JPH02256298A - Method and device for inserting lead wire of electronic component into substrate - Google Patents
Method and device for inserting lead wire of electronic component into substrateInfo
- Publication number
- JPH02256298A JPH02256298A JP1077366A JP7736689A JPH02256298A JP H02256298 A JPH02256298 A JP H02256298A JP 1077366 A JP1077366 A JP 1077366A JP 7736689 A JP7736689 A JP 7736689A JP H02256298 A JPH02256298 A JP H02256298A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- movable
- fixed
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 title abstract description 10
- 238000003780 insertion Methods 0.000 claims abstract description 23
- 230000037431 insertion Effects 0.000 claims abstract description 23
- 238000005452 bending Methods 0.000 claims description 8
- 230000032258 transport Effects 0.000 claims description 7
- 230000002079 cooperative effect Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 16
- 238000013459 approach Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 3
- 239000012530 fluid Substances 0.000 description 8
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子部品リード線の基板への挿入方法及び装
置に係り、特に該電子部品のリード線を基板への挿入に
先立って曲りを矯正すると共に所定の長さに予め短かく
切断した後挿入することによって、該基板への挿入効率
を向上させて高能率の作業を行えるようにした電子部品
リード線の基板への挿入方法及び装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method and apparatus for inserting electronic component lead wires into a board, and in particular to straightening bends in the electronic component lead wires prior to insertion into the board. The present invention also relates to a method and apparatus for inserting an electronic component lead wire into a board, which improves the efficiency of insertion into the board by cutting it short into a predetermined length and then inserting it, thereby enabling highly efficient work.
従来の技術
従来、第７図において、電子部品２を基板２４へ実装す
る方法としては、基板２４を所定の位置に固定して、パ
ーツフィーダ（図示せず）から供給される電子部品２を
挾持装置で挾持し、該電子部品２を実装すべき基板２４
上の位置へ搬送して位置決めを行う。その後、電子部品
２のリード線２ａを基板２４の挿入穴２４ａに挿入（矢
印Ｈ方向）して基板２４の下面から突出したリード線２
ａを基板２４の下面側に配設した装置によって所定の長
さに切断し、更に基板２４への実装強度を高めるために
折り曲げていた。2. Description of the Related Art Conventionally, as shown in FIG. 7, a method for mounting electronic components 2 onto a board 24 is to fix the board 24 in a predetermined position and clamp the electronic components 2 supplied from a parts feeder (not shown). A substrate 24 to be held between devices and on which the electronic component 2 is to be mounted.
Transport it to the upper position and position it. After that, the lead wire 2a of the electronic component 2 is inserted into the insertion hole 24a of the board 24 (in the direction of arrow H), and the lead wire 2a protrudes from the bottom surface of the board 24.
A was cut into a predetermined length by a device provided on the lower surface of the board 24, and then bent to increase the mounting strength on the board 24.
しかし、該従来方法によると、電子部品２のリード線２
ａは長いままであるので、製造工程又はその後の搬送等
の工程において時として曲げられてしまい、その曲った
ままの状態で基板２４に実装されるので、リード線２ａ
は基板２４の挿入穴２４ａに挿入されずに半田付けされ
てしまい、該基板２４が不良品となる欠点があった。そ
して該挿入不良現象は、基板２４と電子部品２の相対的
な位置決め精度を向上させても防ぐことができず、作業
能率を低下させる一因となっていた。また１つの電子部
品２に数本設けられているリード線２ａの１本でも曲っ
ていると、基板２４への挿入の際、該基板と電子部品２
との間に挟まれて変形し、電子部品２を所定の位置まで
挿入できず、自動機械においては、該異常を検出して運
転を停止させるので、その度に作業者が手動で異常電子
部品２を取り除いて再び機械を始動させる操作を要し、
著しく作業能率が低下し、ひいては製造コストが高くな
るという欠点があった。更に、電子部品２は基板２４上
に散在する所定位置に挿入され、該位置でリード線２ａ
を切断しなければならないので、切断されたリード線片
２ｂは該位置で矢印■方向に落下飛散してしまい、該リ
ード線片２ｂの処理が困難であるという欠点があった。However, according to the conventional method, the lead wire 2 of the electronic component 2
Since the lead wire 2a remains long, it is sometimes bent during the manufacturing process or subsequent transportation process, and is mounted on the board 24 in this bent state.
is soldered without being inserted into the insertion hole 24a of the board 24, resulting in a defective board 24. The phenomenon of poor insertion cannot be prevented even if the relative positioning accuracy between the board 24 and the electronic component 2 is improved, and this has been a factor in reducing work efficiency. Furthermore, if even one of the several lead wires 2a provided on one electronic component 2 is bent, when inserting it into the board 24, the board and the electronic component 2
The electronic component 2 cannot be inserted into the specified position due to the electronic component being caught between the It is necessary to remove 2 and start the machine again.
This has the drawback of significantly lowering work efficiency and increasing manufacturing costs. Further, the electronic components 2 are inserted into predetermined positions scattered on the board 24, and the lead wires 2a are inserted at the positions.
Since the lead wire piece 2b must be cut, the cut lead wire piece 2b falls and scatters in the direction of the arrow {circle around (2)}, making it difficult to dispose of the lead wire piece 2b.
目 的
本発明は、上記した従来技術の欠点を除くためになされ
たものであって、その目的とするところは、固定部材と
可動部材との間で電子部品リード線を該リード線の曲り
を矯正すると共に弾性力で保持して可動刃を作動させ、
該リード線を所定の長さに切断し、その後基板位置へ搬
送して該電子部品と基板との相対的な位置決めを行って
基板の挿入穴にリード線を挿入することにより、リード
線の曲りによる挿入不良を防止して、作業効率を向上さ
せることである。Purpose The present invention was made in order to eliminate the drawbacks of the prior art described above, and its purpose is to prevent bending of electronic component lead wires between a fixed member and a movable member. While straightening, the movable blade is activated by holding it with elastic force,
The lead wire is cut to a predetermined length, then transported to the board position, the electronic component and the board are positioned relative to each other, and the lead wire is inserted into the insertion hole of the board, thereby eliminating bending of the lead wire. The objective is to improve work efficiency by preventing insertion defects due to
また他の目的は、リード線を予め短かく切断することに
よって電子部品のリード線以外の部分、例えば素子部を
挾持して搬送しても、細かい金属線であるリード線の先
端が振動することがなく安定しているので、搬送位置決
め後該振動が納まるまで待つことなく直ちに基板に挿入
できるようにすることであり、またリード線の曲りを矯
正してから搬送することにより電子部品と基板との相対
的な位置決め精度を従来の方法よりもラフな精度として
も、同等以上の効果が得られるようにすることであり、
またこれによって実装装置を小型で安価なものとするこ
とである。Another purpose is to cut the lead wire short in advance to prevent the tip of the lead wire, which is a fine metal wire, from vibrating even if parts other than the lead wire of an electronic component, such as the element part, are held and transported. Because it is stable and has no vibrations, it can be inserted into the board immediately after the transport position is determined without having to wait until the vibration subsides.Also, by straightening the bends in the lead wires before transporting, the electronic parts and the board can be connected. Even if the relative positioning accuracy of the method is rougher than that of the conventional method, the same or better effect can be obtained.
This also allows the mounting device to be made smaller and cheaper.
更に他の目的は、リード線の切断を予め一定の位置で行
うことにより、切断されたリード線片の飛散を防止し、
筒車な装置で容易に処理できるようにすることである。Another purpose is to prevent the cut lead wire pieces from scattering by cutting the lead wires at a certain position in advance.
The purpose is to make it easy to process with a machine like an hour wheel.
構成
要するに本発明方法は、固定部材と、該固定部材に接近
する方向の弾性力を弾性部材によって作用させた可動部
材との間で、該電子部品のリード線を該リード線の曲り
を矯正しながら前記弾性力によって押圧保持した後、前
記可動部材に隣接配置した可動刃を作動させて前記電子
部品のリード線を所定の長さに切断し、該電子部品を実
装すべき基板位置へ搬送して前記電子部品と前記基板と
の相対的な位置決めを行うようにし、前記電子部品のリ
ード線の曲りを予め矯正すると共に短か（切断した後前
記基板のリード線挿入穴に挿入することを特徴とするも
のである。In short, the method of the present invention corrects the bending of the lead wire of the electronic component between a fixed member and a movable member on which an elastic member applies an elastic force in a direction approaching the fixed member. After the electronic component is pressed and held by the elastic force, a movable blade disposed adjacent to the movable member is operated to cut the lead wire of the electronic component to a predetermined length, and the electronic component is transported to a position on the board where it is to be mounted. the electronic component and the board are positioned relative to each other, the lead wires of the electronic component are straightened in advance, and the lead wires are cut short (cutted) and then inserted into the lead wire insertion hole of the board. That is.
また本発明装置は、基台に固定され固定刃を有する固定
部材と、該基台上で前記固定部材に対して接近又は離脱
する方向に移動できるようにした移動台とを配設し、該
移動台には、前記固定刃との協働作用によって前記電子
部品のリード線を切断するように該移動台に固定した可
動刃と、前記移動台上で該移動台の移動可能な方向と同
一方向に摺動して前記固定部材との間で前記電子部品の
リード線の曲りを矯正しながら押圧保持するようにした
可動部材と、該可動部材を前記固定部材に接近させる方
向に付勢する弾性部材と、前記電子部品を挾持して該電
子部品を実装すべき基板の位置へ搬送する挾持装置とを
備えたことを特徴とするものである。Further, the device of the present invention is provided with a fixed member fixed to a base and having a fixed blade, and a movable table movable on the base in a direction toward or away from the fixed member. The movable table includes a movable blade fixed to the movable table so as to cut the lead wire of the electronic component in cooperation with the fixed blade, and a movable blade fixed to the movable table so as to cut the lead wire of the electronic component by a cooperative action with the fixed blade, and a movable blade fixed to the movable table so as to cut the lead wire of the electronic component in cooperation with the fixed blade, and a movable blade on the movable table that is the same as the movable direction of the movable table. a movable member configured to slide in a direction to press and hold a lead wire of the electronic component while correcting a bend in the lead wire between the fixed member; and a movable member configured to urge the movable member in a direction to approach the fixed member. The present invention is characterized by comprising an elastic member and a holding device that holds the electronic component and transports the electronic component to a position on a board where the electronic component is to be mounted.
以下本発明を図面に示す実施例に基いて説明する。第１
図及び第２図において、本発明に係る電子部品リード線
の挿入装置１は、電子部品２のリード線２ａを切断する
切断装置３と、挾持装置４とを備えている。The present invention will be explained below based on embodiments shown in the drawings. 1st
In the figures and FIG. 2, an electronic component lead wire insertion device 1 according to the present invention includes a cutting device 3 for cutting a lead wire 2a of an electronic component 2, and a clamping device 4.
切断装置３は、第１図及び第２図を参照して、電子部品
２のリード線２ａをリード線２ａの曲りを矯正すると共
に押圧保持して所定の長さに切断するものであって、基
台５にねじ６で固定され固定刃８ｂを有する固定部材８
と、基台５に設けた案内台５ａに案内されて摺動し固定
部材８に対して接近又は離脱する方向に移動して固定部
材８との間でリード線２ａを保持するようにした移動台
９とを備えている。そして移動台９の側面９ａに設けた
コの字状の切欠き部９ｂには、基台５に固定したピン１
０を中心として揺動可能な駆動レバー１１の一端１１ａ
にナツト１２で固定されたローラ１３が嵌合している。Referring to FIGS. 1 and 2, the cutting device 3 corrects the bending of the lead wire 2a and cuts the lead wire 2a of the electronic component 2 into a predetermined length by pressing and holding the lead wire 2a. A fixed member 8 fixed to the base 5 with a screw 6 and having a fixed blade 8b.
, the lead wire 2a is held between the fixed member 8 by sliding in the direction of approaching or separating from the fixed member 8 while being guided by the guide stand 5a provided on the base 5. It is equipped with a stand 9. A U-shaped notch 9b provided on the side surface 9a of the movable table 9 has a pin 1 fixed to the base 5.
One end 11a of the drive lever 11 that can swing around 0
A roller 13 fixed with a nut 12 is fitted into the roller 13.
そして駆動レバー１１の他の一端に形成された二叉部１
１ｂには、ローラ１４がナツト１５で固定しである。更
にローラ１４は、基台５にねじ１６で固定した流体圧シ
リンダ１８のピストンロッド１８ａの先端に位置する該
ローラ１４の直径と略等しい間隔で固定された２枚の円
板１８ｂの間に嵌合しており、図示しないパイプを通し
て圧力流体を流体圧シリンダ１８に供給して矢印入方向
にピストンロフト１８ａを移動させると、駆動レバー１
１がピン１０を中心にして図中反時計方向に揺動し、ロ
ーラ・１３を介して移動台９を基台５の案内台５ａ上で
摺動させて矢印Ｂ方向に移動させるようになっている。and a bifurcated portion 1 formed at the other end of the drive lever 11.
A roller 14 is fixed to 1b with a nut 15. Further, the roller 14 is fitted between two discs 18b fixed at a distance approximately equal to the diameter of the roller 14 located at the tip of the piston rod 18a of the hydraulic cylinder 18 fixed to the base 5 with a screw 16. When the piston loft 18a is moved in the direction of the arrow by supplying pressure fluid to the fluid pressure cylinder 18 through a pipe (not shown), the drive lever 1
1 swings counterclockwise in the figure around a pin 10, and slides the movable table 9 on the guide table 5a of the base 5 via the roller 13 in the direction of arrow B. ing.
移動台９にはブラケット１７がねじ２７により固定され
、該ブラケットには、可動刃１９がその上面１９ａと固
定部材８の下面８ａとが略同−高さとなるように鍔付き
のスペーサ２０を介してねじ２１で固定され、可動刃１
９と固定部材８の°固定刃８ｂとの間でリード線２ａを
切断するようになっている。鍔付きスペーサ２０には可
動部材２２の中央部に設けた長溝２２ａが嵌合しており
、可動部材２２は、可動刃１９、鍔付きスペーサ２０及
び移動台９のブラケット１７により案内されて固定部材
８に対して接近又は離脱する方向に摺動可能となってい
る。更に可動部材２２と移動台９との間には弾性部材の
一例たる圧縮ばね２３を配設し、可動部材２２を常に固
定部材８方向へ押圧付勢している。A bracket 17 is fixed to the movable table 9 with screws 27, and the movable blade 19 is attached to the bracket via a flanged spacer 20 so that the upper surface 19a of the movable blade 19 and the lower surface 8a of the fixed member 8 are approximately at the same height. The movable blade 1 is fixed with a screw 21.
9 and the fixed blade 8b of the fixed member 8, the lead wire 2a is cut. A long groove 22a provided at the center of the movable member 22 is fitted into the flanged spacer 20, and the movable member 22 is guided by the movable blade 19, the flanged spacer 20, and the bracket 17 of the movable table 9 to the fixed member. It is possible to slide in the direction toward or away from 8. Further, a compression spring 23, which is an example of an elastic member, is disposed between the movable member 22 and the movable table 9, and constantly presses the movable member 22 in the direction of the fixed member 8.
また固定部材８と可動部材２２との間の隙間２５の下方
には、傾斜した底面２６ａを持つホッパ２６を配設して
切断したリード線片２ｂを排出処理できるようになって
いる。Further, a hopper 26 having an inclined bottom surface 26a is disposed below the gap 25 between the fixed member 8 and the movable member 22, so that the cut lead wire pieces 2b can be discharged.
挾持装置４は、第１図において、電子部品２の素子部２
ｃを挾持して図示しないパーツフィーダから切断装置３
へ搬送し、リード線２ａが所定の長さに切断された後、
基板２４の挿入穴２４ａの位置に再び搬送してリード線
２ａを挿入穴２４ａに挿入するものであって、互いに接
近及び離脱する方向に移動する２つの挾持腕４ａと図示
しない移動装置とから構成されている。In FIG.
Cutting device 3 from a parts feeder (not shown) while holding c.
After the lead wire 2a is cut to a predetermined length,
It is conveyed again to the position of the insertion hole 24a of the board 24 and the lead wire 2a is inserted into the insertion hole 24a, and is composed of two clamping arms 4a that move toward and away from each other and a moving device (not shown). has been done.
そして本発明に係る方法は、固定部材８と、固定部材８
に接近する方向の弾性力を弾性部材２３によって作用さ
せた可動部材２２との間で、電子部品２のリード線２ａ
をリード線２ａの曲りを矯正しながら弾性力によって押
圧保持した後、可動部材２２に隣接配置した可動刃１９
を作動させて電子部品２のリード線２ａを所定の長さに
切断し、電子部品２を実装すべき基板２４の位置へ搬送
して電子部品２と基板２４との相対的な位置決めを行う
ようにし、電子部品２のリード線２ａの曲りを予め矯正
すると共に短かく切断した後基板２４のリード線挿入穴
２４ａに挿入する方法である。The method according to the present invention includes the fixing member 8 and the fixing member 8.
The lead wire 2a of the electronic component 2 is connected to the movable member 22 on which the elastic member 23 applies an elastic force in the direction of approaching the lead wire 2a of the electronic component 2.
The movable blade 19 disposed adjacent to the movable member 22 is pressed and held by elastic force while correcting the bending of the lead wire 2a.
to cut the lead wire 2a of the electronic component 2 to a predetermined length, transport the electronic component 2 to the position on the board 24 where it is to be mounted, and perform relative positioning between the electronic component 2 and the board 24. In this method, the bends of the lead wires 2a of the electronic component 2 are corrected in advance, and the lead wires 2a of the electronic component 2 are cut into short pieces and then inserted into the lead wire insertion holes 24a of the board 24.
作用
本発明は、上記のように構成されており、以下その作用
について説明する。第１図から第３図を参照して、図示
しないパーツフィーダによって供給される電子部品２の
素子部２ｃを挾持装置４で挾持して切断装置３の固定部
材８と可動部材２２の隙間２５の上方位置に搬送し、素
子部２ｃの下面が固定部材８の上面８ｂと略同−高さに
なるまで矢印Ｃ方向に下降させる。ここで図示しない圧
力流体源から圧力流体を流体圧シリンダ１８に供給して
ピストンロフト１８ａを矢印Ａ方向に作動させる。該運
動は、２枚の円板１８ｂ及びローラ１４を介して駆動レ
バー１１をビン１０を中心として図中反時計方向に回動
させ、ローラ１３と嵌合する移動台９を矢印Ｂ方向に移
動させる。Function The present invention is constructed as described above, and its function will be explained below. 1 to 3, the element portion 2c of the electronic component 2 fed by a parts feeder (not shown) is held by the holding device 4, and the gap 25 between the fixed member 8 and the movable member 22 of the cutting device 3 is closed. It is transported to an upper position and lowered in the direction of arrow C until the lower surface of the element portion 2c is approximately at the same height as the upper surface 8b of the fixing member 8. Here, pressure fluid is supplied from a pressure fluid source (not shown) to the fluid pressure cylinder 18 to operate the piston loft 18a in the direction of arrow A. This movement rotates the drive lever 11 counterclockwise in the figure around the bin 10 via the two discs 18b and the roller 14, and moves the movable table 9 fitted with the roller 13 in the direction of arrow B. let
第４図及び第５図をも参照して、弾性部材の一例たる圧
縮ばね２３によって矢印り方向に押圧付勢された可動部
材２２は、長溝２２ａの端部と鍔付きスペーサ２０とが
干渉する前進位置にあり、移動台９の矢印Ｂ方向移動の
初期工程においては、可動部材２２と移動台９に固定さ
れた可動刃１９とが１体となって固定部材８に接近し、
これに伴なって隙間２５の間隔が次第に狭くなるが、こ
れによって隙間２５に挿入されているリード線２ａが曲
っていても、該曲りを矯正しつつ、やがて可動部材２２
と固定部材８との間でリード線２ａを押圧保持する（第
４図参照）。そして挾持装置４の挾持腕４ａを互いに離
れる方向に移動させて電子部品２を解放するが、電子部
品２は、リード線２ａが固定部材８と可動部材２２とで
押圧保持されているので落ちることはない。Referring also to FIGS. 4 and 5, when the movable member 22 is pressed in the direction indicated by the arrow by the compression spring 23, which is an example of an elastic member, the end of the long groove 22a and the flanged spacer 20 interfere with each other. In the forward position, in the initial step of movement of the movable table 9 in the direction of arrow B, the movable member 22 and the movable blade 19 fixed to the movable table 9 approach the fixed member 8 as one body,
Along with this, the interval between the gaps 25 becomes gradually narrower, but even if the lead wire 2a inserted into the gap 25 is bent, the bend can be corrected and eventually the movable member 22
The lead wire 2a is held under pressure between the fixing member 8 and the fixing member 8 (see FIG. 4). Then, the clamping arms 4a of the clamping device 4 are moved away from each other to release the electronic component 2, but the electronic component 2 does not fall because the lead wire 2a is held under pressure by the fixed member 8 and the movable member 22. There isn't.
更に流体圧シリンダ１日のピストンロッド１８ａが矢印
Ａ方向に移動すると、可動部材２２の動きはリード線２
ａを介して固定部材８によって阻止されているので移動
することができず、移動台９及びこれに固定された可動
刃１９だけが圧縮ばね２３を矢印り方向に圧縮しながら
、同方向に移動し、リード線２ａは圧縮ばね２３の弾性
力によって、より強固に押圧保持される。そして可動刃
１９の先端がリード線２ａ位置に達すると固定部材８の
固定刃８ｂとの協働作用によってリード線２ａを切断す
る。該切断は、リード線２ａを圧縮ばね２３の弾性力で
押圧保持して行われるので、切断時に作用する力は全く
素子部２ｃに働くことがなく、素子を損傷させ、又は素
子特性を変化させるおそれは全くない。切断されたリー
ド線片２ｂは矢印Ｆ方向に落下してホッパ２６により図
示しない容器に自動的に集められる。Further, when the piston rod 18a of the fluid pressure cylinder 1 moves in the direction of arrow A, the movement of the movable member 22 is caused by the lead wire 2.
It cannot move because it is blocked by the fixed member 8 via a, and only the movable table 9 and the movable blade 19 fixed thereto compress the compression spring 23 in the direction indicated by the arrow and move in the same direction. However, the lead wire 2a is pressed and held more firmly by the elastic force of the compression spring 23. When the tip of the movable blade 19 reaches the position of the lead wire 2a, the lead wire 2a is cut by a cooperative action with the fixed blade 8b of the fixed member 8. Since the cutting is performed by pressing and holding the lead wire 2a with the elastic force of the compression spring 23, the force that acts upon cutting does not act on the element portion 2c at all, which may damage the element or change the element characteristics. There is no fear at all. The cut lead wire pieces 2b fall in the direction of arrow F and are automatically collected by the hopper 26 into a container (not shown).
上述した如く、リード線２ａを所定の長さに短かく切断
された電子部品２は、第１図及び第６図を参照して、再
び挾持装置４により素子部２ｃを挾持された後、流体圧
シリンダ１８に供給する圧力流体の流れの方向を切り換
えることによって流体圧シリンダ１８、駆動レバー１１
及び移動台９を前記した方向と逆の方向に移動させて作
動前の位置に戻り、リード線２ａの押圧保持を解放して
次の作動に備える。As described above, the electronic component 2 whose lead wire 2a has been cut short to a predetermined length is again clamped by the clamping device 4 at the element portion 2c, as shown in FIGS. By switching the flow direction of the pressure fluid supplied to the pressure cylinder 18, the fluid pressure cylinder 18 and the drive lever 11
Then, the moving table 9 is moved in the opposite direction to the above-mentioned direction to return to the position before the operation, and the lead wire 2a is released from being pressed and held in preparation for the next operation.
一方、電子部品２を挾持した挾持装置４は、基板２４上
の該電子部品２を実装すべき位置へ（矢印Ｇ方向に）電
子部品２を搬送し、基板２４と電子部品２の相対的な位
置決めを行った後、矢印Ｈ方向に下降してリード線２ａ
を基板２４のリード線挿入穴２４ａに挿入し、再び次の
電子部品２を挾持するためパーツフィーダ部に復帰し、
以後同様の作動が繰り返される。On the other hand, the holding device 4 holding the electronic component 2 transports the electronic component 2 (in the direction of arrow G) to the position on the board 24 where the electronic component 2 is to be mounted, and the relative position between the board 24 and the electronic component 2 is After positioning, descend in the direction of arrow H and connect the lead wire 2a.
is inserted into the lead wire insertion hole 24a of the board 24, and returned to the parts feeder section to clamp the next electronic component 2 again.
The same operation is repeated thereafter.
効果
本発明は、上記のように固定部材と可動部材との間で電
子部品のリード線を、該リード線の曲りを矯正すると共
に弾性力で保持した後可動刃を作動させてリード線を所
定の長さに短かく切断し、基板位置へ搬送して基板の挿
入穴に挿入するようにしたので、リード線が曲った状態
で基板に挿入されることがなく、曲りに原因する挿入不
良を防止できると共に、基板への挿入率を向上させて作
業効率を高めることができる効果がある。またリード線
を短かく切断してから搬送するようにしたので、搬送に
よってリード線の先端が振動することがなく、基板との
位置決め後直ちに挿入を行うことができると共に、リー
ド線の曲りを矯正してから搬送するので、該基板との位
置決め精度を従来方法よりもラフな精度としても同等以
上の結果を得ることができる効果がある。またこれによ
って電子部品の実装装置を小型化し得、かつ安価にでき
る効果がある。Effects As described above, the present invention corrects the bending of the lead wire of an electronic component between the fixed member and the movable member and holds the lead wire with elastic force, and then operates the movable blade to hold the lead wire in a predetermined position. Since the lead wire is cut short to length, transported to the board position, and inserted into the insertion hole of the board, the lead wire will not be inserted into the board in a bent state, and there will be no insertion failure caused by bending. This has the effect of not only preventing this, but also improving the insertion rate into the board and increasing work efficiency. In addition, since the lead wires are cut short before being transported, the tips of the lead wires do not vibrate during transport, and can be inserted immediately after positioning with the board, while also correcting bends in the lead wires. Since the substrate is then transported, it is possible to obtain results equivalent to or better than the conventional method even if the positioning accuracy with respect to the substrate is rougher than that of the conventional method. Moreover, this has the effect of making it possible to downsize and reduce the cost of the electronic component mounting apparatus.
更に、リード線の切断を一定の位置で行うようにしたの
で、切断されたリード線片の飛散を防止できると共に、
簡単な装置で容易に処理することができる効果がある。Furthermore, since the lead wire is cut at a fixed position, it is possible to prevent the cut lead wire pieces from scattering, and
It has the advantage that it can be easily processed with a simple device.
第１図から第６図は本発明の実施例に係り、第１図は電
子部品リード線の切断装置及び基板への挿入方法を示す
全体斜視図、第２図はリード線の切断装置の縦断面図、
第３図は切断装置が作動する前における電子部品と切断
装置との位置関係を示す切断装置の要部縦断面図、第４
図は電子部品のリード線が押圧保持された状態を示す同
じく要部縦断面図、第５図は電子部品のリード線が切断
される状態を示す同じく要部縦断面図、第６図は電子部
品が基板に挿入される状態を示す部分縦断面正面図、第
７図は従来例に係り、電子部品が基板に挿入され、リー
ド線の先端が切断される状態を示す部分縦断面正面図で
ある。
■は電子部品リード線の挿入装置、２は電子部品、２ａ
はリード線、４は挾持装置、５は基台、８は固定部材、
８ｂは固定刃、９は移動台、１９は可動刃、２２は可動
部材、２３は弾性部材の一例たる圧縮ばね、２４は基板
、２４ａは挿入穴である。
特許出願人 ファーイーストエンジニアリング株式会
社1 to 6 relate to embodiments of the present invention, FIG. 1 is an overall perspective view showing an electronic component lead wire cutting device and a method of inserting it into a board, and FIG. 2 is a longitudinal cross-section of the lead wire cutting device. side view,
Figure 3 is a vertical sectional view of the main part of the cutting device showing the positional relationship between the electronic components and the cutting device before the cutting device operates;
The figure is a longitudinal cross-sectional view of the main part showing a state where the lead wire of the electronic component is pressed and held, FIG. 5 is a longitudinal cross-sectional view of the main part showing the state where the lead wire of the electronic component is cut, and FIG. FIG. 7 is a partial vertical cross-sectional front view showing a state in which a component is inserted into a board, and FIG. be. ■ is an electronic component lead wire insertion device, 2 is an electronic component, 2a
is a lead wire, 4 is a clamping device, 5 is a base, 8 is a fixing member,
8b is a fixed blade, 9 is a movable table, 19 is a movable blade, 22 is a movable member, 23 is a compression spring which is an example of an elastic member, 24 is a substrate, and 24a is an insertion hole. Patent applicant Far East Engineering Co., Ltd.
Claims (1)
弾性部材によって作用させた可動部材との間で、該電子
部品のリード線を該リード線の曲りを矯正しながら前記
弾性力によって押圧保持した後、前記可動部材に隣接配
置した可動刃を作動させて前記電子部品のリード線を所
定の長さに切断し、該電子部品を実装すべき基板位置へ
搬送して前記電子部品と前記基板との相対的な位置決め
を行うようにし、前記電子部品のリード線の曲りを予め
矯正すると共に短かく切断した後前記基板のリード線挿
入穴に挿入することを特徴とする電子部品のリード線の
基板への挿入方法。 ２ 基台に固定され固定刃を有する固定部材と、該基台
上で前記固定部材に対して接近又は離脱する方向に移動
できるようにした移動台とを配設し、該移動台には、前
記固定刃との協働作用によって前記電子部品のリード線
を切断するように該移動台に固定した可動刃と、前記移
動台上で該移動台の移動可能な方向と同一方向に摺動し
て前記固定部材との間で前記電子部品のリード線の曲り
を矯正しながら押圧保持するようにした可動部材と、該
可動部材を前記固定部材に接近させる方向に付勢する弾
性部材と、前記電子部品を挾持して該電子部品を実装す
べき基板の位置へ搬送する挾持装置とを備えたことを特
徴とする電子部品リード線の基板への挿入装置。[Claims] 1. A method for straightening the lead wire of the electronic component between a fixed member and a movable member on which an elastic member applies an elastic force in a direction approaching the fixed member. After the electronic component is pressed and held by the elastic force, a movable blade disposed adjacent to the movable member is operated to cut the lead wire of the electronic component to a predetermined length, and the electronic component is transported to a position on the board where it is to be mounted. the electronic component and the board are positioned relative to each other, and the lead wires of the electronic component are straightened in advance and cut into short pieces, and then inserted into the lead wire insertion holes of the board. How to insert the lead wires of electronic components into the board. 2. A fixed member fixed to a base and having a fixed blade, and a movable base capable of moving toward or away from the fixed member on the base, and the movable base includes: A movable blade fixed to the movable table slides on the movable table in the same direction as the movable direction of the movable table so as to cut the lead wire of the electronic component by a cooperative action with the fixed blade. a movable member configured to press and hold the lead wire of the electronic component while correcting the bending between the lead wire and the fixed member; an elastic member biasing the movable member in a direction toward the fixed member; 1. A device for inserting an electronic component lead wire into a board, comprising a clamping device that clamps an electronic component and transports the electronic component to a position on a board where the electronic component is to be mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1077366A JPH02256298A (en) | 1989-03-29 | 1989-03-29 | Method and device for inserting lead wire of electronic component into substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1077366A JPH02256298A (en) | 1989-03-29 | 1989-03-29 | Method and device for inserting lead wire of electronic component into substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02256298A true JPH02256298A (en) | 1990-10-17 |
Family
ID=13631909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1077366A Pending JPH02256298A (en) | 1989-03-29 | 1989-03-29 | Method and device for inserting lead wire of electronic component into substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02256298A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04179300A (en) * | 1990-11-13 | 1992-06-25 | Matsushita Electric Ind Co Ltd | Transfer equipment for electric part with lead wire |
| CN105555121A (en) * | 2014-10-23 | 2016-05-04 | Juki株式会社 | Lead cutting method, lead cutting device and electronic part installation device |
| WO2018207354A1 (en) * | 2017-05-12 | 2018-11-15 | 株式会社Ｆｕｊｉ | Component insertion machine and lead cutting method |
| CN110381716A (en) * | 2018-04-13 | 2019-10-25 | Juki株式会社 | Mounting device, installation method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59121899A (en) * | 1982-12-28 | 1984-07-14 | 株式会社日立製作所 | Method and device for automatically inserting electronic part |
-
1989
- 1989-03-29 JP JP1077366A patent/JPH02256298A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59121899A (en) * | 1982-12-28 | 1984-07-14 | 株式会社日立製作所 | Method and device for automatically inserting electronic part |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04179300A (en) * | 1990-11-13 | 1992-06-25 | Matsushita Electric Ind Co Ltd | Transfer equipment for electric part with lead wire |
| CN105555121A (en) * | 2014-10-23 | 2016-05-04 | Juki株式会社 | Lead cutting method, lead cutting device and electronic part installation device |
| JP2016086038A (en) * | 2014-10-23 | 2016-05-19 | Juki株式会社 | Lead wire cutting method, lead wire cutting device, and electronic component mounting device |
| WO2018207354A1 (en) * | 2017-05-12 | 2018-11-15 | 株式会社Ｆｕｊｉ | Component insertion machine and lead cutting method |
| CN110603910A (en) * | 2017-05-12 | 2019-12-20 | 株式会社富士 | Component insertion machine and pin cutting method |
| JPWO2018207354A1 (en) * | 2017-05-12 | 2020-03-12 | 株式会社Ｆｕｊｉ | Component insertion machine and lead cutting method |
| US11412649B2 (en) | 2017-05-12 | 2022-08-09 | Fuji Corporation | Component insertion machine and lead cutting method |
| CN110381716A (en) * | 2018-04-13 | 2019-10-25 | Juki株式会社 | Mounting device, installation method |
| CN110381716B (en) * | 2018-04-13 | 2023-02-28 | Juki株式会社 | Mounting device and mounting method |
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