JPH0223234B2 - - Google Patents

Info

Publication number
JPH0223234B2
JPH0223234B2 JP56109886A JP10988681A JPH0223234B2 JP H0223234 B2 JPH0223234 B2 JP H0223234B2 JP 56109886 A JP56109886 A JP 56109886A JP 10988681 A JP10988681 A JP 10988681A JP H0223234 B2 JPH0223234 B2 JP H0223234B2
Authority
JP
Japan
Prior art keywords
copper
ethylenediaminetetraacetic acid
waste liquid
chemical plating
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56109886A
Other languages
Japanese (ja)
Other versions
JPS5811774A (en
Inventor
Masao Oosumi
Masayuki Kotake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10988681A priority Critical patent/JPS5811774A/en
Publication of JPS5811774A publication Critical patent/JPS5811774A/en
Publication of JPH0223234B2 publication Critical patent/JPH0223234B2/ja
Granted legal-status Critical Current

Links

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は錯化剤としてエチレンジアミンテトラ
酢酸を用いる銅の化学メツキ廃液の処理方法に関
するもので、この化学メツキ廃液中に残留する、
あるいは、この化学メツキ廃液の処理過程で混入
する公害規制物質の負荷量、あるいは廃水処理の
妨害物質を事前に、より経済的に削減し、後の廃
水処理をやり易くすることを主な目的とするもの
である。 銅の化学メツキ液の錯化剤として用いられてい
るエチレンジアミンテトラ酢酸は薬品として、比
較的高価な材料であること、あるいは、廃水処理
の際、この錯化剤が多量に混入すると他の金属イ
オンと容易にキレート化物を形成するため、通常
の中和法では廃水処理ができなくなるなどの理由
から、化学メツキ廃液から、廃水処理に先だつて
できるだけ多くのエチレンジアミンテトラ酢酸を
回収し、再利用することが通常行なわれている。 その方法としては、エチレンジアミンテトラ酢
酸錯化銅を含有する化学メツキ廃液に、先ず、還
元剤として、還元剤としては比較的安価なホルマ
リンを添加し、次いで、苛性ソーダを加え、PH13
以上とし、更に、反応速度を高めるために、70℃
以上に、化学メツキ廃液の温度を高め、銅の錯化
物を、固型状の金属銅、又は酸化銅としてこの化
学メツキ廃液から分離除去する。 この銅の除去は次のエチレンジアミンテトラ酢
酸の回収を良くするために行なう前処理工程で、
除去率は高い程よいのであるが、この処理廃液に
残存する銅濃度は通常50ppm以下である。 次に、還元反応によつて、強制的に銅分を分
離、除去した前処理済廃液に、硫酸、塩酸等の酸
を加えて、PHを0.5〜2に調整し、更に、除銅工
程で昇温化した液温を常温以下に充分に冷却して
溶解度を下げて、この処理済廃液から、固型状の
エチレンジアミンテトラ酢酸を折出、分離回収し
ている。 エチレンジアミンテトラ酢酸の回収は、従来こ
のような方法で行なわれているが、エチレンジア
ミンテトラの回収に先だつて行なわれる。化学メ
ツキ廃液の前処理工程、すなわち、除銅工程にお
いて、還元剤であるホルマリンの酸化で生成する
ギ酸の蓄積により折出銅が再溶解するのを防ぎ、
かつ、還元反応を速く完了させるために、反応当
量の数倍に相当するホルマリンが添加されてい
て、かつ、反応温度が高められている。 その結果、エチレンジアミンテトラ酢酸分離
回収後の処理廃液に、除銅工程で多量に投入した
ホルマリンあるいはその分解物がそのまま移行し
て、汚染負荷量すなわちBODあるいはCOD値を
高め最終の廃水処理を困難にする、酸あるいは
アルカリ性にと変化する腐触性の強い化学メツキ
廃液を、昇温あるいは冷却したりするのに大がか
りな装置を必要としエネルギーの消耗も大きく昇
温、冷却のためにかなりの時間がかかる、ホル
マリンの多量使用、高温での処理は作業環境を悪
化させる、といつた欠点を有している。 本発明はエチレンジアミンテトラ酢酸の回収に
先だつて行なう銅の強制分離剤に常温で反応し、
かつ、公害規制項目であるBOD値を高める要因
とならない無機性の硫化物を用い、化学メツキ廃
液中の錯化銅を硫化銅として分離してからエチレ
ンジアミンテトラ酢酸の回収操作に移るようにし
たことを特徴としたもので、その目的は前記従来
の欠点をこのような新規な方法で改善するエチレ
ンジアミンテトラ酢酸含有メツキ廃液の処理法を
提供するにある。 本発明を更に具体的に示すなら、先ず、エチレ
ンジアミンテトラ酢酸含有の銅の化学メツキ廃液
のPH値を4〜12、好ましくは5〜10の範囲に調
整、続いてNa2S,NaHS,H2S等の硫化物を添
加し、エチレンジアミンテトラ酢酸錯化銅を固型
の硫化銅としてORP計など用いて当量結合させ、
凝集沈澱法、遠心分離法あるいは沈澱浮選法等の
手段を用い、固液分離して銅を排除し、次に、こ
の除銅処理廃液に硫酸、塩酸等の酸を加えPHを
0.5〜2に調整して、エチレンジアミンテトラ酢
酸の白色の粉末を折出させる。(PHを下げると、
エチレンジアミンテトラ酢酸が溶解度の低い物質
に変化する。)この析出物を沈降法、遠心分離機
法、あるいは過法等で固液分離、粉末状のエチ
レンジアミンテトラ酢酸を回収する。 次に本発明を実施例に従つて詳細に説明する。 実施例 1 銅を2g/、エチレンジアミンテトラ酢酸20
g/、ホルマリン1g/、PH12の組成からな
る化学メツキ廃液に酸を加え、PHを7に調整し、
次に、この錯化銅と反応するに必要な硫化ソーダ
をORp計で確認しながら添加して不溶性の硫化
銅を析出させる。これに高分子凝集剤を2ppmの
濃度まで添加し、遠心分離機によつて、固液分離
して銅分を排除し、次にこの処理液に硫酸を添
加、PHを1.5に調整、この調整作業で液温が作業
前29℃であつたものが34℃まで上昇したので冷水
で冷却してエチレンジアミンテトラ酢酸を析出さ
せた。析出物は通常の手段で固液分離を行なつて
再利用した。 実施例 2 前実施例―1と同組成の化学メツキ廃液に、酸
を加えてPHを10に調整し、次にこの錯化銅と反応
するに必要な水硫化ソーダをORP計で確認しな
がら添加し、不溶性の硫化銅を析出させた。析出
粒子は先ず簡単な沈降槽で粗分離を行ない、粗大
粒子を除去し、上澄液中に浮遊する微細な懸濁粒
子は界面活性剤(脂肪酸アミン、4級アンモニウ
ム酢酸等)を添加し気泡を発生させ、泡だてるこ
とによつて懸濁粒子を泡に付着させ除去させる。
いわゆる沈澱選法によつて除去し、その後のエチ
レンジアミンテトラ酢酸回収作業は前実施例と同
様の方法で行なつた。 本発明の効果を明らかにするために従来法と前
記実施例について廃液処理法のちがいによる液組
成、液温等の変化を次表に示す。
The present invention relates to a method for treating copper chemical plating waste liquid using ethylenediaminetetraacetic acid as a complexing agent.
Alternatively, the main purpose is to more economically reduce the load of pollution control substances mixed in during the treatment process of chemical plating wastewater, or substances that interfere with wastewater treatment, and to make subsequent wastewater treatment easier. It is something to do. Ethylenediaminetetraacetic acid, which is used as a complexing agent in chemical plating solutions for copper, is a relatively expensive chemical, and if a large amount of this complexing agent is mixed in during wastewater treatment, it may cause other metal ions. Ethylenediaminetetraacetic acid easily forms chelates, making it impossible to treat wastewater using normal neutralization methods. Therefore, as much ethylenediaminetetraacetic acid as possible should be recovered and reused from chemical plating wastewater prior to wastewater treatment. is normally done. The method is to first add formalin, which is relatively inexpensive as a reducing agent, to chemical plating waste liquid containing copper complexed with ethylenediaminetetraacetic acid, and then add caustic soda to the chemical plating waste liquid containing copper complexed with ethylenediaminetetraacetic acid.
above, and further increase the reaction rate at 70°C.
As described above, the temperature of the chemical plating waste liquid is raised, and the copper complex is separated and removed from the chemical plating waste liquid as solid metallic copper or copper oxide. The removal of this copper is a pretreatment step performed to improve the subsequent recovery of ethylenediaminetetraacetic acid.
Although the higher the removal rate, the better, the copper concentration remaining in this treated waste liquid is usually 50 ppm or less. Next, acids such as sulfuric acid and hydrochloric acid are added to the pretreated waste liquid from which the copper content has been forcibly separated and removed through a reduction reaction to adjust the pH to 0.5 to 2. The elevated liquid temperature is sufficiently cooled to below room temperature to lower the solubility, and solid ethylenediaminetetraacetic acid is precipitated and separated and recovered from the treated waste liquid. Recovery of ethylenediaminetetraacetic acid is conventionally carried out by such a method, and is carried out prior to recovery of ethylenediaminetetra. In the pretreatment process of chemical plating waste liquid, that is, the copper removal process, it prevents the deposited copper from being redissolved due to the accumulation of formic acid generated by the oxidation of formalin, which is a reducing agent.
In addition, in order to quickly complete the reduction reaction, formalin is added in an amount equivalent to several times the reaction equivalent, and the reaction temperature is raised. As a result, a large amount of formalin or its decomposition products introduced in the copper removal process transfers to the treated wastewater after separation and recovery of ethylenediaminetetraacetic acid, increasing the pollution load, that is, the BOD or COD value, and making the final wastewater treatment difficult. However, large-scale equipment is required to heat up or cool down the highly corrosive chemical plating waste liquid that changes to acid or alkalinity, which consumes a lot of energy and takes a considerable amount of time to heat up and cool down. Such use of a large amount of formalin and treatment at high temperatures have drawbacks such as deterioration of the working environment. The present invention reacts with a forced separation agent for copper at room temperature prior to the recovery of ethylenediaminetetraacetic acid,
Furthermore, by using inorganic sulfides that do not cause an increase in the BOD value, which is a pollution control item, the complexed copper in the chemical plating waste liquid is separated as copper sulfide before proceeding to the recovery of ethylenediaminetetraacetic acid. The purpose is to provide a method for treating plating waste liquid containing ethylenediaminetetraacetic acid, which improves the above-mentioned conventional drawbacks by such a novel method. To further illustrate the present invention, first, the pH value of copper chemical plating waste solution containing ethylenediaminetetraacetic acid is adjusted to a range of 4 to 12, preferably 5 to 10, and then Na 2 S, NaHS, H 2 Sulfide such as S is added, and ethylenediaminetetraacetic acid complex copper is equivalently combined using an ORP meter as solid copper sulfide.
Copper is removed by solid-liquid separation using means such as coagulation-sedimentation, centrifugation, or sedimentation flotation, and then an acid such as sulfuric acid or hydrochloric acid is added to this copper removal waste liquid to adjust the pH.
Adjust the concentration to 0.5 to 2 to precipitate a white powder of ethylenediaminetetraacetic acid. (If you lower the pH,
Ethylenediaminetetraacetic acid changes to a substance with low solubility. ) This precipitate is subjected to solid-liquid separation using a sedimentation method, a centrifugal separator method, or a filtration method to recover powdered ethylenediaminetetraacetic acid. Next, the present invention will be explained in detail according to examples. Example 1 2 g of copper/20 ethylenediaminetetraacetic acid
g/, formalin 1 g/, and a chemical plating waste liquid with a composition of PH 12, add acid to adjust the PH to 7,
Next, sodium sulfide necessary to react with this complexed copper is added while checking with an ORp meter to precipitate insoluble copper sulfide. A polymer flocculant is added to this to a concentration of 2 ppm, and the copper content is removed through solid-liquid separation using a centrifuge. Next, sulfuric acid is added to this treated solution, and the pH is adjusted to 1.5. During the work, the liquid temperature rose from 29°C before the work to 34°C, so it was cooled with cold water to precipitate ethylenediaminetetraacetic acid. The precipitate was subjected to solid-liquid separation by conventional means and reused. Example 2 Acid was added to the chemical plating waste liquid with the same composition as in the previous Example-1 to adjust the pH to 10, and then the amount of sodium hydrogen sulfide necessary to react with the complexed copper was confirmed using an ORP meter. was added to precipitate insoluble copper sulfide. The precipitated particles are first roughly separated in a simple sedimentation tank to remove coarse particles, and the fine suspended particles floating in the supernatant are treated with a surfactant (fatty acid amine, quaternary ammonium acetate, etc.) to form bubbles. By generating foam and foaming, the suspended particles are attached to the foam and removed.
It was removed by a so-called precipitation method, and the subsequent recovery of ethylenediaminetetraacetic acid was carried out in the same manner as in the previous example. In order to clarify the effects of the present invention, the following table shows changes in liquid composition, liquid temperature, etc. due to differences in waste liquid treatment methods for the conventional method and the above-mentioned examples.

【表】 ……実施例1、……実施例2、……従来例
なお、回収したエチレンジアミンテトラ酢酸は
メツキ液の原料として100%使用してみたが、い
ずれの場合も加工品に影響を及ぼさなかつた。ま
た除銅工程で発生した硫化銅は再資源化可能なス
ラツジであることが判明した。 以上述べたことから明らかなように、本発明は
エチレンジアミンテトラ酢酸を含有する銅の化学
メツキ廃液のエチレンジアミンテトラ酢酸の回収
に先だつて行なう銅の除去剤にPH4〜12と広い範
囲で作用し、かつ非有機性で常温で反応し、更に
は従来のホルマリンよりは安価な硫化物を用いる
方法であるため、従来問題のエチレンジアミン
テトラ酢酸回収後廃液の公害規制項目である
BOD値が極めて低い。表の液温度化から容易
に推察されるように、昇温あるいは冷却に大がか
りな設備を必要とせず、かつエネルギー消費が少
ない、昇温冷却の作業時間が短縮できる。ホル
マリンのように揮発性でなく、かつ常温での作業
が可能であるため、作業環境を悪化させることが
ない。除銅工程でのアルカリ剤の添加(PH上
昇)、これに見合う酸の添加の必要がなく、銅除
法剤もホルマリンの如く反応当量以上に添加する
必要がないため、より高品位のエチレンジアミン
テトラ酢酸が回収でき、使用薬品量も節減でき
る。このようにエチレンジアミンテトラ酢酸回収
後の廃液の廃水処理が容易になるばかりでなく、
作業環境の改善、あるいは省エネルギーなど経済
面での効果も大きい。
[Table] ...Example 1, ...Example 2, ...Conventional example In addition, we tried using 100% of the recovered ethylenediaminetetraacetic acid as a raw material for plating liquid, but in all cases there was no effect on the processed products. Nakatsuta. It was also discovered that the copper sulfide generated during the copper removal process is a recyclable sludge. As is clear from the above, the present invention is a copper removal agent that is used in a copper chemical plating waste solution containing ethylenediaminetetraacetic acid and is used to remove ethylenediaminetetraacetic acid, which is used to remove ethylenediaminetetraacetic acid over a wide range of pH 4 to 12. This method uses sulfide, which is non-organic and reacts at room temperature, and is cheaper than conventional formalin, so it is a pollution control item for the waste liquid after recovering ethylenediaminetetraacetic acid, which has been a problem in the past.
BOD value is extremely low. As can be easily inferred from the liquid temperature change in the table, large-scale equipment is not required for heating or cooling, energy consumption is low, and work time for heating and cooling can be shortened. Unlike formalin, it is not volatile and can be worked at room temperature, so it does not worsen the working environment. There is no need to add an alkaline agent during the copper removal process (which increases pH), and there is no need to add a corresponding amount of acid, and unlike formalin, there is no need to add a copper removing agent in excess of the reaction equivalent, resulting in higher grade ethylenediaminetetraacetic acid. can be recovered and the amount of chemicals used can be reduced. In this way, it not only becomes easier to treat wastewater after recovering ethylenediaminetetraacetic acid, but also
It also has great economic effects, such as improving the working environment and saving energy.

Claims (1)

【特許請求の範囲】[Claims] 1 化学メツキ廃液のPHを4以上にして硫化物を
添加し、この化学メツキ廃液中のエチレンジアミ
ンテトラ酢酸錯化銅を不溶性の硫化銅として固液
分離する第一工程と、第一工程の分離液のPHを2
以下として不溶性のエチレンジアミンテトラ酢酸
を生成分離する第二工程とからなることを特徴と
する銅の化学メツキ廃液の処理方法。
1 A first step in which the pH of the chemical plating waste liquid is adjusted to 4 or more and sulfide is added, and the ethylenediaminetetraacetic acid complex copper in this chemical plating waste liquid is separated into solid-liquid as insoluble copper sulfide, and the separated liquid in the first step PH of 2
1. A method for treating copper chemical plating waste liquid, comprising a second step of producing and separating insoluble ethylenediaminetetraacetic acid as follows.
JP10988681A 1981-07-13 1981-07-13 Treatment of chemical plating waste liquor of copper Granted JPS5811774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10988681A JPS5811774A (en) 1981-07-13 1981-07-13 Treatment of chemical plating waste liquor of copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10988681A JPS5811774A (en) 1981-07-13 1981-07-13 Treatment of chemical plating waste liquor of copper

Publications (2)

Publication Number Publication Date
JPS5811774A JPS5811774A (en) 1983-01-22
JPH0223234B2 true JPH0223234B2 (en) 1990-05-23

Family

ID=14521648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10988681A Granted JPS5811774A (en) 1981-07-13 1981-07-13 Treatment of chemical plating waste liquor of copper

Country Status (1)

Country Link
JP (1) JPS5811774A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4765145B2 (en) * 2000-07-03 2011-09-07 三菱瓦斯化学株式会社 Process for producing polyphenylene ether
CN107973444B (en) * 2017-12-05 2020-12-01 吴江市威士达铜业科技有限公司 Treatment method of waste water generated in preparation of copper hydroxide powder from etching waste liquid

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51764A (en) * 1974-06-25 1976-01-06 Mitsui Mining & Smelting Co MUDENKAIDOMETSUKIHAISUINO SHORIHOHO
JPS517949A (en) * 1974-06-07 1976-01-22 Bbc Brown Boveri & Cie
JPS5620157A (en) * 1979-07-25 1981-02-25 Hitachi Ltd Treatment of waste water from chemical copper plating process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS517949A (en) * 1974-06-07 1976-01-22 Bbc Brown Boveri & Cie
JPS51764A (en) * 1974-06-25 1976-01-06 Mitsui Mining & Smelting Co MUDENKAIDOMETSUKIHAISUINO SHORIHOHO
JPS5620157A (en) * 1979-07-25 1981-02-25 Hitachi Ltd Treatment of waste water from chemical copper plating process

Also Published As

Publication number Publication date
JPS5811774A (en) 1983-01-22

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