JPS6331402Y2 - - Google Patents
Info
- Publication number
- JPS6331402Y2 JPS6331402Y2 JP11375683U JP11375683U JPS6331402Y2 JP S6331402 Y2 JPS6331402 Y2 JP S6331402Y2 JP 11375683 U JP11375683 U JP 11375683U JP 11375683 U JP11375683 U JP 11375683U JP S6331402 Y2 JPS6331402 Y2 JP S6331402Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat sink
- plate nut
- cover
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
この考案はプリント板に取り付けられるDIP型
ICの放熱器に関するものである。[Detailed explanation of the invention] This invention is a DIP type that can be attached to a printed board.
This relates to IC heatsinks.
一般に、プリント板に取り付けられるDIP型IC
の温度上昇が問題となる場合には、ICの頭部か
ら効率良く放熱することが望まれる。 Generally, DIP type ICs are attached to printed circuit boards.
If temperature rise is a problem, it is desirable to efficiently dissipate heat from the IC head.
従来、このようなDIP型ICの放熱方法として次
のような方法がある。第１は放熱器（ラジエー
タ）をICの頭部に取付けて放射冷却及び対流冷
却を行なう方法であり、第２はICの周囲に充填
剤を封入し、プリント板を収容するケース、カバ
ーあるいはICに近接して設けられた熱伝導用板
へ熱伝導により伝熱する方法である。 Conventionally, the following methods have been used to dissipate heat from such DIP type ICs. The first method is to attach a radiator to the head of the IC to perform radiation cooling and convection cooling.The second method is to seal a filler around the IC and use a case, cover, etc. This is a method in which heat is transferred by heat conduction to a heat conduction plate provided in close proximity to the
しかし、第１の方法は取付けられるラジエータ
の大きさに限度があり冷却能力が小さく、かつ重
量増加という欠点があり、第２の方法は充填剤の
性質から熱伝導性の良いものが得難く、また充填
後の部品の交換が困難であるという欠点がある。 However, the first method has the drawbacks of limited cooling capacity and increased weight due to limitations on the size of the radiator that can be installed, while the second method has difficulty obtaining good thermal conductivity due to the nature of the filler. Another drawback is that it is difficult to replace parts after filling.
この考案の目的は、以上の考察にもとづき、プ
リント板上に取り付けられたDIP型ICからの放熱
を、プリント板を収容しているケースのカバーへ
行なうことにより、高い冷却効果が実現可能な
IC用放熱器を提供することにある。 Based on the above considerations, the purpose of this invention is to achieve a high cooling effect by dissipating heat from the DIP type IC mounted on the printed board to the cover of the case that houses the printed board.
Our objective is to provide heatsinks for ICs.
この考案のIC用放熱器は、薄い金属放熱板を
湾曲させて断面がほぼ長円形となるよう成形され
た筒状部と、この筒状部の前記放熱板の結合され
る部分に固定されねじ止め用のめねじを有する板
ナツト部と、この板ナツト部と対面する前記筒状
部にその筒軸から延長して外側にコ字形に折り曲
げたIC保持部とを備えて構成される。 The heatsink for IC of this invention has a cylindrical part formed by curving a thin metal heatsink so that the cross section is approximately oval, and a screw that is fixed to the part of the cylindrical part to which the heatsink is connected. It is configured to include a plate nut portion having a female screw for locking, and an IC holding portion extending from the cylindrical axis of the cylindrical portion facing the plate nut portion and bent outward in a U-shape.
この考案は、板ナツト及び板ナツトと一体とな
つた放熱板より構成され、放熱板に設けられた
IC保持用の折り曲げ部のばね性によりICの本体
をはさみ込みICの熱をIC頭部より放熱板との接
触部において吸収し、板ナツトによりカバー等の
外部熱伝導体と放熱板を締め付けその接触による
熱伝導により、ICから吸収した熱をカバーへ速
やかに伝導させるものである。 This idea consists of a plate nut and a heat sink integrated with the plate nut.
The spring properties of the bent part for holding the IC sandwich the IC body and absorb the heat of the IC from the IC head to the contact area with the heat sink, and the plate nut tightens the external heat conductor such as the cover and the heat sink. Through heat conduction through contact, the heat absorbed from the IC is quickly transferred to the cover.
次にこの考案を図面により詳細に説明する。 Next, this invention will be explained in detail with reference to the drawings.
第１図、第２図は本考案の実施例の斜視図およ
び断面図、第３図は第１図に使用例の断面図であ
る。図において、１は本考案の放熱器、２は板ナ
ツト、３はめねじ、４は放熱板である。また５は
プリント板、６はプリント板５に搭載されたDIP
型ICで熱伝導型放熱器１が取付けられている。
７はプリント板５を収容するケース、８は放熱器
１がねじ止めされるケース７のカバー、９は取付
ねじ、１０はカバー８に設けられた取付穴であ
る。 1 and 2 are a perspective view and a sectional view of an embodiment of the present invention, and FIG. 3 is a sectional view of an example in which the invention is used. In the figure, 1 is a heat sink of the present invention, 2 is a plate nut, 3 is a female screw, and 4 is a heat sink. Also, 5 is a printed board, and 6 is a DIP mounted on the printed board 5.
A heat conduction type radiator 1 is attached to the type IC.
Reference numeral 7 designates a case accommodating the printed board 5, 8 a cover of the case 7 to which the radiator 1 is screwed, 9 a mounting screw, and 10 a mounting hole provided in the cover 8.
この構造において、板ナツト２はめねじ３を有
する板状のナツトであり、放熱板４は、例えば薄
板金属板の折り曲げ加工により成形され、IC本
体を挟み込むために適度なばね圧縮力が作用する
よう若干の成形を施している。 In this structure, the plate nut 2 is a plate-shaped nut with a female thread 3, and the heat sink 4 is formed by bending a thin metal plate, for example, and is designed to apply an appropriate spring compression force to sandwich the IC body. It has some molding.
この熱伝導型放熱器１は、板ナツト２と放熱板
４とが一体となつた状態であり、プリント板５に
搭載されたIC６をはさみ込んでおり、放熱板４
のIC頭部接触面はIC６の頭部とばね圧縮力によ
り確実に接触している。IC６はプリント板５に
半田付けされており、そのプリント板５はケース
７にねじ等で固定されている。カバー８はケース
７の蓋であり、板ナツト２のめねじ３の上の位置
に熱伝導型放熱器１を固定する取付穴１０を有し
ている。この取付穴１０から取付ねじ９を通して
熱伝導型放熱器１をカバー８に締め付けることに
より、熱伝導型放熱器１はIC６の頭部で接触し
ながらカバー８にしつかりと固定される。また、
取付穴１０の穴径はプリント板５に取付けられた
IC６の位置の変動を吸収するのに十分な余裕を
持ち、又放熱板４の長円形の成形によるばね性の
ために熱伝導型放熱器１は上下方向にスライドが
可能であるから取付ねじ９による熱伝導型放熱器
１とカバー８との固定において、IC６に無理な
力を加えることなく、IC６からカバー８にいた
る熱伝導経路を形成することが可能である。 This heat conduction type heat sink 1 is a state in which a plate nut 2 and a heat sink 4 are integrated, and an IC 6 mounted on a printed board 5 is sandwiched between the heat sink 4 and a plate nut 2.
The IC head contact surface of is in reliable contact with the head of IC6 due to the spring compression force. The IC 6 is soldered to a printed board 5, and the printed board 5 is fixed to the case 7 with screws or the like. The cover 8 is a lid for the case 7 and has a mounting hole 10 for fixing the heat conduction type radiator 1 at a position above the female thread 3 of the plate nut 2. By tightening the heat conductive heat radiator 1 to the cover 8 through the mounting screw 9 through the mounting hole 10, the heat conductive heat radiator 1 is firmly fixed to the cover 8 while making contact with the head of the IC 6. Also,
The hole diameter of the mounting hole 10 is the diameter of the mounting hole 10 when it is mounted on the printed board 5.
The heat conduction type heat sink 1 has sufficient margin to absorb changes in the position of the IC 6, and due to the springiness due to the oval shape of the heat sink 4, the heat conduction type heat sink 1 can be slid vertically, so the mounting screw 9 In fixing the heat conduction type heat sink 1 and the cover 8 by the method, it is possible to form a heat conduction path from the IC 6 to the cover 8 without applying excessive force to the IC 6.
また、放熱板４とIC６とを熱伝導率の良い接
着剤で接着することにより、より一層の良好な熱
伝導を得られる。 Further, by bonding the heat sink 4 and the IC 6 with an adhesive having good thermal conductivity, even better heat conduction can be obtained.
以上説明したように、本考案はプリント板に取
付けられた発熱量の多いICの熱を、ICに機械的
に無理な力を加えることなく容易に外部へ伝熱す
ることが可能である。また、この実施例の伝熱に
おいては、IC頭部から金属への接触による熱伝
導あるいは、熱伝導率の良好な接着剤を介した熱
伝導であることから、効率の良い冷却が得られ、
又対流冷却の無い宇宙機器用としても有効であ
る。さらに、放熱板がばね性を有していることか
ら振動、衝撃等によるプリント板やカバーの変位
を吸収してしまうことから伝熱上の障害をおよぼ
さないという利点もある。 As explained above, the present invention allows heat from an IC that generates a large amount of heat attached to a printed circuit board to be easily transferred to the outside without applying excessive mechanical force to the IC. In addition, in the heat transfer in this example, heat is conducted through contact from the IC head to metal or through an adhesive with good thermal conductivity, so efficient cooling can be obtained.
It is also effective for space equipment without convection cooling. Furthermore, since the heat dissipation plate has spring properties, it absorbs the displacement of the printed board and cover due to vibrations, shocks, etc., so there is an advantage that it does not cause a problem in heat transfer.
第１図、第２図はこの考案の実施例の斜視図お
よびその断面図、第３図は第１図の利用時の断面
図である。
図において１……熱伝導型放熱器、２……板ナ
ツト、３……ねじ穴、４……放熱板、５……プリ
ント板、６……IC、７……ケース、８……カバ
ー、９……取付ねじ、１０……取付穴である。
FIGS. 1 and 2 are a perspective view and a sectional view of an embodiment of the invention, and FIG. 3 is a sectional view of FIG. 1 when it is used. In the figure, 1...thermal conduction type heat sink, 2...plate nut, 3...screw hole, 4...heat sink, 5...printed board, 6...IC, 7...case, 8...cover, 9...Mounting screw, 10...Mounting hole.
Claims (1)
となるよう成形された筒状部と、この筒状部の前
記放熱板の結合される部分に固定されねじ止め用
のめねじを有する板ナツト部と、この板ナツト部
と対面する前記筒状部にその筒軸から延長して外
側にコ字形に折り曲げたIC保持部とを備えたIC
用放熱器。 A cylindrical part formed by curving a thin metal heat sink so that its cross section has a substantially oval shape, and a plate nut fixed to a part of the cylindrical part to which the heat sink is joined and having a female thread for screwing. and an IC holding part extending from the cylindrical axis of the cylindrical part facing the plate nut part and bent outward in a U-shape.
Heatsink for use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11375683U JPS6022844U (en) | 1983-07-22 | 1983-07-22 | Heatsink for IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11375683U JPS6022844U (en) | 1983-07-22 | 1983-07-22 | Heatsink for IC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6022844U JPS6022844U (en) | 1985-02-16 |
| JPS6331402Y2 true JPS6331402Y2 (en) | 1988-08-22 |
Family
ID=30263210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11375683U Granted JPS6022844U (en) | 1983-07-22 | 1983-07-22 | Heatsink for IC |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6022844U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5773904B2 (en) * | 2012-02-07 | 2015-09-02 | 三菱電機株式会社 | Electrical box and air conditioner |
-
1983
- 1983-07-22 JP JP11375683U patent/JPS6022844U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6022844U (en) | 1985-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2902531B2 (en) | Heat dissipation device for semiconductor device | |
| JPH09321468A (en) | Heat radiating device | |
| JPS6331402Y2 (en) | ||
| JPH0736468U (en) | Heat dissipation structure for electronic components | |
| JPS60171751A (en) | Heat dissipating construction of ic | |
| JPH09199647A (en) | Semiconductor device | |
| JPS61265849A (en) | Power semiconductor device | |
| JPH0445249Y2 (en) | ||
| JP2015088556A (en) | Electronic module | |
| JPH07273480A (en) | Mounting structure of heat sink for heating electrical parts | |
| JPH09321467A (en) | Heat radiating structure for heat generating electronic part | |
| JPS6228773Y2 (en) | ||
| JPH025578Y2 (en) | ||
| JPS58175641U (en) | Semiconductor component mounting equipment | |
| JPS6416642U (en) | ||
| JP2830212B2 (en) | Hybrid integrated circuit | |
| JPS6318225Y2 (en) | ||
| JPS6246271Y2 (en) | ||
| JP2503828Y2 (en) | Semiconductor device | |
| JPH0222956Y2 (en) | ||
| JPH0747915Y2 (en) | Electronic component mounting structure | |
| JPH0810230Y2 (en) | Mounting structure for electrical parts and radiator | |
| JPS6311739Y2 (en) | ||
| JPS5910790Y2 (en) | package structure | |
| JPS63185050A (en) | Structure for cooling integrated circuit |