JPH02219639A - Lamina - Google Patents
LaminaInfo
- Publication number
- JPH02219639A JPH02219639A JP4230289A JP4230289A JPH02219639A JP H02219639 A JPH02219639 A JP H02219639A JP 4230289 A JP4230289 A JP 4230289A JP 4230289 A JP4230289 A JP 4230289A JP H02219639 A JPH02219639 A JP H02219639A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- layer
- laminate
- film
- adhesive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 239000002313 adhesive film Substances 0.000 claims abstract description 20
- 239000011888 foil Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 230000003746 surface roughness Effects 0.000 abstract description 14
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 6
- 229920000728 polyester Polymers 0.000 abstract description 3
- 239000004840 adhesive resin Substances 0.000 abstract description 2
- 229920006223 adhesive resin Polymers 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 abstract description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 2
- 239000005020 polyethylene terephthalate Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000004744 fabric Substances 0.000 description 11
- 238000000465 moulding Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、積層板に関するものである。さらに詳しく
は、この発明は、積層成形による表面粗度を低減するこ
とのできる配線板用の積層板に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) This invention relates to a laminate. More specifically, the present invention relates to a laminate for wiring boards that can reduce surface roughness due to laminate molding.
（従来の技術）
精密機器、電子計算機、通信機器等に用いられている配
線板用の積層板には、近年の高密度実装の要請の高まり
とともに、耐熱性、強度等の特性とともに、加工に際し
ての寸法・厚み精度の向上とその信顆性の向上がさらに
強く要求されるようになっている。特に、高密度実装に
ともなって、積層成形時の表面粗度の低減が強く求めら
れている。(Conventional technology) Laminated boards for wiring boards used in precision instruments, electronic computers, communication equipment, etc. have increased in recent years with the increasing demand for high-density packaging, as well as characteristics such as heat resistance and strength. There is a strong demand for improved dimensional and thickness accuracy and reliability. In particular, with high-density packaging, there is a strong demand for reducing surface roughness during lamination molding.
従来、この配線板用の積層板としては、一般的にガラス
クロス等の基材に樹脂を含浸したレシンクロスなどを所
要枚数組合わせ、その表裏に金属箔を配して加熱圧締し
たものが知られている。また、これに内層材を介在させ
て成形して多層板としたものも知られている。Conventionally, laminated boards for wiring boards have generally been made by combining a required number of sheets of glass cloth or other resin-impregnated resin cloth, placing metal foil on the front and back sides, and heat-pressing them. It is being It is also known to form a multilayer board by interposing an inner layer material therebetween and molding it.
（発明が解決しよ−うとする課題）
しかしながら、これまでの積層板においては、積層成形
時の大きな表面粗度によって、その後の配線板製造のた
めの加工に支障をきたすのが実状であった。(Problem to be Solved by the Invention) However, in conventional laminates, the large surface roughness during laminate molding hinders subsequent processing for manufacturing wiring boards. .
すなわち、たとえば硬化剤を配合したエポキシ樹脂をガ
ラスクロスに含浸させて乾燥したプリプレグを８枚重ね
、両面に０．０１８ ｃｍの銅箔を配した積層体を金属
プレート間にはさんで成形圧５０ｋｆ／−１温度１７０
℃で１００分間成形し、暑さ１．６薗の積層板を得ると
すると、この時の樹脂の硬化収縮と、冷却による収縮に
よって約５．０μｍ程度の表面粗度が生じてしまう、こ
のような比較的大きな表面粗度は、プリント配線板の加
工に障害となり、高精度、高密度配線板の実現を困難と
し、製品歩留りを悪くする原因となっていた。That is, for example, eight sheets of prepreg made by impregnating glass cloth with an epoxy resin containing a hardening agent and drying are stacked, a laminate with 0.018 cm copper foil arranged on both sides is sandwiched between metal plates, and a molding pressure of 50 kf is applied. /-1 temperature 170
If a laminate with a temperature of 1.6 μm is obtained by molding at ℃ for 100 minutes, a surface roughness of about 5.0 μm will occur due to curing shrinkage of the resin and shrinkage due to cooling. The relatively large surface roughness hinders the processing of printed wiring boards, making it difficult to realize high-precision, high-density wiring boards, and causing poor product yields.
この発明は以上の通りの事情に鑑みてなされたものであ
り、従来の積層板の表面粗度に関する問題点を解消し、
寸法・厚み精度とその信頼性とを向上させることのでき
る、新しい積層板を提供することを目的としている。This invention was made in view of the above circumstances, and solves the problems regarding the surface roughness of conventional laminates,
The objective is to provide a new laminate that can improve dimensional/thickness accuracy and reliability.
（課題を解決するための手段）
上記の課題を解決するために、この発明は、外層金属箔
とこれを積層する基材層との間に接着性フィルム層を配
設一体止してなることを特徴とする積層板を提供する。(Means for Solving the Problems) In order to solve the above problems, the present invention provides a method in which an adhesive film layer is disposed and integrally bonded between the outer metal foil layer and the base material layer on which it is laminated. To provide a laminate featuring:
また、発明は、このような配線板用の積層板として、フ
ィルム表面に樹脂を塗布して形成した接着性フィルム層
を積層一体止することを好ましい態様として提供するも
のでもある。The invention also provides a preferred embodiment of such a laminate for a wiring board, in which an adhesive film layer formed by applying a resin to the film surface is laminated and fixed together.
すなわち、この発明の積層板は、従来の積層板では外層
金属箔が基材層に直接配設されていたのに対し、外層金
属箔と基材層との間に樹脂の硬化、冷却による圧縮の影
響の緩和層として接着性フィルム層を介在させたことを
特徴としている。In other words, in the laminate of the present invention, whereas in conventional laminates the outer metal foil is directly disposed on the base layer, the resin is compressed between the outer metal foil and the base layer by hardening and cooling. The feature is that an adhesive film layer is interposed as a layer to alleviate the influence of.
接着性フィルム層を形成するフィルムとしては、一般的
に２％以上の伸びのあるシートフィルムを用いるのが好
ましく、その素材としては、ポリエチレンテレフタレー
ト、ポリブチレンテレフタレートなどのポリエステル、
ｐｐｏ、ｐｐｓなどを単独素材として１．あるいは複合
素材として使用することができる。As the film forming the adhesive film layer, it is generally preferable to use a sheet film with an elongation of 2% or more, and its material includes polyester such as polyethylene terephthalate, polybutylene terephthalate, etc.
1. Using PPO, PPS, etc. as a single material. Alternatively, it can be used as a composite material.
また、このフィルムの表面には、接着性の樹脂を塗布す
ることが好ましく、たとえば適宜なエポキシ樹脂をその
ために用いることができる。フィルムそのものの表面に
接着性を持たせてもよい。Moreover, it is preferable to coat the surface of this film with an adhesive resin, for example, a suitable epoxy resin can be used for this purpose. The surface of the film itself may have adhesive properties.
この発明の積層板は、外層金属箔と基材層との間に上述
のような接着性フィルム層を配設したものである限り、
種々の態様をとることができ、基材層に用いる樹脂の種
類、層構成、外層金属箔の種類などに関しては特に制限
はない、従来より積層板の成形材料として使用されてい
るものを適宜使用することができる。As long as the laminate of this invention has an adhesive film layer as described above disposed between the outer metal foil and the base layer,
Various embodiments can be taken, and there are no particular restrictions on the type of resin used for the base layer, the layer structure, the type of outer layer metal foil, etc., and materials conventionally used as molding materials for laminates can be used as appropriate. can do.
たとえば、ビスフェノール型、ノボラック型等のエポキ
シ樹脂、ポリイミド樹脂、ＢＴ樹脂等を含浸させたプリ
プレグ、・それらのシート材などを金属箔と共に適宜組
合わせ、片面張り、両面張り、あるいは多層積層板とす
ることができる。For example, prepreg impregnated with bisphenol type, novolac type epoxy resin, polyimide resin, BT resin, etc., and sheet materials thereof are appropriately combined with metal foil to form single-sided, double-sided, or multilayer laminates. be able to.
また、この場合の樹脂には、従来の積層板と同様に麹燃
剤、耐熱性付与剤、無機粉末、補強剤等の種々の添加剤
を配合することができる。プリプレグを用いる場合には
、所定の樹脂フェスを基材に含浸させ、乾燥または半硬
化してＢステージにしたものを使用することができる。Further, the resin in this case can be blended with various additives such as a koji retardant, a heat resistance imparting agent, an inorganic powder, and a reinforcing agent, as in the case of conventional laminates. When using prepreg, it is possible to use a prepreg prepared by impregnating a base material with a predetermined resin face and drying or semi-curing the prepreg to a B stage.
この場合の基材についても特に制限はなく、ガラスクロ
ス、アラミドクロス、ポリエステルクロス、ナイロンク
ロス等のクロスやマット状物、不織布などを用いること
ができる。There are no particular limitations on the base material in this case, and cloth such as glass cloth, aramid cloth, polyester cloth, nylon cloth, mat-like materials, nonwoven fabrics, etc. can be used.
金属箔についても、銅箔、アルミニウム箔等の通常の積
層板に用いられるものを広く使用することができる。As for the metal foil, a wide variety of metal foils such as copper foil, aluminum foil, etc. used in ordinary laminates can be used.
以上のように外層金属箔と基材層との間に接着性フィル
ム層を配設一体止したこの発明の積層板については、そ
の製造方法や製造条件を従来法と同様に適宜に採用する
ことができる。As for the laminate of the present invention in which the adhesive film layer is integrally arranged between the outer metal foil and the base material layer as described above, the manufacturing method and manufacturing conditions may be appropriately adopted as in the conventional method. Can be done.
最も好ましい製造方法としては、まず、シートフィルム
表面に樹脂を塗布して接着性フィルムを製造し、次いで
この接着性フィルムを基材および金属箔に重ね合せ、加
熱圧締して積層一体止する方法が例示される。The most preferred manufacturing method is to first apply a resin to the surface of the sheet film to produce an adhesive film, then to stack this adhesive film on a base material and metal foil, and heat and press them to secure the lamination. is exemplified.
この方法を例示したものが第１図の工程である。An example of this method is the process shown in FIG.
すなわち、フィルム（１）の両面に樹脂（２）を塗布し
、乾燥させる０次いで、この樹脂塗布したフィルム（１
）を、樹脂含浸ガラスクロス等の基材（３）の複数枚の
最外表面に配し、さらにその外側に金属箔（４）を配置
し、これらをプレス等によって加熱圧締して積層一体止
する。That is, the resin (2) is applied to both sides of the film (1) and dried.Then, the resin-coated film (1) is dried.
) are placed on the outermost surface of multiple sheets of base material (3) such as resin-impregnated glass cloth, metal foil (4) is further placed on the outside, and these are heated and pressed using a press or the like to form a laminated body. Stop.
これにより、金属箔（４）と基材（３）層との間には基
材（３）層の樹脂の硬化、冷却による収縮の影響に対す
る緩和層としての接着性フィルム層（５）が形成される
。As a result, an adhesive film layer (5) is formed between the metal foil (4) and the base material (3) layer as a layer that cushions the effects of shrinkage due to curing and cooling of the resin of the base material (3) layer. be done.
この場合、樹脂（２）の塗布に際しては、樹脂を溶剤と
混合したものを使用することができ、また、その塗布法
としては、ロールで転写する等の適宜な方法を採用でき
る。もちろん、加熱圧締時の温度や圧力条件も、使用す
る樹脂や基材の種類、積層態様等に応じて適宜定める。In this case, when applying the resin (2), a mixture of the resin and a solvent can be used, and as the application method, an appropriate method such as transfer with a roll can be adopted. Of course, the temperature and pressure conditions during heat pressing are also determined as appropriate depending on the type of resin and base material used, the lamination mode, etc.
（作 用）
この発明の積層板は、外装金属箔と基材層との間に樹脂
の収縮の影響に対する緩和層として接着性フィルム層を
介在させているので、積層成形にともなう表面粗度の低
減を可能とし、製品精度の信頼性を向上させる。(Function) The laminate of the present invention has an adhesive film layer interposed between the exterior metal foil and the base material layer as a layer to alleviate the effects of resin shrinkage, so that surface roughness caused by laminate molding can be reduced. This makes it possible to reduce costs and improve reliability of product accuracy.
（実施例）
以下、実施例を示して、この発明をさらに詳しく説明す
る。(Examples) Hereinafter, the present invention will be explained in more detail by showing examples.
実施例１
２０μｍ厚のポリエステルフィルムの両面に、硬化剤を
配合したエポキシ樹脂を塗布し、乾煉して各々厚さ５μ
ｍの樹脂層を形成した。Example 1 Epoxy resin mixed with a hardening agent was applied to both sides of a 20 μm thick polyester film, and each layer was dried to a thickness of 5 μm.
m resin layers were formed.
全体として厚さ３０μｍのこの接着性シートフィルムを
、エポキシ樹脂レジンクロス（ガラスクロス、樹脂量４
２％）の６枚と、さらに雨量外面に位置するように厚み
０．０１８ＩｎＩの銅箔とを第１図に示した配置となる
ように組合わせ、成形圧５０ｋｇ ／ ａｌ、温度１６
５℃で１００分間成形した。This adhesive sheet film with a total thickness of 30 μm was coated with epoxy resin cloth (glass cloth, resin amount 4
2%) and a copper foil with a thickness of 0.018 InI placed on the outer surface of the sheet were combined in the arrangement shown in Figure 1, molding pressure was 50 kg/al, temperature was 16.
Molding was performed at 5°C for 100 minutes.
得られた積層板について表面粗度を測定しなところ、１
．８μｍであった。When the surface roughness of the obtained laminate was measured, 1
．． It was 8 μm.
後述比較例との対比から明らかなように、表面粗度は、
約１７３にまで低減している。As is clear from the comparison with the comparative example described below, the surface roughness is
The number has decreased to about 173.
実施例２
シートフィルム両面の樹脂の塗布厚みを１０μｍとし、
全体の厚みが４０μｍの接着性フィルムを用いた他は実
施例１と同様にして積層板を成形しな。Example 2 The coating thickness of the resin on both sides of the sheet film was 10 μm,
A laminate was molded in the same manner as in Example 1, except that an adhesive film having a total thickness of 40 μm was used.
表面粗度は、表１に示したように極めて小さかった。The surface roughness was extremely small as shown in Table 1.
実施例３
厚さ２０μｍのカプトンフィルムに５μｍ厚の樹脂を両
面に塗布し、全体として３０μｍ厚の接着性フィルムを
用いた他は実施例１と同様にして積層板を成形した。Example 3 A laminate was molded in the same manner as in Example 1, except that a 5 μm thick resin was coated on both sides of a 20 μm thick Kapton film and an adhesive film of 30 μm thickness was used as a whole.
表１に示したように、表面粗度は、比較例の１７２以下
に低減していた。As shown in Table 1, the surface roughness was reduced to 172 or less of the comparative example.
比較例
接着性フィルムを用いない場合の表面粗度を測定したろ
ころ、５゜３μｍと極めて大きがった。Comparative Example The surface roughness measured when no adhesive film was used was extremely large at 5.3 μm.
（発明の効果）
この発明の積層板により、以上詳しく説明した通り、表
面粗度の大幅な低減が可能となる０寸法・厚み精度とそ
の信頼性を著しく向上させることができる。(Effects of the Invention) As explained in detail above, the laminate of the present invention makes it possible to significantly reduce the surface roughness and significantly improve the zero dimension/thickness accuracy and its reliability.
第１図は、この発明の製造工程とこれにより得られる積
層板を例示した断面図である。
１・・・フィルム
２・・・樹脂
３・・・基 材
４・・・金 属 箔
５・・・接着性フィルム層FIG. 1 is a cross-sectional view illustrating the manufacturing process of the present invention and a laminate obtained by the process. 1...Film 2...Resin 3...Base material 4...Metal foil 5...Adhesive film layer
Claims (2)
性フィルム層を配設一体化してなることを特徴とする積
層板。(1) A laminate characterized in that an adhesive film layer is integrally disposed between an outer metal foil layer and a base material layer on which it is laminated.
を形成してなる請求項（１）記載の積層板。(2) The laminate according to claim (1), wherein the adhesive film layer is formed by applying a resin to the surface of the film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1042302A JPH0747302B2 (en) | 1989-02-22 | 1989-02-22 | Laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1042302A JPH0747302B2 (en) | 1989-02-22 | 1989-02-22 | Laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02219639A true JPH02219639A (en) | 1990-09-03 |
| JPH0747302B2 JPH0747302B2 (en) | 1995-05-24 |
Family
ID=12632229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1042302A Expired - Fee Related JPH0747302B2 (en) | 1989-02-22 | 1989-02-22 | Laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0747302B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008279666A (en) * | 2007-05-11 | 2008-11-20 | Panefuri Kogyo Kk | Metallic tone decorative sheet and metallic tone decorative material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5291082A (en) * | 1976-01-27 | 1977-08-01 | Toray Ind Inc | Preparation of laminates |
| JPS60154057A (en) * | 1984-01-24 | 1985-08-13 | 松下電工株式会社 | Manufacture of copper lined laminated board |
| JPS61132339A (en) * | 1984-12-03 | 1986-06-19 | 住友電気工業株式会社 | Metallic printed substrate |
| JPS6246637A (en) * | 1985-08-27 | 1987-02-28 | 株式会社神戸製鋼所 | Metallic base material laminated plate for printed wiring board |
-
1989
- 1989-02-22 JP JP1042302A patent/JPH0747302B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5291082A (en) * | 1976-01-27 | 1977-08-01 | Toray Ind Inc | Preparation of laminates |
| JPS60154057A (en) * | 1984-01-24 | 1985-08-13 | 松下電工株式会社 | Manufacture of copper lined laminated board |
| JPS61132339A (en) * | 1984-12-03 | 1986-06-19 | 住友電気工業株式会社 | Metallic printed substrate |
| JPS6246637A (en) * | 1985-08-27 | 1987-02-28 | 株式会社神戸製鋼所 | Metallic base material laminated plate for printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008279666A (en) * | 2007-05-11 | 2008-11-20 | Panefuri Kogyo Kk | Metallic tone decorative sheet and metallic tone decorative material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0747302B2 (en) | 1995-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5633072A (en) | Method of manufacturing a multilayer printed wire board | |
| US6016598A (en) | Method of manufacturing a multilayer printed wire board | |
| JPH02219639A (en) | Lamina | |
| JP2004241647A (en) | Long laminate for printed wiring board and method for manufacturing the same | |
| JP2650072B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JP4759896B2 (en) | Manufacturing method of printed wiring board manufacturing material | |
| JPH04158593A (en) | Manufacture of laminate | |
| JPH07120854B2 (en) | Multilayer wiring board | |
| JPS5862043A (en) | Manufacture of metal lined laminated board | |
| JPH03239A (en) | Composite laminated board | |
| JPH03285391A (en) | Manufacture of multilayer wiring board | |
| JPH10270861A (en) | Manufacture of multilayered printed wiring board | |
| JPH04151216A (en) | Manufacture of laminate | |
| JPS5989495A (en) | Method of producing multilayer board | |
| JPS62124938A (en) | Manufacture of metallic-foil lined laminated board | |
| JPH01293597A (en) | Manufacture of multi-layered printed-wiring board | |
| JPS62238680A (en) | Printed wiring board | |
| JPS61120737A (en) | Manufacture of copper lined laminated board | |
| JPS61261042A (en) | Metallic foil lined laminated board | |
| JPH01225519A (en) | Manufacture of laminate | |
| JPH04260391A (en) | Manufacture of multilayered wiring board | |
| JPH01294019A (en) | Preparation of multi-layer wiring base | |
| JPH01294017A (en) | Preparation of laminated sheet | |
| JPH0315524A (en) | Multilayer printed wiring board | |
| JPS61261044A (en) | Manufacture of metallic foil lined laminated board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |