JPH02229682A - Beam deflecting method for electron beam machine - Google Patents
Beam deflecting method for electron beam machineInfo
- Publication number
- JPH02229682A JPH02229682A JP4644889A JP4644889A JPH02229682A JP H02229682 A JPH02229682 A JP H02229682A JP 4644889 A JP4644889 A JP 4644889A JP 4644889 A JP4644889 A JP 4644889A JP H02229682 A JPH02229682 A JP H02229682A
- Authority
- JP
- Japan
- Prior art keywords
- deflection
- axis
- electron beam
- signal
- electron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010894 electron beam technology Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims description 11
- 230000000694 effects Effects 0.000 description 5
- 238000005553 drilling Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
Landscapes
- Welding Or Cutting Using Electron Beams (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、例えば穴明け加工などに用いられる電子ビ
ーム加工機におけるビーム偏向方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a beam deflection method in an electron beam processing machine used, for example, in drilling.
［従来の技術］
第２図は、例えば特開昭６１−２９３８００号公報に示
された従来の電子ビーム加工機のビーム偏向方法を説明
するための図である。図において、電子銃（１）から放
出された電子ビーム（２）は、集束レンズ（３）、偏向
レンズ（４）によって集束、偏向され、披加工物（５）
が加工される。[Prior Art] FIG. 2 is a diagram for explaining a beam deflection method of a conventional electron beam processing machine disclosed in, for example, Japanese Unexamined Patent Publication No. 61-293800. In the figure, an electron beam (2) emitted from an electron gun (1) is focused and deflected by a focusing lens (3) and a deflection lens (4), and is directed to a workpiece (5).
is processed.
（６）は電子ビーム（２）の照射によって被加工物（５
）が加工された結果発生する飛散物、（７）は被加工物
（５）を移動させるためＸＹテーブルである。(6) The workpiece (5) is irradiated with the electron beam (2).
) is a flying object generated as a result of processing, and (7) is an XY table for moving the workpiece (5).
次にビーム偏向方法について説明する。電子銃（１）よ
り加速放出された電子ビーム（２）は、集束レンズ（３
）によって細く絞られ、彼加工物（５）Ｊ：に局部照射
される。ビーム照射部では彼加工物（５）の瞬間的な溶
融・蒸発が生じた結果、飛散物（６）が紙面上方に散乱
する。加工が終了すると偏向レンズ（４）には偏向信号
（Ａ）が与光られ、電子ビーム（２）は瞬時に次の加工
点へ移動．し、再び加工が行われる。なお、偏向レンズ
（４）は通常の場合２軸の偏向機能を備えており、電子
ビーム（２）は平面上に走査されることとなる。このよ
うにして、ビーム偏向可能領域の加工が終了すると、Ｘ
Ｙテーブル（７）により被加工物（５）を移動し、順次
加工が繰り返される。Next, the beam deflection method will be explained. The electron beam (2) accelerated and emitted from the electron gun (1) is passed through a focusing lens (3).
) and locally irradiates the workpiece (5) J:. As a result of instantaneous melting and evaporation of the workpiece (5) in the beam irradiation section, flying objects (6) are scattered above the plane of the paper. When processing is completed, a deflection signal (A) is applied to the deflection lens (4), and the electron beam (2) instantly moves to the next processing point. Then, processing is performed again. Note that the deflection lens (4) normally has a biaxial deflection function, and the electron beam (2) is scanned on a plane. In this way, when the processing of the beam deflectable area is completed,
The workpiece (5) is moved by the Y table (7), and processing is repeated in sequence.
［発明が解決しようとする課題］
以上のような従来の電子ビーム加工機におけるビーム偏
向方法では、被加工物からの飛散物の電子ビーム通過経
路への付着や、電子銃内部への進入を防止することが極
めて困難であり、電子銃の性能およびビーム偏向精度の
低下を招くなどの問題点があった。[Problems to be Solved by the Invention] In the beam deflection method in the conventional electron beam processing machine as described above, it is difficult to prevent objects scattered from the workpiece from adhering to the electron beam path or entering the inside of the electron gun. It is extremely difficult to do so, and there are problems such as deterioration of electron gun performance and beam deflection accuracy.
この発明は、上記のような問題点を解消するためになさ
れたもので、被加工物からの飛散物による種々の影響を
著し《低減できる電子ビーム加工機におけるビーム偏向
方法を得ることを目的とする。This invention was made to solve the above-mentioned problems, and its purpose is to provide a beam deflection method for an electron beam processing machine that can significantly reduce various effects caused by objects flying from the workpiece. shall be.
［課題を解決するための手段］
この発明に係る電子ビーム加工機におけるビム偏向方法
は、一方の偏向軸には時間的に常に一定の偏向信号を与
え、他方の偏向軸には走査信号を与える。[Means for Solving the Problems] A beam deflection method in an electron beam processing machine according to the present invention is such that a temporally constant deflection signal is always applied to one deflection axis, and a scanning signal is applied to the other deflection axis. .
［作 用］
この発明においては、被加工物からの飛散物を遮蔽し、
ビーム発生・集束・偏向系への影響が低減される。[Function] In this invention, scattering objects from the workpiece are shielded,
The influence on beam generation, focusing, and deflection systems is reduced.
Ｕ実施例コ
以下、この発明の一実施例を第１図を参照して説明する
。図において、（４）は２組からなる偏向レンズ、（８
）は被加工物（５）からの飛散物（６）を遮蔽するため
のスリット（９）を有する遮蔽板、（Ａ）〜（Ｄ）は上
記偏向レンズ（４）それぞれに対応したビーム偏向信号
である。Embodiment 1 An embodiment of the present invention will be described below with reference to FIG. In the figure, (4) is a deflection lens consisting of two sets, (8
) is a shielding plate having a slit (9) for shielding the scattered objects (6) from the workpiece (5), and (A) to (D) are beam deflection signals corresponding to the deflection lenses (4), respectively. It is.
次にビーム偏向方法について説明する。電子銃（１）か
ら加速放出された電子ビーム（２）は、集束レンズ（３
）により肢加工物（５）表面近傍に焦点を結ぶように集
束された後、２組からなる偏向レンズ（４）のビーム偏
向信号（Ａ）〜（Ｄ）に基づき、偏向・走査される。こ
こで、穴明けなどの電子ビーム加工では、ビーム照射に
よって彼加工物（５）の瞬間的な溶融・蒸発が生じた結
果、飛散物（６）が紙面上方に激しく散乱するために、
ビーム発生・集束・偏向系に様々な悪影響をもたらすこ
とが知られており、この飛散物を遮蔽することが重要な
課題となっていた。Next, the beam deflection method will be explained. The electron beam (2) accelerated and emitted from the electron gun (1) passes through a focusing lens (3).
), the beam is focused near the surface of the limb workpiece (5), and then deflected and scanned based on beam deflection signals (A) to (D) from two sets of deflection lenses (4). Here, in electron beam processing such as drilling, the beam irradiation causes instant melting and evaporation of the workpiece (5), and as a result, the flying objects (6) are violently scattered above the paper surface.
It is known that they have various negative effects on beam generation, focusing, and deflection systems, and shielding these flying objects has become an important issue.
そこで、ビーム走査軸を１軸とするとともに、スリット
（９）を設けた遮蔽板（８）を通してビーム照射するこ
とにより、飛散物（６）の紙面上方への散乱を大幅に抑
制し、装置の信顧性を向上させることが可能となる。即
ち、図中（Ａ）および（Ｃ）にはビーム走査信号を、ま
た（Ｂ）および（Ｄ）には時間的に不変の偏向信号を与
えることにより達成できる。いうまでもな《 （Ｃ）お
よび（Ｄ）の信号は、（Ａ）および（Ｂ）の各々に対応
した指令（通常は逆方向の偏向指令）が与えられる。Therefore, by setting the beam scanning axis to one axis and irradiating the beam through a shielding plate (8) provided with a slit (9), scattering of the flying objects (6) upward in the paper can be greatly suppressed, and the equipment can be improved. It becomes possible to improve credibility. That is, this can be achieved by applying a beam scanning signal to (A) and (C) in the figure, and a time-invariant deflection signal to (B) and (D) in the figure. Needless to say, the signals (C) and (D) are given commands (usually deflection commands in opposite directions) corresponding to each of (A) and (B).
なお、上記実施例では偏向レンズが２段の場合について
説明したが、１段であっても良く、上記実施例と同様の
効果を奏する。In addition, although the case where the deflection lens has two stages has been described in the above embodiment, it may also have one stage, and the same effect as in the above embodiment can be obtained.
［発明の効果］
以上のように、この発明によれば、一方の偏向軸には常
に一定の信号、他方には走査信号を与えるようにしたの
で、肢加工物からの飛散物を効率良く遮蔽でき、加工機
の信頼性を向上できる効果が得られる。[Effects of the Invention] As described above, according to the present invention, since a constant signal is always given to one deflection axis and a scanning signal is given to the other, it is possible to efficiently shield objects flying from the limb workpiece. This has the effect of improving the reliability of the processing machine.
第１図はこの発明の一実施例を説明するための装置の概
略斜視図、第２図は従来のビーム偏向方法を説明するた
めの概略正面図である。
（２） ・・電子ビーム、（４） ・・偏向レンズ
、（５）・・被加工物、（Δ）〜（Ｄ） ・・ビーム
偏向信号、（８）・・遮蔽板、（９）・・スリット。
なお、各図中、同一符号は同一または相当部分を示す。FIG. 1 is a schematic perspective view of an apparatus for explaining an embodiment of the present invention, and FIG. 2 is a schematic front view for explaining a conventional beam deflection method. (2)...electron beam, (4)...deflection lens, (5)...workpiece, (Δ)~(D)...beam deflection signal, (8)...shielding plate, (9)... ·slit. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ム加工機におけるビーム偏向方法において、一方の偏向
軸には時間的に常に一定の信号を与え、残る偏向軸に走
査信号を与えることを特徴とする電子ビーム加工機にお
ける偏向方法。A beam deflection method for an electron beam processing machine equipped with at least one set of two-axis beam deflection means, characterized in that a temporally constant signal is always applied to one deflection axis, and a scanning signal is applied to the remaining deflection axis. Deflection method in electron beam processing machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4644889A JPH02229682A (en) | 1989-03-01 | 1989-03-01 | Beam deflecting method for electron beam machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4644889A JPH02229682A (en) | 1989-03-01 | 1989-03-01 | Beam deflecting method for electron beam machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02229682A true JPH02229682A (en) | 1990-09-12 |
Family
ID=12747438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4644889A Pending JPH02229682A (en) | 1989-03-01 | 1989-03-01 | Beam deflecting method for electron beam machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02229682A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012035302A (en) * | 2010-08-06 | 2012-02-23 | Jfe Steel Corp | Electron beam irradiation device |
| JPWO2013099219A1 (en) * | 2011-12-27 | 2015-04-30 | Ｊｆｅスチール株式会社 | Iron loss improvement device for grain-oriented electrical steel sheet |
-
1989
- 1989-03-01 JP JP4644889A patent/JPH02229682A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012035302A (en) * | 2010-08-06 | 2012-02-23 | Jfe Steel Corp | Electron beam irradiation device |
| JPWO2013099219A1 (en) * | 2011-12-27 | 2015-04-30 | Ｊｆｅスチール株式会社 | Iron loss improvement device for grain-oriented electrical steel sheet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI758306B (en) | Compound beam device | |
| JPH0510822B2 (en) | ||
| US4924104A (en) | Ion beam apparatus and method of modifying substrate | |
| US5153441A (en) | Electron-beam exposure apparatus | |
| JPH02229682A (en) | Beam deflecting method for electron beam machine | |
| JPS59208830A (en) | Ion beam processing method and device thereof | |
| US10984977B2 (en) | Particle beam system and method for operating a particle beam system | |
| JP3057110B2 (en) | Laser processing mask irradiation equipment | |
| JP2824340B2 (en) | Section processing observation method | |
| JPS61245164A (en) | Pattern correcting device | |
| JPH07134967A (en) | Composite charged particle beam device | |
| JPH0587014B2 (en) | ||
| JP2813359B2 (en) | Electron beam exposure system | |
| JP2713498B2 (en) | Energy beam processing method | |
| JPS63236251A (en) | Electron beams-ion beams composite device | |
| JPH0322905Y2 (en) | ||
| JP2773702B2 (en) | Mark position detecting method and mark position detecting device | |
| JPS6290842A (en) | Focused ion beam irradiation apparatus | |
| JPH04147978A (en) | Formation of film by cvd with ion beam | |
| JP2822055B2 (en) | Method and apparatus for removing influence of leaked beam in charged particle beam writing apparatus | |
| JPS6326935A (en) | Analyzing device using charged particle beam | |
| JPH01143326A (en) | Electron beam exposure system and its use | |
| JPH1050246A (en) | Focusing ion beam device, and cross section forming method by the focusing ion beam device | |
| JPH11144668A (en) | Focused ion beam machining device | |
| JPH08250496A (en) | Ion beam machining device |