JPH02227909A - Conductive paste and manufacture of conductor - Google Patents
Conductive paste and manufacture of conductorInfo
- Publication number
- JPH02227909A JPH02227909A JP4713589A JP4713589A JPH02227909A JP H02227909 A JPH02227909 A JP H02227909A JP 4713589 A JP4713589 A JP 4713589A JP 4713589 A JP4713589 A JP 4713589A JP H02227909 A JPH02227909 A JP H02227909A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- conductor
- circuit pattern
- conductive
- fine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims description 34
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000843 powder Substances 0.000 claims abstract description 27
- 239000002245 particle Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract 3
- 150000002902 organometallic compounds Chemical class 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000007639 printing Methods 0.000 abstract description 13
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 230000000740 bleeding effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 229910000765 intermetallic Inorganic materials 0.000 abstract 2
- 230000008030 elimination Effects 0.000 abstract 1
- 238000003379 elimination reaction Methods 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 239000010931 gold Substances 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 150000002894 organic compounds Chemical class 0.000 description 4
- 238000006864 oxidative decomposition reaction Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000010944 silver (metal) Substances 0.000 description 4
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 3
- 229920002678 cellulose Polymers 0.000 description 3
- 239000001913 cellulose Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229940116411 terpineol Drugs 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000010946 fine silver Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- -1 For example Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Abstract
Description
【発明の詳細な説明】
〔発明の目的コ
（産業上の利用分野）
本発明は電気的な導体の形成に適する導電性ペーストお
よびこの導電性ペーストを用いた導体の形成方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Objective of the Invention (Industrial Application Field) The present invention relates to a conductive paste suitable for forming an electrical conductor and a method for forming a conductor using this conductive paste.
（従来の技術）
導電性ペーストをたとえば、アルミナ基板などセラミッ
ク基板やプラスチックフィルム乃至プラスチック系基板
の所定面に、印刷法などにより塗着し、これを焼成して
所要の導体回路（回路パターンなど）を形成することは
よく知られている。(Prior art) A conductive paste is applied to a predetermined surface of a ceramic substrate such as an alumina substrate, a plastic film, or a plastic substrate by a printing method, and is fired to form a desired conductor circuit (circuit pattern, etc.). It is well known that .
ところでこの種の導電性ペーストとしては、（Ａ）銀−
パラジウム粉末などとガラスフリットとバインダーとを
必須成分として成るもの、（Ｂ）銀粉末などと熱硬化性
樹脂もしくは熱可塑性樹脂（バインダー）とを必須成分
として成るもの、あるいは（Ｃ）有機金属化合物（いわ
ゆるレジネートペースト）が挙げられる。また、これら
導電性ペーストを用いた導体回路の形成は次のように行
われている。すなわち、（Ａ）の銀など金属粉末−ガラ
スフリット系導電性ペーストの場合は、セラミック基板
の所定面に印刷した後、８００℃以上の高温で焼成して
所望の導体回路を形成している。また、（Ｂ）の銀など
金属粉末−樹脂系導電性ぺ一ストの場合は、所定の基板
面もしくはフィルム面に印刷した後、焼成（ただしセラ
ミック基板のとき）もしくは加熱乾燥して所望の導体回
路を形成している。一方、（Ｃ）の有機金属化合物系導
電性ペーストの場合は所定の基板面に印刷した後、６０
０〜８００℃加熱し前記有機金属化合物の分解ににり金
属を析出させて所望の導体回路を形成している。By the way, as this type of conductive paste, (A) silver-
(B) one consisting of palladium powder etc., glass frit and a binder as essential components, (B) one consisting of silver powder etc. and thermosetting resin or thermoplastic resin (binder) as essential components, or (C) organometallic compound ( so-called resinate paste). Further, formation of conductive circuits using these conductive pastes is performed as follows. That is, in the case of (A), a metal powder such as silver-glass frit type conductive paste, after printing on a predetermined surface of a ceramic substrate, it is fired at a high temperature of 800° C. or higher to form a desired conductor circuit. In addition, in the case of (B), a metal powder such as silver-resin conductive paste, after printing on a predetermined substrate surface or film surface, it is fired (for ceramic substrates) or heated and dried to form the desired conductor. forming a circuit. On the other hand, in the case of the organometallic compound-based conductive paste (C), after printing on a predetermined substrate surface,
A desired conductor circuit is formed by heating from 0 to 800°C to decompose the organometallic compound and precipitate the metal.
（発明が解決しようとする課題）
しかし、上記導電性ペーストについては、たとえばＬＳ
Ｉ素子など半導体素子を実装する／Ｘイブリッド回路の
構成や高密度の導体回路構成（微細な配線パターン形成
）などに使用する場合、次のような問題がある。すなわ
ち、（Ａ）の銅など金属粉末−ガラスフリット系導電性
ペーストの場合は、所望の導体回路を形成するには、８
００℃程度以上の高温で焼成する必要があるため、電子
部品を実装した基板や耐熱性の劣る基板への導体回路形
成には適用し得ない。また、（Ｂ）の銅など金属粉末−
樹脂系導電性ペーストの場合は、高々１５０〜２００℃
程度の加熱処理で所望の導体回路を形成し得るが、導体
回路ピッチが１００μ−以下の高密度配線となると印刷
時ニジミを生じて所要の鮮明な導体回路が得られないば
かりでなく、導体回路の細線化に伴い導体回路自体の電
気抵抗が増加する傾向があり、導体回路として充分な機
能を呈し得ないこともしばしばある。さらに、（Ｃ）の
有機金属化合物系導電性ペースト（レジネートペースト
）の場合は、−殻内に粘度が低く流動性に富むため、微
細パターン形成の場合など印刷ニジミが生じ易く、また
加熱分解、気化により形成する金属膜厚が０．２μｍ程
度以下と極めて薄いため、所望の導体回路（電気抵抗の
低い）を形成するには、前記印刷、加熱処理を複数回繰
返す必要がある。このように、上記各導電性ペーストは
、その用途に限界があり、目的、用途によって適宜選択
するとともに、使用においては繁雑な操作も要すると言
う不都合があった。(Problem to be Solved by the Invention) However, regarding the above conductive paste, for example, LS
When used for mounting semiconductor elements such as I elements/X hybrid circuit configurations, high-density conductor circuit configurations (fine wiring pattern formation), the following problems arise. That is, in the case of (A) metal powder such as copper-glass frit based conductive paste, in order to form the desired conductor circuit, 8
Since it is necessary to bake at a high temperature of approximately 00° C. or higher, it cannot be applied to forming conductor circuits on substrates with electronic components mounted or substrates with poor heat resistance. In addition, (B) metal powder such as copper -
In the case of resin-based conductive paste, at most 150-200℃
A desired conductor circuit can be formed with a certain degree of heat treatment, but if the conductor circuit pitch is 100μ or less, high-density wiring will not only cause smearing during printing, making it impossible to obtain the desired clear conductor circuit, but also cause the conductor circuit to As wires become thinner, the electrical resistance of the conductor circuit itself tends to increase, and it often fails to function adequately as a conductor circuit. Furthermore, in the case of (C) organometallic compound-based conductive paste (resinate paste), since the viscosity inside the shell is low and fluidity is high, printing bleeds are likely to occur when forming fine patterns, and thermal decomposition, Since the metal film formed by vaporization is extremely thin, about 0.2 μm or less, it is necessary to repeat the printing and heat treatment multiple times to form a desired conductor circuit (low electrical resistance). As described above, each of the above-mentioned conductive pastes has a limitation in its use, and has the disadvantage that it must be selected appropriately depending on the purpose and use, and requires complicated operations when used.
［発明の構成］
（課題を解決するための手段）
本発明は上記事情に対処してなされたもので、ガラスフ
リットや樹脂などのバインダーを用いずに、平均粒径０
．１μ以下の導電性微粉末と有機金属化合物乃至レジネ
ートペーストとを必須成分としこれらを混練して調製し
た導電性ペーストであり、またこの導電性ペーストを用
いてオゾンを伴う紫外線照射を併用し、鮮明、微細な導
体回路を得ることを骨子とするものである。[Structure of the Invention] (Means for Solving the Problems) The present invention has been made in response to the above-mentioned circumstances.
．． It is a conductive paste prepared by kneading conductive fine powder of 1μ or less and an organometallic compound or resinate paste as essential components.This conductive paste is also used in conjunction with ultraviolet irradiation with ozone to create a clear image. The main idea is to obtain a fine conductor circuit.
（作 用）
本発明に係る導電性ペーストは、粘性の低いＨ機金属化
合物と平均粒径０．１μ以下の導電性微粉末とを少くと
も含有し、さらにセルロースバインダと高沸点溶媒など
を加え混練され、ペースト状に調製されたもので、たと
えばスクリーン印刷などにより容易に微細かつ、鮮鋭な
配線密度の高い回路パターンの形成が可能である。また
、前記印刷形成などした回路パターンに乾燥処理を施し
た後、３００℃以上程度の加熱を施す一方、オゾンを伴
う紫外線照射を併用し、前記有機金属化合物のやセルロ
ースバインダ酸化分解や気化を助長することにより、有
機金属化合物から酸化分解などで析出した金属結着する
バインダーの役目をなし、前記含有混在している導電性
微粉末を一体的に結合して所要の導電性膜を形成する。(Function) The conductive paste according to the present invention contains at least a low-viscosity H metal compound and conductive fine powder with an average particle size of 0.1μ or less, and further contains a cellulose binder, a high boiling point solvent, etc. It is kneaded and prepared into a paste form, and it is possible to easily form fine, sharp circuit patterns with high wiring density by, for example, screen printing. In addition, after drying the printed circuit pattern, it is heated to a temperature of about 300°C or higher, and UV irradiation with ozone is used in combination to promote oxidative decomposition and vaporization of the organometallic compound and cellulose binder. By doing so, it acts as a binder for binding metals precipitated by oxidative decomposition or the like from organometallic compounds, and integrally binds the mixed conductive fine powders to form a desired conductive film.
（実施例）
以下本発明の詳細な説明する。本発明に係る平均粒径０
．１μ■以下の導電性微粉末と有機金属化合物とを必須
の組成分して成る導電性ペーストは、次のようにして容
品に調製される。すなわち、所要の有機金属化合物とセ
ルロースバインダや高沸点溶媒たとえばテレピネオール
とを混合して成る粘度３０．０００〜５０．０００セン
チボイズ程度のレジネートペースト、たとえば金（Ａｕ
）を約２４％含むレジネートペースト２５ｆｆｌ ！ｉ
１％と、真空蒸発法やガスプラズマなどで得られた平均
粒径０．ｌμ霧以下の導電性微粉末、たとえば銀（Ａｇ
）微粉末７５重量％とを混合し、混練することにより、
見掛上高粘度で印刷などによって所要の導体回路パター
ンなどの形成に適する導電性ペーストが得られる。(Example) The present invention will be described in detail below. Average particle size according to the present invention: 0
．． A conductive paste consisting essentially of a conductive fine powder of 1 .mu.m or less and an organometallic compound is prepared into a container as follows. That is, a resinate paste having a viscosity of about 30,000 to 50,000 centiboise, made by mixing a required organometallic compound with a cellulose binder and a high boiling point solvent such as terpineol, such as gold (Au
) 25ffl of resinate paste containing about 24%! i
1%, and the average particle size obtained by vacuum evaporation method, gas plasma, etc. is 0. Conductive fine powder of less than lμ mist, such as silver (Ag
) by mixing and kneading 75% by weight of fine powder,
A conductive paste with apparently high viscosity and suitable for forming a required conductor circuit pattern by printing or the like can be obtained.
次に上記調製した導電性ペーストを用い導体回路を形成
する例を説明すると、たとえばセラミッり基板の所定面
に厚さ２０μ■の電鋳によるニッケルマスクを介し、ピ
ッチ間隔１００μｍ以下として回路パターンを印刷法に
より被着形成して乾燥させ、前記レジネートペースト成
分中の溶媒を揮散させた後、空気中５００〜７５０℃で
加熱処理したところ、レジネートペースト成分の一部を
成す有機金属化合物の酸化分解によって析出した金（＾
Ｕ）で、前記銀（八ｇ）微粉末を結合一体化して成る電
気抵抗の低い、鮮鋭な微細回路パターンが形成された。Next, to explain an example of forming a conductor circuit using the conductive paste prepared above, for example, a circuit pattern is printed on a predetermined surface of a ceramic substrate with a pitch interval of 100 μm or less through an electroformed nickel mask with a thickness of 20 μm. After the resinate paste component was deposited and dried, and the solvent in the resinate paste component was volatilized, the resinate paste component was heated at 500 to 750°C in the air. Precipitated gold (＾
In U), a sharp fine circuit pattern with low electrical resistance was formed by bonding and integrating the silver (8 g) fine powder.
一方、上記５００〜７５０℃での加熱処理に代えて、た
とえば１８４．９ｎｓと２５３．７ｒｖの波長をもつ紫
外線放射を併用すると、前記レジネートペースト成分の
一部を成す有機金属化合物の酸化分解を、３００℃〜５
００℃程度の温度で行うことができる。On the other hand, when ultraviolet radiation having a wavelength of 184.9 ns and 253.7 rv is used in place of the heat treatment at 500 to 750° C., the oxidative decomposition of the organometallic compound forming a part of the resinate paste components can be reduced. 300℃～5
It can be carried out at a temperature of about 00°C.
つまり、前記紫外線放射を併用すれば、オゾンの発生を
伴い有機金属化合物の酸化分解が容易に進行し、金（Ａ
ｕ）が析出し銀（Ａｇ）微粉末を結合−体化して電気抵
抗の低い、鮮鋭な微細回路パターンを形成し得る。この
ように、バインダー的な機能を成す有機金属化合物の酸
化分解を、３００℃〜５００℃程度の温度で行ない得る
ことは、たとえば半導体素子を実装して成る回路部品の
構成などにおいて、所要の導体回路パターンもしくは導
体領域を形成する場合、前記実装した半導体素子などに
対する熱的な影響を大幅に低減し得ることになる。In other words, if the ultraviolet radiation is used in combination, the oxidative decomposition of organometallic compounds will easily proceed with the generation of ozone, and gold (A
u) can precipitate and bind fine silver (Ag) powder to form a sharp fine circuit pattern with low electrical resistance. The ability to oxidize and decompose organometallic compounds that function as binders at temperatures of about 300°C to 500°C means that, for example, in the construction of circuit components made up of semiconductor elements, it is possible to When forming a circuit pattern or a conductor region, the thermal influence on the mounted semiconductor elements and the like can be significantly reduced.
さらに具体的に実施例を説明すると、最少ピッチ約１０
０μ■のアルミニウムパッド（約８０μ−角）が形成さ
れたＩＣチップを用意し、金レジネートペースト（金と
して２５％含有）５０重量％と平均粒径０，１μ−の銀
微粉末（導電性微粉末） ５０重量％とを混練して調製
したものを印刷ペーストし、印刷穴の直径が８０μ−で
あるニッケルスクリーンマスクで印刷して、前記アルミ
ニウムパッド上にペーストを印刷、被着した。次いで１
２０℃にて１時間乾燥後、徐々に昇温しで約３００℃で
の加熱とともに、オゾンを伴う紫外線照射を行ない第１
図に示すように印刷電極を設けたＩＣチップを得た。To explain an example more specifically, the minimum pitch is about 10
An IC chip on which a 0 μ■ aluminum pad (approximately 80 μ square) was prepared was prepared, and 50% by weight of gold resinate paste (containing 25% gold) and fine silver powder (conductive fine powder with an average particle size of 0.1 μ) were prepared. A printing paste was prepared by kneading 50 wt. then 1
After drying at 20°C for 1 hour, the temperature was gradually increased to about 300°C, and ultraviolet rays accompanied by ozone were irradiated.
An IC chip provided with printed electrodes as shown in the figure was obtained.
第１図において、１はＩＣチップ本体、２はアルミニウ
ムパッド、３は印刷電極であり、この印刷電極３はＩＣ
チップ本体１を外部回路基板の接点電極に当接する接点
として機能するものである。In FIG. 1, 1 is an IC chip body, 2 is an aluminum pad, and 3 is a printed electrode.
The chip main body 1 functions as a contact that contacts a contact electrode of an external circuit board.
なお、上記例では有機金属化合物として金（Ａｕ）の有
機化合物を用い、かつ高沸点溶媒としてのテレピネオー
ルとを混合してレジネートペーストの形で用いたが、前
記金（Ａｕ）の有機化合物の代りにたとえば、銀（Ａｇ
） 、パラジウム（Ｐｄ） 、白金（ＰＬ）などの有機
化合物を用いてもよく、またこれらは２種以上の混合系
で使用してもよい。たとえば、被印刷基板に対する付着
性をよくするため、白金（Ｐｔ）の有機化合物を併用し
ても差支えない。さらに、これら有機金属化合物をレジ
ネートペーストの形で用いるに当り使用する高沸点溶媒
としては前記テレピネオールの他、たとえばブチルカル
ピトール、エチレングリコールモノブチルエーテルなど
であってもよい。しかして、この種のレジネートペース
トは、たとえば（株）ノリタケカンパニーリミテッドや
西進商事（株）などから既に市販されているが、前記有
機金属化合物は、上記レジネートペーストの形で必ずし
も使用する必要はない。つまり、前記有機金属化合物を
導電性微粉末を含む従来形式の印刷ペーストに加えても
よい。In the above example, an organic compound of gold (Au) was used as the organometallic compound, and terpineol as a high boiling point solvent was mixed and used in the form of a resinate paste, but instead of the organic compound of gold (Au), For example, silver (Ag
), palladium (Pd), platinum (PL), and other organic compounds may be used, or two or more of these may be used in a mixed system. For example, in order to improve adhesion to the substrate to be printed, an organic compound of platinum (Pt) may be used in combination. Further, when using these organometallic compounds in the form of a resinate paste, the high boiling point solvent used may be, in addition to the above-mentioned terpineol, for example, butyl calpitol, ethylene glycol monobutyl ether, and the like. Although this type of resinate paste is already commercially available from, for example, Noritake Company Limited and Seishin Shoji Co., Ltd., the organometallic compound does not necessarily need to be used in the form of the resinate paste. . That is, the organometallic compound may be added to a conventional type of printing paste containing electrically conductive fine powder.
本発明に係る導電性ペーストの他の必須成分を成す導電
性微粉末としては、前記銀（Ａｇ）微粉末の代りに金（
Ａｕ）、パラジウム（Ｐｄ） 、白金（Ｐｔ）銅（Ｃｕ
） 、ニッケル（旧）、ルテニウム（Ｒｈ）。The conductive fine powder constituting the other essential component of the conductive paste according to the present invention may be replaced with gold (Ag) fine powder.
Au), palladium (Pd), platinum (Pt), copper (Cu
), nickel (old), ruthenium (Rh).
アルミニウム（Ａ Ｉ ） 、モリブデン（Ｎｏ） 、
タングステン（ｗ）、クロム（Ｃｒ）、インジウム（１
ｎ）チタン（ＴＩ）、カーボン（Ｃ）などが挙げ°られ
る。しかして、これらの微粉末は１種もしくは２種以上
の混合系で使用してもよいが、その平均粒度は０．１μ
霞以下に選択する必要がある。すなわち、平均粒度が０
．１μｍ以下でないと、１００μ自ピツチの微細パター
ンにおいて所要の電気抵抗の低い導体回路乃至所要膜厚
の導体回路（パターン）を容易に形成し得ないからであ
る。Aluminum (AI), molybdenum (No),
Tungsten (w), chromium (Cr), indium (1
n) Titanium (TI), carbon (C) and the like. However, these fine powders may be used alone or in a mixed system of two or more, but the average particle size is 0.1μ.
Must be selected below haze. That is, the average particle size is 0
．． This is because if the thickness is less than 1 μm, a conductor circuit (pattern) with a required low electrical resistance or a conductor circuit (pattern) with a required film thickness cannot be easily formed in a fine pattern with a pitch of 100 μm.
さらに、本発明に係る導電性ペーストにおいて、前記有
機金属化合物と導電性微粉末との組成比は、最終的に形
成しようとする導電回路パターンの特性などを考慮して
選択されるが、−殻内に有機金態化合物は金属として５
〜１５重量％程度、導電性微粉末８５〜９５′重量％程
度の焼成物になるように選択される。また、上記形成す
る導体乃至導体四路の特性たとえば、抵抗値、耐熱性１
機械的な強度などの調整もしくは向上などのため、たと
えばアルミナ（Ａｌ１０３ ）などの酸化物微粉末、炭
化ケイ素（！３１Ｃ）などの炭化物微粉末、窒化アルミ
ニウム（ＡＩＮ ）などの窒化物微粉末を適宜添加配合
してもよい。Furthermore, in the conductive paste according to the present invention, the composition ratio of the organometallic compound and the conductive fine powder is selected in consideration of the characteristics of the conductive circuit pattern to be finally formed. Organometallic compounds are included as metals in 5
15% by weight, and 85 to 95'% by weight of conductive fine powder. In addition, the characteristics of the conductor or four conductor paths formed above, such as resistance value, heat resistance 1
In order to adjust or improve mechanical strength, etc., fine oxide powder such as alumina (Al103), fine carbide powder such as silicon carbide (!31C), fine nitride powder such as aluminum nitride (AIN), etc., may be used as appropriate. It may be added and blended.
［発明の効果］
上記説明から分るように、本発明に係る導電性ペースト
および導体の形成方法によれば、１００μ膳ピッチ以下
の高密度配線の回路パターンなど容易に形成し得るし、
またこの回路パターンなどの形成に当り高温焼成も要し
ないため、他の電子部品に対する熱的な影響も軽減でき
る。すなわち、樹脂を含有していないので、回路パター
ンの印刷形成においてもニジミなどを生じ難い。したが
って微細でかつ、鮮鋭な配線パターンを容易に形成でき
る。また、バインダーとしてガラスフリットを含有して
いないので、８００℃以上の高温焼成も不要となる。し
たがって被回路パターン形成基板の選択自由度が高くな
るばかりでなく、たとえば実装回路部品の構成に適用し
た場合も他の電子部品に対する熱的影響を大幅に低減し
得る。しかも、上記形成される導体回路パターン乃至導
体は、主として導電性微粉末によって形成されるため、
１回の印刷、加熱処理工程でも電気抵抗の低い所要の特
性を保持している。特に所要の導体を形成するため、前
記加熱処理するとき、オゾンを伴う紫外線照射を併用す
ると、さらに低温での加熱処理で足りる。かくして、本
発明に係る導電性ペーストおよびこの導電性ペーストに
より所要の導体形成に当り紫外線照射を併用する導体の
形成方法は繁雑な操作など要しないこと、微細でかつ、
所要の鮮鋭な配線パターン乃至導体を確実に得られるこ
とと相俟って実用上多くの利点をもたらすものと言える
。[Effects of the Invention] As can be seen from the above description, according to the conductive paste and the method for forming a conductor according to the present invention, it is possible to easily form a high-density wiring circuit pattern with a pitch of 100 μm or less,
Furthermore, since high-temperature firing is not required to form this circuit pattern, the thermal influence on other electronic components can be reduced. That is, since it does not contain resin, it is unlikely to cause bleeding or the like when printing a circuit pattern. Therefore, a fine and sharp wiring pattern can be easily formed. Furthermore, since it does not contain glass frit as a binder, high-temperature firing at 800° C. or higher is not necessary. Therefore, not only is there a high degree of freedom in selecting the substrate on which the circuit pattern is formed, but also, for example, when applied to the configuration of mounted circuit components, the thermal influence on other electronic components can be significantly reduced. Moreover, since the conductor circuit pattern or conductor formed above is mainly formed of conductive fine powder,
It maintains the required characteristic of low electrical resistance even after a single printing and heat treatment process. In particular, in order to form the required conductor, when performing the heat treatment, if UV irradiation accompanied by ozone is used in combination, the heat treatment at a lower temperature is sufficient. Thus, the conductive paste according to the present invention and the method of forming a conductor using ultraviolet irradiation in forming a required conductor using this conductive paste do not require complicated operations, are fine and
Together with the ability to reliably obtain the required sharp wiring patterns or conductors, this can be said to bring about many practical advantages.
第１図は本発明に係る導電性ペーストを適用したＩＣチ
ップを示す斜視図である。
１・・・・・・ＩＣチップ本体
２・・・・・・アルミニウムパッド
３・・・・・・印刷電極
２ アルミニウムｌぐ・ノド
出願人 株式会社 東芝FIG. 1 is a perspective view showing an IC chip to which a conductive paste according to the present invention is applied. 1...IC chip body 2...Aluminum pad 3...Printed electrode 2 Aluminum lug/node Applicant: Toshiba Corporation
Claims (2)
と有機金属化合物とを含有する混練物から成ることを特
徴とする導電性ペースト。(1) A conductive paste comprising a kneaded material containing at least a conductive fine powder with an average particle size of 0.1 μm or less and an organometallic compound.
化合物とを含有する混練物から成る導電性ペーストを基
体面上に塗布し、乾燥塗膜を得る工程と、前記乾燥塗膜
に３００℃以上の加熱を施しながらオゾンを伴う紫外線
を照射し、前記有機金属化合物を分解させ析出した金属
で結着した導体を形成することを特徴とする導体の形成
方法。(2) a step of applying a conductive paste made of a kneaded material containing a conductive fine powder with an average particle size of 0.1μ or less and an organometallic compound onto a substrate surface to obtain a dry coating film; and a step of obtaining a dry coating film. A method for forming a conductor, which comprises irradiating the organometallic compound with ultraviolet rays accompanied by ozone while heating at 300° C. or higher to decompose the organometallic compound and form a conductor bound by the precipitated metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4713589A JPH02227909A (en) | 1989-02-28 | 1989-02-28 | Conductive paste and manufacture of conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4713589A JPH02227909A (en) | 1989-02-28 | 1989-02-28 | Conductive paste and manufacture of conductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02227909A true JPH02227909A (en) | 1990-09-11 |
Family
ID=12766679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4713589A Pending JPH02227909A (en) | 1989-02-28 | 1989-02-28 | Conductive paste and manufacture of conductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02227909A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004180217A (en) * | 2002-11-29 | 2004-06-24 | Toppan Printing Co Ltd | Method for forming radio tag and antenna for radio tag |
| JP2006336075A (en) * | 2005-06-02 | 2006-12-14 | Ulvac Japan Ltd | Dispersed liquid, method for producing dispersed liquid, and method for producing reflector |
| JP2013216931A (en) * | 2012-04-05 | 2013-10-24 | Ulvac Japan Ltd | Metal fine particle dispersion liquid |
-
1989
- 1989-02-28 JP JP4713589A patent/JPH02227909A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004180217A (en) * | 2002-11-29 | 2004-06-24 | Toppan Printing Co Ltd | Method for forming radio tag and antenna for radio tag |
| JP2006336075A (en) * | 2005-06-02 | 2006-12-14 | Ulvac Japan Ltd | Dispersed liquid, method for producing dispersed liquid, and method for producing reflector |
| JP2013216931A (en) * | 2012-04-05 | 2013-10-24 | Ulvac Japan Ltd | Metal fine particle dispersion liquid |
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