JPH02271212A - X-ray thickness gauge - Google Patents

X-ray thickness gauge

Info

Publication number
JPH02271212A
JPH02271212A JP9455489A JP9455489A JPH02271212A JP H02271212 A JPH02271212 A JP H02271212A JP 9455489 A JP9455489 A JP 9455489A JP 9455489 A JP9455489 A JP 9455489A JP H02271212 A JPH02271212 A JP H02271212A
Authority
JP
Japan
Prior art keywords
ray
substrate
angle
thin film
total reflection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9455489A
Other languages
Japanese (ja)
Other versions
JP2780324B2 (en
Inventor
Junichiro Nakajima
中島 順一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP9455489A priority Critical patent/JP2780324B2/en
Publication of JPH02271212A publication Critical patent/JPH02271212A/en
Application granted granted Critical
Publication of JP2780324B2 publication Critical patent/JP2780324B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)

Abstract

PURPOSE:To measure the film thickness correctly by setting theta1<thetax=theta2<theta0 for a substrate having a critical angle theta0 of total reflection of an X ray wherein theta1 is a critical angle of total reflection, thetax is an incident angle of an X ray, and theta2 is a take-out angle to detect the X ray reflected from said substrate. CONSTITUTION:Given that a critical angle of total reflection of a substrate 3 is theta0, a critical angle of total reflection of a thin film 1 is theta1, and an incident angle of an X ray is thetax, when an X ray 2 is radiated to the thin film 1 with an incident angle satisfying the condition theta1<thetax<theta0, the X ray 2 passes through the thin film 1 to reach the surface of the substrate 3. A projecting X ray 5 totally reflected by the substrate 3 is detected to be most strong when a take-out angle theta2 of a detector 4 meets the condition theta1<theta2<theta0. At this time, the take-out angle theta2 of the detector 4 is set to be equal to the incident angle thetax of the X ray.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は薄膜の厚さを測定するX線膜厚計に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an X-ray film thickness meter that measures the thickness of a thin film.

〔従来の技術〕[Conventional technology]

従来、この種のX線膜厚計はX線の吸収効果を利用して
金属膜の厚さを測定するもあのであり、近年、半導体基
板における薄膜の膜厚を測定するのに、よく用いられて
きた。
Conventionally, this type of X-ray film thickness meter has been used to measure the thickness of metal films using the absorption effect of X-rays, and in recent years it has been frequently used to measure the thickness of thin films on semiconductor substrates. I've been exposed to it.

このxi膜厚計は、図面には示さないが、被測定試料で
ある薄膜が形成された基板表面に対して所定の入射角で
X線を投射するX線発生器と、このX線発生器と対称に
斜に配置された検出器とを有している。
Although not shown in the drawing, this xi film thickness meter includes an and a symmetrically and obliquely arranged detector.

この基板の薄膜の厚さを測定する場合は、まず、X線を
基板の薄膜の表面に照射し、薄膜及び基板に含まれる元
素より反射するX線を検出器でそれぞれ測定し、その強
度差を膜厚に換算して膜厚としていた。
To measure the thickness of the thin film on this substrate, first irradiate the surface of the thin film on the substrate with X-rays, and measure the X-rays reflected from the thin film and the elements contained in the substrate with a detector. was converted into film thickness.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のX線膜厚計で、例えば、1μm以下の厚
さの薄膜では、基板中の反射するX線の強度をモニタす
る場合、薄膜中の元素の密度が大きく、X線質量係数が
大きいと、薄膜中の吸収が大きくなり、1μm以下の薄
膜でも測定可能な場合がある。ところが、逆に、基板の
元素で反射するX線の強度が強く、薄膜の元素の密度が
小さく、かつ薄膜のX線質量吸収係数が小さいときは、
薄膜によるX線の吸収が小さく、膜厚測定が出来ないと
いう問題がある。
For example, when using the conventional X-ray film thickness meter described above to monitor the intensity of X-rays reflected in a substrate for a thin film with a thickness of 1 μm or less, the density of elements in the thin film is large and the X-ray mass coefficient is If it is large, the absorption in the thin film becomes large, and it may be possible to measure even a thin film of 1 μm or less. However, on the other hand, when the intensity of the X-rays reflected by the elements of the substrate is strong, the density of the elements in the thin film is low, and the X-ray mass absorption coefficient of the thin film is small,
There is a problem in that the X-ray absorption by the thin film is small, making it impossible to measure the film thickness.

本発明の目的は、基板に形成された薄膜の膜厚が1μm
以下でも膜厚の測定が出来るX線膜厚計を提供すること
である。
The object of the present invention is that the thickness of the thin film formed on the substrate is 1 μm.
It is an object of the present invention to provide an X-ray film thickness meter capable of measuring film thickness in the following manner.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のX線膜厚計は、X線の全反射臨界角度θ。をも
つ基板の上に全反射臨界角度θ1をもつとともにこのθ
1が前記θ0より小さい薄膜が形成されたその膜厚を測
定するX線膜厚計において、X線の入射角度θx及び前
記基板より反射するX線を検知する取出し角度θ2をθ
1<θx=θ2<θ0に設定する手段を備え構成される
The X-ray film thickness meter of the present invention has a total reflection critical angle θ of X-rays. has a total reflection critical angle θ1 on a substrate with
In an X-ray film thickness meter that measures the thickness of a thin film formed with 1 smaller than θ0, the incident angle θx of the X-rays and the extraction angle θ2 for detecting the X-rays reflected from the substrate are θ.
1<θx=θ2<θ0.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の一実施例を説明するための入射、反射
X線と薄膜が形成された基板及び検出器との相対位置を
示す模式断面図である。なお、この図面では説明の都合
上屈折角については示していない。いま、第1図で示す
ように、基板3の全反射臨界角度をθ0、薄M1の全反
射臨界角度をθ1、X線の入射角度をθxとし、この入
射X線2の入射角度θxが、θl<θxくθ0の条件で
薄膜1に照射されると、入射X線2は薄膜1を透過し、
基板3の表面に到達する。
FIG. 1 is a schematic cross-sectional view showing the relative positions of incident and reflected X-rays, a substrate on which a thin film is formed, and a detector, for explaining one embodiment of the present invention. Note that the refraction angle is not shown in this drawing for convenience of explanation. Now, as shown in FIG. 1, the critical angle of total reflection of the substrate 3 is θ0, the critical angle of total reflection of the thin M1 is θ1, and the angle of incidence of X-rays is θx, and the angle of incidence θx of the incident X-rays 2 is When the thin film 1 is irradiated under the conditions of θl<θx and θ0, the incident X-ray 2 passes through the thin film 1,
It reaches the surface of the substrate 3.

この基板3で全反射された出所X線5は、検出器4の取
り出し角度θ2がθ、くθ2くθ。のとき、最も強く検
出することが出来るという知見を得た。なお、このとき
の検出器4の取り出し角度θ2は前述のX線の入射角度
をθxと等しい角度に設定しておいな。
The source X-ray 5 totally reflected by this substrate 3 has an extraction angle θ2 of the detector 4, θ2×θ. We have found that the strongest detection is possible when Note that the extraction angle θ2 of the detector 4 at this time is set to be equal to the incident angle θx of the aforementioned X-rays.

ここで、例えば、薄膜1の膜さをdとすると、入射及び
出所X線2透過距離1/2は、1=2d/sinθ8 となる。例えば、θx =2mrad、d=100人と
すると、1=10μmとなる。もし、仮りに、薄膜3が
5i02であるとすると、この密度が2゜3g/cm3
、)(線質量吸収係数がほぼ100cm2/gであるの
で、入射X線の強度工0と検出される出所X線強度■の
比は、 I/工o =eXp (100X2.3xlO/100
00)=0.79 程度となる。また、従来、行なわれていた場合では、検
出器4の取り出し角度θ2が45°程度とすると、この
強度比I/Ioが0.996となり、強度変化が誤差程
度になり、膜厚を評価することは難しい。これに比べ前
述の全反射を用いた本実施例では、薄膜の膜厚を評価す
るのに十分な強度減衰が得られる。
Here, for example, if the thickness of the thin film 1 is d, the transmission distance 1/2 of the incident and source X-rays 2 is 1=2d/sin θ8. For example, if θx = 2 mrad and d = 100 people, then 1 = 10 μm. If the thin film 3 is 5i02, this density is 2°3g/cm3.
, ) (Since the linear mass absorption coefficient is approximately 100 cm2/g, the ratio of the incident X-ray intensity 0 and the detected source X-ray intensity
00)=0.79. In addition, in the conventional case, when the take-out angle θ2 of the detector 4 is about 45 degrees, this intensity ratio I/Io is 0.996, and the intensity change is about an error, making it difficult to evaluate the film thickness. That's difficult. In contrast, in this embodiment using total reflection described above, sufficient intensity attenuation can be obtained to evaluate the thickness of a thin film.

また、これらX線発生器及び検出器の取付けは、公知の
取付は手段を用い、X線防護用チャンバ外からリモート
コントロールで各々の角度を調節出来るようにすれば容
易に実現出来る。
Further, the installation of the X-ray generator and the detector can be easily realized by using known installation means and by allowing the respective angles to be adjusted by remote control from outside the X-ray protection chamber.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、薄く、その密度が小さく
、かつ質量吸収係数の小さな薄膜の膜厚を測定する際に
、基板と薄膜のX線全反射臨界角度との中間の角度で、
基板の照射点に対して対称的にX線発生器と検出器を配
置することによって、入射X線と出所X線の強度差が大
きく得られるので、膜厚の測定を正確に測定出来るX線
膜厚計が得られるという効果がある。
As explained above, the present invention is capable of measuring the thickness of a thin film that is thin, has a low density, and has a small mass absorption coefficient, at an angle intermediate between the critical angle of X-ray total reflection of the substrate and the thin film.
By arranging the X-ray generator and detector symmetrically with respect to the irradiation point on the substrate, a large difference in intensity between the incident and source X-rays can be obtained, making it possible to accurately measure the film thickness using X-rays. This has the effect of providing a film thickness gauge.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を説明するための入射、反射
X線と薄膜が形成された基板及び検出器との相対位置を
示す模式断面図である。 1・・・薄膜、2゛・・・入射X線、3・・・基板、4
・・・検出器、5・・・出所X線。
FIG. 1 is a schematic cross-sectional view showing the relative positions of incident and reflected X-rays, a substrate on which a thin film is formed, and a detector, for explaining one embodiment of the present invention. 1... Thin film, 2゛... Incident X-ray, 3... Substrate, 4
...Detector, 5...Source X-ray.

Claims (1)

【特許請求の範囲】[Claims] X線の全反射臨界角度θ_0をもつ基板の上に全反射臨
界角度θ_1をもつとともにこのθ_1が前記θ_0よ
り小さい薄膜が形成されたその膜厚を測定するX線膜厚
計において、X線の入射角度θ_x及び前記基板より反
射するX線を検知する取出し角度θ_2をθ_1<θ_
x=θ_2<θ_0に設定する手段を備えることを特徴
とするX線膜厚計
In an X-ray film thickness meter that measures the thickness of a thin film formed on a substrate with a critical angle of total reflection θ_0 of X-rays, which has a critical angle of total reflection θ_1 and where θ_1 is smaller than θ_0, The incident angle θ_x and the extraction angle θ_2 for detecting the X-rays reflected from the substrate are set as θ_1<θ_
An X-ray film thickness meter characterized by comprising means for setting x=θ_2<θ_0.
JP9455489A 1989-04-13 1989-04-13 X-ray thickness gauge Expired - Fee Related JP2780324B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9455489A JP2780324B2 (en) 1989-04-13 1989-04-13 X-ray thickness gauge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9455489A JP2780324B2 (en) 1989-04-13 1989-04-13 X-ray thickness gauge

Publications (2)

Publication Number Publication Date
JPH02271212A true JPH02271212A (en) 1990-11-06
JP2780324B2 JP2780324B2 (en) 1998-07-30

Family

ID=14113536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9455489A Expired - Fee Related JP2780324B2 (en) 1989-04-13 1989-04-13 X-ray thickness gauge

Country Status (1)

Country Link
JP (1) JP2780324B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015129666A (en) * 2014-01-07 2015-07-16 富士通株式会社 X-ray analysis method and x-ray analysis device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015129666A (en) * 2014-01-07 2015-07-16 富士通株式会社 X-ray analysis method and x-ray analysis device

Also Published As

Publication number Publication date
JP2780324B2 (en) 1998-07-30

Similar Documents

Publication Publication Date Title
EP0397388A3 (en) Method and apparatus for measuring thickness of thin films
US5619548A (en) X-ray thickness gauge
US6507634B1 (en) System and method for X-ray reflectometry measurement of low density films
JPH0242742A (en) Calibration target for surface analysing system, supporter of analysed object and light trap and aperture structure
JP3726080B2 (en) Method for evaluating orientation of polycrystalline materials
US6222199B1 (en) Ultrathin layer measurement having a controlled ambient of light path
JPS62232506A (en) Apparatus for measuring thickness of surface layer
JPH07103919A (en) Calibrating method for apparatus for total reflection fluorescent x-ray analysis
JPH02271212A (en) X-ray thickness gauge
JP4166400B2 (en) Radiation temperature measurement method
JP4977498B2 (en) Thin film laminate inspection method
Su et al. Spectroscopic ellipsometry and optical transmission study of LiPON thin films prepared by RF sputtering
JPS61200407A (en) Fourier transformation type infrared film thickness measuring apparatus
JP2000155102A (en) X-ray measuring apparatus and method therefor
TWI345055B (en) Method and apparatus for inspection,and cluster tool and apparatus for producing microelectronic devices
Willemsen et al. Hydrogen profiling by proton-proton scattering
Terwagne Cross section measurements of the reactions induced by 3He particles on carbon
JPH0833359B2 (en) Total reflection X-ray fluorescence analyzer
Krist et al. A large-angle neutron polarisation analyser
JPS61173171A (en) Method for measuring resistivity of semiconductor wafer
Hahn et al. Focusing polarisation analysis at the diffuse neutron scattering spectrometer (DNS) in Jülich
JP2010103258A5 (en)
JP2010103258A (en) Method of measuring quality of semiconductor wafer
JPH02107952A (en) X-ray diffraction measurement for powder
JPH10185537A (en) Film thickness measuring method using x-ray diffraction method

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees