JPH0222361A - Silicone composition for releasing - Google Patents
Silicone composition for releasingInfo
- Publication number
- JPH0222361A JPH0222361A JP17338988A JP17338988A JPH0222361A JP H0222361 A JPH0222361 A JP H0222361A JP 17338988 A JP17338988 A JP 17338988A JP 17338988 A JP17338988 A JP 17338988A JP H0222361 A JPH0222361 A JP H0222361A
- Authority
- JP
- Japan
- Prior art keywords
- silicone composition
- silicone
- release
- microcapsules
- organopolysiloxane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 63
- 239000000203 mixture Substances 0.000 title claims abstract description 38
- 239000003094 microcapsule Substances 0.000 claims abstract description 22
- 239000002245 particle Substances 0.000 claims abstract description 10
- -1 polysiloxane Polymers 0.000 claims abstract description 10
- 239000012528 membrane Substances 0.000 claims abstract description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 3
- 239000007795 chemical reaction product Substances 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 9
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 125000005372 silanol group Chemical group 0.000 claims description 2
- 239000004215 Carbon black (E152) Substances 0.000 abstract description 3
- 229930195733 hydrocarbon Natural products 0.000 abstract description 3
- 150000002430 hydrocarbons Chemical class 0.000 abstract description 3
- 229920001843 polymethylhydrosiloxane Polymers 0.000 abstract description 3
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 2
- 238000009835 boiling Methods 0.000 abstract description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 229920002554 vinyl polymer Polymers 0.000 abstract description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 230000000694 effects Effects 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 239000000839 emulsion Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000004005 microsphere Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000011086 glassine Substances 0.000 description 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- CRSOQBOWXPBRES-UHFFFAOYSA-N neopentane Chemical compound CC(C)(C)C CRSOQBOWXPBRES-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920006268 silicone film Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は剥離用シリコーン組成物に関し、特に滑り防止
性を付与した剥離用シリコーン組成物に関する。DETAILED DESCRIPTION OF THE INVENTION "Industrial Application Field" The present invention relates to a release silicone composition, and particularly to a release silicone composition imparted with anti-slip properties.
「従来の技術」
従来、一般の紙、フィルム等の基材表面に加熱硬化性オ
ルガノポリシロキサン組成物の層を設け、これら基材と
粘着性物質との剥離を容易にしたり、基材同士の密着を
防止する事は公知であり、このオルガノポリシロキサン
組成物としてはその硬化反応の機構から、例えば付加反
応型のものと縮合反応型のものが知られている。``Prior Art'' Conventionally, a layer of a heat-curable organopolysiloxane composition is provided on the surface of a base material such as general paper or film to facilitate the peeling of adhesive substances from these base materials, or to facilitate the separation of base materials from each other. It is known to prevent adhesion, and organopolysiloxane compositions are known to be of the addition reaction type and condensation reaction type, depending on the curing reaction mechanism.
しかし、現在知られている剥離用シリコーン組成物の大
半は、゛粘着ラベルやテープ等の様に剥離力の小さい用
途には好適に使用されるが、−１Ｇに摩擦係数が小さい
ために、例えば粘着テープで梱包された荷物を重ねて置
いた場合シリコーン同士が接触し、荷滑りが起こり易い
といった欠点を有している。上記欠点を改善する為に、
剥離用シリコーン組成物中のシロキサンのケイ素原子に
結合するフェニル基やアルキル基等の各種有機基の選択
、各成分の配合比の変更等や上記シリコーン組成物にウ
レタン樹脂、メラミン樹脂或いはシリカ等の充填剤を配
合することが行われているが、剥離性、残留接着性が損
なわれ、必ずしも満足のいく結果が得られていないのが
現状である。However, most of the currently known release silicone compositions are suitable for applications with low release force such as adhesive labels and tapes, but because of their low coefficient of friction of -1G, for example, When packages packed with adhesive tape are stacked on top of each other, the silicone particles come into contact with each other, making it easy for the packages to slip. In order to improve the above drawbacks,
Selection of various organic groups such as phenyl groups and alkyl groups bonded to the silicon atom of siloxane in the release silicone composition, change of the blending ratio of each component, and addition of urethane resin, melamine resin, silica, etc. to the above silicone composition Although fillers have been incorporated, the present situation is that the releasability and residual adhesion are impaired and satisfactory results are not always obtained.
「発明が解決しようとする課題」
かかる現状に鑑み、本発明者等はシリコーンの滑り防止
について鋭意研究した結果、オルガノポリシロキサンを
主成分とするシリコーン組成物中に特定の粒子径を有す
る中空マイクロカプセルを添加することにより、剥離性
、残留接着性を損なうことなく、摩擦が大きくなり、滑
りが抑制されることを見出し本発明を完成するに至った
。``Problems to be Solved by the Invention'' In view of the current situation, the present inventors have conducted intensive research on the slip prevention of silicone, and have found that hollow microspheres having a specific particle size are contained in a silicone composition containing organopolysiloxane as a main component. The present inventors have discovered that by adding capsules, friction is increased and slippage is suppressed without impairing releasability or residual adhesion, and the present invention has been completed.
「課題を解決する為の手段」
本発明は、オルガノポリシロキサンを主成分とする剥離
用シリコーン組成物において、該組成物中に、平均粒子
径が１０μｍ以上の中空マイクロカプセルを含有させた
ことを特徴とする剥離用シリコーン組成物である。"Means for Solving the Problems" The present invention provides a release silicone composition containing organopolysiloxane as a main component, in which hollow microcapsules having an average particle diameter of 10 μm or more are contained in the composition. This is a unique release silicone composition.
「作用」
本発明において使用される中空マイクロカプセルとして
は、公知の方法によって得られるものを挙げることがで
きるが、とりわけ、熱可塑性樹脂を壁膜とする中空マイ
クロカプセルが好ましく、例えば特開昭６２−３３６３
３に記載されているような芯物質として、例えばｎ−ブ
タン、ｉ−ブタン、ネオペンタン、ペンタンの様な低沸
点の炭化水素を含有し、壁膜として塩化ビニリデン、ア
クリロニトリル、メチルメタクリレートの様な（メタ）
アクリル酸エステル、スチレンの様な芳香族ビニル化合
物を主成分とする熱可塑性樹脂を有する発泡性マイクロ
カプセルが好ましい。"Function" The hollow microcapsules used in the present invention include those obtained by known methods, but particularly preferred are hollow microcapsules whose walls are made of thermoplastic resin, for example, JP-A-62 -3363
The core material as described in Section 3 contains a low-boiling hydrocarbon such as n-butane, i-butane, neopentane, pentane, and the wall material contains a hydrocarbon such as vinylidene chloride, acrylonitrile, methyl methacrylate. Meta)
Expandable microcapsules containing a thermoplastic resin containing an aromatic vinyl compound such as acrylic acid ester or styrene as a main component are preferred.
本発明において使用される中空マイクロカプセルは、平
均粒子径が１０μｍ以上のものであるが、発泡性マイク
ロカプセルを使用する場合には発泡した後の平均粒子径
が１０μｍ以上となるものが選択される。The hollow microcapsules used in the present invention have an average particle diameter of 10 μm or more, but when using foamable microcapsules, those with an average particle diameter of 10 μm or more after foaming are selected. .
本発明においては、平均粒子径が１０μｍ以上の中空マ
イクロカプセルであれば滑り防止に効果が認められるが
、とりわけ、２０〜５００μｍの平均粒子径を有する中
空マイクロカプセルが滑り防止効果とシリコーンとの分
散性の点で特に好ましい。In the present invention, hollow microcapsules with an average particle size of 10 μm or more are effective in preventing slipping, but in particular, hollow microcapsules with an average particle size of 20 to 500 μm have an anti-slip effect and dispersion with silicone. It is particularly preferable in terms of properties.
因みに、１０μｍ未満では滑り抑制効果が十分でなく、
一方５００μｍを越えると分散性が低下し、本発明の所
望とする効果が発揮されない。Incidentally, if the thickness is less than 10 μm, the slip suppression effect is not sufficient;
On the other hand, if it exceeds 500 μm, the dispersibility decreases and the desired effect of the present invention cannot be achieved.
上記の如きマイクロカプセルの具体例としては、例えば
マツモトマイクロスフエ：Ｆ−３ｏ、Ｆ−５０、Ｆ−８
０（松本油脂製）、エクスパンセルＷＵ−６４２、ＷＵ
−５５１、ＷＵ−４６１、ＤＵ−５５１、ＤＵ−４６１
（日本フィライト製）等が倒起される。Specific examples of the above-mentioned microcapsules include, for example, Matsumoto Microspheres: F-3o, F-50, F-8.
0 (manufactured by Matsumoto Yushi), Expancel WU-642, WU
-551, WU-461, DU-551, DU-461
(manufactured by Nippon Philite) etc. are lifted up.
また、本発明において用いられる剥離用シリコーンとし
ては、メチルハイドロジエンシロキサンとビニル基含有
ポリシロキサンの付加反応を利用した付加型シリコーン
組成物、及びメチルハイドロジエンシロキサンとシラノ
ール基含有ポリシロキサンの縮合反応を利用した縮合型
シリコーン組成物の二種型が好ましい。In addition, the release silicone used in the present invention includes an addition type silicone composition that utilizes an addition reaction between methylhydrogensiloxane and a vinyl group-containing polysiloxane, and an addition type silicone composition that utilizes a condensation reaction between methylhydrogensiloxane and a silanol group-containing polysiloxane. Two types of condensed silicone compositions are preferred.
これらのシリコーンは水に分散させたエマルジョン型か
トルエン等の有機溶剤に溶解した溶液型或いは水又は有
機溶剤を含まない無溶剤型として用いられる。These silicones are used in the form of an emulsion dispersed in water, a solution type dissolved in an organic solvent such as toluene, or a non-solvent type containing no water or organic solvent.
このようなシリコーン組成物の具体例としては、例えば
ＫＭ−７６３、ＫＭ−７６４Ｅ、 ＫＳ−７７０、ＫＳ
−７０９（信越シリコーン製） 、５Ｍ−７２７０、Ｓ
Ｍ−７２７３，５ＲＸ−２１１，５ＲＸ−３４５，５
ＲＸ−２４４，５ＲＸ−２９０、ＢＹ−１４−４１３、
ＢＹ−１４−４０５、Ｓ Ｐ−７２５９、Ｓ Ｐ −７
２６８（東しシリコーン製）等が挙げられる。Specific examples of such silicone compositions include, for example, KM-763, KM-764E, KS-770, KS
-709 (manufactured by Shin-Etsu Silicone), 5M-7270, S
M-7273,5RX-211,5RX-345,5
RX-244, 5RX-290, BY-14-413,
BY-14-405, SP-7259, SP-7
268 (manufactured by Toshi Silicone), etc.
本発明における剥離用シリコーン組成物は、上記の如き
エマルジョン型、溶液型或いは無溶剤型等のシリコーン
に中空マイクロカプセルを分散させたものである。The release silicone composition of the present invention has hollow microcapsules dispersed in the above-mentioned emulsion type, solution type, or non-solvent type silicone.
このようにして調製された剥離用シリコーン組成物の塗
液は適宜基材に塗布乾燥してシリコーン皮膜を形成させ
剥離剤として目的とする用途に供される。この場合、剥
離用シリコーンとしてその効果を十分に発揮させるため
には、シリコーンの架橋反応が十分に行われていること
が重要である。The coating liquid of the silicone release composition prepared in this way is applied to a base material as appropriate and dried to form a silicone film, which is then used for the intended use as a release agent. In this case, in order to fully exhibit its effect as a release silicone, it is important that the crosslinking reaction of the silicone is sufficiently carried out.
架橋反応が不十分な場合には剥離性や残留接着性が低下
し、所望の効果が得られない。従って、架橋反応を進行
させるために、付加型のシリコーンにあっては、白金系
或いはロジウム系の触媒を、また、縮合型のシリコーン
にあっては、有機スズ系の触媒を使用し、通常１００〜
２００℃で乾燥するのが望ましく、とりわけエマルジョ
ン型においては高温乾燥が要求される。その際、使用さ
れる中空マイクロカプセルが加熱発泡性の場合にはカプ
セル壁膜の軟化点より５〜６０℃高い温度で乾燥するこ
とが望ましい。If the crosslinking reaction is insufficient, releasability and residual adhesion will decrease, making it impossible to obtain the desired effect. Therefore, in order to advance the crosslinking reaction, a platinum-based or rhodium-based catalyst is used for addition-type silicones, and an organotin-based catalyst is used for condensation-type silicones. ~
It is desirable to dry at 200° C., and especially in emulsion type, high temperature drying is required. In this case, if the hollow microcapsules used are heat-foamable, it is desirable to dry them at a temperature 5 to 60° C. higher than the softening point of the capsule wall membrane.
なお、中空マイクロカプセルは、シリコーンに対して０
．３〜３０重量％、より好ましくは１〜１５重量％都心
の範囲で含有せしめられる。因みに、３０重量％を越え
ると滑り抑制効果は十分あるもののシリコーンとマイク
ロカプセルとの接着性が悪くなり、剥離性及び残留接着
性が低下する。又、０゜３重量％未満の場合には、その
効果が少なく、所望の結果を期待できない。In addition, hollow microcapsules have a 0% resistance to silicone.
．． It is contained in the range of 3 to 30% by weight, more preferably 1 to 15% by weight in urban areas. Incidentally, if the amount exceeds 30% by weight, although the slip suppression effect is sufficient, the adhesion between the silicone and the microcapsules deteriorates, resulting in a decrease in releasability and residual adhesion. Furthermore, if the amount is less than 0.3% by weight, the effect will be small and the desired results cannot be expected.
次に、本発明において使用するシリコーン組成物をシー
ト状基材に塗布する方法について述べる。Next, a method for applying the silicone composition used in the present invention to a sheet-like base material will be described.
先ず、シリコーン組成物の塗布量としては０．２８ｇ／
ｍ”、より好ましくは０．５〜５ ｇ／ｍ”程度である
＊０．２ｇ／ｍ”未満の場合には剥離性が低下し、８
ｇ／ｍ”を越えるとその効果が飽和しコスト的に不利と
なる。First, the amount of silicone composition applied was 0.28 g/
m", more preferably about 0.5 to 5 g/m" *If it is less than 0.2 g/m", the releasability decreases
If it exceeds "g/m", the effect will be saturated and it will be disadvantageous in terms of cost.
又、基材としてはグラシン紙、ポリエチレンラミネート
紙、クレーコート紙、合成紙、各種フィルム、金属箔等
従来公知公用のものをそのまま使用でき、特に限定され
るものではない。Further, as the base material, conventionally known and publicly used materials such as glassine paper, polyethylene laminate paper, clay coat paper, synthetic paper, various films, and metal foils can be used as they are, and are not particularly limited.
シリコーン組成物を基材へ塗布する方法としては、従来
公知の方法、例えばバーコーター、グラビアコーター等
の塗布装置によって行われる。The silicone composition can be applied to the substrate by a conventionally known method, for example, using a coating device such as a bar coater or a gravure coater.
「実施例」
以下、本発明を実施例を挙げて説明するが、必ずしも、
これらに限定されるものではない。なお、特に断らない
限り、例中の「部」及び「％」はそれぞれ「重量部」及
び「重量％」を示す。"Examples" The present invention will be described below with reference to Examples, but it is not necessary to
It is not limited to these. Note that unless otherwise specified, "parts" and "%" in the examples indicate "parts by weight" and "% by weight," respectively.
実施例１
下記組成の剥離用シリコーン組成物を調製し、この組成
物を米坪６０ｇ／ｍ”のグラシン紙に乾燥重量が２ｇ／
ｍ２になるようにワイヤーバーで塗布後、１７０℃で４
０秒間乾燥して剥離シートを得た。Example 1 A release silicone composition having the following composition was prepared, and this composition was coated on glassine paper with a dry weight of 2 g/m2.
After coating with a wire bar to a thickness of m2,
It was dried for 0 seconds to obtain a release sheet.
ＫＭ−７６４Ｅ（エマルジョン型シリコーン／（８Ｍシ
リコーン製）４０部
マツモトマイクロスフェアＦ−８０（発泡性マイクロカ
プセル／松本油脂製）０．４部
Ｃ−ＰＭ−４Ｐ（ＫＭ−７６４Ｅ用架橋触媒）４部
氷酢酸 ０．１部水
５６部このようにし
て得た剥離シートに、３１Ｂテープ（日東電工製）を貼
り合わせて粘着シート／剥離シート積層体を得た。KM-764E (emulsion type silicone/(manufactured by 8M silicone) 40 parts Matsumoto Microsphere F-80 (expandable microcapsule/manufactured by Matsumoto Yushi) 0.4 parts C-PM-4P (crosslinking catalyst for KM-764E) 4 parts Glacial acetic acid 0.1 part water
56 parts A 31B tape (manufactured by Nitto Denko) was attached to the thus obtained release sheet to obtain an adhesive sheet/release sheet laminate.
実施例２
下記組成の剥離用シリコーン組成物を調製し、これを米
坪７０ｇ／ｍ”のポリエチレンラミネート紙に乾燥塗布
量が０．８ ｇ／ｍ２になるようにワイヤーバーで塗布
し、１１０℃で６０秒間乾燥して剥離シートを得た。Example 2 A release silicone composition having the following composition was prepared, and it was coated on polyethylene laminate paper with a 70 g/m" weight using a wire bar so that the dry coating amount was 0.8 g/m2, and heated at 110°C. The film was dried for 60 seconds to obtain a release sheet.
Ｋ Ｓ−７７０（溶液型シリコーン／信越シリコーン製
） ４０部エクスパンセルＤＵ
−５５１（発泡性マイクロカプセル／日本フィライトＭ
） １．２部Ｐ Ｌ −３（Ｋ Ｓ−７７０用架橋触媒
）０．４部トルエン ６０部上
記の如くして得た剥離シートにアクリルエマルション型
粘着剤二カゾールＴ Ｓ −６６２（日本、’７−バイ
ト製）を乾燥塗布量が２０ｇ／ｍ２になるようにワイヤ
ーバーで塗布し、１１０℃で９０秒間乾燥後、キャスト
コート紙をラミネートして粘着シート／ｆＪ１離シート
積層体を得た。K S-770 (solution type silicone/manufactured by Shin-Etsu Silicone) 40 parts Expancel DU
-551 (Expandable Microcapsule/Nippon Phyllite M
) 1.2 parts PL-3 (crosslinking catalyst for KS-770) 0.4 parts toluene 60 parts Acrylic emulsion type adhesive Nikazole TS-662 (Japan, ' 7-Bite) was applied with a wire bar to a dry coating amount of 20 g/m2, and after drying at 110°C for 90 seconds, cast coat paper was laminated to obtain an adhesive sheet/fJ1 release sheet laminate.
比較例１
実ｈｆｄ＋Ｈにおいて、マツモトマイクロスフェアＦ−
８０を用い無かった以外は実施例１と同様にして粘着シ
ート／剥離シート積層体を得た。Comparative Example 1 In actual hfd+H, Matsumoto Microsphere F-
A pressure-sensitive adhesive sheet/release sheet laminate was obtained in the same manner as in Example 1 except that 80 was not used.
比較例２
実施例２においてエクスパンセルＤＩＪ−５５１を用い
無かった以外は実施例２と同様にして粘着シ−ト／剥離
シート積層体を得た。Comparative Example 2 An adhesive sheet/release sheet laminate was obtained in the same manner as in Example 2 except that Expancel DIJ-551 was not used.
実施例１〜２、及び比較例１〜２で得た粘着シート／剥
離シート禎層体について以下の評価（★）を行い、得ら
れた結果を表−１に示した。The following evaluations (★) were performed on the adhesive sheet/release sheet layer bodies obtained in Examples 1 and 2 and Comparative Examples 1 and 2, and the obtained results are shown in Table 1.
★剥離力；
実施例、比較例で得た粘着シート／剥離シート積層体を
２０℃、６０％ＲＨの室内条件で１日放置後、インスト
ロン型引張り試験機を用いて引張り角度１８０ ”、引
張り速度３０ｃ１ｗ／分の試験条件で剥離し、粘着シー
トの剥離力を測定した。測定値の小さい方が剥離性が良
いことを示す。★Peeling force: After leaving the adhesive sheet/release sheet laminates obtained in Examples and Comparative Examples under indoor conditions of 20°C and 60% RH for one day, the tensile strength was measured using an Instron type tensile tester at a tensile angle of 180''. The peeling force of the pressure-sensitive adhesive sheet was measured by peeling under test conditions of a speed of 30c1w/min.A smaller measured value indicates better peelability.
★接着力；
剥離力の測定に用いた粘着シートをＪＩＳ Ｚ０２３７
に準じた条件でポリエチレン製の板に貼り付けて、剥離
力測定の場合と同様に引張り角度１８０＠、引張り速度
３０ｃｍ／分の試験条件で剥離し、この時の値を接着力
とした。なお、値が大きい方が接着性がよい（接着力が
強い）。★Adhesive strength: The adhesive sheet used to measure peeling strength was JIS Z0237.
It was attached to a polyethylene plate under the same conditions as in the case of peeling force measurement, and was peeled off under the same test conditions as in the case of peeling force measurement, at a pulling angle of 180 @ and a pulling speed of 30 cm/min, and the value at this time was taken as the adhesive force. Note that the larger the value, the better the adhesiveness (stronger the adhesive force).
★動摩擦係数；
剥離力の測定に用いた剥離シートのシリコーン面同士を
重ねて、ＪＩＳ Ｃ−６２４４に準じて動摩擦係数を測
定した。この値が大きい程摩擦抵抗が大きいことを示す
。★Coefficient of Dynamic Friction; The silicone surfaces of the release sheets used to measure the peeling force were placed on top of each other, and the coefficient of kinetic friction was measured according to JIS C-6244. The larger this value is, the greater the frictional resistance is.
「効果」
表−１から明らかなように、本発明の組成物は剥離性、
接着力を損なうことなく、滑り防止性を向上させた優れ
た！！−、＋１離用シリコーン組成物で有った。"Effect" As is clear from Table 1, the composition of the present invention has excellent peelability and
Excellent anti-slip properties without compromising adhesive strength! ! -, +1 release silicone composition.
Claims (4)
リコーン組成物において、該組成物中に、平均粒子径が
１０μｍ以上の中空マイクロカプセルを含有させたこと
を特徴とする剥離用シリコーン組成物。(1) A release silicone composition containing organopolysiloxane as a main component, characterized in that the composition contains hollow microcapsules having an average particle diameter of 10 μm or more.
る請求項（１）記載の剥離用シリコーン組成物。(2) The silicone composition for release according to claim (1), wherein the membrane material of the hollow microcapsules is a thermoplastic resin.
である請求項（１）記載の剥離用シリコーン組成物。(3) The exfoliating silicone composition according to claim (1), wherein the hollow microcapsules are expandable microcapsules.
シロキサンとビニル基含有ポリシロキサン又はシラノー
ル基含有ポリシロキサンとの反応生成物である請求項（
１）記載の剥離用シリコーン組成物。(4) A claim in which the organopolysiloxane is a reaction product of methylhydrodienesiloxane and a vinyl group-containing polysiloxane or a silanol group-containing polysiloxane (
1) The silicone composition for release described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17338988A JPH0222361A (en) | 1988-07-12 | 1988-07-12 | Silicone composition for releasing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17338988A JPH0222361A (en) | 1988-07-12 | 1988-07-12 | Silicone composition for releasing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0222361A true JPH0222361A (en) | 1990-01-25 |
Family
ID=15959492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17338988A Pending JPH0222361A (en) | 1988-07-12 | 1988-07-12 | Silicone composition for releasing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0222361A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0826723A2 (en) * | 1996-08-29 | 1998-03-04 | Dow Corning Toray Silicone Company, Limited | Silicone rubber sponge composition and method for the manufacture of silicone rubber sponge |
-
1988
- 1988-07-12 JP JP17338988A patent/JPH0222361A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0826723A2 (en) * | 1996-08-29 | 1998-03-04 | Dow Corning Toray Silicone Company, Limited | Silicone rubber sponge composition and method for the manufacture of silicone rubber sponge |
| EP0826723A3 (en) * | 1996-08-29 | 1998-05-13 | Dow Corning Toray Silicone Company, Limited | Silicone rubber sponge composition and method for the manufacture of silicone rubber sponge |
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