member (guard frame), 9... Electronic component (crystal resonator), 10... Support member. Applicant's Representative Patent Attorney Takehiko Suzue Figure 1 Figure 2 Figure 3 Figure 4 Figure 5
Claims (2)
外周縁に設けられた枠部材とからなる板状筺体内に電子
部品を収容してなる薄形電子機器において、前記枠部材
の内側周部近傍に前記電子部品を配置したことを特徴と
する薄形電子機器。(1) In a thin electronic device in which electronic components are housed within a plate-shaped housing consisting of two outer panels and a frame member provided between the two outer panels and on the outer periphery of the outer panels, A thin electronic device, characterized in that the electronic component is arranged near an inner peripheral portion of the frame member.
子部品を収容してなる薄形電子機器において、前記電子
部品の周囲近傍に支持部材を設けたことを特徴とする薄
形電子機器。(2) A thin electronic device in which an electronic component is housed in a plate-like housing consisting of two outer panels and a frame member, characterized in that a support member is provided near the periphery of the electronic component. Electronics.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1122268A JPH02301493A (en) | 1989-05-16 | 1989-05-16 | Thin electronic machinery |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1122268A JPH02301493A (en) | 1989-05-16 | 1989-05-16 | Thin electronic machinery |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02301493A true JPH02301493A (en) | 1990-12-13 |
Family
ID=14831755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1122268A Pending JPH02301493A (en) | 1989-05-16 | 1989-05-16 | Thin electronic machinery |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02301493A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5541452A (en) * | 1994-01-31 | 1996-07-30 | Mitsubishi Denki Kabushiki Kaisha | IC card |
-
1989
- 1989-05-16 JP JP1122268A patent/JPH02301493A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5541452A (en) * | 1994-01-31 | 1996-07-30 | Mitsubishi Denki Kabushiki Kaisha | IC card |
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