JPH0225262Y2 - - Google Patents
Info
- Publication number
- JPH0225262Y2 JPH0225262Y2 JP1516884U JP1516884U JPH0225262Y2 JP H0225262 Y2 JPH0225262 Y2 JP H0225262Y2 JP 1516884 U JP1516884 U JP 1516884U JP 1516884 U JP1516884 U JP 1516884U JP H0225262 Y2 JPH0225262 Y2 JP H0225262Y2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- resistant capsule
- insulating resin
- thermal conductivity
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002775 capsule Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
〔考案の属する技術分野〕
本考案は圧力流体の中で用いられる耐圧力カプ
セルに収納した電気装置に関する。[Detailed description of the invention] [Technical field to which the invention pertains] The present invention relates to an electrical device housed in a pressure-resistant capsule for use in a pressurized fluid.
水中等に沈めて用いられる耐圧力カプセル収納
電気装置はカプセル内の冷却が効果的に行われ小
形軽量であることがのぞましい。 It is desirable that a pressure-resistant capsule-containing electric device used by being submerged in water or the like be small and lightweight, and the capsule can be effectively cooled.
従来は第１図に示すように耐圧力カプセルが絶
縁樹脂のベース１、カバー２よりなる二分割容器
でできており、その中に半導体装置３を収納し、
パツキン４を介して分割部を締付けボルト５によ
つて締合せ、カバー２に埋込んだ引出し端子６に
よつて外部電線に接続するようにしていた。
Conventionally, as shown in FIG. 1, a pressure-resistant capsule is made of a two-part container consisting of an insulating resin base 1 and a cover 2, in which a semiconductor device 3 is housed.
The divided portions were tightened with tightening bolts 5 through packing 4, and connected to external electric wires through lead-out terminals 6 embedded in cover 2.
この構造では内部に納めた半導体素子等の電気
部品の発生熱が絶縁樹脂のベース１およびカバー
２を通して外部に放散されるが、絶縁樹脂は熱伝
導性が低く、また半導体装置を収納した内部には
空気が封じ込められ、空気層が熱伝導を妨げるた
め内部に熱が蓄積されて高温となり電気装置の運
転に支障をきたすので、必要以上に容量の大きな
電気部品を使用するなどして対処していたが、こ
れでは装置が大きくなり、かつ高価になるといつ
た欠点があつた。 In this structure, the heat generated by electrical components such as semiconductor devices housed inside is dissipated to the outside through the insulating resin base 1 and cover 2, but the insulating resin has low thermal conductivity, and Since the air is trapped and the air layer prevents heat conduction, heat accumulates inside and becomes high temperature, which interferes with the operation of electrical equipment. To deal with this, we take measures such as using electrical components with a larger capacity than necessary. However, this had the disadvantage that the device was large and expensive.
本考案は前記の欠点を除去し、耐圧カプセルの
放熱性を向上させて電気装置の小形化、信頼性の
向上をはかることを目的とする。
The object of the present invention is to eliminate the above-mentioned drawbacks, improve the heat dissipation of the pressure-resistant capsule, and thereby reduce the size and improve the reliability of electrical equipment.
本考案は耐圧力カプセルを金属と絶縁樹脂との
異種材料よりなる分割容器で構成し、半導体装置
等の電気装置を収納したうえ、そのまわりに絶縁
性充填材を充填することにより、熱伝導性を良好
とし、内部の電気装置の冷却効果を向上させよう
とするものである。
The present invention consists of a pressure-resistant capsule made of a divided container made of different materials such as metal and insulating resin, which houses electrical devices such as semiconductor devices, and which is filled with an insulating filler around it to achieve thermal conductivity. This aims to improve the cooling effect of internal electrical equipment.
第２図は本考案の実施例の耐圧力カプセル収納
電気装置の平面図、第３図は正面図である。これ
らの図において７は熱伝導性の良好な金属、例え
ばアルミニユームの金属ベースで、８は絶縁樹脂
カバーである。カバー８には引出し端子９が埋込
まれている。１０はパツキング、１１は締合せボ
ルトである。１２は半導体素子等によつて構成さ
れた電気装置であり、プリント板１２１の上に半
導体素子１２２および図示しない電気部品が取り
付けられてできている。１３はプリント板を金属
ベースに固定する絶縁スペーサである。電気装置
１２のまわりには絶縁性充填材１４が充填されて
いる。絶縁性充填材としては、例えばコンパウン
ド状シリコンゴムのごとく高温に耐えるものがの
ぞましい。
FIG. 2 is a plan view of a pressure-resistant capsule-housed electric device according to an embodiment of the present invention, and FIG. 3 is a front view. In these figures, 7 is a metal base made of a metal with good thermal conductivity, such as aluminum, and 8 is an insulating resin cover. A pullout terminal 9 is embedded in the cover 8. 10 is a packing, and 11 is a tightening bolt. Reference numeral 12 denotes an electrical device composed of semiconductor elements and the like, and is made up of a printed board 121 on which a semiconductor element 122 and electrical parts (not shown) are attached. 13 is an insulating spacer that fixes the printed board to the metal base. The electrical device 12 is surrounded by an insulating filler 14 . The insulating filler is preferably one that can withstand high temperatures, such as compound silicone rubber.
このようにすれば耐圧力カプセルのベースを金
属としても近接する部分は電気装置の高度の絶縁
性が不要な部分であるため安全であり、金属ベー
スの熱伝導性が樹脂に比してはるかに大であり、
また絶縁性充填材の熱伝導性が空気より良好であ
るため、装置の発生熱が金属ベース７を通して効
果的に外部に放散されるようになる。 In this way, even if the base of the pressure-resistant capsule is made of metal, it is safe because the adjacent parts of the electrical equipment do not require a high degree of insulation, and the thermal conductivity of the metal base is much higher than that of resin. large,
Furthermore, since the thermal conductivity of the insulating filler is better than that of air, the heat generated by the device can be effectively dissipated to the outside through the metal base 7.
本考案によれば電気装置を収納する耐圧力カプ
セルの一部を熱伝導性の良好な金属で構成し、か
つ内部の空所に絶縁充填材を充填したので電気装
置の冷却性が向上し、装置の小形化と信頼性向上
がはかれる効果がある。
According to the present invention, a part of the pressure-resistant capsule that houses the electrical equipment is made of a metal with good thermal conductivity, and the internal cavity is filled with an insulating filler, so that the cooling performance of the electrical equipment is improved. This has the effect of making the device more compact and improving its reliability.
第１図は従来の耐圧力カプセル収納電気装置の
外観斜視図、第２図は本考案の実施例の耐圧力カ
プセル収納電気装置の平面図、第３図は正面図で
ある。
７……金属ベース、８……絶縁樹脂カバー、９
……引出し端子、１０……パツキング、１１……
締合せボルト、１２……電気装置、１３……絶縁
スペーサ、１４……絶縁性充填材。
FIG. 1 is an external perspective view of a conventional pressure-resistant capsule-storage electrical device, FIG. 2 is a plan view of the pressure-resistant capsule-storage electrical device according to an embodiment of the present invention, and FIG. 3 is a front view. 7...Metal base, 8...Insulating resin cover, 9
...Pull-out terminal, 10...Packaging, 11...
Tightening bolt, 12... Electric device, 13... Insulating spacer, 14... Insulating filler.
Claims (1)
ースと絶縁樹脂により形成される絶縁樹脂カバー
とを密着結合して耐圧力カプセルを形成するとと
もにこの耐圧力カプセル内に半導体素子および電
気部品を収納し、かつ前記耐圧力カプセル内の空
所に熱伝導性の良好な絶縁性充填材を充填し、さ
らに前記絶縁樹脂カバーに引出し端子を埋め込み
この引出し端子を前記半導体素子および電気部品
に接続して構成したことを特徴とする耐圧力カプ
セル収納電気装置。 A metal base made of a metal with good thermal conductivity and an insulating resin cover made of an insulating resin are closely bonded to form a pressure-resistant capsule, and semiconductor elements and electrical components are housed within this pressure-resistant capsule. , and a space in the pressure-resistant capsule is filled with an insulating filler having good thermal conductivity, and a lead-out terminal is embedded in the insulating resin cover and the lead-out terminal is connected to the semiconductor element and the electric component. A pressure-resistant capsule storage electrical device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1516884U JPS60129185U (en) | 1984-02-06 | 1984-02-06 | Pressure resistant capsule storage electrical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1516884U JPS60129185U (en) | 1984-02-06 | 1984-02-06 | Pressure resistant capsule storage electrical equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60129185U JPS60129185U (en) | 1985-08-30 |
| JPH0225262Y2 true JPH0225262Y2 (en) | 1990-07-11 |
Family
ID=30500764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1516884U Granted JPS60129185U (en) | 1984-02-06 | 1984-02-06 | Pressure resistant capsule storage electrical equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60129185U (en) |
-
1984
- 1984-02-06 JP JP1516884U patent/JPS60129185U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60129185U (en) | 1985-08-30 |
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