JPH02229268A - Fiber for chemical plating and production thereof - Google Patents

Fiber for chemical plating and production thereof

Info

Publication number
JPH02229268A
JPH02229268A JP1049897A JP4989789A JPH02229268A JP H02229268 A JPH02229268 A JP H02229268A JP 1049897 A JP1049897 A JP 1049897A JP 4989789 A JP4989789 A JP 4989789A JP H02229268 A JPH02229268 A JP H02229268A
Authority
JP
Japan
Prior art keywords
fiber
fibers
water
chemical plating
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1049897A
Other languages
Japanese (ja)
Inventor
Norihisa Miyamatsu
徳久 宮松
Koichi Suzuki
宏一 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NICHIBI KK
Original Assignee
NICHIBI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NICHIBI KK filed Critical NICHIBI KK
Priority to JP1049897A priority Critical patent/JPH02229268A/en
Publication of JPH02229268A publication Critical patent/JPH02229268A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a fiber which can be plated by chemical plating without pretreatment by coating the surface of a fiber with a coating film of an insolubilized hydrophilic polymer containing palladium or silver in the form of ion or colloid. CONSTITUTION:A mixed aqueous solution of a hydrophilic polymer or a water- soluble polymer containing palladium or silver in the form of ion or colloid and a water-soluble palladium or silver compound is as necessary added with a reducing agent and a crosslinking agent for said water soluble polymer to obtain a treating liquid. The liquid is applied to the surface of a fiber or to a specific part of a fiber aggregate and insolubilized to obtain the objective fiber for chemical plating or a fiber aggregate having a specific part which can be plated by chemical plating. A fiber aggregate which can be plated by chemical plating exclusively on a specific fiber is produced by blending fibers having the above coating film with fibers free from the coating film.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、新規かつ改良さ九た化学メッキできる繊維に
関し,詳し《は,化学メッキに対する触媒能を備えた堅
牢な表面層を有するHA維に係わり,紡績.II織など
のテキスタイル工程に耐えられ十分な触媒活性のある表
面層を与えることにより,前処理なしに,また特定部分
のみ選択的に化学メッキできる繊維集合体を提供せんと
するものである. 〔従来の技8l71 従来,繊維に対するメッキは,金屓の析出に対し触媒作
用を有するパラジウムなどの貴金属を表面に吸着させて
行なわれており,最も一般的なパラジウムを触媒とする
場合においては,(表面を組而化したり化学的活性を高
めるための)化学腐食工程→(油脂、指紋などを除去し
完全な洗浄面を得るための)洗浄工程→(塩化第一鳩な
どの比較的強い還元剤を表面層に吸着させ次の工程で表
面に析出するパラジウムの密着性を改善する)感受性化
処理工程→パラジウムコロイドの付着工程→水洗工程よ
りなる.繁雑でm1!Iな管理が肝要な一連の前処理工
程を経た後,ようやく化学メッキが行なわれている. このような煩わしさを回避するために,触媒能のある金
属化合物の溶液にm維を浸漬後乾燥熱処理をする方法(
特公昭63−3s+9+3) .界面活性剤を含むパラ
ジウムヒドロゾル中に吸水性&Iljaを浸漬し,パラ
ジウムコロイドを吸着せしめた後これを化学メッキする
方法(特公昭63−36396)などが堤案されてはい
るが.なお,触媒となるパラジウムコロイドの付着の堅
牢性には問題が見られた.[発明が解決しようとする問
題点] 本発明者らは,健来法に見られるかかる現状に鑑がみ、
鋭意研究巾のところ、パラジウムコロイドと架橋剤を含
むポリビニルアルコールの希薄水溶液をil#1Kに塗
布することにより,触媒成分が表面被膜中に存在しても
十分な触媒活性を有し、しかも高分子により保護され触
媒が摩擦などに対し卓越した堅牢性を備えるなど,化学
メッキ用繊維として理想的な特性が得られることを見い
だし、さらにその詳細について追求した結果,遂に本発
明に到達した. [発明の構成] 即ち本発明は, (1)表面に,パラジウムまたは銀をイオンまたはコロ
イドとして含有し不溶化された親水性高分子の被膜を、
有する化学メッキ用繊維 (2)表面にパラジウムまたは銀をイオンまたはコロイ
ドとして含有し不溶化された親水性高分子の被膜を有す
る繊維と,該被膜を持たない繊維との混用物よりなる、
特定繊維のみメッキできる化学メッキ用繊維集合体 +:3+&la集合体の特定部分に.パラジウムまたは
銀をイオンまたはコロイドとして含有し不溶化された親
水性高分子被膜を設けてなる,特定部分のみメッキでき
る化学メッキ用繊維集合体(4)水溶性高分子と,水溶
性パラジウムまたは銀化合物との混溶水溶液に、必要に
応じ還元剤と該水溶性高分子に対する架橋剤を加えて得
られる処理肢を,繊維に付与し乾燥および不溶化を行な
うことを特徴とする、特許請求の範囲第1および第3項
記級のm維または繊維集合体の製造方法であり、本発明
によ九ば,煩わしい前処現なしに、均一で再現性良く化
学メッキを行なうことができ,さらに化学メッキされた
繊維とされない繊維との複合体を,容易にかつ高品位の
ものとして製造できる特徴がある. すなわち、一般にメッキされた繊維は剛直であり、同時
に伸張、摩擦,屈曲などによりメッキが破壊され易いた
め,他の繊維との混用特に混用時に機械的な作用を強く
受ける混紡などは実質的に不可能であったが、本発明で
は,他の繊維と混用したのち.あるいは繊維集合体の所
望部分のみをメッキ可能にしたのち,最後に化学メッキ
できる結果.MHII集合体になじみが良い状態でlf
luAのない金厘化部分が導入できる結果,優れた帯電
防止効果.通電効果,電磁波シールド効果などを発蓮す
ることができるのである. なお,これまでの方法においては2披メッキ物の表面に
触媒が存在して始めてメッキが行なわれるものであった
が,本発明において触媒が高分子中に埋没しているにも
拘らず十分機能する原因については明らかではないが、
触媒が埋もれている高分子は架橋されてはいるものの,
もともと水溶性で粗水性の高いものであって,還元剤や
メンキされる金属の侵入が容易であるためメッキ反応が
進行するものと考えられる. [本発明実施の態様] 以下,本発明実施の態様を中心に説明を行なうが,本発
明はその主旨に反しない限り以下の説明にのみ限定され
るものではない. まず,本発明の対象となるm維としては、繊維物性が良
好で,化学メッキ条件に耐えるものであれば特に制限は
ない.例えば;木綿,麻、獣毛,絹,などの天然m維、
レイヨン、セルロースアセテート、セルローストリアセ
テートなどの再生繊維や半合成Ii維.アクリル系繊維
,ポリエステル繊維、ボリアミド繊維5アラミド繊維,
ポリビニルアルコール系繊維,ボリブロビレンm維,ポ
リエチレン繊維などの合成1m維,炭素纒維,ガラス繊
維,セラミック繊維などの無機繊維などほとんどの繊維
が対象となり,これらの一種または一種以上より構成さ
れてなる繊維集合体が使用できる.水溶性高分子として
は,アクリル酸,メタクリル酸、イタコン酸,マレイン
酸.スチレンスルホン酸,などの酸性基を有するビニル
モノマー;ビニルピリジン,アリルアミン,を始めとす
る塩基性基k有するビニルモノマー;アクリルアミド,
メタクリルアミド、ビニルビロリドンなどのノニオン性
モノマーなど、水溶性重合体を与えるビニルモノマーの
単独あるいはこれら詮主成分とする共重合体がある. また,ポリエチレンオキサイド、ポリエチレングリコー
ル,ボリエチレンイミン,ポリビニルアルコールなどの
合成高分子があり,さらには、カルボキシメチルセルロ
ース,メチルセルロース、ヒドロキシメチルセルロース
,ゼラチン.カゼイン.アルギン酸塩,キトサン,など
の半合成あるいは天然の水溶性高分子も使用できる.こ
のうち、平均重合度が500〜5000のポリビニルア
ルコールは,得られる表面被膜の物性が良好であり特に
好ましい. なお,これらの条件を満足する限り,ポリビニルアルコ
ールとしてはカルボキシル基,アミノ基,などの官能基
を5mo le%以下の範囲で有するものであってもよ
い. また、メチロール基,アルデヒド基など自己架橋性を与
える官能基を有する水溶性高分子は,架橋剤の使用を省
略できる利点がある. 二九らの高分子水溶液にパラジウムまたは銀の水溶性化
合物を溶解せしめ、必要に応じ還元剤および用いる水溶
性化合物に対する架橋剤を加えでllaされる処理液を
前記繊維に付与することにより本発明を実施することが
できる. 二こで、パラジウムとしては,硝酸パラジウム,塩化パ
ラジウム、銀としては硝M銀,塩化銀などが水溶性化合
物として好適である. こうした水溶性化合物と水溶性高分子が存在する系で還
元剤を作用させることは,該高分子が存在しない系と比
べても遥かに微細な金属コロイドが生成し、これらは超
微粒子なるが故に触媒として比活性が高く,高分子に保
護され勺散安定性も問題がないことが知られている(例
えば,戸嶋直樹;高分子.f;70 (1987)など
).さらにこの操作は、責な金属イオンを金属に変換し
ておくことであり,金属系容器などを用いる場合に見ら
れる電気化学的な腐食を防止することにもなり,この面
でも好ましいことである.この際,還元剤としては,ホ
ルムアルデヒド.ヒドラジン、次亜リン酸塩、水素化ホ
ウ素ナトリウl1,ホラザン類、2塩化鱒、などの還元
剤が使用できる. また水溶性のパラジウムや銀化合物は酸化力が大である
ため.fJlti的に還元剤を使用しなくても,光照射
,加温により、有機物などを酸化して自らは金属コロイ
ドとなることもある.したがって、酸化され易い水溶性
高分子を用いる場合や、アルコール、アルデヒド,アミ
ン類が共存し,加熱する場合など還元剤は使用しなくて
良い場合もある.パラジウムあるいは銀は添加量が多く
なると表面層の物性が低下する傾向がありまた高価でも
あり,水溶性高分子の重量に対し,金屑として2.Ow
j%を超えない必要があり、一方、量が少なくなると目
的とする機能の発現が不十分となるため,少なくとも0
.001vL%以上が必要である.最後に,かくして得
られる処理液を繊維に付与して不溶化する. 付与する方法は,W1布したり、浸漬一搾液したり、繊
維あるいは繊維集合体の形態、処理目的などにより任意
に選択できる. 綿,トウ,フィラメントなどに対し.均一で7できるだ
けソフトな仕上がりを期待する場合などには、処理液の
濃度を低めとし浸漬後搾液する方法が良く,特に繊維が
イオン性を有する場合には処理液として友対のイオン性
の水溶性高分子を用いたものを利用することは薄く均一
な被膜の形成につながり極めて好ましいことである.ま
た,紙や織物などに線状.格子状など,あるいは外表面
のみに加工部分を形成したい場合には.捺染方式やグラ
ビアコーティング方式が好適な方法である. 最後に不溶化された本発明繊維または繊維集合体は、煩
わしい前処理工程なしに直接メッキを行なうことができ
る. ここで、本発明で使用できる繊維集合体としては糸状.
ms布および不織布などの布状,あるいは新状があり、
これらを加工して得られる二次製品であっても良い. &l#Ii集合体が本発明繊維と他繊維との混成体であ
る場合、これらの分布は均一でもよいが,むしろ不均一
であったほうが好ましい場合がある.例えば,内層に本
発明繊維を配し外層には保護と絶縁を兼ねた通常繊維を
配した糸状体をメッキすることによりシ運一トや感電の
ない通電用コードが得らh.これが布状体とすれば安全
なIIili発熱体として使用することができる. また,本発明Ill維を表裏両面にのみ配した三店構造
の紙状繊維集合体をメッキしたものは超小型のコンデン
サーとして使用できる. 本発明繊維がメンキされる金属種については.パラジウ
ムおよび銀コロイドによりメッキ可能な全てが対象とな
り、代表的なものとしてニッケル,鋼.クロム、コバル
ト,銀.錫,があり、これらの本独または複合メッキも
対象となる.〔実施例〕 以下,実施例により,本発明の説明を続けるが例中,部
はffi量部の意味である. 実施例1 平均重合度1,800、鹸化度99.98 llIol
e%のポリビニルアルコール29.9部を120部の水
と共に二−ダー・(溶解機)に投入し、密閉状態のまま
 120℃まで昇温しで完全に溶解後、このm液を75
℃まで冷却したところで,0.3部の塩化パラジウムを
 o.il定アンモニア水5、θ部に溶解して添加し均
一に溶解せしめ、さらに純分80wt%のヒドラジンヒ
ドラート水溶液0,2部を添加混合すると透明な溶液は
パラジウムコロイドの生成により淡島色透明に変化した
. このパラジウムコロイドとポリビニルアノレコールの濃
厚水溶液の一部を,別容器に移し水で希釈し室温にまで
冷却したのちさらに架橋剤としてポリビニルアルコール
重量に対し 5,0%のグルタルアルデヒド転加え、固
形分濃度1.0%の処理液転調製した. この処理液に.ポリビニルアルコール繊維よりなる双糸
 (20P″;−ル/8フィラメントX2)  の酩糸
をIO分間浸漬したのち遠心脱水し風乾後150℃で熱
処理をして本発明繊維を得た. この処理により,繊維の重量は0.7%増加していたが
付着量が僅少量のため繊維間の接着による風合いの硬化
は極く僅かであった. このものを,市販の無電解メッキ液(日本カニゼン株式
会社製商品名:ブルーシュマー)の5倍希釈水溶液に液
@90”Cで45分間攪拌しつつ浸漬処理したところ,
均一なニッケルメッキが行なえ、得られた&l維は0,
3Ω/C一の電気抵抗値を示した.また,本例の本発明
m維についてはコバルト,!li鉛,クロム、錫,金、
パラジウム、銀などの化学メッキにも常法により可能で
あった.[実施例2] 実施例lにおいて,用いたポリビニルアルコールの代わ
りにこれと同量の、スルホン酸基を 2.2mole%
有するスルホン酸変性ポリビニルアルコール(日本合成
化学工業株式会社製. CKS−501 を用い,他は
全く同一条件で処理液を調製した.ナイロンmtti布
を,得られた処理液に浸7λ・脱水・乾燥・熱処現を順
次行なったところ、実施例lと同様,均一なニッケルメ
ッキ性を付与できた.[実施例3】 水溶性高分子として高分子量ポリエチレンイミン(相互
薬工株式会社11 210一丁)を用いこの30wL%
水wI液に,ボリエチレンイミン重量の 1.3%の塩
化パラジウムをあらかじめ0.lモルの炭酸アンモニア
水に溶解せしめて添加混合し,水を加え希釈したのち,
さらにボリエチレンイミンに対し 3.5wl%のグリ
セロールジグリシジルエーテルを加え、固形分濃度が0
.9%の処J!II液を調製した.この処郡液にカチオ
ン染料可染のアクリル長繊維布を浸漬後,搾11L乾燥
7熱処理を行なった.かくして得られた布は、実施例1
と同じメッキ条件で均一なニッケルメッキができた.ま
た、本例において処理液濃度を 5.6%に調製し,こ
れを上記のアクリル布の縦糸に添って複数の直線状に塗
布し乾燥と熱処理をしたものについては、処理液を塗布
した部分のみメッキがなされた. 〔実施例4】 芯1:300テ゛ニー馬/l00フィラメントのポリエ
ステノレmart配し,その周りを、実施例1で得られ
た本発明繊維繊維でもって lcn+当たり12回の割
りで巻きつけ、さらにその外周を40番綿糸で lam
当たり10回巻きつけて三1W構造のカバーヤーンを作
成した.これを,まず,硫酸ニッケル30g/L.次■
リン酸1G./L.酢酸ソーダ10./Lよりなるニッ
ケルメッキ浴で80℃30分間処理してニッケルメッキ
を行なった後,水洗し、次に,これを陰極とし電解銅メ
ッキ浴に連続的に通過させる方式により銅メッキを施し
た. かくして得られたものは,中間層の本発明m維一のみメ
ッキされ,その電気抵抗は0、02Ω/cmであり,こ
れをビニール被覆したものは極めて軽量かつ強靭であり
.導線として有用である.なお.本例のメッキ前のカバ
ーヤーンを縦糸に用いたテープ織物,あるいは複数合撚
糸した場合にもメッキは同様可能であり,この事実は、
従来*mな工程を経て製造された,導線,コード,ケー
ブル,あるいはこれらより構成される?iI雑な電気、
電子部品が,al維#i術とメッキ技術により合理的に
製造できることを示唆するものである.[実施例5] 実施例1において,塩化パラジウム/アンモニア諷合水
の代わりに0.3部の硝酸銀を20部の水に熔解して添
加する以外、同一条件により銀コロイドを含有する被膜
を有するポリビニルアルコール繊維を得た.得られた本
発明繊維は,常法により銅メソキを行なうことができた
がニッケルメッキについては困難であった. [参考(Fl 1−3 ] 実施例1〜3において架橋剤の添加なしにg4I!した
処理液を用いる以外,それぞれ実施例1〜3と同じ条件
で処理し、ニッケルメッキしようとしたところ,実施例
2(ナイロン)および実施例3(アクリル繊維)では全
くメッキできず,僅かに実施例1 (ポリビニルアルコ
ールat維)の場合のみメッキできたが,光沢がなく顕
微IIIllIlt察した結果,メッキの表面は凹凸が
多く,また,密着性も不良であった. さらに,いずれの場合も,恐らく触媒粒子がメッキ浴に
溶出したのであろう,メッキ浴での金属粒子の生成が多
<amされた. 特許出願人   株式会社 二チビ
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a new and improved chemically plateable fiber, and more particularly, to an HA fiber having a robust surface layer with catalytic ability for chemical plating. Involved in spinning. By providing a surface layer that can withstand textile processes such as II weaving and has sufficient catalytic activity, we aim to provide a fiber aggregate that can be chemically plated selectively on specific areas without pretreatment. [Conventional Techniques 8l71 Traditionally, plating on fibers has been carried out by adsorbing noble metals such as palladium, which has a catalytic effect on the surface of metal precipitation, and when palladium is the most common catalyst, Chemical corrosion process (to metabolize the surface or increase chemical activity) → Cleaning process (to remove oil, fat, fingerprints, etc. and obtain a completely cleaned surface) → Relatively strong reduction (such as Daiichi Chloride) The process consists of a sensitization process (which improves the adhesion of the palladium deposited on the surface by adsorbing the agent onto the surface layer) → a palladium colloid deposition process → a water washing process. Complicated and m1! After going through a series of pretreatment steps that require careful management, chemical plating is finally carried out. In order to avoid such troubles, we have developed a method in which M-fibers are immersed in a solution of a metal compound with catalytic ability and then subjected to dry heat treatment (
Tokuko Sho 63-3s+9+3). A method has been proposed in which water-absorbing &Ilja is immersed in a palladium hydrosol containing a surfactant to adsorb palladium colloid and then chemically plated (Japanese Patent Publication No. 36396/1983). Furthermore, there was a problem with the robustness of the attachment of palladium colloid, which serves as a catalyst. [Problems to be solved by the invention] In view of the current situation in the conventional law, the present inventors have solved the following problem:
Through extensive research, we have found that by applying a dilute aqueous solution of polyvinyl alcohol containing colloidal palladium and a crosslinking agent to IL#1K, it has sufficient catalytic activity even if the catalyst component is present in the surface coating, and it has been found that polymer It was discovered that this fiber has ideal properties as a fiber for chemical plating, such as protection by the catalyst and excellent durability against friction, etc., and as a result of further investigation into the details, the present invention was finally achieved. [Structure of the Invention] That is, the present invention has the following features: (1) A coating of a hydrophilic polymer containing palladium or silver as an ion or colloid and made insolubilized on the surface;
Fibers for chemical plating (2) consisting of a mixture of fibers with a coating of a hydrophilic polymer containing palladium or silver as ions or colloids and made insolubilized on the surface, and fibers without the coating,
Fiber aggregate for chemical plating +: 3+&la can plate only specific fibers on specific parts of the aggregate. A fiber assembly for chemical plating that can plate only specific parts and is provided with an insolubilized hydrophilic polymer coating containing palladium or silver as ions or colloids (4) A water-soluble polymer and a water-soluble palladium or silver compound. Claim 1, characterized in that a treatment limb obtained by adding a reducing agent and a crosslinking agent for the water-soluble polymer as necessary to a mixed aqueous solution of is applied to the fiber to dry and insolubilize the fiber. According to the present invention, chemical plating can be performed uniformly and with good reproducibility without complicated pretreatment, and further, chemical plating can be performed with good reproducibility. It is characterized by the ability to easily produce high-quality composites of processed and non-processed fibers. In other words, plated fibers are generally rigid, and at the same time, the plating is easily destroyed by stretching, friction, bending, etc., so mixing with other fibers, especially blends that are subject to strong mechanical effects when mixed, is practically unnecessary. However, in the present invention, after mixing with other fibers. Or, after making it possible to plate only the desired part of the fiber aggregate, the final result is chemical plating. lf with good familiarity with MHII aggregate
As a result of being able to introduce a gold-plated portion without luA, it has an excellent antistatic effect. It can produce effects such as energizing effect and electromagnetic shielding effect. In addition, in conventional methods, plating was performed only after a catalyst was present on the surface of the plated material, but in the present invention, the catalyst is fully functional even though it is buried in the polymer. Although the cause of this is not clear,
Although the polymer in which the catalyst is buried is crosslinked,
It is thought that the plating reaction progresses because it is originally water-soluble and has a high roughness, and the reducing agent and the metal to be plated can easily penetrate it. [Modes for Carrying Out the Present Invention] Hereinafter, explanations will be given centering on modes for carrying out the present invention, but the present invention is not limited to the following explanation unless it goes against the gist thereof. First, there are no particular limitations on the m-fiber that is the object of the present invention, as long as it has good fiber properties and can withstand chemical plating conditions. For example; natural fibers such as cotton, linen, animal hair, silk, etc.
Regenerated fibers such as rayon, cellulose acetate, cellulose triacetate, and semi-synthetic Ii fibers. Acrylic fiber, polyester fiber, polyamide fiber 5 aramid fiber,
Most fibers are eligible, including synthetic 1m fibers such as polyvinyl alcohol fibers, polypropylene fibers, and polyethylene fibers, and inorganic fibers such as carbon fibers, glass fibers, and ceramic fibers, and fibers composed of one or more of these fibers. Aggregates can be used. Examples of water-soluble polymers include acrylic acid, methacrylic acid, itaconic acid, and maleic acid. Vinyl monomers with acidic groups such as styrene sulfonic acid; vinyl monomers with basic groups such as vinylpyridine and allylamine; acrylamide,
There are vinyl monomers, such as nonionic monomers such as methacrylamide and vinylpyrrolidone, used alone or copolymers mainly composed of vinyl monomers that provide water-soluble polymers. In addition, there are synthetic polymers such as polyethylene oxide, polyethylene glycol, polyethyleneimine, and polyvinyl alcohol, as well as carboxymethyl cellulose, methyl cellulose, hydroxymethyl cellulose, gelatin. casein. Semi-synthetic or natural water-soluble polymers such as alginate and chitosan can also be used. Among these, polyvinyl alcohol having an average degree of polymerization of 500 to 5000 is particularly preferred because the resulting surface coating has good physical properties. As long as these conditions are satisfied, the polyvinyl alcohol may have a functional group such as a carboxyl group or an amino group in a range of 5 mole% or less. Furthermore, water-soluble polymers that have functional groups that provide self-crosslinking properties, such as methylol groups and aldehyde groups, have the advantage of omitting the use of crosslinking agents. The present invention is carried out by dissolving a water-soluble compound of palladium or silver in an aqueous polymer solution of Niku et al., and applying a treatment liquid to the fibers by adding a reducing agent and a crosslinking agent for the water-soluble compound to be used as necessary. can be carried out. As the palladium, palladium nitrate and palladium chloride are suitable, and as the silver, silver nitrate and silver chloride are suitable as water-soluble compounds. When a reducing agent is used in a system where such water-soluble compounds and water-soluble polymers exist, much finer metal colloids are generated than in a system where the polymers are not present, and these are ultrafine particles. It is known that it has a high specific activity as a catalyst, is protected by polymers, and has no problems in dispersion stability (for example, Naoki Toshima; Kobunshi.f; 70 (1987), etc.). Furthermore, this operation converts harmful metal ions into metals, which prevents the electrochemical corrosion that occurs when using metal containers, which is also preferable. .. At this time, formaldehyde is used as the reducing agent. Reducing agents such as hydrazine, hypophosphite, sodium borohydride, forazane, trout dichloride, etc. can be used. Also, water-soluble palladium and silver compounds have strong oxidizing power. Even without using a reducing agent, organic substances can be oxidized and become metal colloids by light irradiation and heating. Therefore, there are cases where it is not necessary to use a reducing agent, such as when using water-soluble polymers that are easily oxidized, or when alcohols, aldehydes, or amines coexist and heating is required. When palladium or silver is added in a large amount, the physical properties of the surface layer tend to deteriorate, and they are also expensive. Ow
On the other hand, if the amount is small, the expression of the desired function will be insufficient, so it should be at least 0.
.. 001vL% or more is required. Finally, the treatment liquid thus obtained is applied to the fibers to make them insoluble. The application method may be W1 cloth, dipping or squeezing, or can be arbitrarily selected depending on the form of the fibers or fiber aggregates, the purpose of treatment, etc. For cotton, tow, filament, etc. If you want a uniform and as soft finish as possible, it is better to lower the concentration of the treatment liquid and squeeze the liquid after soaking. Especially if the fibers are ionic, use an ionic treatment liquid as the treatment liquid. The use of water-soluble polymers is extremely preferable as it allows for the formation of a thin and uniform film. Lines may also appear on paper and textiles. When you want to form a lattice pattern or a processed part only on the outer surface. The preferred methods are textile printing and gravure coating. Finally, the insolubilized fibers or fiber aggregates of the present invention can be directly plated without any troublesome pretreatment steps. Here, the fiber aggregate that can be used in the present invention is filamentous.
There are cloth forms such as ms cloth and non-woven fabrics, and new forms.
Secondary products obtained by processing these materials may also be used. &l#Ii When the aggregate is a hybrid of the fibers of the present invention and other fibers, the distribution may be uniform, but it may be preferable that the distribution is non-uniform. For example, by plating a thread-like body in which the fibers of the present invention are arranged in the inner layer and ordinary fibers which serve as protection and insulation are arranged in the outer layer, a current-carrying cord without any shock or electric shock can be obtained.h. If this is made into a cloth-like material, it can be used as a safe IIIli heating element. Furthermore, a plated paper fiber aggregate with a three-storey structure in which the Ill fibers of the present invention are arranged only on both the front and back sides can be used as an ultra-small capacitor. Regarding the types of metals to which the fibers of the present invention are coated. Anything that can be plated with palladium and silver colloids is targeted, with typical examples being nickel and steel. Chromium, cobalt, silver. There is tin, and these original or composite platings are also covered. [Example] The present invention will be further explained with reference to Examples below. In the examples, parts mean ffi parts. Example 1 Average degree of polymerization 1,800, degree of saponification 99.98 llIol
Pour 29.9 parts of e% polyvinyl alcohol into a seconder (dissolver) together with 120 parts of water, raise the temperature to 120°C in a closed state, and after completely dissolving the m solution,
Once cooled to 0.degree. C., 0.3 parts of palladium chloride was added o. Dissolve and add 5 parts of constant ammonia water to dissolve it uniformly, then add 0.2 parts of an aqueous solution of hydrazine hydrate with a purity of 80 wt% and mix. The transparent solution becomes pale island-colored and transparent due to the formation of palladium colloid. changed. A part of this concentrated aqueous solution of palladium colloid and polyvinyl anolecole was transferred to a separate container, diluted with water, cooled to room temperature, and then 5.0% glutaraldehyde was added as a crosslinking agent based on the weight of polyvinyl alcohol. A treatment solution with a concentration of 1.0% was prepared. In this processing liquid. A double yarn (20P''; -8 filament x 2) made of polyvinyl alcohol fiber was immersed for IO minutes, centrifugally dehydrated, air-dried, and then heat-treated at 150°C to obtain the fiber of the present invention. Through this treatment, Although the weight of the fibers increased by 0.7%, the amount of adhesion was so small that the hardening of the texture due to adhesion between the fibers was extremely slight. When immersed in a 5-fold diluted aqueous solution of the company's product name: Bruschmar) at 90"C for 45 minutes with stirring,
Uniform nickel plating can be performed, and the resulting &l fibers are 0,
It showed an electrical resistance value of 3Ω/C. Moreover, regarding the m-fiber of the present invention in this example, cobalt,! li lead, chromium, tin, gold,
Chemical plating with palladium, silver, etc. was also possible using conventional methods. [Example 2] In Example 1, instead of the polyvinyl alcohol used, the same amount of sulfonic acid group was added as 2.2 mole%.
A treatment solution was prepared using sulfonic acid-modified polyvinyl alcohol (manufactured by Nippon Gosei Kagaku Kogyo Co., Ltd., CKS-501) under the same conditions as above. A nylon mtti cloth was immersed in the resulting treatment solution for 7λ, dehydrated, and dried.・When heat treatment was carried out sequentially, uniform nickel plating properties could be imparted as in Example 1. [Example 3] High molecular weight polyethyleneimine (Sogo Yakuko Co., Ltd. 11 210 Ichito) was used as the water-soluble polymer. ) using this 30wL%
0.0% palladium chloride (1.3% by weight of polyethyleneimine) was added to the water wI solution in advance. Dissolve in 1 mol of ammonia carbonate water, add and mix, add water to dilute,
Furthermore, 3.5w% of glycerol diglycidyl ether was added to polyethyleneimine to bring the solid concentration to 0.
.. 9% place J! Solution II was prepared. After immersing a cationic dyeable acrylic long fiber cloth in this solution, it was dried for 11 liters and heat-treated for 7 hours. The fabric thus obtained was prepared in Example 1.
Uniform nickel plating was achieved under the same plating conditions. In addition, in this example, the treatment liquid concentration was adjusted to 5.6%, and this was applied in multiple straight lines along the warp of the acrylic cloth, dried and heat-treated. Only plating was done. [Example 4] Core 1: A polyester fiber having 300 tennies/100 filaments was arranged around the core, and the fiber of the present invention obtained in Example 1 was wound around it 12 times per lcn+. Lam the outer circumference with No. 40 cotton thread.
A cover yarn with a 31W structure was created by wrapping each yarn 10 times. First, 30g/L of nickel sulfate was added. Next■
Phosphoric acid 1G. /L. Sodium acetate10. After nickel plating was carried out by treating the sample in a nickel plating bath consisting of 300 liters at 80°C for 30 minutes, it was washed with water, and then copper plating was applied by using this as a cathode and continuously passing it through an electrolytic copper plating bath. The product thus obtained was plated with only the intermediate layer of the fiber of the present invention, and had an electrical resistance of 0.02 Ω/cm, and the product coated with vinyl was extremely lightweight and strong. Useful as a conductor. In addition. Plating is also possible in the case of a tape fabric using the pre-plated cover yarn of this example as the warp, or a plurality of twisted yarns, and this fact shows that
Is it composed of conductor wires, cords, cables, or any of these manufactured through conventional processes? iI miscellaneous electricity,
This suggests that electronic components can be manufactured rationally using aluminum fiber technology and plating technology. [Example 5] A film containing silver colloid was obtained under the same conditions as in Example 1 except that 0.3 parts of silver nitrate was dissolved in 20 parts of water and added instead of the palladium chloride/ammonia mixed water. Polyvinyl alcohol fibers were obtained. The obtained fibers of the present invention could be plated with copper by conventional methods, but it was difficult to plate them with nickel. [Reference (Fl 1-3) In Examples 1 to 3, the treatment was performed under the same conditions as in Examples 1 to 3, except that a g4I! treatment solution was used without the addition of a crosslinking agent, and nickel plating was performed. Example 2 (nylon) and Example 3 (acrylic fiber) could not be plated at all, and only Example 1 (polyvinyl alcohol AT fiber) could be plated. There were many irregularities and poor adhesion.Furthermore, in both cases, a large number of metal particles were generated in the plating bath, probably due to the catalyst particles being eluted into the plating bath. Patent applicant Nichibi Co., Ltd.

Claims (4)

【特許請求の範囲】[Claims] (1)表面に、パラジウムまたは銀をイオンまたはコロ
イドとして含有し不溶化された親水性高分子の被膜を、
有する化学メッキ用繊維
(1) On the surface, a hydrophilic polymer coating containing palladium or silver as ions or colloids and made insolubilized,
Fiber for chemical plating with
(2)表面にパラジウムまたは銀をイオンまたはコロイ
ドとして含有し不溶化された親水性高分子の被膜を有す
る繊維と、該被膜を持たない繊維との混用物よりなる、
特定繊維のみメッキできる化学メッキ用繊維集合体
(2) Consisting of a mixture of fibers with a coating of an insolubilized hydrophilic polymer containing palladium or silver as ions or colloids on the surface, and fibers without the coating;
Fiber aggregate for chemical plating that can plate only specific fibers
(3)繊維集合体の特定部分に、パラジウムまたは銀を
イオンまたはコロイドとして含有し不溶化された親水性
高分子の被膜を設けてなる、特定部分のみメッキできる
化学メッキ用繊維集合体
(3) A fiber aggregate for chemical plating that can be plated only in a specific part, by providing a coating of an insolubilized hydrophilic polymer containing palladium or silver as an ion or colloid on a specific part of the fiber aggregate.
(4)水溶性高分子と、水溶性パラジウムまたは銀化合
物との混溶水溶液に、必要に応じ還元剤と該水溶性高分
子に対する架橋剤を加えて得られる処理液を、繊維に付
与し乾燥および不溶化を行なうことを特徴とする、特許
請求の範囲第1および第3項記載の繊維または繊維集合
体の製造方法
(4) A treatment liquid obtained by adding a reducing agent and a crosslinking agent for the water-soluble polymer as necessary to a mixed aqueous solution of a water-soluble polymer and a water-soluble palladium or silver compound is applied to the fibers and dried. The method for producing fibers or fiber aggregates according to claims 1 and 3, characterized by carrying out insolubilization.
JP1049897A 1989-03-03 1989-03-03 Fiber for chemical plating and production thereof Pending JPH02229268A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1049897A JPH02229268A (en) 1989-03-03 1989-03-03 Fiber for chemical plating and production thereof

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Application Number Priority Date Filing Date Title
JP1049897A JPH02229268A (en) 1989-03-03 1989-03-03 Fiber for chemical plating and production thereof

Publications (1)

Publication Number Publication Date
JPH02229268A true JPH02229268A (en) 1990-09-12

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Family Applications (1)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0518422A2 (en) * 1991-06-12 1992-12-16 Koninklijke Philips Electronics N.V. Method of selectively metallizing a pattern of a material other than glass on a glass substrate by electroless metallization
US5258435A (en) * 1991-03-13 1993-11-02 Bayer Aktiengesellschaft Palladium-containing polymer composition and a process for its preparation
JP2013047385A (en) * 2011-08-17 2013-03-07 Rohm & Haas Electronic Materials Llc Stable catalyst for electroless metallization
JP2013047386A (en) * 2011-08-17 2013-03-07 Rohm & Haas Electronic Materials Llc Stable tin free catalysts for electroless metallization
JP2013049920A (en) * 2011-08-17 2013-03-14 Rohm & Haas Electronic Materials Llc Stable catalyst for electroless metallization
CN111235875A (en) * 2019-10-14 2020-06-05 四川大学 Silver-plated special-shaped polyvinyl alcohol fiber, and preparation method and application thereof
JP2020526029A (en) * 2017-09-30 2020-08-27 シーアールアールシー チンタオ シーファン カンパニー,リミティッド Nickel-plated carbon fiber film, its manufacturing method, shield structure and its manufacturing method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258435A (en) * 1991-03-13 1993-11-02 Bayer Aktiengesellschaft Palladium-containing polymer composition and a process for its preparation
EP0518422A2 (en) * 1991-06-12 1992-12-16 Koninklijke Philips Electronics N.V. Method of selectively metallizing a pattern of a material other than glass on a glass substrate by electroless metallization
JP2013047385A (en) * 2011-08-17 2013-03-07 Rohm & Haas Electronic Materials Llc Stable catalyst for electroless metallization
JP2013047386A (en) * 2011-08-17 2013-03-07 Rohm & Haas Electronic Materials Llc Stable tin free catalysts for electroless metallization
JP2013049920A (en) * 2011-08-17 2013-03-14 Rohm & Haas Electronic Materials Llc Stable catalyst for electroless metallization
JP2020526029A (en) * 2017-09-30 2020-08-27 シーアールアールシー チンタオ シーファン カンパニー,リミティッド Nickel-plated carbon fiber film, its manufacturing method, shield structure and its manufacturing method
CN111235875A (en) * 2019-10-14 2020-06-05 四川大学 Silver-plated special-shaped polyvinyl alcohol fiber, and preparation method and application thereof
CN111235875B (en) * 2019-10-14 2021-12-28 四川大学 Silver-plated special-shaped polyvinyl alcohol fiber, and preparation method and application thereof

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