JPH02288598A - Speaker - Google Patents
SpeakerInfo
- Publication number
- JPH02288598A JPH02288598A JP10938489A JP10938489A JPH02288598A JP H02288598 A JPH02288598 A JP H02288598A JP 10938489 A JP10938489 A JP 10938489A JP 10938489 A JP10938489 A JP 10938489A JP H02288598 A JPH02288598 A JP H02288598A
- Authority
- JP
- Japan
- Prior art keywords
- voice coil
- spacer ring
- lead
- speaker
- diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000006850 spacer group Chemical group 0.000 claims abstract description 16
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 13
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 11
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 230000010354 integration Effects 0.000 abstract 1
- 238000000605 extraction Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は音響機器あるいは映像機器分野に利用されるス
ピーカに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a speaker used in the field of audio equipment or video equipment.
従来の技術
従来、スピーカの振動系の組合わせは第7図のようにな
っていた。まず、スペーサリング2に振動板1を先に貼
シ合わせ、次にボイスコイル3を貼シ合わせた後、ボイ
スコイル3のリード引出し線4,6をスペーサリング2
に溶剤型のクロロプレンゴム系等の接着剤6によシ仮止
め接着し振動板1上のボイスコイル3のリード引出し線
4,6を溶剤型のアクリル系接着剤7で接着固定してい
た。又、従来のスピーカの外観は第8図のようになって
いる。前記ボイスコイル3の残シリード引出し線4,6
をフレーム8及びヨーク9に添わせターミナル7a 、
7bに半田固定後、フレーム8及びヨーク9上のボイス
コイル3のリード引出し線4,6を溶剤型のクロロプレ
ンゴム系等の接着剤1oにより接着固定し、スピーカの
組立を行っていた。Prior Art Conventionally, the combination of speaker vibration systems was as shown in FIG. First, the diaphragm 1 is attached to the spacer ring 2, and then the voice coil 3 is attached, and then the lead wires 4 and 6 of the voice coil 3 are attached to the spacer ring 2.
The lead wires 4 and 6 of the voice coil 3 on the diaphragm 1 were adhesively fixed with a solvent-based acrylic adhesive 7. Further, the appearance of a conventional speaker is as shown in FIG. Remaining series lead wires 4 and 6 of the voice coil 3
Attach the terminal 7a to the frame 8 and yoke 9,
7b, the lead wires 4 and 6 of the voice coil 3 on the frame 8 and yoke 9 were adhesively fixed using an adhesive 1o such as a solvent type chloroprene rubber type adhesive, and the speaker was assembled.
発明が解決しようとする課題
ところが上記の組立方法では、リード引出し線4.6の
仮止め及び固定処理にそれぞれ溶剤型接着剤6,7.1
0を使用するため、約30分以上の乾燥時間が必要であ
った。又、フレーム8及びヨーク9上のボイスコイル3
のリード引出し線4゜6の引廻しにおいても、フレーム
8及びヨーク9上にきれいに添うように引廻しを行わな
いとボイスコイル3のリード引出し線4,5が突っ張っ
た状態で半田固定され、スピーカボックス、あるいはヘ
ッドホンハウジングへの組込み時にボイスコイル3のリ
ード引出し線4,5が切断されるという問題が発生して
いた。Problem to be Solved by the Invention However, in the above assembly method, solvent-based adhesives 6 and 7.1 are used for temporary fixing and fixing of the lead wires 4.6, respectively.
0, a drying time of approximately 30 minutes or more was required. Also, the voice coil 3 on the frame 8 and yoke 9
Even when routing the lead wires 4°6, if the lead wires 4 and 5 of the voice coil 3 are not routed neatly along the frame 8 and yoke 9, the lead wires 4 and 5 of the voice coil 3 will be soldered and fixed in a taut state, and the speaker There has been a problem in that the lead wires 4 and 5 of the voice coil 3 are cut when the voice coil 3 is assembled into a box or headphone housing.
さらに、ターミナル部で入力コードとの半田固定時に、
半田付時の温度上昇によりあらかじめ半田固定されたリ
ード引出し線部分が溶融してはずれが発生し、スピーカ
として動作しなくなるという問題も生じていた。Furthermore, when soldering to the input cord at the terminal section,
There has also been a problem in that the lead wire portion, which has been soldered in advance, melts due to the rise in temperature during soldering and comes off, causing the speaker to no longer function as a speaker.
加えて、リード引出し線の引廻しにおいても、φ0.0
4〜φ0.o6の細線を利用する場合には。In addition, in the routing of lead wires, φ0.0
4~φ0. When using o6 thin line.
引廻し時の切断も多発していた。There were also many cuts during hauling.
本発明は以上のような従来の欠点を除去し、ボイスコイ
ルのリード引出し線の配線を容易にしたスピーカを提供
することを目的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned conventional drawbacks and to provide a speaker in which voice coil lead wires can be wired easily.
課題を解決するための手段
この課題を解決するために本発明は、振動板を貼シ合わ
せるスペーサリングとボイスコイルのリード引出し線及
びターミナルを一枚の7レキシプル基板を使用して、配
線する構成としたものである。Means for Solving the Problem In order to solve this problem, the present invention has a configuration in which a spacer ring for bonding a diaphragm, a voice coil lead wire, and a terminal are wired using a single 7-lexiple board. That is.
作用
以上のようにスペーサリング部、リード引出し部及びタ
ーミナル部を一体化したフレキシブル基板を用いること
によシ、リード線の固定に伴なう接着工程及び接着剤、
乾燥時間も不要になる。As described above, by using a flexible substrate that integrates the spacer ring part, lead extraction part, and terminal part, the adhesive process and adhesive associated with fixing the lead wires can be avoided.
Drying time is also unnecessary.
さらに、リード引出し部がフレキシブル基板上にあるた
め、リード線の強度(引張り、屈折等)は従来のものよ
りはるかに向上し、組込時の断線が防止できる。Furthermore, since the lead lead-out portion is located on the flexible substrate, the strength (tensile strength, bending, etc.) of the lead wire is much improved compared to conventional ones, and breakage during assembly can be prevented.
加えて、リード引出し部がフレキシブル基板上にプリン
トされているため、入力コード半田固定時のはずれが防
止できる。In addition, since the lead lead-out portion is printed on the flexible substrate, it is possible to prevent the input cord from coming off when soldered.
実施例 以下、本発明の実施例を添付の図面を用いて説明する。Example Embodiments of the present invention will be described below with reference to the accompanying drawings.
厚さ0.2nmのフレキシブル基板11上にスペーサリ
ング部12.リード引出し部13及びターミナル部14
をパターン印刷したものを第3図に示す。フレキシブル
基板11の表面部には、スペーサリング部121C中継
ターミナル151L、15bとリード引出し部13にプ
リントリード線161L。A spacer ring portion 12 is formed on a flexible substrate 11 with a thickness of 0.2 nm. Lead drawer section 13 and terminal section 14
Fig. 3 shows a printed pattern of . On the surface of the flexible substrate 11, there are a spacer ring section 121C, relay terminals 151L and 15b, and a printed lead wire 161L on the lead extraction section 13.
16bを設け、裏面部には半円弧状のターミナル部14
にターミナル171L、17bを設けである。16b, and a semicircular arc-shaped terminal part 14 is provided on the back side.
Terminals 171L and 17b are provided.
表面と裏面の導通接続はスルーホール部18a。The conductive connection between the front and back surfaces is through-hole portion 18a.
18bで行われている。振動板19とボイスコイル20
とを本発明のフレキシブル基板11に貼シ合わせ、ボイ
スコイル2oのリード引出し線21゜22をスペーサリ
ング部12の中継ターミナル151L 、 15bにそ
れぞれ半田固定し、リード引出し線21.22を溶剤型
のアクリル系粘着剤23で接着固定した状態を第4図で
示す。18b. Diaphragm 19 and voice coil 20
The lead wires 21 and 22 of the voice coil 2o are soldered to the relay terminals 151L and 15b of the spacer ring 12, respectively, and the lead wires 21 and 22 are bonded to the flexible substrate 11 of the present invention. FIG. 4 shows a state in which it is adhesively fixed with an acrylic adhesive 23.
次に、ターミナル部14とフレーム24、ヨーク26よ
りなる筐体部を接合したその状態を第6図に示す。以上
のように構成したスピーカの断面図及び平面図を第1図
及び第2図に示す。Next, FIG. 6 shows the state in which the terminal section 14, the frame 24, and the casing section consisting of the yoke 26 are joined together. A sectional view and a plan view of the speaker configured as described above are shown in FIGS. 1 and 2.
第1図、第2図において、ヨーク26内にはマグブト2
6.上部プレート27を組込み、これらの中央部をフレ
ーム24を構成する際に同時に合成樹脂の成形による結
合部28で結合して磁気回路29を構成している。この
磁気回路29の磁気ギャップ3oにボイスコイル20を
はまりこませるように、ヨーク26の外周に設けたフレ
ーム24の周縁部に振動板19の外周に貼付けたスペー
サリング部12を貼付けて固着し、フレーム24の外側
面にリード引出し部13を通してヨーク26の底面忙タ
ーミナル部14を貼付けて結合し、振動板1eの前面に
保護カバー31を被せてスピーカとしている。In FIGS. 1 and 2, there is a magbution 2 in the yoke 26.
6. When the upper plate 27 is assembled and the frame 24 is constructed, the magnetic circuit 29 is constructed by connecting the upper plate 27 with a connecting portion 28 formed by molding synthetic resin. In order to fit the voice coil 20 into the magnetic gap 3o of the magnetic circuit 29, the spacer ring 12 attached to the outer periphery of the diaphragm 19 is attached and fixed to the peripheral edge of the frame 24 provided on the outer periphery of the yoke 26. The bottom terminal part 14 of the yoke 26 is pasted and coupled to the outer surface of the frame 24 through the lead pull-out part 13, and the front surface of the diaphragm 1e is covered with a protective cover 31 to form a speaker.
又、入力コード32とターミナル171L 、 17b
とを半田固定し、ハウジング33と前記スピーカとを組
合わせてヘッドホンを完成させたものを第6図に示す。Also, input code 32 and terminals 171L and 17b
FIG. 6 shows a completed headphone in which the housing 33 and the speaker are combined with each other by soldering.
従来の方法では、この組込み時にリード線固定が不十分
の場合、組込み時の応力あるいは治工具あるいは指等の
引掛シにより断線が発生していたが1本発明の方法によ
ればリード引出し部13の強度が増しくフレキシブル基
板11及びプリントリード線部161L、16bさらK
は保護膜の複合化による強度向上)組込み時の応力ある
いは治工具あるいは指等の引掛りがあっても。In the conventional method, if the lead wire was not sufficiently fixed during assembly, the wire would break due to stress during assembly or catching by a jig or finger, but according to the method of the present invention, the lead wire 13 The strength of the flexible substrate 11 and printed lead wire parts 161L and 16b is increased.
(Increased strength due to the use of a composite protective film) Even if there is stress during assembly or getting caught by jigs, tools, fingers, etc.
十分耐えうることか判明した。さらに、寿命試験等の信
頼性試験を行っても何ら問題がなかった。It turned out to be quite bearable. Furthermore, no problems were found even when reliability tests such as life tests were conducted.
まだ、入力コード半田固定でも何ら問題は生じなかった
。I haven't had any problems even with the input cord soldered.
リード引出し部13をターミナル部14と同様に7レキ
シプル基板11の裏面に設け、スルホ−ル部181!L
、18bをスペーサリング部12に設けたが、上記と同
様の結果が得られた。The lead drawer portion 13 is provided on the back surface of the lexiple board 11 in the same manner as the terminal portion 14, and the through hole portion 181! L
, 18b were provided in the spacer ring portion 12, but the same results as above were obtained.
又、リード引出し部13をフレーム24に接合しても同
様の結果が得られた。Further, similar results were obtained even when the lead pull-out portion 13 was joined to the frame 24.
さらにはターミナル部14の固定はヨーク25の底面上
が樹脂を使用していることから、この樹脂の一部を利用
してターミナル部14を熱融着により取シ付けて実験し
ても上記したものと同様な結果が得られた。Furthermore, since the bottom surface of the yoke 25 is made of resin to fix the terminal part 14, an experiment was carried out in which the terminal part 14 was attached by heat fusion using a part of this resin. Similar results were obtained.
発明の効果
以上のように本発明は、スペーサリング部、リード引出
し部及びターミナル部を一体化した7レキシプル基板を
用いることにより、リード線の固定に伴なう接着工程及
び接着剤の乾燥時間をなくせ引廻し時の断線が防止でき
、入力コード半田固定時のリード線はがれがなくなる。Effects of the Invention As described above, the present invention uses a 7-lexiple board that integrates a spacer ring part, a lead extraction part, and a terminal part, thereby reducing the adhesion process and drying time of the adhesive associated with fixing the lead wires. This prevents wire breakage when the cable is routed, and prevents the lead wire from coming off when the input cord is soldered.
又、リード引出し部がフレキシブル基板上にあるため、
リード線の強度は従来のものよシはるかに向上し、ノ・
ウジング等に組込む際の断線も防止できる。Also, since the lead extraction part is on the flexible board,
The strength of the lead wire is much improved compared to the conventional one, and the
It also prevents disconnection when incorporating it into housings, etc.
さらには、フレーム及びヨーク上のボイスコイルリード
引出し線の引廻しがなくなるため、接着工程のない合理
的な自動化が可能となる。Furthermore, since there is no need to route the voice coil lead wires on the frame and yoke, rational automation without a bonding process is possible.
第1図〜第6図は本発明によるスピーカの一実施例を示
すもので、第1図は組立断面図、第2図は外観平面図、
第3図は本発明のフレキシブル基板の正面図、第4図及
び第5図は本発明のフレキシブル基板を使用した振動系
の斜視図とスピーカ斜視図であり、第6図は本発明のス
ピーカをヘッドホン等のハウジングに組込んだ組立断面
図である。又第7図、第8図は従来のスピーカの振動系
斜視図とスピーカの斜視図である。
11・・・・・・7レキシプル基板、12・・・・・・
スペーサリング部、13・・・・・・リード引出部、1
4・・・・・・ターミナル部、16a、16b・・・・
・・プリントリード線部、 1ya 、 1rb−−−
−・・ターミナ/l/、181L。
18b・・・・・・スルホール、19・・・・・・振動
板、20・・・・・ボイスコイル、21.22・・・・
・・リード引出し線。
24・・・・・・フレーム、29・・・・・・磁気回路
、30・・・・・・磁気ギャップ。
代理人の氏名 弁理士 粟 野 重 孝 ほか1名菓
1 図
第2図
第
図
第
図
→
図1 to 6 show an embodiment of the speaker according to the present invention, in which FIG. 1 is an assembled sectional view, FIG. 2 is an external plan view,
FIG. 3 is a front view of the flexible substrate of the present invention, FIGS. 4 and 5 are a perspective view of a vibration system and a speaker perspective view using the flexible substrate of the present invention, and FIG. 6 is a perspective view of the speaker of the present invention. FIG. 2 is an assembled sectional view of the device assembled into a housing of headphones or the like. 7 and 8 are a perspective view of a vibration system of a conventional speaker and a perspective view of the speaker. 11...7 Lexiple board, 12...
Spacer ring part, 13... Lead drawer part, 1
4...Terminal section, 16a, 16b...
・・Print lead wire part, 1ya, 1rb---
--Termina/l/, 181L. 18b...Through hole, 19...Diaphragm, 20...Voice coil, 21.22...
・Lead extraction line. 24... Frame, 29... Magnetic circuit, 30... Magnetic gap. Name of agent: Patent attorney Shigetaka Awano and one other name
1 Figure 2 Figure 2 Figure → Figure
Claims (1)
えた振動板の周縁部をスペーサリングを介してフレーム
に結合し、上記スペーサリングにボイスコイルのリード
引出し線を接続する中継ターミナルを設け、このスペー
サリングとリード引出し部とターミナル部をフレキシブ
ルプリント基板で一体に構成し上記ターミナル部を磁気
回路の底面に結合してなるスピーカ。The peripheral part of the diaphragm having a voice coil that fits into the magnetic gap of the magnetic circuit is connected to the frame via a spacer ring, and a relay terminal is provided to connect the lead wire of the voice coil to the spacer ring. A speaker in which a lead lead-out part and a terminal part are integrally constructed using a flexible printed circuit board, and the terminal part is connected to the bottom surface of a magnetic circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1109384A JP2832999B2 (en) | 1989-04-28 | 1989-04-28 | Speaker |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1109384A JP2832999B2 (en) | 1989-04-28 | 1989-04-28 | Speaker |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02288598A true JPH02288598A (en) | 1990-11-28 |
JP2832999B2 JP2832999B2 (en) | 1998-12-09 |
Family
ID=14508874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1109384A Expired - Fee Related JP2832999B2 (en) | 1989-04-28 | 1989-04-28 | Speaker |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2832999B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030016619A (en) * | 2001-08-21 | 2003-03-03 | 현대자동차주식회사 | Door speaker connecting device of vehicle |
JP2013077918A (en) * | 2011-09-29 | 2013-04-25 | Star Micronics Co Ltd | Electrodynamic exciter |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5757694U (en) * | 1980-09-22 | 1982-04-05 | ||
JPS58147398U (en) * | 1982-03-30 | 1983-10-04 | オンキヨー株式会社 | electroacoustic transducer |
-
1989
- 1989-04-28 JP JP1109384A patent/JP2832999B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5757694U (en) * | 1980-09-22 | 1982-04-05 | ||
JPS58147398U (en) * | 1982-03-30 | 1983-10-04 | オンキヨー株式会社 | electroacoustic transducer |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030016619A (en) * | 2001-08-21 | 2003-03-03 | 현대자동차주식회사 | Door speaker connecting device of vehicle |
JP2013077918A (en) * | 2011-09-29 | 2013-04-25 | Star Micronics Co Ltd | Electrodynamic exciter |
Also Published As
Publication number | Publication date |
---|---|
JP2832999B2 (en) | 1998-12-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |