JPH02248055A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPH02248055A
JPH02248055A JP1069603A JP6960389A JPH02248055A JP H02248055 A JPH02248055 A JP H02248055A JP 1069603 A JP1069603 A JP 1069603A JP 6960389 A JP6960389 A JP 6960389A JP H02248055 A JPH02248055 A JP H02248055A
Authority
JP
Japan
Prior art keywords
tool
wire
bonding
bonded
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1069603A
Other languages
Japanese (ja)
Inventor
Shinya Matsumura
信弥 松村
Akihiro Yamamoto
章博 山本
Yutaka Makino
豊 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1069603A priority Critical patent/JPH02248055A/en
Priority to JP19590189A priority patent/JP2682156B2/en
Publication of JPH02248055A publication Critical patent/JPH02248055A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7801—Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To perform a high-speed and highly reliable treatment to a wide range of works by a method wherein the title device is provided with a rotating means for modifying the elevating means and the direction of a bonding tool, which pressure-welds a wire to a part to be bonded to electrify the wire, and with a cleaning means for cleaning the point of the tool. CONSTITUTION:A substrate chuck 1 provided on an X-Y table supports unmovably a substrate 2, on which a semiconductor to be wire bonded is installed. A wire 3 is inserted in a tool 5 through a clamper 4 and the tool 5 is supported in a vertically movable design to a rotating shaft 8 installed on the point part of a block 6. A sensor 14 reads that the tool 5 has come into contact to a bonding surface and a linear motor 15 energizes a prescribed bonding load to the tool. The wire 3 is pressure-welded to a bonding part, the wire 3 is electrified by an electrode formed on the point of the tool 5 and the wire 3 is bonded by heating to first and second surfaces to be bonded. After a bonding is completed, the tool 5 is pulled up to cut the wire 3 is cut; thereafter, the wire 3 is fed out. The point of the tool 5 is cleaned by a cleaning means 17.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は半導体製造工程において利用されるワイヤボン
ディング装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a wire bonding apparatus used in a semiconductor manufacturing process.

従来の技術 一般にワイヤボンディング装置においては、基板をヒー
ター上に固定し加熱し、次にワイヤ先端に形成されたポ
ールをボンディングツールにて第１の被接合面に圧接さ
せた状態で超音波を印加して超音波と熱で接合し、次に
ボンディングツールを第２の被接合面上に相対移動させ
た後ボンディングツールにてワイヤを第２の被接合面に
圧接させて同じく超音波と熱とで接合し、接合完了後ボ
ンディングツール及びワイヤを引き上げることによって
ワイヤを切断し、その後ワイヤ先端とスパーク電極の間
でスパークを生じさせてワイヤ先端にボールを形成する
という工程を繰り返してボンディングを行なっている。Conventional technology Generally, in wire bonding equipment, a substrate is fixed on a heater and heated, and then ultrasonic waves are applied while a pole formed at the tip of the wire is pressed against the first surface to be bonded using a bonding tool. Then, after moving the bonding tool relative to the second surface to be bonded, the wire is pressed against the second surface to be bonded using the bonding tool, and the wire is bonded using ultrasonic waves and heat. After the bonding is completed, the wire is cut by pulling up the bonding tool and the wire, and then a spark is generated between the wire tip and the spark electrode to form a ball at the wire tip. Bonding is performed by repeating the process. There is.

発明が解決しようとする課題 従来のワイヤボンディング装置では、ワークをヒートブ
ロック等で加熱しなければならないため、ワークの両面
に回路部品が装置されているものには適用できず、また
半田付けを有するワークの場合にはその半田付けが外れ
ない温度までしか加熱できず、またワークの耐熱温度以
上に加熱できないため、加熱温度を高く設定して接合の
安定化を図ることもできない。また加熱により接合面が
酸化するため接合面の材質が限定されるという問題があ
った。Problems to be Solved by the Invention Conventional wire bonding equipment requires the workpiece to be heated with a heat block or the like, so it cannot be applied to equipment where circuit components are installed on both sides of the workpiece. In the case of a workpiece, it can only be heated to a temperature at which the solder does not come off, and it cannot be heated above the heat-resistant temperature of the workpiece, so it is not possible to stabilize the bond by setting the heating temperature high. Furthermore, there is a problem in that the material of the bonding surface is limited because the bonding surface is oxidized by heating.

本発明は上記従来の問題点に鑑み、ワークを加熱せずに
安定した接合が可能なワイヤボンディング装置の提供を
目的とする。SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, it is an object of the present invention to provide a wire bonding device that can perform stable bonding without heating workpieces.

課題を解決するための手段 上記問題点を解決するために本発明は、ワイヤを被ボン
ディング部に圧接すると共にボンディングツール先端に
形成した２つの電極によりワイヤに通電し、ワイヤを加
熱接合するボンディングツールと、このツールをボンデ
ィング位置と上昇位置との間で昇降させるツール昇降手
段と、ツールの方向を変更する回転手段と、ツールがボ
ンディング面に接触したことを検出するボンディング面
検出手段と、ワイヤのカットと送りを行うクランパと、
ツールを被ボンディング部に付勢するように設けられた
リニアモータと、ツール先端を清掃する手段とを備えた
ものである。Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a bonding tool that presses a wire onto a bonded part and heats the wire by applying current to the wire using two electrodes formed at the tip of the bonding tool. a tool elevating means for raising and lowering the tool between a bonding position and a raised position; a rotating means for changing the direction of the tool; a bonding surface detecting means for detecting that the tool has come into contact with a bonding surface; A clamper that performs cutting and feeding,
The tool is equipped with a linear motor provided to urge the tool toward the bonding target part, and means for cleaning the tip of the tool.

作　　　用 本発明は、上記構成を有するので、ワークを加熱せずに
、ボンディングツールによってワイヤに通電することに
よってワイヤをポイント瞬間加熱し、ワイヤを被接合面
に接合することができる。Since the present invention has the above-described configuration, the wire can be instantaneously heated at a point by applying electricity to the wire using a bonding tool, and the wire can be bonded to the surface to be bonded without heating the workpiece.

ワークを加熱しないので、ワークの材質、状態の影響を
受は難く、広範囲に適用することができる。Since the workpiece is not heated, it is less affected by the material and condition of the workpiece, and can be applied to a wide range of areas.

実施例 以下、本発明の一実施例を第１図を参照しながら説明す
る。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIG.

第１図において、１は水平面上で互いに直交するＸ方向
とＹ方向に位置決め可能な図示されていないＸ−Ｙテー
ブル上に設けられた基板チャックであり、ワイヤボンデ
ィングすべき半導体装置された基板２を固定支持するよ
うに構成されている。In FIG. 1, reference numeral 1 denotes a substrate chuck provided on an X-Y table (not shown) that can be positioned in X and Y directions perpendicular to each other on a horizontal plane, and a substrate 2 on which a semiconductor device to be wire-bonded is mounted. It is configured to fixedly support the.

３はワイヤでクランパ４を介してツール５に挿通されて
いる。ツール５はブロック６の先端部に装着されており
、このブロック６の後端部には通電用の電源７が接続さ
れている。またブロック６は回転軸８に対し上下できる
ように支持されており、上下軸９の上部に設けられたＡ
Ｃサーボモータ１０にて回転駆動可能なリニアモーショ
ンカム１１に係合しており、ＡＣサーボモータ１０の回
転角に比例して上下移動し、また回転軸８はタイミング
ベルトを介してＡＣサーボモータ１３にて回転駆動可能
に係合しており、ＡＣサーボモータ１３の回転角に比例
して回転するように構成されている。なお、回転軸８の
回転手段としては歯車、ヂエーン等でも駆動可能である
。A wire 3 is inserted through the tool 5 via the clamper 4. The tool 5 is attached to the tip of a block 6, and a power source 7 for energization is connected to the rear end of the block 6. Further, the block 6 is supported so as to be able to move up and down with respect to the rotating shaft 8.
It is engaged with a linear motion cam 11 that can be rotated by a C servo motor 10, and moves up and down in proportion to the rotation angle of the AC servo motor 10. The AC servo motor 13 is configured to rotate in proportion to the rotation angle of the AC servo motor 13. Note that the rotating shaft 8 can be driven by gears, wheels, etc. as a rotating means.

１４はツール５がボンディング面に接触したことを検出
するためのセンサであり、１５はツールに所定のボンデ
ィング荷重を付勢するためのリニアモータである。１６
は通電電流又は電圧を検出し、一定条件のもとてボンデ
ィングを行うための検出手段である。１７はツール先端
のクリーニングを行なう清掃手段であり、第２図（ａ）
、　（ｂ）に示すように研摩テープ１８を用いたもので
ある。研摩テープ１８はツール５先端形状に合わせた治
具１８ａの上を走行し、ツール５の形状を保持しながら
クリーニングを行う。クリーニング方法としては他にツ
ールのギャップに合わせた突起１９ａを有するといし１
９を用いる方法（第３図（ａ）、　（ｂ）参照）、ツー
ルのギャップより少し細いワイヤ２０を用いてゴミ２１
を除去する方法等（第４図参照）がある。14 is a sensor for detecting that the tool 5 has contacted the bonding surface, and 15 is a linear motor for applying a predetermined bonding load to the tool. 16
is a detection means for detecting a current or voltage and performing bonding under certain conditions. 17 is a cleaning means for cleaning the tip of the tool, as shown in Fig. 2(a).
As shown in (b), an abrasive tape 18 is used. The polishing tape 18 runs on a jig 18a that matches the shape of the tip of the tool 5, and performs cleaning while maintaining the shape of the tool 5. Another cleaning method is to use a tool 1 having protrusions 19a that match the tool gap.
9 (see Figures 3(a) and (b)), use a wire 20 slightly thinner than the tool gap to remove dust 21.
There is a method for removing the (see Figure 4).

以上のような構成のもとで、ワイヤ３を被ボンディング
部に圧接すると共にボンディングツール５の先端に形成
した２つの電極によりワイヤ３に通電し、ワイヤ３を第
１と第２の被接合面に加熱接合する。接合完了後ツール
５及びワイヤ３を引き上げることによりワイヤ３を切断
し、その後ワイヤ３を送り出すという工程を繰り返して
順次ワイヤボンディングを行う。With the above configuration, the wire 3 is pressed against the bonded part, and the wire 3 is energized by the two electrodes formed at the tip of the bonding tool 5, and the wire 3 is connected to the first and second bonded surfaces. Heat and join. After the bonding is completed, the wire 3 is cut by pulling up the tool 5 and the wire 3, and then the wire 3 is sent out. This process is repeated to sequentially perform wire bonding.

発明の効果 本発明のワイヤボンディング装置によれば、ボンディン
グのためにワークを加熱する必要がないので、ワークの
材質、状態に左右されず広範囲のワークに対して適用す
ることができる。また、ツール昇降手段と接触検出手段
にてツールを形成させた後、リニアモータにて付勢する
ことにより、ツールを高速動作させると共に適正な加圧
状態で通電加熱してボンディングを行うことができる。Effects of the Invention According to the wire bonding apparatus of the present invention, there is no need to heat the workpiece for bonding, so it can be applied to a wide range of workpieces regardless of the material and condition of the workpiece. In addition, after the tool is formed using the tool elevating means and the contact detection means, the tool is energized by the linear motor, so that the tool can be operated at high speed and bonding can be performed by energizing and heating it under appropriate pressure. .

さらに、回転手段にて任意の方向に延びるワイヤでもボ
ンディングすることができ、また清掃手段にてツール先
端を清掃でき、信頼性の高いボンディングができる等、
大なる効果を発揮する。Furthermore, the rotating means can be used to bond wires extending in any direction, and the cleaning means can be used to clean the tip of the tool, allowing for highly reliable bonding.
It has a great effect.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例の概略構成を示す斜視図、第
２図（ａ）、　（ｂ）は清掃手段の一例の斜視図および
縦断側面図、第３図（ａ）、　（ｂ）は清掃手段の他の
例の斜視図および縦断側面図、第４図は清掃手段のさら
に別の例の斜視図、第５図は従来のワイヤボンディング
方法を説明するための構成図である。 ２・・・・・・基板、３・・・・・・ワイヤ、４・・・
・・・クランパ５・・・・・・ボンディングツール、７
・・・・・・通電用電源、８・・・・・・回転軸、９・
・・・・・上下軸、１４・・・・・・センサ、１５・・
・・・・リニアモータ、１７・・・・・・清掃手段。 代理人の氏名　弁理士　粟野重孝　ほか１名２一基板 ３−−−ワイヤ 牛−−−クランパ ９・・−ＩＴ顆 １７−−−５腎掃＋挽FIG. 1 is a perspective view showing a schematic configuration of an embodiment of the present invention, FIGS. 2(a) and (b) are a perspective view and a longitudinal sectional side view of an example of a cleaning means, and FIGS. 3(a) and (b) are ) is a perspective view and a vertical side view of another example of the cleaning means, FIG. 4 is a perspective view of yet another example of the cleaning means, and FIG. 5 is a configuration diagram for explaining a conventional wire bonding method. 2... Board, 3... Wire, 4...
... Clamper 5 ... Bonding tool, 7
...Power supply for energizing, 8...Rotating shaft, 9.
...Vertical axis, 14...Sensor, 15...
...Linear motor, 17...Cleaning means. Name of agent Patent attorney Shigetaka Awano and 1 other person 21 PCB 3---Wire cow---Clamper 9...-IT condyle 17---5 Renal cleaning + grinding

Claims (1)

【特許請求の範囲】[Claims] ワイヤを被ボンディング部に圧接すると共にボンディン
グツール先端に形成した２つの電極によりワイヤに通電
し、ワイヤを加熱接合するボンディングツールと、この
ツールをボンディング位置と上昇位置との間で昇降させ
るツール昇降手段と、ツールの方向を変更する回転手段
と、ツールがボンディング面に接触したことを検出する
ボンディング面接触検出手段と、ワイヤのカットと送り
を行うクランパと、ツールを被ボンディング部に付勢す
るように設けられたリニアモータと、ツール先端を清掃
する手段とを備えたことを特徴とするワイヤボンディン
グ装置。A bonding tool that pressure-contacts a wire to a part to be bonded and heats and joins the wire by applying current to the wire using two electrodes formed at the tip of the bonding tool, and a tool elevating means for elevating the tool between a bonding position and a raised position. a rotating means for changing the direction of the tool; a bonding surface contact detection means for detecting that the tool has contacted the bonding surface; a clamper for cutting and feeding the wire; and a clamper for urging the tool toward the bonded part. 1. A wire bonding device comprising: a linear motor provided in the tool; and means for cleaning the tip of the tool.
JP1069603A 1988-07-28 1989-03-22 Wire bonding device Pending JPH02248055A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1069603A JPH02248055A (en) 1989-03-22 1989-03-22 Wire bonding device
JP19590189A JP2682156B2 (en) 1988-07-28 1989-07-27 Progressive linear actuator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1069603A JPH02248055A (en) 1989-03-22 1989-03-22 Wire bonding device

Publications (1)

Publication Number Publication Date
JPH02248055A true JPH02248055A (en) 1990-10-03

Family

ID=13407580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1069603A Pending JPH02248055A (en) 1988-07-28 1989-03-22 Wire bonding device

Country Status (1)

Country Link
JP (1) JPH02248055A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0574833A (en) * 1991-09-11 1993-03-26 Nec Corp Wire bonding apparatus
US6527027B2 (en) 2000-07-27 2003-03-04 Kabushiki Kaisha Shinkawa Single-point bonding apparatus
JP2008021943A (en) * 2006-07-14 2008-01-31 Shinkawa Ltd Bonding apparatus and method and program for washing distal end of bonding tool
US7762449B2 (en) * 2008-11-21 2010-07-27 Asm Assembly Automation Ltd Bond head for heavy wire bonder
CN103515262A (en) * 2012-06-26 2014-01-15 先进科技新加坡有限公司 Wedge bonder and a method of cleaning a wedge bonder
JP2021511664A (en) * 2018-01-30 2021-05-06 クリック アンド ソッファ インダストリーズ、インク． A cleaning system for wire bonding tools, wire bonding equipment that includes that system, and related methods.

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0574833A (en) * 1991-09-11 1993-03-26 Nec Corp Wire bonding apparatus
US6527027B2 (en) 2000-07-27 2003-03-04 Kabushiki Kaisha Shinkawa Single-point bonding apparatus
JP2008021943A (en) * 2006-07-14 2008-01-31 Shinkawa Ltd Bonding apparatus and method and program for washing distal end of bonding tool
JP4700570B2 (en) * 2006-07-14 2011-06-15 株式会社新川 Bonding apparatus, bonding tool tip cleaning method and program
US7762449B2 (en) * 2008-11-21 2010-07-27 Asm Assembly Automation Ltd Bond head for heavy wire bonder
CN103515262A (en) * 2012-06-26 2014-01-15 先进科技新加坡有限公司 Wedge bonder and a method of cleaning a wedge bonder
TWI548010B (en) * 2012-06-26 2016-09-01 先進科技新加坡有限公司 A wedge bonder and a method of cleaning a wedge bonder
JP2021511664A (en) * 2018-01-30 2021-05-06 クリック アンド ソッファ インダストリーズ、インク． A cleaning system for wire bonding tools, wire bonding equipment that includes that system, and related methods.

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